JP3322393B2 - LED luminous body and planar luminous light source using the same - Google Patents
LED luminous body and planar luminous light source using the sameInfo
- Publication number
- JP3322393B2 JP3322393B2 JP31359498A JP31359498A JP3322393B2 JP 3322393 B2 JP3322393 B2 JP 3322393B2 JP 31359498 A JP31359498 A JP 31359498A JP 31359498 A JP31359498 A JP 31359498A JP 3322393 B2 JP3322393 B2 JP 3322393B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- light
- die
- led die
- resin package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Liquid Crystal (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は車載メータや液晶表
示用などの各種光源に利用されるＬＥＤ発光体に係わ
り、特に製造時等に生ずる樹脂パッケージの反りを比較
的簡単に矯正でき量産性、信頼性及び光利用効率の優れ
たものとできるＬＥＤ発光体などに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED luminous body used for various light sources such as an on-vehicle meter and a liquid crystal display. The present invention relates to an LED illuminator capable of improving reliability and light use efficiency.
【０００２】[0002]
【従来技術】今日、高輝度に発光可能なＬＥＤが開発さ
れたことに伴い、低消費電力、高輝度且つ省スペースな
どの特徴を生かして各種液晶装置の光源に利用され始め
ている。2. Description of the Related Art Today, with the development of LEDs capable of emitting light with high luminance, they have begun to be used as light sources for various liquid crystal devices by utilizing features such as low power consumption, high luminance, and space saving.
【０００３】このような光源用のＬＥＤランプ装置の１
種として実開平４−１４９４３号、特開平９−３２１３
４４号などにバックライト光源として開示されている。
具体的には、図５に示す如く、前面が開放された略矩形
形状をなす反射ケース５０７の前面凹嵌部５０２の内底
面に外部リードを有する電極板５０３を配設し、電極板
５０２上には発光ダイオードチップ５０３がボンディン
グされていると共に、反射ケースの凹嵌部内には透明あ
るいは半透明のモールド材の充填により形成したライト
ガイド部を有するＬＥＤ発光体５００を形成させてあ
る。このようなＬＥＤ発光体５００は、ほぼ平板形状を
なすと共に、透光性を有する透明若しくは半透明の板体
により形成され、その外縁部に沿った位置に前記ＬＥＤ
発光体が嵌合される嵌合溝を有する拡散板５０８とを備
え、ＬＥＤ発光体はその前面が拡散板の内側面方向に向
けて拡散板の嵌合溝内に嵌合されているＬＥＤランプ装
置が記載されている。このＬＥＤランプ装置によりＬＥ
Ｄ発光体をその前面が拡散板の内側面側方向に向けて嵌
合溝に嵌合されているので、ＬＥＤ発光体の光が拡散板
の内部を透過してその表面全体に均一に照射されて十分
な輝度を得ることができることが開示されている。One of the LED lamp devices for such a light source is as follows.
Seed in Japanese Utility Model Application Laid-Open No. 4-14943,
No. 44 and the like disclose a backlight light source.
Specifically, as shown in FIG. 5, an electrode plate 503 having external leads is provided on the inner bottom surface of the front recessed portion 502 of the reflection case 507 having a substantially rectangular shape with an open front surface. A light emitting diode chip 503 is bonded, and an LED light emitting body 500 having a light guide portion formed by filling a transparent or translucent mold material is formed in the concave fitting portion of the reflection case. The LED luminous body 500 has a substantially flat shape and is formed of a transparent or translucent plate having a light-transmitting property. The LED luminous body 500 is disposed at a position along the outer edge thereof.
A diffusion plate 508 having a fitting groove into which the luminous body is fitted, wherein the LED luminous body is fitted in the fitting groove of the diffusion plate with its front surface facing the inner surface of the diffusion plate. An apparatus is described. LE by this LED lamp device
Since the D luminous body is fitted into the fitting groove with its front surface facing the inner surface side of the diffusion plate, the light of the LED luminous body passes through the inside of the diffusion plate and is uniformly irradiated on the entire surface. It is disclosed that a sufficient luminance can be obtained.
【０００４】しかしながら、より低消費電力且つ高輝度
な発光が求められている現在においては上記構成のＬＥ
Ｄ発光体では十分ではなく更なる改良が求められてい
る。また、本発明はより量産性、信頼性及び光利用効率
に優れたＬＥＤ発光体を提供することにある。However, at present, light emission with lower power consumption and higher luminance is required, and the
D light emitters are not sufficient and further improvements are required. Another object of the present invention is to provide an LED light-emitting body which is more excellent in mass productivity, reliability and light use efficiency.
【０００５】[0005]
【課題を解決するための手段】本発明は横長となる矩形
状などのパッケージの前面に開口する凹部と、開口凹部
内に配置されたＬＥＤダイと、凹部底面に配置されＬＥ
Ｄダイとパッケージ外部とを電気的に接続させるリード
電極と、ＬＥＤダイとリード電極とを接続させるワイヤ
とを有するＬＥＤ発光体において、パッケージはＬＥＤ
ダイが配置可能な前記凹部を複数有すると共に複数の凹
部間の長手方向に少なくとも一つの切り欠き部を有する
ＬＥＤ発光体である。SUMMARY OF THE INVENTION The present invention is directed to a horizontally long rectangular or similar package having an opening at the front of a package, an LED die disposed within the opening, and an LE disposed at the bottom of the recess.
In an LED luminous body having a lead electrode for electrically connecting a D die and the outside of a package, and a wire for connecting the LED die and the lead electrode, the package includes an LED.
