JP3450138B2 - Substrate processing equipment - Google Patents
Substrate processing equipmentInfo
- Publication number
- JP3450138B2 JP3450138B2 JP31458696A JP31458696A JP3450138B2 JP 3450138 B2 JP3450138 B2 JP 3450138B2 JP 31458696 A JP31458696 A JP 31458696A JP 31458696 A JP31458696 A JP 31458696A JP 3450138 B2 JP3450138 B2 JP 3450138B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- unit
- processing
- processing unit
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 406
- 238000012545 processing Methods 0.000 title claims description 171
- 238000004140 cleaning Methods 0.000 claims description 143
- 238000012546 transfer Methods 0.000 claims description 94
- 239000011248 coating agent Substances 0.000 claims description 45
- 238000000576 coating method Methods 0.000 claims description 45
- 239000007788 liquid Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 36
- 238000001035 drying Methods 0.000 claims description 29
- 230000008569 process Effects 0.000 claims description 28
- 239000012670 alkaline solution Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000011161 development Methods 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 description 39
- 239000010408 film Substances 0.000 description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- 239000000126 substance Substances 0.000 description 15
- 210000000078 claw Anatomy 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning In General (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶表示器用ガラ
ス角型基板、半導体ウエハ等の基板に所定の処理を施す
基板処理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing a predetermined process on a substrate such as a glass rectangular substrate for a liquid crystal display or a semiconductor wafer.
【０００２】[0002]
【従来の技術】従来の基板処理装置の一つとして、基板
にレジスト塗布及び現像処理を施す塗布現像装置が、特
開平８−２２２６１６号公報に開示されている。2. Description of the Related Art As one of conventional substrate processing apparatuses, a coating / developing apparatus for performing resist coating and developing processing on a substrate is disclosed in Japanese Patent Application Laid-Open No. 8-222616.
【０００３】この塗布現像装置は、基板を所定の方向に
搬送する複数の搬送ロボットと、搬送ロボットの搬送路
に沿ってその一方側に設けられた処理部とを有してい
る。この処理部には、基板を洗浄処理するスピンスクラ
バと、基板上にレジストを塗布するスピンコータと、露
光機によって所定のパターンが焼き付けられた基板上の
レジスト膜を現像処理するスピンデベロッパとが設けら
れている。This coating and developing apparatus has a plurality of transfer robots for transferring a substrate in a predetermined direction, and a processing section provided on one side of the transfer robot along the transfer path. This processing unit is provided with a spin scrubber for cleaning the substrate, a spin coater for applying a resist on the substrate, and a spin developer for developing the resist film on the substrate having a predetermined pattern baked by an exposure machine. ing.
【０００４】また、上述の塗布現像装置に設けられたス
ピンスクラバでは、基板サイズの大型化に十分対応でき
ないという問題があった。すなわち、例えば液晶表示器
の製造工場に基板を受け入れた際の基板表面の汚れや、
基板上に各種薄膜を形成した後に表面に付着する金属粉
や油脂汚れを十分に除去できず、さらに基板の裏面を十
分に洗浄できる構成となっていないため、上述の塗布現
像装置とは別に基板を洗浄する基板洗浄装置が必要とな
っていた。Further, the spin scrubber provided in the above-mentioned coating and developing apparatus has a problem that it cannot sufficiently cope with an increase in substrate size. That is, for example, when the substrate is received in a liquid crystal display manufacturing factory, the surface of the substrate is dirty,
After forming various thin films on the substrate, it is not possible to sufficiently remove the metal powder and grease stains attached to the surface, and the back surface of the substrate is not sufficiently cleaned. A substrate cleaning device for cleaning the substrate has been required.
【０００５】この基板洗浄装置は、基板の搬送方向に沿
って並列された複数の搬送ローラと、複数の搬送ローラ
によって搬送される基板の表裏両面に向かって、アルカ
リ溶液等の薬液や、例えば特開平５−２６４９４２号公
報に開示されるような、高圧の純水又は超音波が付与さ
れた純水等を吹き付けて基板を洗浄するものである。ま
た、例えば、特開平７−６９８７号公報に開示されるよ
うに複数の搬送ローラによって搬送される基板の表裏両
面にロールブラシを当接させて基板を洗浄する基板洗浄
装置も知られている。In this substrate cleaning apparatus, a plurality of transfer rollers arranged in parallel along the transfer direction of the substrate and a chemical solution such as an alkaline solution, for example, a special solution, are applied to both front and back surfaces of the substrate which are transferred by the plurality of transfer rollers. As disclosed in Kaihei 5-264942, high pressure pure water, pure water to which ultrasonic waves are applied, or the like is sprayed to clean the substrate. Further, for example, as disclosed in Japanese Patent Laid-Open No. 7-6987, there is also known a substrate cleaning device which cleans a substrate by bringing a roll brush into contact with both front and back surfaces of the substrate transported by a plurality of transport rollers.
【０００６】上述の基板洗浄装置によって洗浄処理さ
れ、カセットに収納された基板は、ＡＧＶによって前述
の塗布現像装置に搬送され、レジスト塗布および現像処
理が施される。The substrate cleaned by the above-mentioned substrate cleaning device and accommodated in the cassette is conveyed by the AGV to the above-mentioned coating / developing device for resist coating and developing treatment.
【０００７】また、基板の表面にＩＴＯ（Indium Tin O
xide）膜等の電極膜を形成するプラズマＣＶＤ法やスパ
ッタリング法を用いた成膜処理の前処理としても、上述
の基板洗浄装置によって基板の洗浄処理が行われてお
り、上述と同様に洗浄処理された基板は、ＡＧＶによっ
てスパッタ装置やＣＶＤ装置等の成膜装置に搬送され成
膜処理が施される。In addition, ITO (Indium Tin O
(xide) film, etc., the substrate cleaning process is performed by the above-described substrate cleaning apparatus even as a pretreatment for the film forming process using the plasma CVD method or the sputtering method. The formed substrate is transported by AGV to a film forming apparatus such as a sputtering apparatus or a CVD apparatus and subjected to a film forming process.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、上述の
ように、例えば液晶表示器の製造工場の一つのフロアー
に、塗布現像装置、基板洗浄装置、成膜装置を別々に配
置し、各装置間においてＡＧＶによってカセットに収納
された基板を搬送すると、フロアーにＡＧＶの搬送路を
確保する必要があるとともに、各装置に、カセットと所
定の処理ユニットとの間で基板を受け渡しするインデク
サ部をそれぞれ設ける必要があるので、各処理装置が設
置される全フロアー面積が増大するという問題が発生す
る。However, as described above, for example, a coating / developing apparatus, a substrate cleaning apparatus, and a film forming apparatus are separately arranged on one floor of a manufacturing factory of liquid crystal displays, and the respective apparatuses are connected to each other. When the substrate stored in the cassette is transported by the AGV, it is necessary to secure a transport path for the AGV on the floor, and it is necessary to provide each device with an indexer unit for transferring the substrate between the cassette and a predetermined processing unit. Therefore, there is a problem that the total floor area where each processing device is installed increases.
【０００９】さらに、ＡＧＶによってカセットに収納さ
れた基板を搬送する際に、カセット内の基板が汚染され
るという別の問題も発生する。Further, when the substrate stored in the cassette is transported by the AGV, another problem that the substrate in the cassette is contaminated occurs.
【００１０】本発明の目的は、上述のような点に鑑み、
各装置が設置されるフロアー面積を低減させるととも
に、ＡＧＶによる基板搬送時の基板の汚染を抑制した基
板処理装置を提供することにある。In view of the above points, an object of the present invention is to
It is an object of the present invention to provide a substrate processing apparatus in which the floor area where each apparatus is installed is reduced and the contamination of the substrate during the substrate transfer by AGV is suppressed.
【００１１】[0011]
【課題を解決するための手段】上記課題を解決するた
め、請求項１の装置は、基板に所定の処理を施す基板処
理装置において、カセット単位で搬送されてきた基板を
受け入れて後の連続処理のために前記カセットから１枚
ずつ基板を取り出すとともに現像処理を終了した基板を
前記カセットに収納するインデクサ部と、前記インデク
サ部の前記カセットから一枚ずつ取り出された前記基板
を受け取り、この受け取った複数の前記基板を前記基板
の搬送行路に沿って並列に配置された複数の搬送ローラ
によってほぼ水平に支持するとともに連続的に所定の方
向に搬送させつつ、当該基板の主面に洗浄液を供給する
洗浄液供給手段と、当該洗浄液供給手段によって前記基
板に供給された前記洗浄液を乾燥処理する乾燥手段とが
前記搬送行路上の所定位置に配置された第１処理部であ
るローラ搬送方式の洗浄部と、前記基板の主面にレジス
トを塗布する塗布ユニットと所定のパターンが焼き付け
られたレジスト膜を現像処理する現像ユニットとを含む
複数の処理ユニットを有し、前記複数の処理ユニットの
うちの任意の処理ユニットに前記基板を搬送ロボットが
所定の順序で逐次搬送して前記基板に一連の処理を行う
第２処理部であるロボット逐次搬送方式のレジスト塗布
現像部と、前記第１処理部と前記第２処理部との間で、
受け渡しされる前記基板を一旦蓄積するバッファ手段
と、当該バッファ手段を介して前記第１処理部と前記第
２処理部との間で前記基板を受け渡しする受渡手段とを
有する基板受渡部と、を備えたことを特徴とする。In order to solve the above-mentioned problems, the apparatus according to claim 1 is a substrate processing apparatus for subjecting a substrate to a predetermined processing, wherein the substrates transferred in cassette units are used.
One from the cassette for continuous processing after receipt
Take out the boards one by one and
The indexer part to be stored in the cassette and the indexer
The substrates taken out one by one from the cassette of the
Receiving a plurality of the received substrates
Transport rollers arranged in parallel along the transport path
The cleaning liquid is supplied to the main surface of the substrate while being supported in a substantially horizontal direction and continuously conveyed in a predetermined direction, and the cleaning liquid supplied to the substrate by the cleaning liquid supply device is dried. and drying means is
The first processing unit der disposed at a predetermined position on the conveying path
A roller transfer type cleaning unit, a coating unit for coating resist on the main surface of the substrate, and a predetermined pattern are baked.
A plurality of processing units including a developing unit that develops the obtained resist film .
A robot that transfers the substrate to any of the processing units
Robot sequential transfer system resist coating, which is a second processing unit , for performing a series of processes on the substrate by sequentially transferring the substrates in a predetermined order
Between the developing unit and the first processing unit and the second processing unit ,
Buffer means for temporarily accumulating the transferred substrate, and the first processing section and the first processing means via the buffer means .
A substrate delivery section having a delivery means for delivering the substrate to and from the two processing sections .
