JP3520540B2 - 多層基板 - Google Patents

多層基板

Info

Publication number
JP3520540B2
JP3520540B2 JP30682493A JP30682493A JP3520540B2 JP 3520540 B2 JP3520540 B2 JP 3520540B2 JP 30682493 A JP30682493 A JP 30682493A JP 30682493 A JP30682493 A JP 30682493A JP 3520540 B2 JP3520540 B2 JP 3520540B2
Authority
JP
Japan
Prior art keywords
power element
multilayer substrate
substrate
filling
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30682493A
Other languages
English (en)
Japanese (ja)
Other versions
JPH07162157A (ja
Inventor
浅井　　康富
長坂　　崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP30682493A priority Critical patent/JP3520540B2/ja
Priority to DE4443424A priority patent/DE4443424B4/de
Publication of JPH07162157A publication Critical patent/JPH07162157A/ja
Application granted granted Critical
Publication of JP3520540B2 publication Critical patent/JP3520540B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP30682493A 1993-12-07 1993-12-07 多層基板 Expired - Fee Related JP3520540B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP30682493A JP3520540B2 (ja) 1993-12-07 1993-12-07 多層基板
DE4443424A DE4443424B4 (de) 1993-12-07 1994-12-06 Anordnungen aus einem mehrschichtigen Substrat und einem Leistungselement und Verfahren zu ihrer Herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30682493A JP3520540B2 (ja) 1993-12-07 1993-12-07 多層基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2003304692A Division JP2004006993A (ja) 2003-08-28 2003-08-28 多層基板

Publications (2)

Publication Number Publication Date
JPH07162157A JPH07162157A (ja) 1995-06-23
JP3520540B2 true JP3520540B2 (ja) 2004-04-19

Family

ID=17961705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30682493A Expired - Fee Related JP3520540B2 (ja) 1993-12-07 1993-12-07 多層基板

Country Status (2)

Country Link
JP (1) JP3520540B2 (de)
DE (1) DE4443424B4 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3671457B2 (ja) * 1995-06-07 2005-07-13 株式会社デンソー 多層基板
EP0926729A3 (de) * 1997-12-10 1999-12-08 Mitsubishi Gas Chemical Company, Inc. Kunststoffhalbleitergehäuse und seine Herstellung
JP4630041B2 (ja) * 2004-11-12 2011-02-09 日本特殊陶業株式会社 配線基板の製造方法
DE102007022947B4 (de) 2007-04-26 2022-05-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
DE102009023849B4 (de) * 2009-06-04 2022-10-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und optoelektronischer Halbleiterchip
TW201319507A (zh) * 2011-11-04 2013-05-16 Most Energy Corp 散熱裝置及其製造方法
KR102413224B1 (ko) * 2015-10-01 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자, 발광 소자 제조방법 및 발광 모듈

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JPS5563900A (en) * 1978-11-08 1980-05-14 Fujitsu Ltd Multilyaer ceramic circuit board
JPS55130198A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Hybrid integrated circuit board for tuner
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
JPS61288448A (ja) * 1985-06-17 1986-12-18 Sumitomo Electric Ind Ltd 半導体素子塔載用基板
JPS6273799A (ja) * 1985-09-27 1987-04-04 日本電気株式会社 多層セラミツク配線基板
DE3843787A1 (de) * 1988-12-24 1990-07-05 Standard Elektrik Lorenz Ag Verfahren und leiterplatte zum montieren eines halbleiter-bauelements
JPH03286590A (ja) * 1990-04-03 1991-12-17 Nippon Cement Co Ltd セラミック配線基板
US5139973A (en) * 1990-12-17 1992-08-18 Allegro Microsystems, Inc. Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte

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DE4443424A1 (de) 1995-06-08
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