An LED illuminator having a plurality of the recesses in which a die can be arranged and having at least one cutout in a longitudinal direction between the plurality of recesses.
【０００６】樹脂パッケージに熱応力が発生し変形する
とき、切り欠き部は選択的に変形する傾向にある。他
方、切り欠き部は変形しやすく逆に矯正しやすいという
特徴を併せ持つ。したがって、パッケージ形成時に生ず
る樹脂成型時残留応力による反り変形は成形後、樹脂パ
ッケージをそり方向とは逆方向に弱い力で押圧すること
で容易に矯正することができる。同様に、パッケージに
ＬＥＤを実装時のワイヤボンド加熱や樹脂硬化加熱によ
って発生するパッケージの反りも、反り方向とは逆に弱
い力で押圧するこにより容易に矯正することができる。When the resin package is deformed due to thermal stress, the cutout tends to be selectively deformed. On the other hand, the notch has a feature that it is easily deformed and easily corrected. Therefore, the warp deformation due to the residual stress during resin molding that occurs at the time of forming the package can be easily corrected by pressing the resin package with a small force in a direction opposite to the warp direction after molding. Similarly, the package warpage caused by wire bond heating or resin curing heating when mounting the LED on the package can be easily corrected by pressing with a weak force opposite to the warping direction.
【０００７】また、反りによる変形が集中する箇所と矯
正箇所はＬＥＤダイ実装箇所とは離れた切り欠き部であ
り、変形、矯正による応力が殆どＬＥＤダイ実装箇所に
は影響しない。従って、パッケージ変形応力によって、
ＬＥＤダイとマウント樹脂、マウント樹脂とパッケージ
などやモールド部材などが剥がれることが極めて少な
い。そのため、ワイヤボンドの断線等による信頼性が損
なわれることが極めて少ないＬＥＤ発光体とすることが
できる。Further, the portion where the deformation due to the warpage concentrates and the correction portion are cutout portions separated from the LED die mounting portion, and the stress due to the deformation and correction hardly affects the LED die mounting portion. Therefore, due to the package deformation stress,
The LED die and the mount resin, the mount resin and the package, the mold member, and the like are very unlikely to peel off. Therefore, it is possible to provide an LED light emitting element in which reliability due to disconnection of a wire bond or the like is extremely small.
【０００８】本発明の請求項２に記載のＬＥＤ発光体
は、切り欠き部がＬＥＤダイと電気的に接続されたリー
ド電極によって補強されている。そのため、樹脂の厚み
が薄く変形しやすい代わりに矯正しやすくすることがで
きる。また、機械的強度を向上させることもできる。In the LED light emitting device according to the second aspect of the present invention, the cutout portion is reinforced by a lead electrode electrically connected to the LED die. Therefore, the resin can be easily corrected instead of being thin and easily deformed. Further, the mechanical strength can be improved.
【０００９】本発明の請求項３に記載のＬＥＤ発光体
は、切り欠き部がパッケージの横長方向の略中央部に設
けられた窪みを有する。樹脂パッケージの最も変形しや
すい、長手方向の略中央部に故意に応力集中しやすい切
り欠き部を設けたことにより、ＬＥＤダイに損傷を与え
ることなく簡単に矯正することができる。The LED light emitting device according to the third aspect of the present invention has a recess in which a cutout portion is provided at a substantially central portion in a horizontal direction of the package. By providing a notch in which the resin package is most likely to be deformed and which is likely to intentionally concentrate stress at a substantially central portion in the longitudinal direction, it is possible to easily correct the LED package without damaging the LED die.
【００１０】本発明の請求項４に記載のＬＥＤ発光体
は、ＬＥＤダイが活性層を挟んでダブルへテロ構造であ
る窒化物半導体である。これにより、活性層の端面から
放出される割合が高い窒化物半導体を用いたＬＥＤダイ
からの光利用効率をより高めることができる。The LED light emitting device according to the fourth aspect of the present invention is a nitride semiconductor in which an LED die has a double hetero structure with an active layer interposed therebetween. Thereby, the light utilization efficiency from the LED die using the nitride semiconductor having a high rate of emission from the end face of the active layer can be further increased.
【００１１】本発明の請求項５に記載のＬＥＤ発光体
は、凹部内に透光性のモールド部材が配置されている。
これにより、信頼性をより高めることができると共に面
状発光光源への光の導入をよりスムーズに行うことがで
き、光利用効率を高めることができる。In the LED light emitting device according to the fifth aspect of the present invention, a translucent mold member is disposed in the recess.
Thereby, the reliability can be further improved, and the light can be more smoothly introduced into the planar light source, and the light use efficiency can be improved.
【００１２】本発明の面状発光源は、上述のＬＥＤ発光
体が所定の厚みを有する透光性導光板の端部に装着され
ている。これにより、信頼性が高く比較的簡単に光利用
効率の高い面状発光光源を構成することができる。特
に、ＬＥＤ発光体がＬＥＤ発光体を破壊しない比較的弱
い力で反りとは逆方向に押圧することで、簡単にパッケ
ージは反りのない横長矩形状とすることができる。その
ため、導光板にＬＥＤ発光体を組み付けたときに導光板
とＬＥＤ発光体との間に隙間が生ずることを低減させ、
隙間から生ずる光の漏れを低減させることにより光の利
用効率を向上させることができる。また、導光板の嵌合
溝にＬＥＤ発光体を挿入するものと異なり形成時に生じ
た歪みを導光板と一体時に矯正することができる。In the planar light source of the present invention, the above-mentioned LED light emitter is mounted on an end portion of a light transmitting light guide plate having a predetermined thickness. As a result, a highly reliable planar light-emitting light source having a high light use efficiency can be configured relatively easily. In particular, by pressing the LED light emitter in the direction opposite to the warpage with a relatively weak force that does not destroy the LED light emitter, the package can be easily formed into a horizontally long rectangular shape without warpage. Therefore, when the LED light emitter is assembled to the light guide plate, the occurrence of a gap between the light guide plate and the LED light emitter is reduced,
The light use efficiency can be improved by reducing the light leakage generated from the gap. Also, unlike the case where the LED light emitter is inserted into the fitting groove of the light guide plate, the distortion generated during the formation can be corrected at the time of integration with the light guide plate.
