JP3460772B2 - Electronic components - Google Patents
Electronic componentsInfo
- Publication number
- JP3460772B2 JP3460772B2 JP22930596A JP22930596A JP3460772B2 JP 3460772 B2 JP3460772 B2 JP 3460772B2 JP 22930596 A JP22930596 A JP 22930596A JP 22930596 A JP22930596 A JP 22930596A JP 3460772 B2 JP3460772 B2 JP 3460772B2
- Authority
- JP
- Japan
- Prior art keywords
- seat plate
- electronic component
- dummy
- plate
- outer case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子部品に係り、さ
らに詳しく言えば、回路基板に対する実装強度の向上を
図ったチップ状アルミニウム電解コンデンサ等の電子部
品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly, to an electronic component such as a chip-shaped aluminum electrolytic capacitor whose mounting strength on a circuit board is improved.
【０００２】[0002]
【従来の技術】近年、回路基板に実装される各種電子部
品は、実装密度を向上させるためにチップ化が進められ
ている。図２（Ａ）および図２（Ｂ）にチップ化された
アルミニウム電解コンデンサ２０を示す。このアルミニ
ウム電解コンデンサ２０は、部品素子が内蔵された有底
筒状の外装ケース２１と、この外装ケース２１の封口部
２２から引き出された一対のリード端子２３，２３と、
外装ケース２１における封口部２２側の端面に取り付け
られた板状の座板２４とを有し、各リード端子２３，２
３は座板２４に貫通させるとともに座板２４の底面２５
に沿って互いに離れる方向に折り曲げられている。この
ようなアルミニウム電解コンデンサ２０は、座板２４の
底面２５に沿う各リード端子２３，２３を図示しない回
路基板のランドにハンダ付けすることにより、その回路
基板に表面実装される。2. Description of the Related Art In recent years, various electronic components mounted on a circuit board have been made into chips in order to improve the mounting density. 2A and 2B show an aluminum electrolytic capacitor 20 which is made into a chip. This aluminum electrolytic capacitor 20 has a bottomed cylindrical outer case 21 in which component elements are built in, a pair of lead terminals 23, 23 drawn from a sealing portion 22 of the outer case 21,
The external case 21 has a plate-shaped seat plate 24 attached to the end surface on the sealing portion 22 side, and each of the lead terminals 23, 2
3 is penetrated through the seat plate 24 and the bottom surface 25 of the seat plate 24
Are bent in directions away from each other. Such an aluminum electrolytic capacitor 20 is surface-mounted on the circuit board by soldering the lead terminals 23, 23 along the bottom surface 25 of the seat plate 24 to the land of the circuit board (not shown).
【０００３】ところで、従来より、回路基板に表面実装
される電子部品には、実装時の安定性を向上させるため
に様々な工夫がなされている。例えば、本願出願人は、
図２（Ｂ）に示すように、座板２４の底面２５に所定高
さの脚部２６を形成した電子部品２０Ａを提案した（実
開昭６４―３５７３５号公報参照：従来例１）。この従
来例１は、各脚部２６が回路基板に接触するため回路基
板に対する良好な載置安定性が得られるが、回路基板に
対して各脚部が固定されないため耐振性を向上させるも
のではない。[0003] By the way, conventionally, various contrivances have been made for electronic components surface-mounted on a circuit board in order to improve stability during mounting. For example, the applicant
As shown in FIG. 2B, there has been proposed an electronic component 20A in which a leg portion 26 having a predetermined height is formed on a bottom surface 25 of a seat plate 24 (see Japanese Utility Model Application Laid-Open No. 64-35735: Prior Art Example 1). In this conventional example 1, since each leg portion 26 comes into contact with the circuit board, good placement stability on the circuit board can be obtained, but since each leg portion is not fixed to the circuit board, vibration resistance is not improved. Absent.
