JP2562904B2 - Inspection device for electronic components on printed circuit boards - Google Patents
Inspection device for electronic components on printed circuit boardsInfo
- Publication number
- JP2562904B2 JP2562904B2 JP62180727A JP18072787A JP2562904B2 JP 2562904 B2 JP2562904 B2 JP 2562904B2 JP 62180727 A JP62180727 A JP 62180727A JP 18072787 A JP18072787 A JP 18072787A JP 2562904 B2 JP2562904 B2 JP 2562904B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- light beam
- electronic component
- reflected light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Geophysics And Detection Of Objects (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 （Ｉ）産業上の利用分野 各種プリント基板（以下単に基板と記す。）の製造工
程において、基板上にチップその他の各種電子部品を実
装（定位置固着及び電気接続）したのち、該電子部品が
基板上の定位置に実装されているか否か（電子部品の
有、無）及び、実装された電子部品が正確な位置に設定
されているか否かを調べる検査工程があり、事後の基板
の合否及び性能に係わる重要な工程とされている。DETAILED DESCRIPTION OF THE INVENTION (I) Fields of Industrial Application In the manufacturing process of various printed circuit boards (hereinafter simply referred to as “substrate”), chips and other various electronic components are mounted on the substrate (fixed position fixing and electrical connection). After that, an inspection process for checking whether or not the electronic component is mounted at a fixed position on the substrate (whether or not the electronic component is mounted) and whether or not the mounted electronic component is set at an accurate position are performed. Yes, it is considered to be an important step related to the pass / fail of the substrate and the performance after the fact.
本発明は、上記検査工程に使用する検査装置に係り、
スリット光線を設定入射角度で電子部品を実装した基板
面に照射し、該光線をカメラ（例、CCD内蔵カメラ）で
スキャニング（走査）することによって、電子部品の
有、無及びその位置精度を検査するようにしたものであ
る。The present invention relates to an inspection device used in the above inspection process,
Irradiate a slit ray at a set incident angle onto the surface of a board on which electronic components are mounted, and scan (scan) the rays with a camera (eg, a CCD built-in camera) to inspect the presence or absence of electronic components and their positional accuracy. It is something that is done.
（II）従来技術とその課題 （１）…従来のこの種検査装置としては、主として、光
学方式のものとメカニカル方式のものがあり、光学方式
のものは、電子部品を実装した基板面を照射してカメラ
で読み取って電子信号として取り出し、CRTディスプレ
イに表示する等して行うものであり、それには、 （１）、反射光の色波長を読み取り、電子部品を色彩で
判別する。(II) Conventional technology and its problems (1) ... Conventionally, this type of inspection device includes an optical type and a mechanical type, and the optical type irradiates a substrate surface on which electronic components are mounted. Then, it is read by a camera, taken out as an electronic signal, and displayed on a CRT display. (1) The color wavelength of the reflected light is read and the electronic component is discriminated by color.
（２）、基板面の明暗の強弱（明るさの差）で判別す
る。(2) The determination is made based on the intensity of light and dark (brightness difference) on the substrate surface.
（３）、斜方向から光線を当て、それによって電子部品
の反対側に生じる影で判別する、 等のものが用いられている。(3), a light ray is applied from an oblique direction, and it is determined by a shadow generated on the opposite side of the electronic component, and so on.
また、メカニカル方式のものとしては、例えば、多数
の電気接点付ピンを平面状に配置したものを、基板面に
押し付け、ピンの電気接点の開閉により、電子部品の
有、無及び位置を検査するものが用いられている。Further, as the mechanical type, for example, a large number of pins with electric contacts arranged in a plane are pressed against the substrate surface, and the presence / absence and position of electronic parts are inspected by opening / closing the electric contacts of the pins. Things are used.
（２）…而して、光学方式の内、色彩判別のものは装置
が極めて高価な難点があり、明瞭の強弱判別のもの及
び、影判別のものは装置の価格はともかく、例えば、極
く近接した電子部品や、大きな電子部品の陰になる小さ
な電子部品を読み取り難いなど、検査精度が劣る欠点が
あり、また、メカニカル方式のものは、機構的なもので
あることから、検査密度が疎で、小形精密なものの検査
に不向きな欠点があった。(2) Thus, among the optical methods, the color discrimination type has a drawback that the device is extremely expensive, and the clear intensity discrimination type and the shadow discrimination type have a low device price, for example, extremely low. There is a drawback that the inspection accuracy is poor, such as it is difficult to read small electronic components that are close to large electronic components or close electronic components, and the mechanical type is mechanical, so the inspection density is low. However, there was a drawback that was unsuitable for the inspection of small and precise products.
（III）課題を解決する手段 本発明は、上記従来の欠点を解消すべくなされたもの
である。(III) Means for Solving the Problems The present invention has been made to solve the above-mentioned conventional drawbacks.