【００１３】[0013]
【発明の実施の形態】本発明者は種々の実験の結果、外
形が横長のＬＥＤ発光体においては量産性、信頼性及び
光利用効率がＬＥＤ発光体の特定形状により大きく変化
することを見出し本発明を成すに至った。BEST MODE FOR CARRYING OUT THE INVENTION As a result of various experiments, the present inventor has found that mass productivity, reliability, and light use efficiency of a horizontally long LED light-emitting device vary greatly depending on the specific shape of the LED light-emitting device. Invented the invention.
【００１４】本願発明の構成による特性向上の理由は定
かではないが、ＬＥＤ発光体の反りがＬＥＤダイ近傍に
直接影響すること及びＬＥＤ発光体の厚みが樹脂パッケ
ージの応力集中に大きな関係があるためと考えられる。Although the reason for the improvement of the characteristics by the structure of the present invention is not clear, the warpage of the LED luminous body directly affects the vicinity of the LED die and the thickness of the LED luminous body has a great influence on the stress concentration of the resin package. it is conceivable that.
【００１５】横長のＬＥＤ発光体はパッケージ成形離型
後の残留応力や実装工程での加熱による熱応力などによ
り、樹脂パッケージが変形し、長手方向に著しい反りが
発生する傾向にある。樹脂パッケージは、金型への樹脂
注入口近辺と最も樹脂注入口から遠い場所では冷却に要
する時間が異なる。インサート成形により樹脂の冷却時
間を３分から５分程度の長い時間かけて徐々に冷却させ
ＬＥＤ発光体の樹脂パッケージを形成させると樹脂パッ
ケージの反りは比較的小さくできるものの量産効率が極
めて悪い。In the case of a horizontally long LED light emitting device, the resin package tends to be deformed due to residual stress after mold release from the package or thermal stress due to heating in a mounting process, so that a significant warpage in the longitudinal direction tends to occur. The time required for cooling of the resin package differs between the vicinity of the resin injection port to the mold and the place farthest from the resin injection port. When the resin is gradually cooled over a long period of about 3 to 5 minutes by insert molding to form a resin package of an LED light emitting body, the warpage of the resin package can be made relatively small, but mass production efficiency is extremely poor.
【００１６】他方、量産性向上のため金型への樹脂注入
から冷却までの時間を約４０秒程度以下に短くさせる
と、ＬＥＤ発光体の樹脂パッケージは形成時に生じた内
部応力が残留し反りが大きく生じやすい。注入された樹
脂はＬＥＤ発光体のリード電極となる金属が、金型内で
の樹脂の流れの抵抗となるため樹脂の冷却時間が場所に
より顕著に異なる傾向にある。On the other hand, if the time from injection of the resin into the mold to cooling is shortened to about 40 seconds or less to improve mass productivity, the resin package of the LED luminous body has internal stress generated during its formation and warpage. Large and easy to occur. The injected resin has a tendency for the cooling time of the resin to be significantly different depending on the location because the metal serving as the lead electrode of the LED light emitter becomes the resistance of the flow of the resin in the mold.
【００１７】ＬＥＤ発光体を構成する樹脂パッケージの
反りは、ＬＥＤダイを固定するダイボンド樹脂、モール
ド部材の剥離やＬＥＤダイとリード電極とを電気的に接
続させるワイヤの断線などを生ずる場合がある。また、
導光板との光学的な接続時にＬＥＤ発光体と導光板との
隙間が大きくなる。そのため、光が漏れ導光板に入力さ
れる光量が低下する。結果的に導光板から放出される光
の利用効率が低下する。さらに、ＬＥＤ発光体の反りが
大きくなれば自動実装機を用いて導光板に実装できない
という問題が生ずる場合もある。The warpage of the resin package constituting the LED luminous body may cause a die bond resin for fixing the LED die, peeling of the mold member, or disconnection of a wire for electrically connecting the LED die to the lead electrode. Also,
At the time of optical connection with the light guide plate, the gap between the LED light emitter and the light guide plate increases. Therefore, the amount of light input to the leak light guide plate decreases. As a result, the utilization efficiency of light emitted from the light guide plate decreases. Further, if the warpage of the LED illuminant increases, there may be a problem that the LED illuminator cannot be mounted on the light guide plate using an automatic mounting machine.
【００１８】本発明は予め樹脂パッケージの応力が集中
する樹脂パッケージの厚みを変化する切り欠き部をＬＥ
Ｄダイが配置される開口部とは独立して形成させる。ま
た、切り欠き部を利用して反りを局所的に矯正可能とす
るものである。According to the present invention, the notch portion which changes the thickness of the resin package in which the stress of the resin package is concentrated in advance is LE.
It is formed independently of the opening where the D die is arranged. Further, the warp can be locally corrected by using the notch.