【００１２】また、請求項２の装置は、基板に所定の処
理を施す基板処理装置において、カセット単位で搬送さ
れてきた基板を受け入れて後の連続処理のために前記カ
セットから１枚ずつ基板を取り出すとともに成膜後の基
板を前記カセットに収納するインデクサ部と、前記イン
デクサ部の前記カセットから一枚ずつ取り出された前記
基板を受け取り、この受け取った複数の前記基板を前記
基板の搬送行路に沿って並列に配置された複数の搬送ロ
ーラによってほぼ水平に支持するとともに連続的に所定
の方向に搬送させつつ、当該基板の主面に洗浄液を供給
する洗浄液供給手段と、当該洗浄液供給手段によって前
記基板に供給された前記洗浄液を乾燥処理する乾燥手段
とが前記搬送行路上の所定位置に配置された第１処理部
であるローラ搬送方式の洗浄部と、基板に金属膜を形成
する成膜用チャンバと、基板を前記成膜用チャンバまで
搬送する搬送ロボットとを備え、前記洗浄部で洗浄され
た基板の主面に所定の電極膜を形成するための第２処理
部である成膜部と、前記洗浄部と前記成膜部との間で、
受け渡しされる前記基板を一旦蓄積するバッファ手段
と、当該バッファ手段を介して前記洗浄部と前記成膜部
との間で前記基板を受け渡しする受渡手段とを有する基
板受渡部と、を備えたことを特徴とする。 According to the apparatus of claim 2, the substrate is subjected to a predetermined treatment.
The substrate processing equipment that processes
The received substrate is then received for subsequent processing.
Take out the substrates one by one from the set,
An indexer portion for storing a plate in the cassette;
The above-mentioned one by one taken out from the cassette of the dexter part
The substrate is received, and the plurality of received substrates are
A plurality of transfer rollers arranged in parallel along the transfer path of the board.
Supported almost horizontally by a roller and continuously specified
Supply the cleaning liquid to the main surface of the substrate while transporting it in the direction of
And the cleaning liquid supply means
Drying means for drying the cleaning liquid supplied to the substrate
And a first processing unit arranged at a predetermined position on the transport path.
Roller transport type cleaning unit and a metal film is formed on the substrate
Film forming chamber and substrate to the film forming chamber
It is equipped with a transfer robot for transfer and is cleaned in the cleaning section.
Process for forming a predetermined electrode film on the main surface of the substrate
Between the film forming unit, which is a unit, and the cleaning unit and the film forming unit,
Buffer means for temporarily accumulating the transferred substrate
And the cleaning unit and the film forming unit via the buffer means.
And a delivery means for delivering the substrate to and from the substrate.
And a board delivery section.
【００１３】また、請求項３の装置は、請求項１または
請求項２に記載の基板処理装置において、前記バッファ
手段は、前記第１処理部から前記第２処理部に受渡すべ
き基板を前記洗浄部から受け取って保持する第１バッフ
ァ手段と、前記第１バッファ手段から移送される基板を
蓄積可能な第２バッファ手段と、を有し、前記受渡手段
は、前記第１バッファ手段を介して前記第１処理部と前
記第２処理部との間で基板の受渡しを行う第１受渡し動
作と、前記第１バッファ手段を介して前記第１処理部か
ら受け取った基板を前記第２バッファ手段に移送して一
旦蓄積させた後、前記第２バッファ手段中の基板を前記
第２処理部に受渡す第２受渡し動作と、のいずれもが可
能とされていることを特徴とする。 The device of claim 3 is the device of claim 1 or
The substrate processing apparatus according to claim 2, wherein the buffer
Means for delivering from the first processing unit to the second processing unit.
First buff for receiving and holding the substrate from the cleaning unit
And a substrate transferred from the first buffer means.
Second buffer means capable of accumulating, and said delivery means
Is connected to the first processing unit via the first buffer means.
The first transfer operation for transferring the substrate to and from the second processing unit.
And the first processing unit via the first buffer means.
The substrate received from the second buffer means is transferred to the second buffer means.
After storing the substrate, the substrate in the second buffer means is
Any of the second delivery operation of delivering to the second processing unit is possible
It is characterized as being Noh.
【００１４】また、請求項４の装置は、請求項３に記載
の基板処理装置において、前記受渡手段は、前記第２受
渡し動作における前記第２バッファ手段への基板の出し
入れを、ファイストイン・ファーストアウト方式で行う
ことを特徴とする。 また、請求項５の装置は、請求項３
または請求項４に記載の基板処理装置において、前記第
２処理部は基板出入部を有しており、前記第２受渡し動
作において、前記受渡手段は、前記基板出入部に存在し
ていた先行基板が前記第２処理部内のロボットによって
搬送されたことに応答して前記第２バッファ手段中の基
板を前記基板出入部に受け渡すことを特徴とする。 The apparatus of claim 4 is the same as that of claim 3.
In the substrate processing apparatus of the above, the delivery means includes the second delivery device.
Discharging the substrate to the second buffer means in the transfer operation
Inserting is done by the fight-in first-out method
It is characterized by The device of claim 5, claim 3
Or in the substrate processing apparatus according to claim 4, wherein said
2 The processing section has a substrate loading / unloading section, and the second transfer operation
In the operation, the delivery means is present in the board loading / unloading section.
The preceding substrate that was being used by the robot in the second processing unit
In response to being transported, the substrate in the second buffer means
It is characterized in that the plate is transferred to the substrate loading / unloading portion.
【００１５】また、請求項６の装置は、第１処理部が、
基板をほぼ水平に支持するとともにこの基板を所定の方
向に搬送させつつ、この基板の主面にブラシを当接させ
て基板を洗浄するブラシ洗浄手段を有することを特徴と
する。Further, in the apparatus of claim 6 , the first processing section is
It is characterized by comprising brush cleaning means for supporting the substrate substantially horizontally and transporting the substrate in a predetermined direction while bringing a brush into contact with the main surface of the substrate to clean the substrate.
【００１６】また、請求項７の装置は、洗浄液供給手段
によって供給される洗浄液がアルカリ溶液であることを
特徴とする。また、請求項８の装置は、基板に所定の処
理を施す基板処理装置において、(a) 前記基板をほぼ
水平に支持するとともに当該基板を所定の方向に搬送さ
せつつ、当該基板の主面に洗浄液を供給する洗浄液供給
手段と、当該洗浄液供給手段によって前記基板に供給さ
れた前記洗浄液を乾燥処理する乾燥手段とを有する第１
処理部と、(b) 前記基板の主面にレジストを塗布する
塗布ユニットを含む複数の処理ユニットを有する第２処
理部と、(c) 下記の(c-1)〜(c-2)の要素、すなわち、
(c-1) 前記第１処理部から前記第２処理部に受渡すべ
き基板を前記第１処理部から受け取って保持する第１バ
ッファ手段と、(c-2) 前記第１バッファ手段から移送
される基板を蓄積可能な第２バッファ手段と、(c-3)
前記第１バッファ手段を介して前記第１処理部と前
記第２処理部との間で基板の受渡しを行う第１受渡し動
作と、 前記第１バッファ手段を介して前記第１処理
部から受け取った基板を前記第２バッファ手段に移送し
て一旦蓄積させた後、前記第２バッファ手段中の基板を
前記第２処理部に受渡す第２受渡し動作と、のいずれも
が可能とされた受渡手段と、を有する基板受渡部と、を
備えたことを特徴とする。 The apparatus of claim 7 is characterized in that the cleaning liquid supplied by the cleaning liquid supply means is an alkaline solution. Further, the apparatus according to claim 8 has a predetermined treatment on the substrate.
In a substrate processing apparatus that applies
Support the substrate horizontally and transport the substrate in the specified direction.
While supplying the cleaning liquid to the main surface of the substrate
Means for supplying the cleaning liquid to the substrate.
A drying means for drying the washed cleaning solution.
A processing part, and (b) applying a resist on the main surface of the substrate.
Second processing having a plurality of processing units including a coating unit
Science Department and (c) the following elements (c-1) to (c-2), that is,
(c-1) Transfer from the first processing unit to the second processing unit
A first substrate that receives and holds the substrate from the first processing unit.
Cuffer means, and (c-2) transfer from the first buffer means
Second buffer means capable of accumulating the substrate to be processed, (c-3)
Before the first processing unit via the first buffer means
The first transfer operation for transferring the substrate to and from the second processing unit.
And the first processing via the first buffer means.
Transfer the substrate received from the second section to the second buffer means
And then temporarily store the substrate in the second buffer means.
Any of the second delivery operation of delivering to the second processing unit
And a board transfer part having a transfer means capable of
It is characterized by having.
【００１７】[0017]
〔第１実施形態〕図１は、本発明の実施形態に係る基板
処理装置の構造を示す。図１（ａ）は、基板処理装置の
平面図であり、図１（ｂ）は、基板処理装置の正面図で
ある。[First Embodiment] FIG. 1 shows a structure of a substrate processing apparatus according to an embodiment of the present invention. FIG. 1A is a plan view of the substrate processing apparatus, and FIG. 1B is a front view of the substrate processing apparatus.
【００１８】図示のように、この基板処理装置は、ＡＧ
Ｖからカセット単位で搬送されてきた基板を受け入れて
後の連続処理のためにカセットから１枚ずつ基板を取り
出すインデクサ部１０と、取り出された基板を所定の洗
浄液で洗浄するための第１処理部である洗浄部２０と、
洗浄部２０とレジスト塗布現象部３０との間で受け渡さ
れる基板を一旦蓄積するとともに、洗浄部２０とレジス
ト塗布現像部３０との間で基板を受け渡す基板受渡部Ｉ
Ｆと、洗浄後の基板にレジスト塗布等の処理を行うため
の第２処理部であるレジスト塗布現像部３０と、レジス
ト塗布後の基板に周辺露光を行うとともにこの基板をス
テッパ５０に受け渡すインタフェース部４０とを備え
る。As shown, this substrate processing apparatus is
An indexer unit 10 for receiving the substrates conveyed from V in cassette units and taking out the substrates one by one from the cassette for subsequent continuous processing, and a first processing unit for cleaning the taken-out substrates with a predetermined cleaning liquid. A cleaning unit 20 which is
A substrate transfer unit I that temporarily accumulates the substrate transferred between the cleaning unit 20 and the resist coating phenomenon unit 30 and transfers the substrate between the cleaning unit 20 and the resist coating and developing unit 30.
F, a resist coating / developing unit 30 that is a second processing unit for performing processing such as resist coating on the cleaned substrate, and an interface that performs peripheral exposure on the substrate after resist coating and transfers the substrate to the stepper 50. And a section 40.
【００１９】インデクサ部１０は、４つのカセットＣＡ
のいずれかに収納された基板をインデクサロボットＩＮ
Ｄにより一枚ずつ取り出して、後述する洗浄部２０の基
板出入部２１に基板を受け渡すとともに、洗浄処理、レ
ジスト塗布現像処理、露光処理がそれぞれ施され、洗浄
部２０の基板出入部２１にある基板を、インデクサロボ
ットＩＮＤにより受け取り、４つのカセットＣＡのいず
れかに収納するものである。The indexer unit 10 includes four cassettes CA.
