JP2651399B2 - Terminal soldering method - Google Patents
Terminal soldering methodInfo
- Publication number
- JP2651399B2 JP2651399B2 JP12466092A JP12466092A JP2651399B2 JP 2651399 B2 JP2651399 B2 JP 2651399B2 JP 12466092 A JP12466092 A JP 12466092A JP 12466092 A JP12466092 A JP 12466092A JP 2651399 B2 JP2651399 B2 JP 2651399B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- pin
- plate
- wire
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、端子の一方にピン状端
子、他方に電線をそれぞれ同時にハンダ付けすることの
できる端子のハンダ接続方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of soldering terminals, which can simultaneously solder a pin-shaped terminal to one terminal and an electric wire to the other terminal.
【０００２】[0002]
【従来の技術】図５は、実開昭５６−４４４７１号公報
等に記載された従来の端子のハンダ接続方法を示すもの
である。該端子１７は、一方に接続用の円筒部１８、他
方に電線圧着部１９をそれぞれ設けてなるものであり、
回路基板２０に立設した矩形ピン状端子２１に該円筒部
１８を挿通させ、円筒部１８内にハンダ２２を流し込ん
でハンダ接続させる。この例で該ピン状端子２１の外径
は0.64mm角、また円筒部１８の内径は1.47mmと大きめに
設定されている。2. Description of the Related Art FIG. 5 shows a conventional method of soldering terminals, which is described in Japanese Utility Model Application Publication No. Sho 56-44471. The terminal 17 is provided with a cylindrical portion 18 for connection on one side and a wire crimping portion 19 on the other side, respectively.
The cylindrical portion 18 is inserted through the rectangular pin-shaped terminal 21 erected on the circuit board 20, and the solder 22 is poured into the cylindrical portion 18 to make a solder connection. In this example, the outer diameter of the pin-shaped terminal 21 is set to be 0.64 mm square, and the inner diameter of the cylindrical portion 18 is set to be as large as 1.47 mm.
【０００３】また、電線圧着部１９は、一対の前方圧着
片２３と同じく後方圧着片２４とによりなり、前方圧着
片２３に電線（リード線）２５の導体部２５ａ、後方圧
着片２４に同じく被覆部２５ｂをそれぞれ圧着固定させ
ている。The electric wire crimping portion 19 includes a pair of front crimping pieces 23 and a rear crimping piece 24, and the front crimping piece 23 covers the conductor 25 a of the electric wire (lead wire) 25 and the rear crimping piece 24. The portions 25b are fixed by crimping.
【０００４】しかしながら、上記従来の接続方法にあっ
ては、端子１７の円筒部１８下端が回路基板２０上に接
するために、ハンダ２２が基板２０上に溶着し、基板２
０が熱影響を受けて変形する等の不具合を生じる危険が
あった。また、電線２５が強く引っ張られた場合に、導
体部２５ａと圧着片２３との接触が悪くなったり、圧着
部１９から抜けたりするという問題があった。However, in the above-described conventional connection method, since the lower end of the cylindrical portion 18 of the terminal 17 is in contact with the circuit board 20, the solder 22 is welded onto the board 20,
There was a danger of causing defects such as deformation of the O. 0 due to heat. Further, when the electric wire 25 is strongly pulled, there is a problem that the contact between the conductor portion 25a and the crimping piece 23 deteriorates or the wire 25 comes off the crimping portion 19.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、上記した点
に鑑み、基板上のピン状端子とのハンダ接続に際して基
板に熱影響を与えず、しかも電線との接続強度を向上さ
せ得る端子のハンダ接続方法を提供することを目的とす
る。DISCLOSURE OF THE INVENTION In view of the above, the present invention provides a terminal which does not have a thermal effect on a substrate when soldering to a pin-like terminal on the substrate and which can improve the strength of connection with an electric wire. An object is to provide a solder connection method.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、一方に接続孔を有する平板部、他方に電
線圧着部をそれぞれ設け、該平板部から電線圧着部にか
けてガイドリブを立設してなる板端子の該接続孔を、基
板に立設したピン状端子に挿通させると共に、該電線圧
着部側を下げて該板端子を傾斜させた状態に該接続孔を
該ピン状端子に係止させ、該平板部と該ピン状端子とを
ハンダ接続することにより、流下した溶融ハンダで該電
線圧着部側を同時にハンダ付けする端子の接続方法を採
用する。In order to achieve the above object, the present invention provides a flat plate portion having a connection hole on one side and a wire crimping portion on the other side, and guide ribs are set up from the flat plate portion to the wire crimping portion. The connection hole of the plate terminal provided is inserted through a pin-shaped terminal erected on a board, and the connection hole is lowered in a state where the wire crimping part side is lowered and the plate terminal is inclined. Then, the flat plate portion and the pin-shaped terminal are connected by soldering, thereby adopting a terminal connection method of simultaneously soldering the wire crimping portion side with the molten solder that has flowed down.