【００１９】即ち、樹脂は厚み厚くなるほど内部応力が
大きくなる。また、内部応力は樹脂の厚みが変化した箇
所において、その厚みの差分の応力が局所的にかかると
考えられる。したがって、ＬＥＤ発光体の樹脂パッケー
ジにＬＥＤダイを配置する開口部とは独立させて予め局
所的に応力のかかる部位をことによって、量産性、信頼
性及び光利用効率の向上を図ることができる。That is, the internal stress increases as the thickness of the resin increases. In addition, it is considered that the internal stress is locally applied to a portion where the thickness of the resin changes, with a difference in the thickness. Therefore, mass production, reliability, and light use efficiency can be improved by providing a portion to which a local stress is applied in advance independently of the opening for disposing the LED die in the resin package of the LED light emitter.
【００２０】なお、ＬＥＤ発光体をＬＥＤダイごと（但
し、必ずしも１つとは限らない）に凹部内に配置させる
ことで発光効率を向上させることができる。ＬＥＤダイ
から放出された光はＬＥＤダイの発光観測面側から放出
される光の他、ＬＥＤダイの層方向から放出される光が
ある。このような光はＬＥＤ発光体と導光板との界面や
ＬＥＤ発光体に好適に設けられたモールド部材との界面
において全反射される。全反射した光は外部に取り出さ
れる光の他、ＬＥＤ発光体やモールド部材に吸収される
ものがある。横長のＬＥＤ発光体の前面が開口された形
状である場合、ＬＥＤダイから層方向に放出された光が
反射壁に到達する距離が長く光吸収される割合が大き
い。そのため、光利用効率が低下する傾向にある。窒化
物半導体を利用した発光素子は層方向から放出される光
の割合が高いため顕著に現れる傾向にある。従って、本
発明はＬＥＤダイから放出される光をＬＥＤダイごとに
設けられた凹部内に配置させることにより光利用効率を
高めることもできる。以下、本発明の具体的実施例に基
づいて、詳述する。The luminous efficiency can be improved by arranging the LED luminous body in the concave portion for each LED die (however, not necessarily one). The light emitted from the LED die includes light emitted from the LED die layer direction in addition to light emitted from the light emission observation surface side of the LED die. Such light is totally reflected at the interface between the LED illuminant and the light guide plate and at the interface with the mold member suitably provided for the LED illuminant. Some of the totally reflected light may be absorbed by an LED light-emitting body or a mold member, in addition to the light extracted to the outside. In the case where the front surface of the horizontally long LED light emitter has an open shape, the light emitted from the LED die in the layer direction reaches the reflective wall for a long distance, and the light is absorbed at a large rate. Therefore, the light use efficiency tends to decrease. Light-emitting elements using nitride semiconductors tend to appear remarkably because the ratio of light emitted from the layer direction is high. Therefore, the present invention can enhance the light use efficiency by arranging the light emitted from the LED dies in the concave portions provided for each LED die. Hereinafter, the present invention will be described in detail with reference to specific examples.
【００２１】（実施例１）図１に本発明の一実施例によ
るＬＥＤ発光体１００の模式的正面図を示す。予め略直
方体形状の樹脂パッケージ１０７内に配置されるリード
電極１０４を厚さ約０．２ｍｍの鉄入り銅の平板を打ち
抜き加工させることにより形成させる。リード電極１０
４はＬＥＤダイ１０３と外部とを電気的に接続させるた
め電気伝導性の優れたものが好ましい。また、リード電
極１０４上にＬＥＤダイ１０４を配置させる場合、ＬＥ
Ｄダイ１０３からの熱を好適に放出させたり、ＬＥＤダ
イ１０３からの光を効率よく反射できる材料を選択する
ことが好ましい。リード電極１０４の具体的材料として
は銅、鉄、鉄入り銅やりん青銅など各種金属や合金を利
用することができる。また、これらの金属上に銀、金や
パラジウムなどの貴金属メッキを好適に行うことができ
る。特に本発明においては、ＬＥＤ発光体１００を構成
する樹脂パッケージの外形を矯正するはたきも併せ持つ
ためある程度の機械的強度が高いものを利用することが
好ましい。(Embodiment 1) FIG. 1 is a schematic front view of an LED luminous body 100 according to an embodiment of the present invention. The lead electrodes 104 arranged in the resin package 107 having a substantially rectangular parallelepiped shape are formed by punching a flat plate of iron-containing copper having a thickness of about 0.2 mm. Lead electrode 10
Reference numeral 4 preferably has excellent electrical conductivity in order to electrically connect the LED die 103 to the outside. When the LED die 104 is arranged on the lead electrode 104, LE
It is preferable to select a material that can appropriately emit heat from the D die 103 and efficiently reflect light from the LED die 103. As a specific material of the lead electrode 104, various metals and alloys such as copper, iron, copper containing iron and phosphor bronze can be used. In addition, precious metal plating such as silver, gold and palladium can be suitably performed on these metals. In particular, in the present invention, it is preferable to use a resin package having high mechanical strength to some extent in order to correct the outer shape of the resin package constituting the LED light emitter 100.
【００２２】次に、リード電極１０４となる金属フレー
ムを金型内に配置させてインサート成型法を用いて液晶
ポリマーを注入させることによりＬＥＤ発光体の樹脂パ
ッケージを成形させる。金型に液晶ポリマーを注入後、
約３０秒で取り出し、長さ約２３ｍｍ、幅約１．２ｍ
ｍ、奥行き約１ｍｍのＬＥＤ発光体１００とさせてあ
る。Next, a metal frame to be the lead electrode 104 is placed in a mold, and a liquid crystal polymer is injected by an insert molding method to form a resin package of an LED light emitting body. After injecting the liquid crystal polymer into the mold,
Take out in about 30 seconds, length about 23mm, width about 1.2m
m, an LED illuminator 100 having a depth of about 1 mm.