Substrates stored in any of the indexer robots IN
The substrates are taken out one by one by D, and the substrates are transferred to the substrate loading / unloading part 21 of the cleaning part 20 which will be described later. At the same time, the cleaning process, the resist coating / developing process, and the exposure process are performed, respectively, and the substrate loading / unloading part 21 of the cleaning part 20 is present. The substrate is received by the indexer robot IND and stored in one of the four cassettes CA.
【００２０】洗浄部２０は、レジスト塗布前の基板を水
平方向に順次搬送しながら一枚一枚連続的に洗浄するコ
ンベア方式の処理部分で、インデクサ部１０との間で基
板をやり取りする基板出入部２１と、受け入れた基板に
紫外線を照射するＵＶ処理部２２と、基板を水平姿勢か
ら基板の搬送方向に向かって左右方向に、水平面に対し
て傾斜角３゜から４０゜の範囲内で傾斜して傾斜姿勢に
変位させる基板傾斜部２３と、基板を傾斜姿勢で搬送し
つつ基板の上下表面に薬液処理を施す薬液洗浄部２４
と、基板の上下表面を純水で洗浄する純水洗浄部２５
と、水洗後の基板を乾燥させるエアーナイフ乾燥部２６
とを備える。The cleaning section 20 is a conveyor-type processing section for successively cleaning the substrates before resist coating in the horizontal direction while successively cleaning the substrates one by one. The cleaning section 20 transfers substrates to and from the indexer section 10. Part 21, a UV processing part 22 for irradiating the received substrate with ultraviolet rays, and tilting the substrate from the horizontal position in the left-right direction toward the substrate transport direction within a tilt angle range of 3 ° to 40 ° with respect to the horizontal plane. Substrate tilting part 23 for displacing it in a tilted posture, and chemical cleaning part 24 for carrying out chemical treatment on the upper and lower surfaces of the substrate while transporting the substrate in a tilted posture.
And a pure water cleaning unit 25 for cleaning the upper and lower surfaces of the substrate with pure water.
And an air knife drying unit 26 for drying the substrate after washing with water
With.
【００２１】受渡部ＩＦは、エアーナイフ乾燥部２６で
乾燥され、傾斜姿勢で搬送された基板を、傾斜姿勢から
水平姿勢に変位させた後、後述するバッファ部に一旦蓄
積する。そして、バッファ部に一旦蓄積した基板を、受
渡手段である搬送ロボットＴＲによって、レジスト塗布
現像部３０の基板出入部ＴＲＰ１に受け渡す。The delivery unit IF displaces the substrate dried in the air knife drying unit 26 and conveyed in the inclined posture from the inclined posture to the horizontal posture, and then temporarily stores it in the buffer unit described later. Then, the substrate once accumulated in the buffer unit is delivered to the substrate loading / unloading unit TRP1 of the resist coating / developing unit 30 by the transfer robot TR which is a delivery unit.
【００２２】一方、インターフェース部４０を介して、
ステッパ５０で露光され、レジスト塗布現像部３０で現
像処理が終了した基板は、基板出入部ＴＲＰ１から、基
板受渡部ＩＦの搬送ロボットＴＲを介してシャトル搬送
部２９に渡される。このシャトル搬送部２９は、基板を
搬送して基板出入部２１まで移動させる。On the other hand, through the interface section 40,
The substrate that has been exposed by the stepper 50 and has completed the developing process in the resist coating / developing unit 30 is transferred from the substrate loading / unloading unit TRP1 to the shuttle transfer unit 29 via the transfer robot TR of the substrate transfer unit IF. The shuttle transport unit 29 transports the substrate and moves it to the substrate loading / unloading unit 21.
【００２３】レジスト塗布現像部３０は、搬送ロボット
が往復自在に移動して、複数の処理ユニットのうちの任
意の処理ユニットに基板を所定の順席で逐次搬送するロ
ボット逐次搬送方式の処理部であり、洗浄部２０で洗浄
された基板にレジストを塗布して基板の主面にレジスト
膜を形成するとともに、ステッパ５０で露光され所定の
パターンが焼き付けられたレジスト膜に現像処理を施す
ものである。レジスト塗布現像部３０は、上記のような
一連の基板処理を施すため、水平方向に配列されるとと
もに互いに積層された複数の処理ユニットに分かれてお
り、処理対象である基板は、処理ユニットの配列されて
いる水平方向に沿って移動可能な複数の搬送手段である
搬送ロボットＴＲ1〜ＴＲ3によって、各処理ユニット間
を所定の手順で循環的に搬送される。処理ユニットとし
て、下段側には、基板の主面（上側表面）にレジストを
塗布する塗布ユニットであるスピンコータＳＣ、基板の
端面に塗布されたレジストを除去する端面洗浄ユニット
ＥＢＲ、ステッパ５０で所定のパターンが焼き付けられ
たレジスト膜を現像処理するための現像ユニットである
スピンデベロッパＳＤ1〜ＳＤ3等が設けられている。ま
た、上段側には、基板に脱水乾燥処理を行うデハイドベ
ークユニットＤＢ、基板へのレジスト塗布前に基板に対
するレジストの密着力を強化させる密着強化処理を行う
密着強化ユニットＡＰ、レジスト乾燥のために熱処理を
行うソフトベークユニットＳＢ、レジスト現像後の基板
を乾燥させるハードベークユニットＨＢ、露光機５０に
よって所定のパターンが焼き付けられたレジスト膜を有
する基板を乾燥処理する露光後ベークユニットＰＥＢ、
基板を冷却するクーリングプレートＣＰ１〜ＣＰ４基板
を冷却するとともに、搬送ロボットＴＲ１と搬送ロボッ
トＴＲ２との間での基板の受け渡し部として機能するク
ーリングプレートＩＭＣ１、基板を冷却するとともに、
搬送ロボットＴＲ２と搬送ロボットＴＲ３との間での基
板の受け渡し部として機能するクーリングプレートＩＭ
Ｃ２、が設けられている。The resist coating / developing unit 30 is a processing unit of a robot sequential transfer system in which a transfer robot moves reciprocally and sequentially transfers substrates to arbitrary processing units among a plurality of processing units in a predetermined order. The resist is applied to the substrate cleaned by the cleaning unit 20 to form a resist film on the main surface of the substrate, and the resist film exposed by the stepper 50 and having a predetermined pattern baked is developed. . The resist coating / developing unit 30 is divided into a plurality of processing units that are arranged in the horizontal direction and stacked on each other in order to perform the series of substrate processing as described above. The transfer robots TR1 to TR3, which are a plurality of transfer means movable in the horizontal direction, are cyclically transferred between the processing units in a predetermined procedure. As the processing unit, on the lower side, a spin coater SC that is a coating unit that coats the resist on the main surface (upper surface) of the substrate, an edge cleaning unit EBR that removes the resist coated on the edge of the substrate, and a stepper 50 are provided. Spin developers SD1 to SD3, which are developing units for developing the resist film having the pattern printed thereon, are provided. Further, on the upper side, a dehydration bake unit DB for dehydrating and drying the substrate, an adhesion enhancing unit AP for performing an adhesion enhancing process for enhancing the adhesion of the resist to the substrate before applying the resist to the substrate, and a resist drying unit. A soft bake unit SB for performing heat treatment, a hard bake unit HB for drying the substrate after resist development, a post-exposure bake unit PEB for drying a substrate having a resist film having a predetermined pattern baked by the exposure device 50,
Cooling Plates CP1 to CP4 for Cooling the Substrate While cooling the substrate, the cooling plate IMC1, which functions as a substrate transfer unit between the transfer robot TR1 and the transfer robot TR2, cools the substrate,
A cooling plate IM that functions as a substrate transfer unit between the transfer robot TR2 and the transfer robot TR3.
C2 is provided.
【００２４】図２は、洗浄部２０の構造をより詳細に示
す斜視図である。基板出入部２１では、インデクサ部１
０のカセットＣＡからインデクサロボットＩＮＤによっ
て一枚ずつ取り出された基板Ｗ1を受け取る。ここで受
け取られた基板Ｗ1は、複数の搬送ローラ（図示せず）
で支持されて水平に順次搬送され、ＵＶ処理部２２まで
移動する。ＵＶ処理部２２では、基板Ｗ1表面に紫外線
照射を照射して基板Ｗ1表面の油脂成分等を灰化させ
る。紫外線処理された基板Ｗ1は、複数の搬送ローラ
（図示せず）を利用した水平搬送によって直進した後、
そのままの姿勢で直交方向に進行方向を変更し、基板傾
斜部２３まで水平移動する。この基板傾斜部２３では、
後の洗浄処理の便宜のために、姿勢変位機構（図示せ
ず）によって水平姿勢の基板Ｗ1を基板の搬送方向に向
って左右方向に、水平面に対する傾斜角３゜〜４０゜の
範囲で傾斜させた傾斜姿勢に搬送ローラＲとともに変位
させる。これは、基板Ｗ1上に供給された洗浄液に一方
向への流れを形成して、基板Ｗ1上の洗浄液の置換やパ
ーティクルの除去を効率化するためである。薬液洗浄部
２４では、基板傾斜部２３から傾いたままで後述する複
数の搬送ローラＲ上を搬送されてきた基板Ｗ1の表面に
アルカリ溶液を供給して薬液洗浄を行う。純水洗浄部２
５では、傾斜姿勢で搬送ローラＲ上を搬送されてきた基
板Ｗ1の表面に純水を供給して純水洗浄を行う。エアー
ナイフ乾燥部２６では、基板Ｗ1の表面に付着した純水
を清浄化された加圧空気で液切りすることによって基板
Ｗ1を乾燥させる。FIG. 2 is a perspective view showing the structure of the cleaning section 20 in more detail. In the substrate loading / unloading section 21, the indexer section 1
The substrates W1 taken out one by one from the cassette CA of 0 by the indexer robot IND are received. The substrate W1 received here has a plurality of transport rollers (not shown).
It is supported by, is sequentially transported horizontally, and moves to the UV processing unit 22. In the UV processing unit 22, the surface of the substrate W1 is irradiated with ultraviolet rays to ash the oil and fat components on the surface of the substrate W1. The substrate W1 which has been subjected to the ultraviolet ray treatment advances straight by horizontal conveyance using a plurality of conveyance rollers (not shown),
With the posture as it is, the traveling direction is changed to the orthogonal direction and the substrate is moved horizontally to the inclined portion 23. In this substrate inclined portion 23,
For convenience of the subsequent cleaning process, the horizontal displacement substrate W1 is tilted in the horizontal direction toward the substrate transport direction by a posture displacement mechanism (not shown) within a tilt angle range of 3 ° to 40 ° with respect to the horizontal plane. It is displaced together with the transport roller R in the inclined posture. This is to form a flow in one direction in the cleaning liquid supplied onto the substrate W1 so as to efficiently replace the cleaning liquid on the substrate W1 and remove particles. In the chemical cleaning section 24, the alkaline solution is supplied to the surface of the substrate W1 which has been conveyed on a plurality of conveying rollers R described later while being inclined from the substrate inclination section 23 to perform the chemical cleaning. Pure water cleaning unit 2
In step 5, pure water is supplied to the surface of the substrate W1 that has been conveyed on the conveyance roller R in an inclined posture to perform pure water cleaning. In the air knife drying unit 26, the substrate W1 is dried by draining pure water attached to the surface of the substrate W1 with purified pressurized air.