【０００４】[0004]
【発明が解決しようとする課題】一方、実開昭６１―１
７１２４１号公報には、座板の底面にハンダ付け可能な
ダミー端子を設けた電解コンデンサが示されている（従
来例２）。この従来例２は、ダミー端子が従来例１にお
ける脚部２６に相当し、ダミー端子を回路基板の所定位
置にハンダ付けすれば、各リード端子のみをランドにハ
ンダ付けした従来の電子部品に比較して表面実装強度を
向上できることになる。[Problems to be Solved by the Invention] On the other hand, the actual Kai 61-1
Japanese Patent No. 71241 discloses an electrolytic capacitor in which a solderable dummy terminal is provided on the bottom surface of a seat plate (conventional example 2). In this conventional example 2, the dummy terminal corresponds to the leg portion 26 in the conventional example 1, and if the dummy terminal is soldered to a predetermined position of the circuit board, it is compared with the conventional electronic component in which only each lead terminal is soldered to the land. As a result, the surface mounting strength can be improved.
【０００５】しかしながら、前述した従来例２では、回
路基板に対して電子部品を表面実装するとダミー端子が
座板に隠れるため、ダミー端子のハンダ付け不良を視認
できないという問題がある。この問題は、チップ化され
たアルミニウム電解コンデンサ以外にも、回路基板に対
して表面実装される電子部品全般に生ずる。本発明は、
このような従来の問題を解決するためになされたもの
で、その目的は、ダミー端子のハンダ付け不良を視認で
きる電子部品を提供することにある。However, in the above-mentioned conventional example 2, when the electronic components are surface-mounted on the circuit board, the dummy terminals are hidden by the seat plate, so that there is a problem that the soldering failure of the dummy terminals cannot be visually recognized. This problem occurs not only in the chipped aluminum electrolytic capacitor but also in all electronic components surface-mounted on the circuit board. The present invention is
The present invention has been made in order to solve such a conventional problem, and an object thereof is to provide an electronic component in which a soldering failure of a dummy terminal can be visually recognized.
【０００６】[0006]
【課題を解決するための手段】前記目的を達成するため
に、本発明は、部品素子が内蔵された有底筒状の外装ケ
ースと、前記外装ケースの封口部から引き出された一対
のリード端子と、前記外装ケースにおける前記封口部側
の端面に取り付けられた板状の座板とを有し、前記各リ
ード端子が前記座板を貫通するとともに前記座板の底面
に沿って互いに離れる方向に折り曲げられている電子部
品において、前記座板の底面には、前記各リード端子の
延在方向と直交する方向に沿って前記座板の端面にまで
至る凹部が前記座板の底面中央を中心として左右対称的
に形成されており、前記各凹部内には平板状のダミー端
子が設けられ、前記ダミー端子の端部が前記座板の平面
輪郭形状外側に突出していることを特徴としている。In order to achieve the above object, the present invention provides a bottomed cylindrical outer case in which a component element is built in, and a pair of lead terminals drawn from a sealing portion of the outer case. And a plate-shaped seat plate attached to the end face of the outer case on the side of the sealing portion, in a direction in which the lead terminals penetrate the seat plate and separate from each other along the bottom surface of the seat plate. In the bent electronic component, on the bottom surface of the seat plate ,
Up to the end face of the seat along the direction orthogonal to the extending direction
The recessed part is symmetrical about the bottom center of the seat plate
And a flat dummy terminal is provided in each of the recesses, and an end portion of the dummy terminal projects outside the flat outline of the seat plate.
【０００７】この場合、ダミー端子としては、ハンダ付
け可能であれば材質・個数・形状等は任意に選択でき、
例えばハンダめっきされた銅，洋白，４―２アロイもし
くはＣＰ線（ハンダメッキされた銅被覆鋼線）のプレス
加工品等が採用できる。このダミー端子は、少なくとも
一部が座板の平面輪郭形状の外側に突出していればよ
く、突出部分の形状・寸法等は任意でよい。そして、こ
のようなダミー端子は、接着剤等を使用して座板の底面
に固定しておけばよく、あるいは座板の製造時に座板の
底面に沿うように埋設してもよい。In this case, the material, number, shape, etc. of the dummy terminals can be arbitrarily selected as long as they can be soldered.