【００２３】樹脂パッケージ１０７は発光観測面側にＬ
ＥＤダイ１０３が配置可能なリード電極１０４、及びＬ
ＥＤダイ１０３と電気的に接続させることが可能な２つ
のリード電極１０４が露出した凹部１０２が形成されて
いる。凹部１０２はパッケージの長さ方向に沿って約２
ｍｍ、幅約０．８ｍｍ、奥行き約０．４ｍｍの内部に行
くにつれ小さくなった形状を発光観測面側から見て左右
に２個有してある。凹部の形状は発光むらなく導光板に
光を導入させるためにＬＥＤ発光体の長手方向に長く形
成されることが好ましく、ＬＥＤ発光体１００の発光観
測面側から見て楕円、長方形や縁なしの長方形形状など
とすることが好ましい。The resin package 107 has L
A lead electrode 104 on which the ED die 103 can be arranged;
A recess 102 is formed where two lead electrodes 104 that can be electrically connected to the ED die 103 are exposed. The recess 102 has a length of about 2 along the length of the package.
It has two smaller shapes on the left and right sides as viewed from the light emission observation surface side, with the shape decreasing toward the inside of about 0.8 mm, about 0.8 mm in width, and about 0.4 mm in depth. The shape of the concave portion is preferably formed to be long in the longitudinal direction of the LED illuminant in order to introduce light into the light guide plate without uneven light emission. It is preferable to use a rectangular shape or the like.
【００２４】ＬＥＤ発光体１００の略中央となる凹部１
０２間にはリード電極１０４の一部が露出した切り込み
部１０１が露出してある。切り込み部１０１はＬＥＤ発
光体１００の奥行きが最も薄く形成されており外力によ
り切り込み部１０１が設けられた略中央からＬＥＤ発光
体１００を折り曲げることができる。なお、本発明の切
り欠き部１０１とはＬＥＤダイ１０３が配置される凹部
１０２とは別に樹脂パッケージの厚みが薄くなった箇所
であり、リード電極が露出するまで切り欠いた如き形状
でも良いし、リード電極が露出していない溝形状でも良
い。また、ＬＥＤ発光体１００の発光観測面側となる正
面に設けることもできるし、非発光観測面となる背面に
設けることもできる。さらに、正面と背面の両方に設け
ることもできる。切り欠き部１０１の深さは樹脂パッケ
ージの強度や強度を向上させるリード電極などを考慮し
て種々の厚みとすることができる。The concave portion 1 which is located substantially at the center of the LED luminous body 100
The cut portion 101 in which a part of the lead electrode 104 is exposed is exposed between 02. The notch 101 is formed so that the depth of the LED light emitter 100 is the thinnest, and the LED light emitter 100 can be bent by an external force from substantially the center where the notch 101 is provided. Note that the notch portion 101 of the present invention is a portion where the thickness of the resin package is reduced separately from the concave portion 102 in which the LED die 103 is arranged, and may have a shape such that the lead electrode is notched until it is exposed. A groove shape in which the lead electrode is not exposed may be used. Further, it can be provided on the front side of the LED light emitter 100 on the light emission observation side, or can be provided on the back side of the non-light emission observation side. Further, it can be provided on both the front and the back. The depth of the notch 101 can be various thicknesses in consideration of the strength of the resin package and a lead electrode for improving the strength.
【００２５】凹部１０２はＬＥＤダイ１０３からの光を
効率的に放出すると共に各導光板に効率よく光を導くも
のである。したがって、導光板の大きさに合わせて凹部
を複数設けることができるし、ＬＥＤ発光体１００の長
手方向における所望の位置に形成させることができる。
なお、ＬＥＤ発光体の長手方向における端部には導光板
と機械的にはめ込み固定させるためＵ字形状の取っ手部
１０６を形成させてある。The concave portion 102 efficiently emits light from the LED die 103 and efficiently guides light to each light guide plate. Therefore, a plurality of concave portions can be provided in accordance with the size of the light guide plate, and the concave portions can be formed at desired positions in the longitudinal direction of the LED light emitter 100.
A U-shaped handle 106 is formed at the end of the LED luminous body in the longitudinal direction so as to be mechanically fitted and fixed to the light guide plate.
【００２６】樹脂パッケージ１０７の材料としては、Ｌ
ＥＤダイ１０２を保護することができると共に、ＬＥＤ
ダイ１０２からの光を効率反射できる、或いは外来光か
らの光を吸収できるなど所望に応じて種々のものを選択
することができる。パッケージ材料としては液晶ポリ
マ、ＰＢＴ、メラミン樹脂やＡＢＳ樹脂などを好適に利
用することができる。The material of the resin package 107 is L
ED die 102 can be protected and LED
Various types can be selected as desired, such as being able to efficiently reflect light from the die 102 or absorb light from extraneous light. As the package material, liquid crystal polymer, PBT, melamine resin, ABS resin and the like can be suitably used.