【００２５】図３は、薬液洗浄部２４、純水洗浄部２５
及びエアーナイフ乾燥部２６における処理の概要をより
詳細に説明する模式図である。複数の搬送ローラＲは、
基板の進行方向に沿って並列に配置され、基板を一枚ず
つ傾斜姿勢で保持するとともに、前述の基板傾斜部２
３、薬液洗浄部２４、純水洗浄部２５、エアーナイフ乾
燥部２６、後述する基板受渡部ＩＦの基板取出部２７に
順次、複数の基板を搬送するものである。ブラシ洗浄手
段である薬液洗浄部２４では、基板傾斜部２３側から搬
送されてきた基板Ｗ1の表面に第１の洗浄液供給手段で
あるノズル１２４からのアルカリ溶液が供給され、ロー
ルブラシ２２４によって基板Ｗ1の上下面の油脂成分等
が除去される。次に、純水洗浄部２５では、第２の洗浄
液供給手段である純水ノズル１２５から吐出される純水
のカーテンによって基板Ｗ1の上下面のアルカリ溶液等
が流される。さらに、基板Ｗ1は、第３の洗浄液供給手
段である高圧ノズル２２５からの高圧の洗浄水によって
高圧スプレー洗浄され、第４の洗浄液供給手段である超
音波洗浄装置３２５から超音波振動を与えた洗浄水を供
給することによってさらに洗浄される。最後に、乾燥手
段であるエアーナイフ乾燥部２６では、ノズル１２６か
らの加圧空気によって基板Ｗ1の上下表面の液切りが行
われる。FIG. 3 shows a chemical cleaning section 24 and a pure water cleaning section 25.
FIG. 6 is a schematic diagram for explaining the outline of the processing in the air knife drying unit 26 in more detail. The plurality of transport rollers R are
The substrates are arranged in parallel along the traveling direction of the substrates to hold the substrates one by one in a tilted posture, and the above-described substrate tilting portion 2 is provided.
3, a chemical cleaning unit 24, a pure water cleaning unit 25, an air knife drying unit 26, and a substrate take-out unit 27 of a substrate transfer unit IF, which will be described later, sequentially convey a plurality of substrates. In the chemical cleaning unit 24, which is the brush cleaning unit, the alkaline solution is supplied from the nozzle 124, which is the first cleaning liquid supply unit, to the surface of the substrate W1 that has been conveyed from the substrate inclined unit 23 side, and the substrate W1 is supplied by the roll brush 224. Oil and fat components on the upper and lower surfaces are removed. Next, in the pure water cleaning unit 25, the alkaline solution or the like on the upper and lower surfaces of the substrate W1 is caused to flow by the curtain of pure water discharged from the pure water nozzle 125 which is the second cleaning liquid supply means. Further, the substrate W1 is subjected to high-pressure spray cleaning with high-pressure cleaning water from the high-pressure nozzle 225 which is the third cleaning liquid supply means, and ultrasonic cleaning is applied from the ultrasonic cleaning device 325 which is the fourth cleaning liquid supply means. It is further washed by supplying water. Finally, in the air knife drying unit 26 which is a drying means, the upper and lower surfaces of the substrate W1 are drained by the pressurized air from the nozzle 126.
【００２６】再び、図２に戻って、エアーナイフ乾燥部
２６を経て乾燥された基板Ｗ１は、傾斜姿勢のままで複
数の搬送ローラＲによって基板受渡部ＩＦの基板取出部
２７に搬送される。基板取出部２７に搬送された基板Ｗ
１は、複数の搬送ローラＲとともに、姿勢変位機構（図
示せず）によって傾斜姿勢から水平姿勢に変位される。
そして、水平姿勢に変位した基板Ｗ１は、フォーク状の
リフタ２８に保持されて上方の退避位置まで移動する。Returning to FIG. 2 again, the substrate W1 dried through the air knife drying section 26 is conveyed to the substrate take-out section 27 of the substrate transfer section IF by a plurality of conveying rollers R while keeping the inclined posture. The substrate W transported to the substrate unloading section 27
1, along with the plurality of transport rollers R, is displaced from an inclined posture to a horizontal posture by a posture displacement mechanism (not shown).
Then, the substrate W1 displaced in the horizontal posture is held by the fork-shaped lifter 28 and moves to the upper retracted position.
【００２７】図４は、洗浄部２０又はレジスト塗布現像
部３０における基板Ｗ1の処理時間（処理タクト）と搬
送ロボットＴＲの搬送タイミングとの差を調整するため
のバッファ手段であるリフタ２８の構造を示す図であ
る。このリフタ２８の本体部分２２８からは、一対の支
持棒１２８、１２８が基板の搬送行路上に延びている。
各支持棒１２８には、基板Ｗ1を支持するための複数の
ツメ１２８ａが設けられている。各支持棒１２８は、本
体部分２２８内部に設けた駆動機構（図示せず）によっ
て、それぞれ同時に上下動するとともに、同時かつ互い
に反対方向に回転可能となっている。各支持棒１２８に
設けたツメ１２８ａを互いに離間する方向に回転させた
開状態とすると、各支持棒１２８は基板取出部２７に設
けられた複数の搬送ローラＲに水平姿勢で保持された基
板Ｗ1に干渉されることなく上下動可能となる。一方、
各支持棒１２８に設けたツメ１２８ａを互いに近づく方
向に回転させた開状態とすると、ツメ１２８ａの先端が
基板Ｗ1の両端を下面側から支持できるので、基板Ｗ1は
一対の支持棒１２８に保持されて上下動可能となる。FIG. 4 shows the structure of a lifter 28 which is a buffer means for adjusting the difference between the processing time (processing tact) of the substrate W1 in the cleaning section 20 or the resist coating / developing section 30 and the transfer timing of the transfer robot TR. FIG. From the main body portion 228 of the lifter 28, a pair of support bars 128, 128 extend on the substrate transfer path.
Each support rod 128 is provided with a plurality of tabs 128a for supporting the substrate W1. A drive mechanism (not shown) provided inside the main body portion 228 allows the support bars 128 to move up and down at the same time and to rotate simultaneously and in opposite directions. When the claws 128a provided on the respective support bars 128 are rotated in a direction in which they are separated from each other and brought into an open state, the respective support bars 128 are held horizontally by the plurality of transport rollers R provided on the substrate unloading section 27. It can move up and down without being interfered by. on the other hand,
When the claws 128a provided on the support rods 128 are rotated in a direction toward each other and brought into the open state, the tips of the claws 128a can support both ends of the substrate W1 from the lower surface side, so that the substrate W1 is held by the pair of support rods 128. Can be moved up and down.
【００２８】動作について説明すると、基板Ｗ1は、複
数の搬送ローラＲによって、傾斜姿勢で保持されつつエ
アーナイフ乾燥部２６から基板取出部２７まで搬送され
た後、静止させられる。次に基板Ｗ1は、姿勢変位機構
（図示せず）により搬送ローラとともに水平姿勢に変位
させられる。このとき、一対の支持棒１２８は、搬送ロ
ーラＲの上方の退避位置に退避している。そして、一対
の支持棒１２８は、水平姿勢にある基板Ｗ1の両端の高
さ位置（搬送位置）まで、ツメ１２８ａを開状態にして
下降する。搬送位置まで下降した一対の支持棒１２８
は、それぞれ回転してツメ１２８ａを開状態とし、ツメ
１２８ａの先端を基板Ｗ1の両端の下主面に当接させた
後、退避位置まで上昇して、基板Ｗ1の両端を下主面か
らツメ１２８ａで支持しつつ、基板Ｗ1を退避位置まで
搬送する。In operation, the substrate W1 is held in an inclined posture by a plurality of transport rollers R, transported from the air knife drying unit 26 to the substrate unloading unit 27, and then stopped. Next, the substrate W1 is horizontally displaced together with the transport roller by an attitude displacement mechanism (not shown). At this time, the pair of support bars 128 are retracted to the retracted position above the transport roller R. Then, the pair of support bars 128 descends to the height positions (conveyance positions) at both ends of the substrate W1 in the horizontal posture with the claws 128a in the open state. A pair of support bars 128 lowered to the transfer position
Respectively rotate the claws 128a to the open state, bring the tips of the claws 128a into contact with the lower main surfaces of both ends of the substrate W1, and then move up to the retracted position, so that both ends of the substrate W1 are clawed from the lower main surface. The substrate W1 is transported to the retracted position while being supported by 128a.
【００２９】図２に戻って、基板受渡部ＩＦに設けられ
た搬送ロボットＴＲは、案内レール（図示せず）に沿っ
て、基板取出部２７に対して進退するように図２のＹ方
向に沿って往復運動するロボット本体７２と、ロボット
本体７２に対して伸縮、回転及び昇降する多関節型のア
ーム７１と、基板Ｗ1を下主面から保持するハンド７０
とを有している。この搬送ロボットＴＲによって、基板
取出部２７の退避位置で一対の支持棒１２８により支持
された基板Ｗ1を、レジスト塗布現像部３０に設けられ
た基板出入部ＴＲＰ１に搬送する。具体的に説明する
と、まず、ロボット本体７２は、基板取出部２７の直前
まで前進した後、アーム７１を伸ばしてハンド７０を、
退避位置で支持棒１２８により支持された基板Ｗ1の下
方に挿入する。次にアーム７１を上昇させてハンド７０
により基板Ｗ1を支持棒１２８から受け取った後、アー
ム７１を縮める。そして、ハンド７０で基板Ｗ1を保持
した状態でロボット本体７２は基板出入部ＴＲＰ１の直
前まで後退した後、アーム７１を図２のＸ方向に沿って
伸ばしつつ回転させて、基板Ｗ1とともにハンド７０を
基板出入部ＴＲＰ１に設けられた基板受台（図示せず）
の上方に挿入する。次にアーム７１を下降させて基板Ｗ
1を基板受台に受け渡す。このように、基板出入部ＴＲ
Ｐ１の基板受台に搬送された基板Ｗ1は、レジスト塗布
現像部３０に設けられた搬送ロボットＴＲ１（図１）に
よって、レジスト塗布現像部３０の所定の処理ユニッ
ト、例えばデハイドベークＤＢに搬送される。Returning to FIG. 2, the transfer robot TR provided in the substrate transfer section IF moves in the Y direction of FIG. 2 so as to move back and forth with respect to the substrate unloading section 27 along a guide rail (not shown). A robot main body 72 that reciprocates along the robot main body 72, an articulated arm 71 that expands, contracts, rotates, and moves up and down with respect to the robot main body 72, and a hand 70 that holds the substrate W1 from the lower main surface.