【０００７】[0007]
【作用】板端子を傾斜させることにより、接続孔がピン
状端子の任意の位置で係止され、且つ電線圧着部へのハ
ンダの流れ込みが可能となる。そして平板部とピン状端
子とをハンダ接続することにより、溶融したハンダがガ
イドリブに沿って電線圧着部側に流れ込み、電線が電線
圧着部に強固にハンダ付けされる。By inclining the plate terminal, the connection hole is locked at an arbitrary position of the pin-like terminal, and the solder can flow into the wire crimping portion. Then, by soldering the flat plate portion and the pin-shaped terminal, the molten solder flows into the wire crimping portion along the guide rib, and the wire is firmly soldered to the wire crimping portion.
【０００８】[0008]
【実施例】図１〜２は、本発明に係る端子のハンダ接続
方法の一実施例を示すものである。この接続方法は、回
路基板１に立設した従来同様の矩形ピン状端子２に丸型
板端子３を傾斜させた状態でハンダ接続するものであ
る。1 and 2 show one embodiment of a method for soldering terminals according to the present invention. In this connection method, a round plate terminal 3 is solder-connected to a rectangular pin-like terminal 2 erected on a circuit board 1 in the same manner as in the related art.
【０００９】すなわち、板端子３の一方に形成された丸
型平板部４の中央の接続孔５を該ピン状端子２に挿通さ
せ、任意の位置で傾けて該接続孔５周縁のエッジを該ピ
ン状端子２の角部２ａに当接係止させる。該板端子３の
他方には、予め電線圧着部６に電線（リード線）７を従
来同様に圧着接続させておく。該板端子３は自重と該電
線７の重みとで確実に係止される。なお、板端子３の接
続孔５の内径は、ピン状端子２の外径（0.64mm角) に対
して0.94mmと従来例の端子の円筒部内径（1.47) よりも
小さめに設定して係止性を良くしている。That is, the connection hole 5 at the center of the round flat plate portion 4 formed on one of the plate terminals 3 is inserted into the pin-shaped terminal 2 and is inclined at an arbitrary position so that the edge of the peripheral edge of the connection hole 5 is formed. The pin-shaped terminal 2 is abutted and locked to the corner 2a. To the other of the plate terminals 3, an electric wire (lead wire) 7 is previously crimped and connected to the electric wire crimping portion 6 as in the conventional case. The plate terminal 3 is securely locked by its own weight and the weight of the electric wire 7. The inner diameter of the connection hole 5 of the plate terminal 3 is set to 0.94 mm with respect to the outer diameter (0.64 mm square) of the pin-shaped terminal 2, which is smaller than the inner diameter (1.47) of the conventional terminal. Improves stopping performance.
【００１０】図３(a) ，(b) は、該板端子３の形状を示
すものであり、導体圧着片８と被覆圧着片９とよりなる
電線圧着部６と丸型平板部４との間に、一対のガイドリ
ブ１０を立ち上げ連成してある。FIGS. 3 (a) and 3 (b) show the shape of the plate terminal 3, which is formed by a wire crimping portion 6 comprising a conductor crimping piece 8 and a covering crimping piece 9 and a round flat plate portion 4. FIG. In between, a pair of guide ribs 10 are raised and coupled.