【００２７】次に、凹部内底面の一方のリード電極１０
４上にエポキシ樹脂を用いてＬＥＤダイ１０３をダイボ
ンドする。なお、ＬＥＤダイ１０３はサファイア基板上
に窒化物半導体を積層させて同一面側に一対の電極を形
成させたものを利用してある。窒化物半導体はサファイ
ア基板上にバッファ層としてＧａＮ、ｎ型コンタクト層
兼クラッド層としてＳｉドープのＧａＮ、ＧａＮとＩｎ
ＧａＮの多重量子井戸構造である活性層、ｐ型クラッド
層としてＭｇドープのＡｌＧａＮ、ｐ型コンタクト層と
してＭｇドープのＧａＮとしてある。なお、これはダブ
ルへテロ構造のＬＥＤダイである。Next, one lead electrode 10 on the inner bottom surface of the concave portion
4 is die-bonded to the LED die 103 using an epoxy resin. Note that the LED die 103 uses a nitride semiconductor laminated on a sapphire substrate and a pair of electrodes formed on the same surface side. A nitride semiconductor is formed on a sapphire substrate by using GaN as a buffer layer, Si-doped GaN as an n-type contact layer and cladding layer, and GaN and In.
The active layer has a multiple quantum well structure of GaN, the Mg-doped AlGaN as the p-type cladding layer, and the Mg-doped GaN as the p-type contact layer. This is an LED die having a double hetero structure.
【００２８】ＬＥＤダイ１０３の各電極と各リード電極
とをそれぞれ太さ約３０μｍの金線１０５でワイヤボン
ディングさせる。次に、凹部１０２内にＬＥＤダイ１０
３を保護するモールド部材１０８を設けるためエポキシ
樹脂を流し込み硬化させＬＥＤ発光体１００を形成させ
る。モールド部材１０８はＬＥＤダイ１０３やワイヤ１
０５を外部応力から保護すると共に効率よく導光板にＬ
ＥＤダイからの光を入射させるものである。モールド部
材１０８の材料としてはエポキシ樹脂、シリコーン樹
脂、不飽和ポリエステル樹脂や変性アクリル樹脂など好
適に用いることができる。なお、モールド部材１０８は
その作用により、ＬＥＤダイからの光を整えるフィルタ
ー効果を持った着色剤、ＬＥＤダイ１０３からの光を拡
散発光させる拡散剤やＬＥＤダイ１０３からの光を他の
色に変換させる蛍光体を好適に含有させることもでき
る。なお、蛍光体をセリウムで付活されたイットリウム
・アルミニウム・ガーネット系蛍光体などを選択して含
有量を調節させることにより白色発光可能なＬＥＤ発光
体とすることができる。Each electrode of the LED die 103 and each lead electrode are wire-bonded with a gold wire 105 having a thickness of about 30 μm. Next, the LED die 10 is
In order to provide a mold member 108 for protecting the LED 3, an epoxy resin is poured and cured to form the LED light emitter 100. The molding member 108 includes the LED die 103 and the wire 1.
05 is protected from external stress, and L
The light from the ED die is made incident. As a material of the mold member 108, an epoxy resin, a silicone resin, an unsaturated polyester resin, a modified acrylic resin, or the like can be suitably used. The mold member 108 has a colorant having a filter effect for adjusting the light from the LED die, a diffusing agent for diffusing and emitting the light from the LED die 103, and converting the light from the LED die 103 to another color. The phosphor to be used can be suitably contained. It should be noted that an LED illuminator capable of emitting white light can be obtained by selecting a phosphor such as an yttrium / aluminum / garnet phosphor activated with cerium and adjusting the content.
【００２９】樹脂パッケージ外部に突出しているリード
電極１１４をプレス加工により所望に切断させることに
よりＬＥＤ発光体１００を１０００個形成させた。ＬＥ
Ｄ発光体１００の略中心から端部までの反りが１ｍｍ以
上となったＬＥＤ発光体を任意に１００個選択し、図３
の如く、反りと反対方向に切り欠き部に１０Ｋｇｆの押
圧矯正したところ、ＬＥＤ発光体の中心から端部までの
反りは全て０．０５ｍｍ以下とすることができる。The lead electrodes 114 protruding outside the resin package were cut as desired by press working, whereby 1,000 LED luminous bodies 100 were formed. LE
As shown in FIG. 3, 100 LED illuminants whose warp from the approximate center to the end of the D illuminant 100 is 1 mm or more are arbitrarily selected.
As described above, when the pressure is corrected to 10 Kgf in the notch in the direction opposite to the warp, the warp from the center to the end of the LED luminous body can be all 0.05 mm or less.
【００３０】ＬＥＤ発光体を端部に突起部４０３を有す
る導光板４０１にはめ込み面状発光光源を構成させた。
導光板の主面及びＬＥＤ発光体との界面を除いて白色反
射板４０２や樹脂筐体によって覆った面状発光光源は主
面から面状に発光することができる。なお、導光板は図
４において板状としたがこれのみに限られるものではな
く、底面が徐々に傾斜した舟板上や所望の自動車メータ
用など種種の形状に合わせて利用できる。An LED light emitter was fitted into a light guide plate 401 having a protrusion 403 at an end to form a planar light source.
Except for the main surface of the light guide plate and the interface with the LED light emitter, the planar light source covered with the white reflector 402 or the resin housing can emit light in a planar manner from the main surface. Although the light guide plate is formed in a plate shape in FIG. 4, the present invention is not limited to this, and the light guide plate can be used in accordance with various shapes such as a boat plate having a gradually inclined bottom surface and a desired vehicle meter.