And have. The transport robot TR transports the substrate W1 supported by the pair of support rods 128 at the retracted position of the substrate unloading unit 27 to the substrate loading / unloading unit TRP1 provided in the resist coating / developing unit 30. More specifically, first, the robot main body 72 advances to the position just before the substrate unloading section 27, then extends the arm 71 to move the hand 70,
It is inserted below the substrate W1 supported by the support rod 128 at the retracted position. Next, the arm 71 is raised to raise the hand 70.
After receiving the substrate W1 from the support rod 128 by, the arm 71 is retracted. Then, after holding the substrate W1 with the hand 70, the robot main body 72 retracts to the position immediately before the substrate loading / unloading part TRP1, and then rotates the arm 71 while extending it along the X direction in FIG. A substrate pedestal (not shown) provided in the substrate loading / unloading section TRP1
Insert above. Next, the arm 71 is lowered to move the substrate W
Transfer 1 to the board pedestal. In this way, the board loading / unloading part TR
The substrate W1 transported to the substrate pedestal P1 is transported by the transport robot TR1 (FIG. 1) provided in the resist coating and developing unit 30 to a predetermined processing unit of the resist coating and developing unit 30, for example, dehydration bake DB.
【００３０】上述のように洗浄部２０により洗浄処理を
終えた基板Ｗ1を、搬送ロボットＴＲに受け渡す前に、
支持棒１２８により一時的に保持することにより、基板
Ｗ1を一旦蓄積することができる。すなわち、搬送ロボ
ットＴＲが基板Ｗ1を搬送している途中であっても、次
の基板（Ｗ2とする）は、支持棒１２８に保持されてい
るので、さらに次の基板（Ｗ3とする）を基板取出部２
７に受け入れることが可能となり、洗浄部２０の連続的
な洗浄処理を中断することなく、基板（Ｗ1、Ｗ2、Ｗ
3、…）を洗浄部２０からレジスト塗布現像部３０へ連
続して搬送することができる。Before the substrate W1 which has been cleaned by the cleaning unit 20 as described above is transferred to the transfer robot TR,
The substrate W1 can be temporarily stored by temporarily holding it by the support rod 128. That is, even while the transfer robot TR is transferring the substrate W1, the next substrate (referred to as W2) is held by the support rod 128, so that the next substrate (referred to as W3) is transferred to the substrate. Extraction part 2
It is possible to accept the substrate (W1, W2, W) without interrupting the continuous cleaning process of the cleaning unit 20.
, ...) can be continuously conveyed from the cleaning unit 20 to the resist coating and developing unit 30.
【００３１】また、支持棒１２８の退避位置の上方に
は、複数の基板、例えば２０枚程度を収納可能なバッフ
ァカセットＢＣＡ（図２）が設けられている。このバッ
ファカセットＢＣＡは、洗浄部２０において一枚の基板
を洗浄処理する時間（処理タクト）が、洗浄部２０より
後工程である例えば、レジスト塗布現像部３０部におけ
る処理タクトとよりも小さくその差が大きい場合や、洗
浄部２０より後工程である例えばレジスト塗布現像部３
０に故障が生じ、その処理が中断している場合に用いら
れるものである。具体的に説明すると、上述のように処
理タクトの差が大きい場合などは、基板受渡部ＩＦの搬
送ロボットＴＲが保持している基板Ｗ1より前に洗浄処
理された基板（Ｗ0とする）がレジスト塗布現像部３０
の基板出入部ＴＲＰ１の基板受台からレジスト塗布現像
部３０の搬送ロボットＴＲによって受け取られずに停滞
し、基板受渡部ＩＦの搬送ロボットＴＲは、基板Ｗ1を
基板出入部ＴＲＰ１に受け渡せない。このような場合、
搬送ロボットＴＲは、その保持する基板Ｗ1をバッファ
カセットＢＣＡに収納した後、基板出入部ＴＲＰ１の基
板Ｗ0が搬送ロボットＴＲ1によって搬送されるまで、順
次、支持棒１２８に保持された基板（Ｗ2、Ｗ3…）を受
け取ってバッファカセットＢＣＡに収納する。A buffer cassette BCA (FIG. 2) capable of accommodating a plurality of substrates, for example, about 20 is provided above the retracted position of the support rod 128. In this buffer cassette BCA, the time (processing tact) for cleaning one substrate in the cleaning unit 20 is smaller than the processing tact in the resist coating / developing unit 30 which is a post process of the cleaning unit 20, and the difference therebetween. Is large, or a process subsequent to the cleaning unit 20, for example, the resist coating / developing unit 3
It is used when a failure occurs in 0 and the processing is interrupted. More specifically, when the difference between the processing tacts is large as described above, the substrate (which is referred to as W0) that has been subjected to the cleaning process before the substrate W1 held by the transfer robot TR of the substrate transfer part IF is registered. Coating and developing unit 30
The transfer robot TR of the resist coating / developing unit 30 stagnates because it is not received from the substrate receiving / receiving unit TRP1 of the substrate loading / unloading unit TRP1, and the transfer robot TR of the substrate transfer unit IF cannot transfer the substrate W1 to the substrate loading / unloading unit TRP1. In such cases,
After the substrate W1 held by the transport robot TR is stored in the buffer cassette BCA, the substrates W0 and W3 held by the support rod 128 are sequentially held until the substrate W0 in the substrate loading / unloading section TRP1 is transported by the transport robot TR1. ...) is received and stored in the buffer cassette BCA.
【００３２】基板出入部ＴＲＰ１の基板Ｗ0が搬送ロボ
ットＴＲ１によって搬送されると、搬送ロボットＴＲ
は、バッファカセットＢＣＡから基板Ｗ0の次の基板Ｗ1
を取り出して、基板出入部ＴＲＰ１に搬送する。そし
て、搬送ロボットＴＲは、順次、基板（Ｗ2、Ｗ3…）を
バッファカセットＢＣＡから基板出入部ＴＲＰ１へ、い
わゆるＦＩＦＯ（ファーストイン・ファーストアウト）
方式で搬送する。When the substrate W0 of the substrate loading / unloading section TRP1 is transported by the transport robot TR1, the transport robot TR
Is the next substrate W1 from the buffer cassette BCA to the substrate W0.
Is taken out and conveyed to the substrate loading / unloading section TRP1. Then, the transfer robot TR sequentially transfers the substrates (W2, W3 ...) From the buffer cassette BCA to the substrate loading / unloading section TRP1, so-called FIFO (first in / first out).
Transport by method.
【００３３】上述のように、洗浄部２０で洗浄処理を終
えた基板を順次、バッファカセットＢＣＡに収納するこ
とにより、基板出入部ＴＲＰ１に基板が停滞していて
も、洗浄部２０における洗浄処理を途中で中断すること
を防止できて、以下のような問題を解決することができ
る。すなわち、洗浄部２０において洗浄処理を途中で中
断すると、搬送ローラ２０による基板の搬送を停止する
こととなり、例えば、薬液洗浄部２４において、過剰な
アルカリ溶液が基板の一部分に供給されるとともに、所
定の時間よりも長く、ロールブラシ２４によって基板の
一部分のみが洗浄されることとなるので、洗浄処理の中
断が解消された後に、洗浄処理を終えた基板に洗浄ムラ
や傷が発生するという問題が生じる。この問題を解決す
るために、インデクサ部１０から洗浄部２０への基板の
供給を一時的に停止する方法も考えられるが、この方法
では、例えばレジスト塗布現像装置３０の予測できない
故障に対応できないし、洗浄部２０における洗浄処理を
中断することになるので、基板の処理能力が低下すると
いった別の問題が発生する。As described above, the substrates that have undergone the cleaning process in the cleaning unit 20 are sequentially stored in the buffer cassette BCA, so that the cleaning process in the cleaning unit 20 can be performed even if the substrates are stagnant in the substrate loading / unloading unit TRP1. It is possible to prevent the interruption on the way and solve the following problems. That is, if the cleaning process is interrupted in the cleaning unit 20, the transfer of the substrate by the transfer roller 20 is stopped, and, for example, in the chemical cleaning unit 24, an excessive alkaline solution is supplied to a part of the substrate and a predetermined amount of the alkaline solution is supplied. Since the roll brush 24 cleans only a part of the substrate for a longer time than the above, there is a problem that uneven cleaning and scratches occur on the substrate after the cleaning process after the interruption of the cleaning process is eliminated. Occurs. In order to solve this problem, a method of temporarily stopping the supply of the substrate from the indexer section 10 to the cleaning section 20 can be considered, but this method cannot cope with an unexpected failure of the resist coating and developing apparatus 30, for example. Since the cleaning process in the cleaning unit 20 is interrupted, another problem occurs that the processing capacity of the substrate is reduced.
【００３４】一方、レジスト塗布現像部３０で現像処理
を終了した基板ＷZは、基板出入部ＴＲＰ１から、洗浄
部２０側の搬送ロボットＴＲを介してシャトル搬送部２
９に受け渡される。具体的には、搬送ロボットＴＲが基
板出入部ＴＲＰ１からの処理済みの基板ＷZを受け取っ
て、この基板をシャトル搬送部２９の一端に設けたター
ンテーブル１２９上に移載する。基板Ｗ2は、ターンテ
ーブル１２９に真空吸着により保持されてこれとともに
９０゜回転し、インデクサ部１０への受け渡しが可能な
向きになる。この状態でターンテーブル１２９が上昇
し、基板ＷZは、スライドハンド２２９に受け渡され
る。具体的には、スライドハンド２２９をターンテーブ
ル１２９の位置まで移動させると、スライドハンド２２
９の本体直下に基板ＷZが相対的に移動する。この状態
で、ターンテーブル１２９を降下させ吸着状態を解除せ
せると、スライドハンド２２９両端に設けたフック２２
９ａ、２２９ａに基板ＷZが保持される。基板ＷZを保持
したスライドハンド２２９は、シャトル搬送部２９の長
手方向（図２の−Ｘ方向）に沿って移動し、基板ＷZを
基板出入部２１まで移動させる。基板出入部２１まで移
動させられた基板ＷZは、インデクサ部１０側に設けた
搬送ロボットＩＮＤに受け渡される。搬送ロボットＩＮ
Ｄは、搬送ロボットＴＲと同一構造を有し基板ＷZを４
つのカセットＣＡのいずれかに収納する。On the other hand, the substrate WZ, which has undergone the developing process in the resist coating / developing unit 30, is transferred from the substrate loading / unloading unit TRP1 to the shuttle transport unit 2 via the transport robot TR on the cleaning unit 20 side.
Handed over to 9. Specifically, the transport robot TR receives the processed substrate WZ from the substrate loading / unloading section TRP1 and transfers the substrate onto a turntable 129 provided at one end of the shuttle transport unit 29. The substrate W2 is held on the turntable 129 by vacuum suction and rotates 90 ° with it, so that the substrate W2 can be transferred to the indexer unit 10. In this state, the turntable 129 rises and the substrate WZ is transferred to the slide hand 229. Specifically, when the slide hand 229 is moved to the position of the turntable 129, the slide hand 22
The substrate WZ moves relative to the body 9 directly below. In this state, when the turntable 129 is lowered to release the suction state, the hooks 22 provided at both ends of the slide hand 229 are provided.