即ち、本発明は、プリント基板に対し設定入射角度で
スリット光線を照射する光源を備える一方、プリント基
板に上記光源から設定入射角度で照射されたスリット光
線の反射光線を走査するカメラを、該反射光線の反射角
度の想定線上に、反射光線の反射面に焦点を合わせて備
えて、カメラが焦点の合った反射光線だけを走査し、焦
点の合わない反射光線は走査しないように備えたもので
あり、 プリント基板面上を反射面としてそこにカメラの焦点
を合わせた場合は電子部品が無いプリント基板面の反射
光線を走査し、電子部品の反射光線を走査せず、 また、プリント基板上の電子部品上を反射面としてそ
こにカメラの焦点を合わせた場合は、電子部品の反射光
線を走査し、電子部品の無いプリント基板面の反射光線
は走査しないことを、電気信号として取り出し、 もって、カメラの反射光線の走査の有無により、プリ
ント基板上の電子部品の有無及び位置を検査するように
したことを特徴とする、 プリント基板の電子部品有無検査装置によって課題を
解決したものである。That is, the present invention includes a light source that irradiates a printed circuit board with a slit light beam at a set incident angle, while a camera that scans a reflected light beam of a slit light beam emitted from the light source at the set incident angle onto the printed circuit board is used. It is provided by focusing on the reflection surface of the reflected ray on the assumed line of the reflected angle of the ray so that the camera scans only the reflected ray that is in focus and does not scan the reflected ray that is out of focus. Yes, when the camera is focused on the printed circuit board surface as a reflective surface, the reflected light beam of the printed circuit board surface without electronic parts is scanned, the reflected light beam of the electronic parts is not scanned, and the When the camera is focused on the electronic component as a reflective surface, the reflected light beam of the electronic component is scanned, and the reflected light beam of the printed circuit board surface without the electronic component is not scanned. The electronic component presence / absence inspecting device for a printed circuit board is used to inspect the presence and position of the electronic component on the printed circuit board by taking out as an air signal and scanning the reflected light beam of the camera. It has been resolved.
（IV）実施例 （１）…次に、本発明の実施例を第１図、第２図につき
説明すると、 プリント基板Ｐに対し設定入射角度（例、右45゜）で
スリット光線１を照射する光源２を備える一方、プリン
ト基板Ｐに上記光源２から設定入射角度（例、右45゜）
で照射されたスリット光線の反射光線を走査するカメラ
３を、該反射光線の反射角度（例、左45゜）の想定線上
に、反射光線の反射面に焦点を合わせて備えて、カメラ
３が焦点の合った反射光線だけを走査し、焦点の合わな
い反射光線は走査しないように備えたものであり、 プリント基板Ｐ面上を反射面としてそこにカメラ３の
焦点を合わせた場合は電子部品４が無いプリント基板Ｐ
面の反射光線を走査し、電子部品４の反射光線を走査せ
ず、 また、プリント基板Ｐ上の電子部品４上を反射面とし
てそこにカメラ３の焦点を合わせた場合は、電子部品４
の反射光線を走査し、電子部品４の無いプリント基板Ｐ
面の反射光線は走査しないことを、電気信号として取り
出し、 もって、カメラ３の反射光線の走査の有無により、プ
リント基板Ｐ上の電子部品４の有無及び位置を検査する
ようにしたことを特徴とする、プリント基板の電子部品
有無検査装置である。(IV) Embodiment (1) Next, an embodiment of the present invention will be described with reference to FIGS. 1 and 2. Irradiating the slit light beam 1 onto the printed board P at a set incident angle (eg, 45 ° to the right). While the light source 2 is provided, the incident angle from the light source 2 to the printed circuit board P is set (eg, right 45 °).
The camera 3 that scans the reflected light of the slit light emitted in step (3) is provided with the reflection surface of the reflected light focused on the assumed line of the reflection angle (eg, left 45 °) of the reflected light. It is provided so that only the reflected light beam that is in focus is scanned and the reflected light beam that is not in focus is scanned, and when the camera 3 is focused on the printed circuit board P surface as a reflective surface, an electronic component is provided. Printed circuit board P without 4
When the reflected light beam of the surface is scanned and the reflected light beam of the electronic component 4 is not scanned, and the camera 3 is focused on the electronic component 4 on the printed circuit board P as a reflective surface, the electronic component 4
Printed circuit board P without electronic component 4 by scanning the reflected light of
The fact that the reflected light beam on the surface is not scanned is taken out as an electric signal, so that the presence or absence and the position of the electronic component 4 on the printed circuit board P are inspected depending on whether the reflected light beam of the camera 3 is scanned. It is an electronic component presence / absence inspection device for a printed circuit board.