For example, solder-plated copper, nickel-white, 4-2 alloy, or CP wire (solder-plated copper-coated steel wire) pressed products can be used. It is sufficient that at least a part of this dummy terminal projects outside the planar contour shape of the seat plate, and the shape and size of the projecting portion may be arbitrary. Then, such a dummy terminal may be fixed to the bottom surface of the seat plate by using an adhesive or the like, or may be embedded along the bottom surface of the seat plate at the time of manufacturing the seat plate.
【０００８】このような本発明においては、ダミー端子
の端部が座板の平面輪郭形状外側に突出しているため、
突出部分を回路基板にハンダ付けすれば、ハンダ付けの
良否を容易に判別できることになり、これにより前記目
的が達成される。In the present invention as described above, since the end portion of the dummy terminal projects outside the plane contour of the seat plate,
If the protruding portion is soldered to the circuit board, it is possible to easily determine whether the soldering is good or bad, thereby achieving the above object.
【０００９】また、本発明においては、ダミー端子が座
板の底面中央を中心とする点対称位置や、あるいはリー
ド端子に沿う線を中心とする線対称位置に複数設けられ
ているため、表面実装強度が一層向上するとともに、ハ
ンダ付けするまで回路基板に対する良好な載置安定性が
得られることになる。Further, in the present invention , since a plurality of dummy terminals are provided at a point symmetrical position centering on the center of the bottom surface of the seat plate or at a line symmetrical position centering on a line along the lead terminal, surface mounting is performed. The strength is further improved, and good mounting stability on the circuit board can be obtained until soldering.
【００１０】さらに、本発明は、前記ダミー端子が前記
座板の底面に接着剤を介して固定されていてもよく、例
えばエポキシ系接着剤，アクリル系接着剤もしくはエポ
キシアクリレート系接着剤等が採用できる。この発明に
おいては、ダミー端子および座板のうちの少なくとも一
方に接着剤を塗布するというきわめて簡単な手順により
ダミー端子を座板に固定できるため、電子部品の製造工
程を簡略化できることになる。Further, according to the present invention, the dummy terminal may be fixed to the bottom surface of the seat plate through an adhesive, for example, an epoxy adhesive, an acrylic adhesive or an epoxy acrylate adhesive is adopted. it can. According to the present invention, since the dummy terminal can be fixed to the seat plate by a very simple procedure of applying an adhesive to at least one of the dummy terminal and the seat plate, the manufacturing process of the electronic component can be simplified.
【００１１】一方、本発明は、前記ダミー端子がその面
方向に対して交差する方向に延びる突起部を有し、前記
突起部が前記座板に埋設されていてもよく、例えば帯状
に形成されたダミー端子は、ほぼへ字状，ほぼＶ字状等
に折り曲げることにより一端に突起部を設ければよく、
あるいは別部材の突起部を接続することによりほぼ変形
Ｔ字状等に形成しておいてもよい。この発明において
は、突起部が座板に埋設されているため、ダミー端子が
座板から脱落する虞れを低減できることになる。On the other hand, according to the present invention, the dummy terminal may have a protrusion extending in a direction intersecting the plane direction of the dummy terminal, and the protrusion may be embedded in the seat plate. The dummy terminal may be provided with a protrusion at one end by bending it into a substantially V shape or a substantially V shape.
Alternatively, it may be formed into a substantially deformed T-shape by connecting the protrusions of another member. In the present invention, since the protrusion is embedded in the seat plate, it is possible to reduce the risk that the dummy terminal will fall off the seat plate.