The substrate WZ is held on 9a and 229a. The slide hand 229 holding the substrate WZ moves along the longitudinal direction of the shuttle transport unit 29 (-X direction in FIG. 2) to move the substrate WZ to the substrate loading / unloading unit 21. The substrate WZ moved to the substrate loading / unloading section 21 is delivered to the transfer robot IND provided on the indexer section 10 side. Transport robot IN
D has the same structure as the transfer robot TR and has four substrates WZ.
Store in one of the two cassettes CA.
【００３５】〔第２実施形態〕第１実施形態の基板処理
装置の変形として、図２に示すような洗浄部２０を成膜
装置の前段に配置した基板処理装置とすることも可能で
ある。[Second Embodiment] As a modification of the substrate processing apparatus of the first embodiment, it is possible to use a substrate processing apparatus in which the cleaning unit 20 as shown in FIG. 2 is arranged in the preceding stage of the film forming apparatus.
【００３６】図５は、第２実施形態に係る成膜用の基板
処理装置の構成を示すブロック図である。この基板処理
装置は、図１と同一構造のインデクサ部１０と、図１と
同一構造の洗浄部２０と、例えば洗浄後の液晶用ガラス
基板に電極膜を形成するための第２処理部であるプラズ
マＣＶＤ法やスパッタリング法を用いた成膜部９０とを
備える。成膜部９０には、基板にＩＴＯ等の金属膜を形
成する成膜用チャンバ９１と、基板出入部ＴＲＰ１で受
け入れた基板を成膜用チャンバ９１まで搬送する搬送ロ
ボットＴＲ4とを備える。動作について簡単に説明する
と、インデクサ部１０でカセットから取り出された基板
は、洗浄部２０側に受け渡され、ＵＶ処理部２２で紫外
線照射処理がなされ、基板傾斜部２３を経て、薬液洗浄
部２４で薬液洗浄が行われ、純水洗浄部２５で純水洗浄
が行われる。基板は、乾燥後に基板受渡部ＩＦに設けた
搬送ロボットＴＲによって、成膜部９０に設けた基板出
入部ＴＲＰ１に搬送される。基板出入部ＴＲＰ１で受け
入れた基板は、搬送ロボットＴＲ4によって、成膜用チ
ャンバ９１まで搬送されて成膜用チャンバ９１内で成膜
処理が行われる。成膜用チャンバ９１から取り出された
成膜後の基板は、搬送ロボットＴＲ4によって、基板出
入部ＴＲＰ１まで搬送される。基板出入部ＴＲＰ１に移
された成膜後の基板は、搬送ロボットＴＲによって、シ
ャトル搬送部２９の一端に移載され、このシャトル搬送
部２９を搬送されて、インデクサ部１０においてカセッ
ト中に収容される。FIG. 5 is a block diagram showing the arrangement of a substrate processing apparatus for film formation according to the second embodiment. This substrate processing apparatus is an indexer unit 10 having the same structure as in FIG. 1, a cleaning unit 20 having the same structure as in FIG. 1, and a second processing unit for forming an electrode film on a cleaned glass substrate for liquid crystal, for example. A film forming unit 90 using a plasma CVD method or a sputtering method is provided. The film forming unit 90 includes a film forming chamber 91 for forming a metal film such as ITO on the substrate, and a transfer robot TR4 for transferring the substrate received by the substrate loading / unloading unit TRP1 to the film forming chamber 91. To briefly explain the operation, the substrate taken out from the cassette in the indexer unit 10 is transferred to the cleaning unit 20 side, subjected to ultraviolet irradiation treatment in the UV processing unit 22, passed through the substrate tilting unit 23, and passed through the chemical cleaning unit 24. The chemical solution cleaning is performed in step 1, and the pure water cleaning unit 25 performs pure water cleaning. After drying, the substrate is transferred to the substrate loading / unloading unit TRP1 provided in the film forming unit 90 by the transport robot TR provided in the substrate delivery unit IF. The substrate received by the substrate loading / unloading section TRP1 is transferred to the film forming chamber 91 by the transfer robot TR4, and the film forming process is performed in the film forming chamber 91. The substrate after the film formation taken out from the film formation chamber 91 is transferred to the substrate loading / unloading part TRP1 by the transfer robot TR4. The substrate after film formation transferred to the substrate loading / unloading unit TRP1 is transferred to one end of the shuttle transport unit 29 by the transport robot TR, transported by the shuttle transport unit 29, and accommodated in the cassette in the indexer unit 10. It
【００３７】以上、実施形態に即してこの発明を説明し
たが、この発明は上記実施形態に限定されるものではな
い。例えば、洗浄部２０の構成は自由であり、ＵＶ処理
部２２や薬液洗浄部２４は必ずしも設ける必要がない。
また、純水洗浄部２５の構成も自由である。Although the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments. For example, the configuration of the cleaning unit 20 is arbitrary, and the UV processing unit 22 and the chemical cleaning unit 24 do not necessarily have to be provided.
The configuration of the pure water cleaning unit 25 is also free.
【００３８】また、洗浄部２０において基板Ｗ1を複数
の搬送ローラＲによって搬送する際の基板の姿勢は、傾
斜姿勢ではなく水平姿勢とすることもできる。尚、本発
明におけるほぼ水平に支持された基板とは、上述の水平
姿勢（水平面に対する傾斜角０゜）から傾斜姿勢（水平
面に対する傾斜角３゜から４０゜の範囲）の範囲内で支
持された基板のことである。Further, the posture of the substrate when the substrate W1 is transported by the plurality of transport rollers R in the cleaning section 20 may be a horizontal posture instead of the inclined posture. The substrate which is supported substantially horizontally in the present invention is supported in the range from the above-mentioned horizontal posture (inclination angle 0 ° to the horizontal plane) to inclination posture (inclination angle 3 ° to 40 ° relative to the horizontal plane). It is a substrate.
【００３９】また、エアーナイフ乾燥部２６の代わりに
スピンドライ装置を配置することも可能である。It is also possible to dispose a spin dryer instead of the air knife dryer 26.
【００４０】また、シャトル搬送部２９も不可欠ではな
く、搬送ロボットＴＲによって基板出入部ＴＲＰ１から
基板出入部２１まで基板を移送することもできる。Further, the shuttle transfer unit 29 is not essential, and the transfer robot TR can transfer the substrate from the substrate loading / unloading unit TRP1 to the substrate loading / unloading unit 21.
【００４１】また、第２実施形態で、レジスト塗布現像
部３０の配置構成も自由であり、搬送ロボットの数も必
要に応じて適宜変更可能である。Further, in the second embodiment, the resist coating / developing section 30 can be arranged freely, and the number of transfer robots can be changed as required.
【００４２】また、第１実施形態で、レジスト塗布現像
部３０を利用する処理は不可欠でなく、洗浄部２０のみ
を利用する処理を行わせることもできる。この場合、イ
ンデクサ部１０でカセットから取り出された基板は、洗
浄部２０側に受け渡され、紫外線照射処理、薬液洗浄、
純水洗浄等が行われる。洗浄後の基板は、乾燥後に基板
受渡部ＩＦに設けた搬送ロボットＴＲによって、シャト
ル搬送部２９の一端に移載され、このシャトル搬送部２
９を搬送されて、インデクサ部１０においてカセット内
に収容される。In the first embodiment, the processing using the resist coating / developing section 30 is not essential, and the processing using only the cleaning section 20 can be performed. In this case, the substrate taken out from the cassette in the indexer unit 10 is transferred to the cleaning unit 20 side, and is subjected to ultraviolet irradiation treatment, chemical cleaning,
Cleaning with pure water is performed. The substrate after cleaning is transferred to one end of the shuttle transfer unit 29 by the transfer robot TR provided in the substrate transfer unit IF after drying.
9 is conveyed and accommodated in the cassette in the indexer unit 10.
【００４３】[0043]
【発明の効果】以上の説明のように、請求項１の装置で
は、基板をほぼ水平に支持するとともにこの基板を所定
の方向に搬送させつつ、この基板の主面に洗浄液を供給
する洗浄液供給手段と、この洗浄液供給手段によって基
板に供給された洗浄液を乾燥処理する乾燥手段とを有す
る第１処理部と、基板の主面にレジストを塗布する塗布
ユニットを含む複数の処理ユニットを有する第２処理部
と、第１処理部と第２処理部との間で、受け渡しされる
基板を一旦蓄積するバッファ手段と、このバッファ手段
を介して第１処理部と第２処理部との間で基板を受け渡
しする受渡手段とを有する基板受渡部とを備えるので、
洗浄のための第１処理部とレジスト塗布のための第２処
理部とのそれぞれに基板をカセットから出し入れするた
めの専用のインデクサ部を設ける必要がなく、このよう
なインデクサ部間でＡＧＶによってカセットを搬送する
必要もない。よって、装置が設置されるフロアー面積を
低減させることができるとともに、ＡＧＶによる基板搬
送の際の基板の汚染を抑制することができる。As described above, in the apparatus according to the first aspect, the cleaning liquid is supplied to the main surface of the substrate while supporting the substrate substantially horizontally and transporting the substrate in the predetermined direction. And a plurality of processing units including a coating unit for coating the main surface of the substrate with a resist, and a first processing unit having a drying unit configured to dry the cleaning liquid supplied to the substrate by the cleaning liquid supply unit. A processing unit, a buffer unit that temporarily stores a substrate to be transferred between the first processing unit and the second processing unit, and a substrate between the first processing unit and the second processing unit via the buffer unit. Since it is provided with a substrate delivery section having delivery means for delivering and receiving,
It is not necessary to provide a dedicated indexer section for loading and unloading a substrate in each of the first processing section for cleaning and the second processing section for resist coating, and the cassette is provided by AGV between such indexer sections. Need not be carried. Therefore, it is possible to reduce the floor area on which the apparatus is installed, and it is possible to suppress the contamination of the substrate when the substrate is transferred by the AGV.
【００４４】また、請求項１の装置では、第１処理部
が、ローラ搬送方式の処理部であり、第２処理部が、ロ
ボット逐次搬送方式の処理部であるので、第１処理部か
ら第２処理部への基板の受け渡しタイミングの調整が不
可欠であるが、基板の受け渡しにバッファ手段を介在さ
せることにより、基板の受け渡しが確実かつ効率良いも
のとなる。[0044] Further, in the apparatus of claim 1, the first processing unit is a processing unit of the roller conveyor system, a second processing unit, so a processing unit of the robot sequential conveyance method, first from the first processing unit 2 It is indispensable to adjust the delivery timing of the substrate to the processing section, but by interposing the buffer means in the delivery of the substrate, the delivery of the substrate becomes reliable and efficient.