（３）…なお、上記において、光源２が発射するスリッ
ト光線１は、その長さを基板Ｐの全幅を横断する長さに
設定し、幅をできるだけ小さく（実施例、0.5mm）設定
する。(3) ... In the above, the slit light beam 1 emitted by the light source 2 is set to have a length that traverses the entire width of the substrate P, and the width is set as small as possible (Example, 0.5 mm).
（４）…第３図は、プリント基板Ｐに対するスリット光
線１の入射角度の設定範囲及び、その反射光線の反射角
度に対応したカメラ３の設置角度範囲を例示したもので
あるが、勿論この例に限定されるものではない。(4) ... FIG. 3 exemplifies the setting range of the incident angle of the slit light beam 1 with respect to the printed circuit board P and the installation angle range of the camera 3 corresponding to the reflection angle of the reflected light beam. It is not limited to.
電子部品４の大小、高低、形状等や配置間隔等によっ
て、スリット光線１の入射角度及びカメラ設置角度も変
更する場合がある。The incident angle of the slit light beam 1 and the camera installation angle may be changed depending on the size, height, shape, arrangement interval, etc. of the electronic component 4.
（Ｖ）作用、効果 （１）…チップその他の各種電子部品４を実装したプリ
ント基板Ｐを矢印方向に移行しつつ、該基板Ｐ面（若し
くは電子部品４上）にスリット光線１を照射し、カメラ
３を操作開始すると、 プリント基板Ｐ面上を反射面としてそこにカメラ３の
焦点を合わせた場合は、 電子部品４が無いプリント基板Ｐ面の反射光線を走査
し（第２図（イ）、第３図）、 電子部品４の反射光線を走査せず（第１図、第２図
（ロ））、 また、プリント基板Ｐ上の電子部品４上を反射面とし
てそこにカメラ３の焦点を合わせた場合は、電子部品４
の反射光線を走査し、電子部品４の無いプリント基板Ｐ
面の反射光線を走査しないこととなる。(V) Action and effect (1) ... While moving the printed circuit board P on which chips and various other electronic components 4 are mounted in the direction of the arrow, irradiate the slit light beam 1 on the surface of the substrate P (or on the electronic component 4), When the camera 3 is started to operate, when the camera 3 is focused on the printed circuit board P surface as a reflective surface, the reflected light beam on the printed circuit board P surface without the electronic component 4 is scanned (Fig. 2 (a)). , FIG. 3), the reflected light beam of the electronic component 4 is not scanned (FIGS. 1 and 2 (b)), and the electronic component 4 on the printed circuit board P is used as a reflecting surface to focus the camera 3 there. Electronic components 4
Printed circuit board P without electronic component 4 by scanning the reflected light of
The reflected light beam on the surface is not scanned.
（２）…よって、カメラ３によりスリット光線１の走査
の有、無を電気信号として取り出して適宜電気処理し、
例えばCRTディスプレイに表示するなどして、実装電子
部品の有、無及び位置精度を精密に検査し得る秀れた特
徴がある。(2) Therefore, the presence / absence of the scanning of the slit light beam 1 by the camera 3 is extracted as an electric signal and appropriately processed electrically,
For example, there is an excellent feature that can accurately inspect the presence / absence and position accuracy of mounted electronic components by displaying them on a CRT display.
第１図は本発明の実施例構成の概略図、 第２図の（イ）、（ロ）は作用説明図、 第３図はスリット光線の入射角度とその反射光線の反射
角度に対応したカメラの設置角度範囲を示す説明図であ
る。 付号 Ｐ……プリント基板 １……スリット光線 ２……光源 ３……カメラ ４……電子部品FIG. 1 is a schematic view of the configuration of an embodiment of the present invention, (a) and (b) of FIG. 2 are explanatory views of the action, and FIG. 3 is a camera corresponding to the incident angle of the slit light beam and the reflection angle of its reflected light beam. It is explanatory drawing which shows the installation angle range of. Appendix P …… Printed circuit board 1 …… Slit beam 2 …… Light source 3 …… Camera 4 …… Electronic parts
Claims (2)
ト光線を照射する光源を備える一方、プリント基板に上
記光源から設定入射角度で照射されたスリット光線の反
射光線を走査するカメラを、該反射光線の反射角度の想
定線上に、反射光線の反射面に焦点を合わせて備えて、
カメラが焦点の合った反射光線だけを走査し、焦点の合
わない反射光線は走査しないように備えたものであり、 プリント基板面上を反射面としてそこにカメラの焦点を
合わせた場合は電子部品が無いプリント基板面の反射光
線を走査し、電子部品が有る電子部品の反射光線を走査
せず、 また、プリント基板上の電子部品上を反射面としてそこ
にカメラの焦点を合わせた場合は、電子部品の反射光線
を走査し、電子部品の無いプリント基板面の反射光線は
走査しないことを、電気信号として取り出し、 もって、カメラの反射光線の走査の有無により、プリン
ト基板上の電子部品の有無及び位置を検査するようにし
たことを特徴とする、 プリント基板の電子部品有無検査装置。1. A camera, which comprises a light source for irradiating a slit light beam on a printed circuit board at a set incident angle, and a camera for scanning a reflected light beam of the slit light beam irradiated on the printed circuit board from the light source at the set incident angle, On the assumed line of the reflection angle of
The camera scans only the reflected light rays that are in focus and not the reflected light rays that are out of focus. If the camera is focused on the printed circuit board surface as a reflective surface, electronic components There is no, but the reflected light beam of the printed circuit board surface is not scanned, the reflected light beam of the electronic component that has the electronic component is not scanned, and if the camera is focused on the electronic component on the printed circuit board as the reflective surface, Scan the reflected light beam of the electronic component and not the reflected light beam of the printed circuit board surface without the electronic component as an electric signal. Therefore, the presence or absence of the electronic component on the printed circuit board depends on whether the reflected light beam of the camera is scanned or not. And an electronic device presence / absence inspection device for a printed circuit board, which is characterized in that the position and position are inspected.