【００３１】（比較例１）同様に、比較例として切り欠
き部が設けられていない以外は実施例１と同様にして形
成させたＬＥＤ発光体において、ＬＥＤ発光体中心から
端部までの反りが１ｍｍ以上となったＬＥＤ発光体を任
意に１００個選択し、反りと反対方向に切り欠き部に１
０Ｋｇｆの押圧矯正したところ、ＬＥＤ発光体の中心か
ら端部までの反りは平均０．３ｍｍ程度にしかならなか
った。(Comparative Example 1) Similarly, as a comparative example, in the LED luminous body formed in the same manner as in Example 1 except that the notch portion was not provided, the warpage from the center of the LED luminous body to the end portion. Arbitrarily select 100 LED luminous bodies of 1 mm or more, and insert 1 in the cutout in the direction opposite to the warp.
When the pressure was corrected to 0 kgf, the warpage from the center to the end of the LED light emitter was only about 0.3 mm on average.
【００３２】（比較例２）また、比較例２として前面に
開口を有するＬＥＤ発光体とした以外は実施例１と同様
に形成させたＬＥＤ発光体において、ＬＥＤ発光体中心
から端部までの反りが１ｍｍ以上となったＬＥＤ発光体
を任意に１００個選択し、反りと反対方向に切り欠き部
に１０Ｋｇｆの押圧矯正したところ、ＬＥＤ発光体の中
心から端部までの反りは平均０．１ｍｍ程度にしかなら
なかった。(Comparative Example 2) In Comparative Example 2, an LED luminous body formed in the same manner as in Example 1 except that an LED luminous body having an opening on the front surface was used. Arbitrarily selected 100 LED luminous bodies having a length of 1 mm or more, and corrected the pressure of 10 Kgf in the cutout in the direction opposite to the warp. I was nothing.
【００３３】矯正した後の実施例１のＬＥＤ発光体と比
較のための各ＬＥＤ発光体をそれぞれ熱衝撃試験を行い
信頼性を評価した。熱衝撃試験はＬＥＤ発光体を−４０
℃３０分、１００℃３０分を１サイクルとした雰囲気内
に配置させ、３００サイクル繰り返して試験を行った。
切り欠き部が設けられた実施例１のＬＥＤ発光体は、熱
衝撃試験後においても不灯となったＬＥＤ発光体がなか
ったのに対し、比較例１のＬＥＤ発光体は不点灯となっ
たものが５個もあった。また、比較例２のＬＥＤ発光体
は不灯となったものが１２個もあった。不灯となったＬ
ＥＤ発光体を調べたところワイヤが断線していた。実施
例１のＬＥＤ発光体を利用した面状発光光源の出力を１
００とすると比較例２のＬＥＤ発光体を用いた面状発光
源の出力は８２であり実施例１のＬＥＤ発光体の方が光
利用効率が高いことが分かる。The LED luminous body of Example 1 after the correction and each LED luminous body for comparison were subjected to a thermal shock test to evaluate the reliability. The thermal shock test showed that the LED light emitter was -40.
The test was carried out in an atmosphere in which the temperature was 30 ° C. for 30 minutes and the temperature was 100 ° C. for 30 minutes, and the cycle was repeated 300 times.
The LED luminous body of Example 1 provided with the cutout portion did not have any illuminated LED luminous body even after the thermal shock test, whereas the LED luminous body of Comparative Example 1 was non-luminous. There were as many as five. In addition, there were 12 LED illuminants of Comparative Example 2 which were not lit. L was turned off
Examination of the ED light emitter revealed that the wire was broken. The output of the planar light source using the LED light emitter of the first embodiment is 1
Assuming that the output is 00, the output of the planar light emitting source using the LED light emitting device of Comparative Example 2 is 82, which indicates that the LED light emitting device of Example 1 has higher light use efficiency.
【００３４】[0034]
【発明の効果】本発明はＬＥＤ発光体の反りを比較的簡
単な構成で精度良く矯正することができると共に、熱衝
撃がかかった場合においても信頼性の高いＬＥＤ発光体
を量産性良く形成することができる。また、このＬＥＤ
発光体を利用することにより光利用効率の高い面状発光
光源を利用することができる。According to the present invention, it is possible to accurately correct the warpage of the LED luminous body with a relatively simple structure, and to form a highly reliable LED luminous body with good productivity even when subjected to a thermal shock. be able to. Also, this LED
By using the luminous body, a planar light source having high light use efficiency can be used.
【図１】 本発明のＬＥＤ発光体の模式的正面図を示
す。FIG. 1 shows a schematic front view of an LED light emitter of the present invention.
【図２】 本発明のＬＥＤ発光体の模式的断面図を示
す。FIG. 2 shows a schematic cross-sectional view of the LED light emitter of the present invention.
【図３】 本発明のＬＥＤ発光体の矯正を示す模式的説
明図である。FIG. 3 is a schematic explanatory view showing the correction of the LED luminous body of the present invention.
【図４】 本発明の面状発光光源の模式的斜視図を示
す。FIG. 4 is a schematic perspective view of a planar light source according to the present invention.
【図５】 図５（Ａ）は本発明のＬＥＤ発光体と比較の
ための模式的正面図を示し、図５（Ｂ）は本発明のＬＥ
Ｄ発光体と比較のために示す面状発光光源の模式的斜視
図である。5 (A) is a schematic front view for comparison with the LED light emitter of the present invention, and FIG. 5 (B) is an LE of the present invention.
FIG. 4 is a schematic perspective view of a planar light source shown for comparison with a D light emitter.