【００４５】また、請求項１の装置では、複数の処理ユ
ニットの一つが、基板の主面に形成され、所定のパター
ンが焼き付けられたレジスト膜を現像処理する現像ユニ
ットであるので、第１処理部と第２処理部とレジスト露
光機とを直列に配置し、一つのインデクサ部のみで基板
の洗浄、レジスト塗布及びその現像処理が可能となり、
フロアー面積を効果的に減少させることができる。Further, in the apparatus of claim 1, one of the plurality of processing units is a developing unit for developing the resist film formed on the main surface of the substrate and having a predetermined pattern printed thereon. Part, the second processing part, and the resist exposure device are arranged in series, and it becomes possible to wash the substrate, apply resist, and develop the substrate with only one indexer part.
The floor area can be effectively reduced.
【００４６】また、請求項２の装置では、基板をほぼ水
平に支持するとともにこの基板を所定の方向に搬送させ
つつ、この基板の主面に洗浄液を供給する洗浄液供給手
段と、この洗浄液供給手段によって基板に供給された洗
浄液を乾燥処理する乾燥手段とを有する第１処理部と、
基板の主面に所定の電極膜を形成する成膜手段を有する
第２処理部と、第１処理部と第２処理部との間で、受け
渡しされる基板を一旦蓄積するバッファ手段と、このバ
ッファ手段を介して第１処理部と第２処理部との間で基
板を受け渡しする受渡手段とを有する基板受渡部とを備
えるので、洗浄のための第１処理部と成膜のための第２
処理部のそれぞれに基板をカセットから出し入れするた
めのインデクサ部を設ける必要がなく、装置設置のため
のフロアー面積を低減させることができるとともに、Ａ
ＧＶによる基板搬送の際の基板の汚染を抑制することが
できる。Further, in the apparatus of claim 2 , the substrate is supported substantially horizontally and the substrate is conveyed in a predetermined direction, and a cleaning liquid supply means for supplying a cleaning liquid to the main surface of the substrate, and the cleaning liquid supply means. A first processing unit having a drying means for drying the cleaning liquid supplied to the substrate by
A second processing unit having a film forming unit for forming a predetermined electrode film on the main surface of the substrate; a buffer unit for temporarily accumulating the substrate to be transferred between the first processing unit and the second processing unit; Since the substrate transfer unit having the transfer unit for transferring the substrate between the first processing unit and the second processing unit via the buffer unit is provided, the first processing unit for cleaning and the first processing unit for film formation are provided. Two
It is not necessary to provide an indexer unit for loading and unloading the substrate to and from each of the processing units, and it is possible to reduce the floor area for installing the apparatus.
It is possible to suppress the contamination of the substrate when the substrate is transferred by the GV.
【００４７】また、請求項６の装置では、第１処理部
が、基板をほぼ水平に支持するとともにこの基板を所定
の方向に搬送させつつ、この基板の主面にブラシを当接
させて基板を洗浄するブラシ洗浄手段を有するので、基
板の主面に強固に付着した汚染物質を効果的に除去でき
る。Further, in the apparatus according to the sixth aspect , the first processing section supports the substrate substantially horizontally and conveys the substrate in a predetermined direction while bringing the brush into contact with the main surface of the substrate to bring the substrate into contact with the substrate. Since it has a brush cleaning means for cleaning the substrate, it is possible to effectively remove the contaminants strongly adhered to the main surface of the substrate.
【００４８】また、請求項７の装置では、洗浄液供給手
段によって供給される洗浄液がアルカリ溶液であるの
で、基板の主面に付着した有機物質等の除去の効率を高
めることができる。Further, in the apparatus according to the seventh aspect , since the cleaning liquid supplied by the cleaning liquid supply means is the alkaline solution, the efficiency of removing the organic substances and the like adhering to the main surface of the substrate can be improved.
【図１】 第１実施形態に係る基板処理装置の平面図及
び正面図である。FIG. 1 is a plan view and a front view of a substrate processing apparatus according to a first embodiment.
【図２】 図１の基板処理装置の洗浄部をより詳細に説
明する斜視図である。FIG. 2 is a perspective view illustrating the cleaning unit of the substrate processing apparatus of FIG. 1 in more detail.
【図３】 図２の洗浄部での洗浄処理工程の一部を模式
的に説明する図である。FIG. 3 is a diagram schematically illustrating a part of a cleaning process step in the cleaning unit in FIG.
【図４】 図２の洗浄部に設けたリフタの動作等を説明
する図である。4A and 4B are views for explaining the operation of a lifter provided in the cleaning unit of FIG.
【図５】 第２実施形態に係る基板処理装置の平面構造
を説明するための模式図である。FIG. 5 is a schematic diagram for explaining a planar structure of a substrate processing apparatus according to a second embodiment.
１０ インデクサ部 ２０ 洗浄部 ２１ 基板出入部 ２２ ＵＶ処理部 ２３ 基板傾斜部 ２４ 薬液洗浄部 ２５ 純水洗浄部 ２６ エアーナイフ乾燥部 ２８ リフタ ２９ シャトル搬送部 ３０ レジスト塗布現像部 ４０ インタフェース部 ５０ ステッパ ＩＦ 基板受渡部 ＴＲ，ＴＲ1〜ＴＲ4 搬送ロボット 10 Indexer section 20 Washing department 21 Board entry / exit 22 UV processing unit 23 Substrate slope 24 Chemical cleaning section 25 Pure water cleaning section 26 Air knife drying section 28 Lifters 29 Shuttle transport section 30 Resist coating and development department 40 Interface part 50 stepper IF board delivery section TR, TR1 to TR4 transfer robots
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０１Ｌ 21/30 ５６９Ｄ (56)参考文献 特開 平８−236498（ＪＰ，Ａ) 特開 平８−222616（ＪＰ，Ａ) 特開 平８−115967（ＪＰ，Ａ) 特開 平７−297258（ＪＰ，Ａ) 特開 平７−192992（ＪＰ，Ａ) 特開 平７−176507（ＪＰ，Ａ) 特開 平７−74133（ＪＰ，Ａ) 特開 平７−7067（ＪＰ，Ａ) 特開 平７−6987（ＪＰ，Ａ) 特開 平５−304112（ＪＰ，Ａ) 特開 平２−78243（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/027 H01L 21/304 H01L 21/68 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI H01L 21/30 569D (56) References JP-A-8-236498 (JP, A) JP-A-8-222616 (JP, A) JP-A-8-115967 (JP, A) JP-A-7-297258 (JP, A) JP-A-7-192992 (JP, A) JP-A-7-176507 (JP, A) JP-A-7-74133 (JP, A) JP 7-7067 (JP, A) JP 7-6987 (JP, A) JP 5-304112 (JP, A) JP 2-78243 (JP, A) (JP, A) 58) Fields surveyed (Int.Cl. 7 , DB name) H01L 21/027 H01L 21/304 H01L 21/68
Claims (8)
おいて、カセット単位で搬送されてきた基板を受け入れて後の連
続処理のために前記カセットから１枚ずつ基板を取り出
すとともに現像処理を終了した基板を前記カセットに収
納するインデクサ部と、 前記インデクサ部の前記カセットから一枚ずつ取り出さ
れた前記基板を受け取り、この受け取った複数の前記基
板を前記基板の搬送行路に沿って並列に配置された複数
の搬送ローラによって ほぼ水平に支持するとともに連続
的に所定の方向に搬送させつつ、当該基板の主面に洗浄
液を供給する洗浄液供給手段と、当該洗浄液供給手段に
よって前記基板に供給された前記洗浄液を乾燥処理する
乾燥手段とが前記搬送行路上の所定位置に配置された第
１処理部であるローラ搬送方式の洗浄部と、 前記基板の主面にレジストを塗布する塗布ユニットと所
定のパターンが焼き付けられたレジスト膜を現像処理す
る現像ユニットとを含む複数の処理ユニットを有し、前
記複数の処理ユニットのうちの任意の処理ユニットに前
記基板を搬送ロボットが所定の順序で逐次搬送して前記
基板に一連の処理を行う第２処理部であるロボット逐次
搬送方式のレジスト塗布現像部と、 前記第１処理部と前記第２処理部との間で、受け渡しさ
れる前記基板を一旦蓄積するバッファ手段と、当該バッ
ファ手段を介して前記第１処理部と前記第２処理部との
間で前記基板を受け渡しする受渡手段とを有する基板受
渡部と、を備えたことを特徴とする基板処理装置。1. A substrate processing apparatus that performs a predetermined process on a substrate, receives a substrate conveyed in a cassette unit, and then connects the substrates.
Removes the substrates one by one from the cassette for subsequent processing
At the same time, the substrate that has undergone development processing is stored in the cassette.
The indexer part to be stored and one from the cassette of the indexer part are taken out one by one.
Received the substrate and the received plurality of substrates.
A plurality of plates arranged in parallel along the transfer path of the substrate.
Continuous as well as substantially horizontally supported by the transport rollers
Manner while conveyed in a predetermined direction, and the cleaning liquid supply means for supplying a cleaning liquid to the main surface of the substrate, drying means and said conveying line path for drying the cleaning liquid supplied to the substrate by the cleaning liquid supply means coating unit and Tokoro to the coating and cleaning of the roller conveyor type is a first processing unit disposed in a predetermined position, the resist on the main surface of the substrate
Develop a resist film with a fixed pattern baked
Having a plurality of processing units including a developing unit that, prior to
Note Before any processing unit among multiple processing units
The substrate is sequentially transferred by a transfer robot in a predetermined order to
A robot that is a second processing unit that performs a series of processing on a substrate
A transfer type resist coating / developing unit, a buffer unit that temporarily stores the substrate transferred between the first processing unit and the second processing unit, and the first processing unit via the buffer unit. A substrate processing unit , comprising: a substrate transfer unit having a transfer unit for transferring the substrate to and from the second processing unit .
おいて、 カセット単位で搬送されてきた基板を受け入れて後の連
続処理のために前記カセットから１枚ずつ基板を取り出
すとともに成膜後の基板を前記カセットに収納するイン
デクサ部と、 前記インデクサ部の前記カセットから一枚ずつ取り出さ
れた前記基板を受け取り、この受け取った複数の前記基
板を前記基板の搬送行路に沿って並列に配置された複数
の搬送ローラによってほぼ水平に支持するとともに連続
的に所定の方向に搬送させつつ、当該基板の主面に洗浄
液を供給する洗浄液供給手段と、当該洗 浄液供給手段に
よって前記基板に供給された前記洗浄液を乾燥処理する
乾燥手段とが前記搬送行路上の所定位置に配置された第
１処理部であるローラ搬送方式の洗浄部と、 基板に金属膜を形成する成膜用チャンバと、基板を前記
成膜用チャンバまで搬送する搬送ロボットとを備え、前
記洗浄部で洗浄された基板の主面に所定の電極膜を形成
するための第２処理部である成膜部と、 前記第１処理部と前記第２処理部との間で、受け渡しさ
れる前記基板を一旦蓄積するバッファ手段と、当該バッ
ファ手段を介して前記第１処理部と前記第２処理部との
間で前記基板を受け渡しする受渡手段とを有する基板受
渡部と、を備えたことを特徴とする基板処理装置。 2. A substrate processing apparatus for performing a predetermined process on a substrate.