【００１１】該ガイドリブ１０は、平板部４の中央の最
大径部４ａから導体圧着片８の先端にかけてテーパ状に
傾斜して立ち上げ形成され、その終端部高さｈ1 は導体
圧着片８の加締高さｈ2 の2/3 以上に設定され、丸型平
板部４の補強と共に溶融ハンダ１１の誘導部として作用
する。[0011] The guide ribs 10 are formed up to be inclined in a tapered shape from the largest diameter portion 4a of the center of the flat plate portion 4 to the distal end of the conductor crimping pieces 8, the end portion height h 1 is the conductor crimping pieces 8 The caulking height h 2 is set to 2/3 or more, and serves as a guide portion for the molten solder 11 together with the reinforcement of the round plate portion 4.
【００１２】すなわち図１〜２の如く傾斜して係止され
た板端子３の平板部４にハンダ１１を盛ってピン状端子
２とのハンダ接続を行うことにより、溶融したハンダ１
１が矢印イの如くガイドリブ１０に沿って導体圧着片８
側に流れ込み、電線７の導体部７ａと導体圧着片８との
ハンダ付けが同時に行われるのである。ここで溶融した
ハンダ１１は導体部７ａと圧着片８との間及び導体部７
ａ内の隙間に入り込み、電線７を強固に固定すると同時
に電気的接続の信頼性を向上させる。That is, the solder 11 is put on the flat plate portion 4 of the plate terminal 3 which is inclined and locked as shown in FIGS.
1 is a conductor crimping piece 8 along a guide rib 10 as shown by an arrow a.
Then, the conductor 7a of the electric wire 7 and the conductor crimping piece 8 are soldered at the same time. The solder 11 melted between the conductor 7a and the crimping piece 8 and the conductor 7
a, the wire 7 is firmly fixed, and at the same time, the reliability of the electrical connection is improved.
【００１３】図４は、本発明に係る端子のハンダ接続方
法の類似例を示すものである。この例は、矩形ピン状端
子２′の前後面にそれぞれ端子係止用の切欠１３を傾斜
方向に設け、板端子３′の平板部４′の接続孔内縁５′
に、該切欠１３に対する一対の係合突起１４を設けて、
板端子３′の係止をより確実としたものである。この例
によれば、板端子３′を係止させた状態で回路基板１を
搬送させたり、隣接する電線同士７′が接触したりして
も板端子３′が外れ落ちる心配がない。FIG. 4 shows a similar example of the method of soldering terminals according to the present invention. In this example, notches 13 for locking the terminals are provided in the front and rear surfaces of the rectangular pin-shaped terminal 2 'in the inclined direction, and the inner edge 5' of the connection hole of the flat plate portion 4 'of the plate terminal 3'.
A pair of engaging projections 14 for the notch 13
This secures the locking of the plate terminal 3 '. According to this example, even if the circuit board 1 is transported in a state where the plate terminals 3 'are locked, or the adjacent wires 7' come into contact with each other, the plate terminals 3 'do not come off.
【００１４】[0014]
【発明の効果】以上の如くに、本発明によれば、ピン状
端子と板端子とをハンダ接続することによって同時に該
板端子と電線とをハンダ付けすることができるから、作
業効率が良く、生産性が向上する。また、電線が板端子
の圧着部にハンダで強固に固定されるから電線が強く引
っ張られても抜けを生じることがなく、また電線と圧着
部とがハンダを介して密着するから電気的接続の信頼性
が向上する。さらに、基板上にハンダが接触しないから
基板の熱変形等が防止される。As described above, according to the present invention, by connecting the pin-shaped terminal and the plate terminal by soldering, the plate terminal and the electric wire can be soldered at the same time. Productivity is improved. In addition, since the electric wire is firmly fixed to the crimping portion of the plate terminal with solder, the wire does not come out even if pulled strongly, and the electric wire and the crimping portion are in close contact with each other via the solder, so that the electric connection can be prevented. Reliability is improved. Further, since the solder does not contact the substrate, thermal deformation of the substrate is prevented.