【００１２】また、本発明は、前記外装ケースの封口部
外周側と前記座板とが接着剤により相互に固定されてい
てもよく、接着剤の材質や塗布箇所等を適宜選択すれば
よい。この発明においては、外装ケースおよび座板が相
互に固定されているため、耐振性が向上し、良好な表面
実装強度が得られることになる。Further, according to the present invention, the outer peripheral side of the sealing portion of the outer case and the seat plate may be fixed to each other by an adhesive agent, and the material of the adhesive agent and the application site may be appropriately selected. In the present invention, since the outer case and the seat plate are fixed to each other, vibration resistance is improved and good surface mounting strength is obtained.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施例を図面に基
づいて説明する。なお、以下に説明する実施例におい
て、既に図２において説明した部材については、図中に
同一符号を付すことにより説明を簡略あるいは省略す
る。図１には、本発明に係る一実施例のアルミニウム電
解コンデンサ１０が示されている。図１（Ａ）に示すよ
うに、このアルミニウム電解コンデンサ１０は、外装ケ
ース２１，リード端子２３および座板２４を有するとと
もに、ＣＰ線（ハンダメッキされた銅被覆鋼線）をプレ
ス加工することにより形成された各リード端子２３，２
３が座板２４に貫通し、かつ、座板２４の底面２５に沿
って互いに離れる方向に折り曲げられていて、座板２４
の底面２５に沿う各リード端子２３，２３を図示しない
回路基板のランドにハンダ付けすることにより、回路基
板に対して表面実装可能とされている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the embodiments described below, the members already described with reference to FIG. 2 are denoted by the same reference numerals in the drawing, and the description thereof will be simplified or omitted. FIG. 1 shows an aluminum electrolytic capacitor 10 according to an embodiment of the present invention. As shown in FIG. 1 (A), the aluminum electrolytic capacitor 10 has an outer case 21, a lead terminal 23 and a seat plate 24, and is formed by pressing a CP wire (copper coated steel wire plated with solder). Each formed lead terminal 23, 2
3 pass through the seat plate 24 and are bent along the bottom surface 25 of the seat plate 24 away from each other.
By soldering the lead terminals 23, 23 along the bottom surface 25 to a land of a circuit board (not shown), surface mounting can be performed on the circuit board.
【００１４】 このアルミニウム電解コンデンサ１０
は、外装ケース２１の封口部２２の外周側と座板２４と
が接着剤３０により相互に固定されているとともに、図
１（Ｂ）にも示すように、回路基板に対する表面実装強
度を向上させるために、座板２４の底面２５に平板状の
ダミー端子１１，１１が設けられている。This aluminum electrolytic capacitor 10
The outer peripheral side of the sealing portion 22 of the outer case 21 and the seat plate 24 are fixed to each other with an adhesive 30 , and as shown in FIG. 1B, the surface mounting strength on the circuit board is improved. Therefore, flat plate-shaped dummy terminals 11, 11 are provided on the bottom surface 25 of the seat plate 24.
【００１５】ダミー端子１１，１１は、例えばハンダめ
っきされた銅，洋白，４―２アロイもしくはＣＰ線（ハ
ンダメッキされた銅被覆鋼線）のプレス加工品とされて
いる。一方、座板２４の底面２５には、ダミー端子１
１，１１を収容可能な所定深さの凹部１２，１２が形成
されている。凹部１２，１２は、各リード端子２３，２
３に対して直交し、かつ、各リード端子２３，２３の長
手方向を中心とする線対称位置に形成されている。これ
らの凹部１２，１２は、それぞれダミー端子１１，１１
を収容すると、ダミー端子１１，１１の長手方向一端部
１３，１３が座板２４の平面輪郭形状外側に突出するよ
うに形成されている。なお、本実施例のアルミニウム電
解コンデンサ１０は、リード端子２３，２３の端部も座
板２４の平面輪郭形状外側に突出するように形成されて
いる。The dummy terminals 11, 11 are, for example, stamped products of solder-plated copper, nickel silver, 4-2 alloy or CP wire (solder-plated copper-coated steel wire). On the other hand, on the bottom surface 25 of the seat plate 24, the dummy terminals 1
Recesses 12, 12 having a predetermined depth capable of accommodating 1, 1 are formed. The recesses 12 and 12 are formed on the lead terminals 23 and 2 respectively.
It is formed at a line symmetry position orthogonal to 3 and centered on the longitudinal direction of each lead terminal 23. These recesses 12 and 12 are used as dummy terminals 11 and 11 respectively.