At that time, the board transferred in cassette units is received and
Removes the substrates one by one from the cassette for subsequent processing
In addition, the substrate after film formation is stored in the cassette.
Remove one from the indexer and one from the cassette in the indexer.
Received the substrate and the received plurality of substrates.
A plurality of plates arranged in parallel along the transfer path of the substrate.
Continuously supported and supported almost horizontally by the transport rollers
Cleaning the main surface of the substrate while transporting it in a predetermined direction
A cleaning liquid supply means for supplying a liquid, to the wash solution supply means
Therefore, the cleaning liquid supplied to the substrate is dried.
And a drying means arranged at a predetermined position on the transport path.
A roller transport type cleaning unit which is one processing unit, a film forming chamber for forming a metal film on the substrate, and the substrate
It is equipped with a transfer robot that transfers the film to the deposition chamber.
A predetermined electrode film is formed on the main surface of the substrate cleaned by the cleaning section.
And a second film forming unit, which is a second processing unit, and the first film processing unit and the second film processing unit.
Buffer means for temporarily accumulating the substrate, and the buffer
Between the first processing unit and the second processing unit
Substrate receiving means for delivering and receiving the substrate between
A substrate processing apparatus comprising: a transfer unit.
理装置において、 前記バッファ手段は、 前記第１処理部から前記第２処理部に受渡すべき基板を
前記洗浄部から受け取って保持する第１バッファ手段
と、 前記第１バッファ手段から移送される基板を蓄積可能な
第２バッファ手段と、を有し、 前記受渡手段は、 前記第１バッファ手段を介して前記第１処理部と前記第
２処理部との間で基板の受渡しを行う第１受渡し動作
と、 前記第１バッファ手段を介して前記第１処理部から受け
取った基板を前記第２バッファ手段に移送して一旦蓄積
させた後、前記第２バッファ手段中の基板を前記第２処
理部に受渡す第２受渡し動作と、のいずれもが可能とさ
れていることを特徴とする基板処理装置。 3. The substrate processing according to claim 1 or 2.
In the processing device, the buffer means transfers the substrate to be delivered from the first processing unit to the second processing unit.
First buffer means for receiving and holding from the cleaning section
And capable of accumulating the substrate transferred from the first buffer means.
Second buffer means, and the delivery means includes the first processing section and the first processing section via the first buffer means.
First transfer operation for transferring the substrate between the two processing units
And from the first processing unit via the first buffer means.
The taken substrate is transferred to the second buffer means and temporarily stored
Then, the substrate in the second buffer means is subjected to the second treatment.
It is possible to perform both the second delivery operation and delivery to the science department.
A substrate processing apparatus characterized in that
て、 前記受渡手段は、前記第２受渡し動作における前記第２
バッファ手段への基板の出し入れを、ファイストイン・
ファーストアウト方式で行うことを特徴とする基板処理
装置。 4. The substrate processing apparatus according to claim 3.
Then, the delivery means is configured to perform the second delivery in the second delivery operation.
When loading / unloading the board to / from the buffer means,
Substrate processing characterized by first-out method
apparatus.
理装置において、 前記第２処理部は基板出入部を有しており、前記第２受
渡し動作において、前記受渡手段は、前記基板出入部に
存在していた先行基板が前記第２処理部内のロボットに
よって搬送されたことに応答して前記第２バッファ手段
中の基板を前記基板出入部に受け渡すことを特徴とする
基板処理装置。 5. The substrate processing according to claim 3 or 4.
In the processing device, the second processing section has a substrate loading / unloading section, and the second receiving section is provided.
In the transfer operation, the transfer means is connected to the board loading / unloading section.
The existing preceding substrate is transferred to the robot in the second processing unit.
Thus, in response to being transported, the second buffer means
The inside substrate is transferred to the substrate loading / unloading part.
Substrate processing equipment.
に支持するとともに当該基板を所定の方向に搬送させつ
つ、当該基板の主面にブラシを当接させて基板を洗浄す
るブラシ洗浄手段を有することを特徴とする請求項１か
ら請求項５のいずれかに記載の基板処理装置。 6. The first processing unit holds the substrate substantially horizontally.
Support the substrate and transport the substrate in the specified direction.
First, wash the board by bringing a brush into contact with the main surface of the board.
2. A brush cleaning means according to claim 1 or 2.
6. The substrate processing apparatus according to claim 5.
前記洗浄液がアルカリ溶液であることを特徴とする請求
項１から請求項６のいずれかに記載の基板処理装置。 7. The cleaning liquid supply means supplies the cleaning liquid.
The cleaning liquid is an alkaline solution.
The substrate processing apparatus according to any one of claims 1 to 6.
おいて、 (a) 前記基板をほぼ水平に支持するとともに当該基板
を所定の方向に搬送させつつ、当該基板の主面に洗浄液
を供給する洗浄液供給手段と、当該洗浄液供給手段によ
って前記基板に供給された前記洗浄液を乾燥処理する乾
燥手段とを有する第１処理部と、 (b) 前記基板の主面にレジストを塗布する塗布ユニッ
トを含む複数の処理ユニットを有する第２処理部と、 (c) 下記の(c-1)〜(c-2)の要素、すなわち、 (c-1) 前記第１処理部から前記第２処理部に受渡すべ
き基板を前記第１処理部から受け取って保持する第１バ
ッファ手段と、 (c-2) 前記第１バッファ手段から移送される基板を蓄
積可能な第２バッファ手段と、 (c-3) 前記第１バッファ手段を介して前記第１処理
部と前記第２処理部との間で基板の受渡しを行う第１受
渡し動作と、 前記第１バッファ手段を介して前記第
１処理部から受け取った基板を前記第２バッファ手段に
移送して一旦蓄積させた後、前記第２バッファ手段中の
基板を前記第２処理部に受渡す第２受渡し動作と、のい
ずれもが可能とされた受渡手段と、を有する基板受渡部
と、 を備えたことを特徴とする基板処理装置。 8. A substrate processing apparatus for performing a predetermined process on a substrate.
The substrate Oite, with substantially horizontally supporting the (a) said substrate
Of the cleaning liquid on the main surface of the substrate while conveying the cleaning liquid in a predetermined direction.
And a cleaning liquid supply means for supplying
To dry the cleaning liquid supplied to the substrate.
A first processing unit having a drying means, and (b) a coating unit for coating a resist on the main surface of the substrate.
A second processing unit having a plurality of processing units including a unit, and (c) the following elements (c-1) to (c-2), that is, (c-1) the first processing unit to the second processing unit. Should be handed over to the processing unit
A first substrate that receives and holds the substrate from the first processing unit.
Buffer means , and (c-2) storing the substrate transferred from the first buffer means.
A stackable second buffer means, and (c-3) the first processing via the first buffer means
First transfer for transferring a substrate between the processing section and the second processing section
A passing operation, and the first buffer means
1 The substrate received from the processing unit is stored in the second buffer means.
In the second buffer means, after transferring and once accumulating
A second transfer operation for transferring the substrate to the second processing section;
Substrate delivery section having delivery means capable of shifting
The substrate processing apparatus characterized by comprising a and.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31458696A JP3450138B2 (en) | 1996-11-26 | 1996-11-26 | Substrate processing equipment |
| KR1019970042707A KR100292935B1 (en) | 1996-11-26 | 1997-08-29 | Substrate processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31458696A JP3450138B2 (en) | 1996-11-26 | 1996-11-26 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10154652A JPH10154652A (en) | 1998-06-09 |
| JP3450138B2 true JP3450138B2 (en) | 2003-09-22 |
Family
ID=18055085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31458696A Expired - Lifetime JP3450138B2 (en) | 1996-11-26 | 1996-11-26 | Substrate processing equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3450138B2 (en) |
| KR (1) | KR100292935B1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002167038A (en) * | 2000-11-30 | 2002-06-11 | Ishikawajima Harima Heavy Ind Co Ltd | Board transfer device |
| JP4796040B2 (en) * | 2001-03-09 | 2011-10-19 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and substrate manufacturing method |
| JP4619562B2 (en) * | 2001-03-27 | 2011-01-26 | 東京エレクトロン株式会社 | Processing equipment |
| JP2002318545A (en) * | 2001-04-20 | 2002-10-31 | Sony Corp | Manufacturing method and manufacturing apparatus for display panel |
| JP5132856B2 (en) * | 2001-04-24 | 2013-01-30 | 東京エレクトロン株式会社 | Processing equipment |
| JP2002329661A (en) * | 2001-04-27 | 2002-11-15 | Yoshitake Ito | Substrate processing device and method therefor, and method for manufacturing substrate |
| JP3725051B2 (en) * | 2001-07-27 | 2005-12-07 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP2006024643A (en) * | 2004-07-06 | 2006-01-26 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| JP2005142590A (en) * | 2005-01-28 | 2005-06-02 | Yoshitake Ito | Substrate processing device and method, and method for manufacturing substrate |
| JP4802016B2 (en) * | 2006-03-08 | 2011-10-26 | 芝浦メカトロニクス株式会社 | Board transfer device |
| KR100819497B1 (en) * | 2007-04-02 | 2008-04-07 | 뉴영엠테크 주식회사 | Modular apparatus for cleaning a substrate |
| JP2008053738A (en) * | 2007-09-04 | 2008-03-06 | Yoshitake Ito | Substrate processing device, method for processing substrate, and method for manufacturing substrate |
| JP4643630B2 (en) * | 2007-11-27 | 2011-03-02 | 東京エレクトロン株式会社 | Processing equipment |
| JP2008109158A (en) * | 2007-12-28 | 2008-05-08 | Yoshitake Ito | Substrate treatment apparatus, substrate treatment method, substrate producing method and electronic device |
| JP2008166820A (en) * | 2007-12-28 | 2008-07-17 | Yoshitake Ito | Apparatus and method for processing substrate, method for manufacturing substrate, and electronic instrument |
| JP2008124502A (en) * | 2008-02-01 | 2008-05-29 | Yoshitake Ito | Substrate treatment equipment, method for treating substrate, method for manufacturing substrate, and electronic instrument |
| JP5155778B2 (en) * | 2008-08-28 | 2013-03-06 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and processing method |
| JP5371664B2 (en) * | 2009-09-29 | 2013-12-18 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP5877954B2 (en) * | 2011-03-07 | 2016-03-08 | 株式会社ゼビオス | Substrate processing apparatus having non-contact levitation transfer function |
| JP7405884B2 (en) * | 2022-02-18 | 2023-12-26 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3113411B2 (en) * | 1992-03-18 | 2000-11-27 | 東京エレクトロン株式会社 | Cleaning equipment |
| JPH07235468A (en) * | 1994-02-22 | 1995-09-05 | Toshiba Corp | Resist coater |
-
1996
- 1996-11-26 JP JP31458696A patent/JP3450138B2/en not_active Expired - Lifetime
-
1997
- 1997-08-29 KR KR1019970042707A patent/KR100292935B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10154652A (en) | 1998-06-09 |
| KR19980041844A (en) | 1998-08-17 |
| KR100292935B1 (en) | 2001-10-24 |
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