【図１】本発明に係る端子のハンダ接続方法の一実施例
を示す斜視図である。FIG. 1 is a perspective view showing one embodiment of a method for soldering a terminal according to the present invention.
【図２】同じく端子上にハンダを盛った状態を示す斜視
図である。FIG. 2 is a perspective view showing a state where solder is piled on the terminal.
【図３】板端子を示し、(a) は平面図、(b) は側面図で
ある。3A and 3B show a plate terminal, wherein FIG. 3A is a plan view and FIG. 3B is a side view.
【図４】端子のハンダ接続方法の類似例を示す分解斜視
図である。FIG. 4 is an exploded perspective view showing a similar example of a method of soldering terminals.
【図５】従来例を示す斜視図である。FIG. 5 is a perspective view showing a conventional example.
１ 回路基板 ２，２′ ピン状端子 ３，３′ 板端子 ４，４′ 平板部 ５，５′ 接続孔 ６ 電線圧着部 １０ ガイドリブ １１ ハンダ DESCRIPTION OF SYMBOLS 1 Circuit board 2, 2 'Pin-shaped terminal 3, 3' Board terminal 4, 4 'Flat plate part 5, 5' Connection hole 6 Wire crimping part 10 Guide rib 11 Solder
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小野 剛 静岡県御殿場市川島田252 矢崎部品株 式会社内 (56)参考文献 特開 昭56−67177（ＪＰ，Ａ) 特開 昭52−85387（ＪＰ，Ａ) 実開 昭56−44471（ＪＰ，Ｕ) 実開 昭61−204372（ＪＰ，Ｕ) 実開 昭59−20568（ＪＰ，Ｕ) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Tsuyoshi Ono 252 Kawashimada, Gotemba-shi, Shizuoka Prefecture Inside Yazaki Parts Co., Ltd. (56) References JP-A-56-67177 (JP, A) JP-A-52-85387 (JP) , A) Japanese Utility Model Showa 56-44471 (JP, U) Japanese Utility Model Showa 61-204372 (JP, U) Japanese Utility Model Showa 59-20568 (JP, U)
Claims (1)
線圧着部をそれぞれ設け、該平板部から電線圧着部にか
けてガイドリブを立設してなる板端子の該接続孔を、基
板に立設したピン状端子に挿通させると共に、該電線圧
着部側を下げて該板端子を傾斜させた状態に該接続孔を
該ピン状端子に係止させ、該平板部と該ピン状端子とを
ハンダ接続することにより、流下した溶融ハンダで該電
線圧着部側を同時にハンダ付けすることを特徴とする端
子のハンダ接続方法。A flat plate having a connection hole on one side and a wire crimping portion on the other side, and a connection rib of a plate terminal having guide ribs erected from the flat plate portion to the wire crimping portion are erected on a substrate. And the connection hole is engaged with the pin-shaped terminal in a state where the wire crimping part side is lowered and the plate terminal is inclined, and the flat plate portion and the pin-shaped terminal are soldered. A method of soldering a terminal, wherein the wire crimping portion side is simultaneously soldered with molten solder that has flowed down by connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12466092A JP2651399B2 (en) | 1992-05-18 | 1992-05-18 | Terminal soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12466092A JP2651399B2 (en) | 1992-05-18 | 1992-05-18 | Terminal soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05326102A JPH05326102A (en) | 1993-12-10 |
| JP2651399B2 true JP2651399B2 (en) | 1997-09-10 |
Family
ID=14890902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12466092A Expired - Fee Related JP2651399B2 (en) | 1992-05-18 | 1992-05-18 | Terminal soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2651399B2 (en) |
-
1992
- 1992-05-18 JP JP12466092A patent/JP2651399B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05326102A (en) | 1993-12-10 |
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