Is formed, the one longitudinal end portions 13, 13 of the dummy terminals 11, 11 are formed so as to project to the outside of the plane contour shape of the seat plate 24. The aluminum electrolytic capacitor 10 of the present embodiment is formed so that the end portions of the lead terminals 23, 23 also project outside the planar contour shape of the seat plate 24.
【００１６】図１（Ｃ）に示すように、これらのダミー
端子１１，１１は、その面方向に対して交差する方向に
延びる突起部１４，１４を有するほぼへ字状に折り曲げ
形成されている。そして、各ダミー端子１１，１１は、
座板２４を製造するにあたって、あらかじめそれぞれの
突起部１４，１４を埋設することにより座板２４に固定
されている。なお、これらのダミー端子１１，１１は、
当該ダミー端子１１，１１あるいは凹部１２，１２に例
えばエポキシ系接着剤，アクリル系接着剤もしくはエポ
キシアクリレート系接着剤等を塗布することにより座板
２４に固定してもよい。As shown in FIG. 1 (C), these dummy terminals 11 and 11 are bent and formed in a substantially V shape having projecting portions 14 and 14 extending in a direction intersecting the plane direction. . Then, the dummy terminals 11 and 11 are
When the seat plate 24 is manufactured, it is fixed to the seat plate 24 by embedding the respective projections 14, 14 in advance. In addition, these dummy terminals 11 and 11 are
The dummy terminals 11, 11 or the recesses 12, 12 may be fixed to the seat plate 24 by applying, for example, an epoxy adhesive, an acrylic adhesive, or an epoxy acrylate adhesive.
【００１７】以上のようなアルミニウム電解コンデンサ
１０は、あらかじめ各リード端子２３，２３に対応する
回路基板のランドおよびダミー端子１１，１１に対応す
る固定部にクリームハンダを塗布しておき、クリームハ
ンダに各リード端子２３，２３およびダミー端子１１，
１１を接触させることにより、回路基板に載置される。
次に、回路基板を加熱・冷却することによりクリームハ
ンダを溶融・固化させ、これにより回路基板に対してア
ルミニウム電解コンデンサ１０が表面実装される。In the aluminum electrolytic capacitor 10 as described above, cream solder is applied in advance to the land of the circuit board corresponding to each lead terminal 23, 23 and the fixed portion corresponding to the dummy terminals 11, 11. Each lead terminal 23, 23 and dummy terminal 11,
By bringing 11 into contact, they are mounted on the circuit board.
Next, the circuit board is heated and cooled to melt and solidify the cream solder, whereby the aluminum electrolytic capacitor 10 is surface-mounted on the circuit board.
【００１８】 以上のような本実施例のアルミニウム電
解コンデンサ１０によれば、座板２４にダミー端子１
１，１１が設けられているため、これらの各ダミー端子
１１，１１を回路基板にハンダ付けすることにより、従
来の電子部品と同様に、回路基板に対する良好な表面実
装強度が得られる。そして、本実施例のアルミニウム電
解コンデンサ１０によれば、各ダミー端子１１，１１の
長手方向一端部１３，１３が座板２４の平面輪郭形状外
側に突出しているため、突出部分を回路基板にハンダ付
けすることにより、ハンダ付けの良否を容易に判別で
き、回路基板に対する表面実装強度を確実に向上でき
る。According to the aluminum electrolytic capacitor 10 of the present embodiment as described above, the dummy terminal 1 is attached to the seat plate 24.
Since the terminals 1 and 11 are provided, by soldering these dummy terminals 11 and 11 to the circuit board, good surface mounting strength on the circuit board can be obtained as in the conventional electronic component. Further, according to the aluminum electrolytic capacitor 10 of the present embodiment, since the longitudinal one end portions 13, 13 of the dummy terminals 11, 11 are projected to the outside of the planar contour shape of the seat plate 24, the projecting portions are soldered to the circuit board. With
The KES Rukoto, the quality of the soldering can be easily discriminated can be reliably improved surface mounting strength to the circuit board.