１００・・・ＬＥＤ発光体 １０１・・・切り欠き部 １０２・・・ＬＥＤダイが配置される凹部 １０３・・・ＬＥＤダイ １０４・・・リード電極 １０５・・・ワイヤ １０６・・・ＬＥＤ発光体に設けられた取っ手部 １０７・・・樹脂パッケージ １０８・・・モールド部材 １１４・・・ＬＥＤ発光体の外部に突出したリード電極 ４０１・・・導光板 ４０２・・・反射板 ４０３・・・ＬＥＤ発光体の取って部とはめ合わす導光
板の突起部 ５００・・・ＬＥＤ発光体 ５０２・・・凹嵌部 ５０３・・・発光ダイオードチップ ５０４・・・電極板 ５０５・・・ワイヤ ５０７・・・略矩形形状をなす反射ケース ５０８・・・拡散板 ５１４・・・ＬＥＤ発光体の外部に突出したリード電極Reference numeral 100: LED luminous body 101: Notch 102: concave portion in which the LED die is arranged 103: LED die 104: lead electrode 105: wire 106: LED luminous body Provided handle portion 107 Resin package 108 Mold member 114 Lead electrode projecting outside LED light emitter 401 Light guide plate 402 Reflector 403 LED light emitter Projecting portion 500 of the light guide plate to be fitted with the take-out portion 500 LED emitting body 502 recessed portion 503 LED chip 504 electrode plate 505 wire 507 substantially rectangular Reflective case 508 ... Diffusion plate 514 ... Lead electrode protruding outside LED light-emitting body
Claims (6)
口した凹部と、該凹部内に配置されたＬＥＤダイと、少
なくとも一部が凹部内に配され前記ＬＥＤダイと樹脂パ
ッケージ外部とを電気的に接続させるリード電極と、前
記ＬＥＤダイとリード電極とを接続させるワイヤとを有
するＬＥＤ発光体であって、前記樹脂パッケージは前記
複数の凹部間に少なくとも一つの切り欠き部とを有する
ことを特徴とするＬＥＤ発光体。1. A plurality of concave portions having openings on the front surface of a horizontally long resin package, an LED die disposed in the concave portion, and at least a part disposed in the concave portion to electrically connect the LED die and the outside of the resin package. An LED light emitter having a lead electrode connected to the LED die and a wire connecting the LED die and the lead electrode, wherein the resin package has at least one cutout between the plurality of recesses. LED illuminant.
接続されたリードによって補強されている請求項１に記
載のＬＥＤ発光体。2. The LED illuminator according to claim 1, wherein the notch is reinforced by a lead electrically connected to an LED die.
方向の略中央部に設けられた窪みである請求項１に記載
のＬＥＤ発光体。3. The LED light emitting device according to claim 1, wherein the cutout portion is a depression provided at a substantially central portion of the resin package in a laterally long direction.
へテロ構造である窒化物半導体からなる請求項１に記載
のＬＥＤ発光体。4. The LED illuminator according to claim 1, wherein said LED die is made of a nitride semiconductor having a double hetero structure with an active layer interposed therebetween.
置されている請求項１に記載のＬＥＤ発光体。5. The LED illuminator according to claim 1, wherein a light-transmissive mold member is disposed in the recess.
みを有する透光性導光板の端部に装着されたことを特徴
とする面状発光光源。6. A planar light emitting light source, wherein the LED light emitting body according to claim 1 is mounted on an end of a light transmitting light guide plate having a predetermined thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31359498A JP3322393B2 (en) | 1998-11-04 | 1998-11-04 | LED luminous body and planar luminous light source using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31359498A JP3322393B2 (en) | 1998-11-04 | 1998-11-04 | LED luminous body and planar luminous light source using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000138397A JP2000138397A (en) | 2000-05-16 |
| JP3322393B2 true JP3322393B2 (en) | 2002-09-09 |
Family
ID=18043204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31359498A Expired - Fee Related JP3322393B2 (en) | 1998-11-04 | 1998-11-04 | LED luminous body and planar luminous light source using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3322393B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101996984B (en) * | 2009-08-21 | 2012-07-04 | 柏友照明科技股份有限公司 | Light-emitting diode packing structure of forming filling type convex lens and manufacturing method thereof |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3659635B2 (en) * | 2001-04-10 | 2005-06-15 | 株式会社東芝 | Optical semiconductor device |
| CN100466308C (en) * | 2003-09-29 | 2009-03-04 | 松下电器产业株式会社 | Linear light source and production method therefor and surface emission device |
| JP2006041380A (en) * | 2004-07-29 | 2006-02-09 | Nippon Leiz Co Ltd | Light source device |
| JP2006253528A (en) * | 2005-03-14 | 2006-09-21 | Opto Device Kenkyusho:Kk | Reflecting light emitting diode unit, and light emitting diode |
| JP2007081242A (en) * | 2005-09-15 | 2007-03-29 | Toshiba Lighting & Technology Corp | Light emitting diode device and lighting system |
| KR100780176B1 (en) * | 2005-11-25 | 2007-11-27 | 삼성전기주식회사 | Side-view light emitting diode package |
| JP2008294309A (en) * | 2007-05-25 | 2008-12-04 | Showa Denko Kk | Light emitting device and display device |
| JP5545279B2 (en) | 2011-09-20 | 2014-07-09 | 豊田合成株式会社 | Surface light source device |
-
1998
- 1998-11-04 JP JP31359498A patent/JP3322393B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101996984B (en) * | 2009-08-21 | 2012-07-04 | 柏友照明科技股份有限公司 | Light-emitting diode packing structure of forming filling type convex lens and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000138397A (en) | 2000-05-16 |
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