プリント基板の全幅を横断する寸法に設定し、幅を出来
るだけ小さく設定し、また、電子部品を実装したプリン
ト基板を一方向に移行するように備えたものである、 特許請求の範囲第１項記載のプリント基板の電子部品有
無検査装置。2. A slit light beam emitted from a light source is set so that its length crosses the entire width of the printed circuit board, the width is set as small as possible, and the printed circuit board on which electronic parts are mounted is moved in one direction. The electronic component presence / absence inspection device for a printed circuit board according to claim 1, wherein the electronic component presence / absence inspection device is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62180727A JP2562904B2 (en) | 1987-07-20 | 1987-07-20 | Inspection device for electronic components on printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62180727A JP2562904B2 (en) | 1987-07-20 | 1987-07-20 | Inspection device for electronic components on printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6423191A JPS6423191A (en) | 1989-01-25 |
| JP2562904B2 true JP2562904B2 (en) | 1996-12-11 |
Family
ID=16088247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62180727A Expired - Lifetime JP2562904B2 (en) | 1987-07-20 | 1987-07-20 | Inspection device for electronic components on printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2562904B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101522286B1 (en) * | 2012-01-17 | 2015-05-21 | 삼성테크윈 주식회사 | An apparatus for mounting electronic components |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0774830B2 (en) * | 1990-02-13 | 1995-08-09 | 日鉄鉱業株式会社 | Method and apparatus for detecting breaks in continuously transferred articles |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5624998A (en) * | 1979-08-08 | 1981-03-10 | Pioneer Electronic Corp | Device for identifying chip component |
-
1987
- 1987-07-20 JP JP62180727A patent/JP2562904B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101522286B1 (en) * | 2012-01-17 | 2015-05-21 | 삼성테크윈 주식회사 | An apparatus for mounting electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6423191A (en) | 1989-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5610710A (en) | Dual mode illumination system for optical inspection | |
| JPS6339841B2 (en) | ||
| JP2562904B2 (en) | Inspection device for electronic components on printed circuit boards | |
| JP2537543B2 (en) | Circuit pattern inspection device for printed wiring boards | |
| JPH0478200B2 (en) | ||
| JPH0156682B2 (en) | ||
| JPH0544961B2 (en) | ||
| JPH04221705A (en) | Visual inspection device | |
| JPS5970947A (en) | Method for detecting pattern of printed-wiring board | |
| JP2946688B2 (en) | Parts inspection equipment | |
| JP3230267B2 (en) | Appearance inspection device and appearance inspection method | |
| JPH04142410A (en) | Shape recognizing device | |
| JPH03181807A (en) | Visual apparatus | |
| JPH0729483Y2 (en) | Mounted printed circuit board automatic inspection device | |
| JPS57168384A (en) | Detecting method for shape of object | |
| JP3444228B2 (en) | Semiconductor device lead inspection device | |
| JPS61126405A (en) | Position inspecting device | |
| JPH09218162A (en) | Surface defect inspection device | |
| JP3232811B2 (en) | Inspection method of mounted printed circuit board | |
| JPH0457339A (en) | Parts inspection equipment | |
| KR820001894B1 (en) | Method for inspecting printed wiring boards | |
| JPH10221271A (en) | Photographing system for specular object | |
| JPS6025405A (en) | Input system for image of solder surface | |
| JP2739739B2 (en) | Misalignment inspection device | |
| JP2002507330A (en) | Method and apparatus for measuring height position of target edge of component element |