【００１９】 また、本実施例のアルミニウム電解コン
デンサ１０は、各ダミー端子１１，１１が座板２４の底
面中央を中心とする対称位置に設けられているため、表
面実装強度が一層向上するとともに、ハンダ付けが完了
するまで回路基板に対する良好な載置安定性が得られ
る。さらに、各ダミー端子１１，１１は、座板２４の底
面２５に形成された凹部１２，１２に各種接着剤あるい
は接着剤付金属箔テープを介して固定されているため、
アルミニウム電解コンデンサ１０の製造工程を簡略化で
きる。そして、本実施例のアルミニウム電解コンデンサ
１０は、外装ケース２１および座板２４が接着剤３０に
より相互に固定されているため、耐振性が一層向上し、
良好な表面実装強度が得られる。Further, in the aluminum electrolytic capacitor 10 of the present embodiment, since the dummy terminals 11, 11 are provided at symmetrical positions about the center of the bottom surface of the seat plate 24, the surface mounting strength is further improved and Good placement stability on the circuit board can be obtained until soldering is completed. Furthermore, since the dummy terminals 11 and 11 are fixed to the recesses 12 and 12 formed on the bottom surface 25 of the seat plate 24 through various adhesives or adhesive-attached metal foil tapes,
The manufacturing process of the aluminum electrolytic capacitor 10 can be simplified. Further, in the aluminum electrolytic capacitor 10 of the present embodiment, since the outer case 21 and the seat plate 24 are fixed to each other by the adhesive 30 , the vibration resistance is further improved,
Good surface mount strength can be obtained.
【００２０】なお、本発明は前述した実施例に限定され
るものではなく、例えば外装ケース・封口部・リード端
子・座板・ダミー端子・接着剤等の材質，形状，寸法，
形態，数，配置個所等の改良，変形等は本発明に含まれ
るものであり、限定されない。The present invention is not limited to the above-mentioned embodiment, and for example, the material, shape, size, etc. of the outer case, the sealing portion, the lead terminal, the seat plate, the dummy terminal, the adhesive, etc.
Improvements, modifications, etc. of the form, the number, the location, etc. are included in the present invention and are not limited.
【００２１】[0021]
【発明の効果】本発明によれば、ダミー端子の端部が座
板の平面輪郭形状外側に突出しているため、突出部分を
回路基板にハンダ付けすることにより表面実装強度を確
実に向上できる。また、本発明によれば、ダミー端子が
座板の底面中央を中心とする対称位置に複数設けられて
いるため、表面実装強度が一層向上するとともに、ハン
ダ付けするまで回路基板に対する良好な載置安定性が得
られる。According to the present invention, since the end portions of the dummy terminals project outside the planar contour shape of the seat plate, the surface mounting strength can be reliably improved by soldering the projecting portions to the circuit board. Further, according to the present invention, a plurality provided in <br/> have order at symmetrical positions where the dummy terminal is centered on the center of the bottom of <br/> seat plate, together with the surface mounting strength is further improved, soldering Until then, good placement stability on the circuit board can be obtained.
【００２２】さらに、本発明によれば、ダミー端子を座
板の底面に接着剤を介して固定したり、あるいはダミー
端子に設けられた突起部を埋設することにより座板に固
定すれば、製造工程を簡略化できる。また、本発明によ
れば、外装ケースおよび座板が接着剤により相互に固定
されていれば、耐振性が向上し、良好な表面実装強度が
得られる。Further, according to the present invention, the dummy terminal is fixed to the bottom surface of the seat plate through an adhesive, or the projection provided on the dummy terminal is embedded to fix the dummy terminal to the seat plate. The process can be simplified. Further, according to the present invention, if the outer case and the seat plate are fixed to each other with an adhesive, the vibration resistance is improved, and good surface mounting strength can be obtained.
【図１】本発明の一実施例を示す全体斜視図，底面図お
よび要部断面図である。FIG. 1 is an overall perspective view, a bottom view, and a sectional view of an essential part showing an embodiment of the present invention.
【図２】従来の電子部品を示す分解斜視図および要部斜
視図である。FIG. 2 is an exploded perspective view and a perspective view of a main part showing a conventional electronic component.
【符号の説明】 １０ 電子部品であるアルミニウム電解コンデンサ １１ ダミー端子 １３ 端部 １４ 突起部 ２１ 外装ケース ２２ 封口部 ２３ リード端子 ２４ 座板 ２５ 底面３０ 接着剤[Explanation of reference numerals] 10 Aluminum electrolytic capacitor which is an electronic component 11 Dummy terminal 13 End portion 14 Projection portion 21 Outer case 22 Sealing portion 23 Lead terminal 24 Seat plate 25 Bottom surface 30 Adhesive
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01G 9/00 - 9/10 H01G 2/06 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01G 9/00-9/10 H01G 2/06
Claims (4)
ースと、前記外装ケースの封口部から引き出された一対
のリード端子と、前記外装ケースにおける前記封口部側
の端面に取り付けられた板状の座板とを有し、前記各リ
ード端子が前記座板を貫通するとともに前記座板の底面
に沿って互いに離れる方向に折り曲げられている電子部
品において、 前記座板の底面には、前記各リード端子の延在方向と直
交する方向に沿って前記座板の端面にまで至る凹部が前
記座板の底面中央を中心として左右対称的に形成されて
おり、前記各凹部内には平板状のダミー端子が設けら
れ、前記ダミー端子の端部が前記座板の平面輪郭形状外
側に突出していることを特徴とする電子部品。1. A bottomed cylindrical outer case having a built-in component element, a pair of lead terminals pulled out from a sealing portion of the outer case, and an end surface of the outer case on the side of the sealing portion. In the electronic component having a plate-shaped seat plate, each of the lead terminals is bent in a direction away from each other along the bottom surface of the seat plate while penetrating the seat plate, the bottom surface of the seat plate , Directly align with the extension direction of each lead terminal.
The recess reaching the end face of the seat plate along the intersecting direction is the front
Formed symmetrically about the center of the bottom of the seat plate
The electronic component is characterized in that a flat plate-shaped dummy terminal is provided in each of the recesses, and an end portion of the dummy terminal projects to the outside of the planar contour shape of the seat plate.
介して固定されている請求項１に記載した電子部品。2. The dummy terminal has an adhesive in the recess.
The electronic component according to claim 1, which is fixed via the electronic component.
差する方向に延びる突起部を有し、前記突起部が前記凹
部内において前記座板に埋設されている請求項１に記載
した電子部品。3. The dummy terminals are intersected in the plane direction.
Has a protrusion extending in the inserting direction, and the protrusion is the concave
The electronic component according to claim 1 , wherein the electronic component is embedded in the seat plate inside the portion .
板とが接着剤により相互に固定されている請求項１に記
載した電子部品。 4. The outer peripheral side of the sealing portion of the outer case and the seat
The electronic component according to claim 1, wherein the plate and the plate are fixed to each other with an adhesive .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22930596A JP3460772B2 (en) | 1996-08-12 | 1996-08-12 | Electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22930596A JP3460772B2 (en) | 1996-08-12 | 1996-08-12 | Electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1064756A JPH1064756A (en) | 1998-03-06 |
| JP3460772B2 true JP3460772B2 (en) | 2003-10-27 |
Family
ID=16890065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22930596A Expired - Lifetime JP3460772B2 (en) | 1996-08-12 | 1996-08-12 | Electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3460772B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60144181D1 (en) | 2000-02-03 | 2011-04-21 | Panasonic Corp | Chip capacitor with sheath |
| JP2009290094A (en) * | 2008-05-30 | 2009-12-10 | Nichicon Corp | Electronic component and its mounting method |
| EP4174887A1 (en) * | 2021-11-02 | 2023-05-03 | CapXon Electronic (Shenzhen) Co., Ltd | Capacitor seat plate assembly |
-
1996
- 1996-08-12 JP JP22930596A patent/JP3460772B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1064756A (en) | 1998-03-06 |
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