JP2021133433A - ドレッサーボード - Google Patents
ドレッサーボード Download PDFInfo
- Publication number
- JP2021133433A JP2021133433A JP2020028977A JP2020028977A JP2021133433A JP 2021133433 A JP2021133433 A JP 2021133433A JP 2020028977 A JP2020028977 A JP 2020028977A JP 2020028977 A JP2020028977 A JP 2020028977A JP 2021133433 A JP2021133433 A JP 2021133433A
- Authority
- JP
- Japan
- Prior art keywords
- cutting blade
- dresser board
- dressing layer
- cutting
- dressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 139
- 239000006061 abrasive grain Substances 0.000 claims abstract description 37
- 239000002245 particle Substances 0.000 claims abstract description 33
- 239000011230 binding agent Substances 0.000 claims abstract description 24
- 230000002265 prevention Effects 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000010410 layer Substances 0.000 description 66
- 239000000463 material Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 7
- 238000011109 contamination Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002173 cutting fluid Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/02—Wheels in one piece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/18—Wheels of special form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Abstract
Description
11a 切削溝
13 ドレッシング層
13a 表面(第1面)
13b 裏面(第2面)
13c 側面(外周面)
15,15A,15B 飛散防止膜
17 テープ
19 フレーム
19a 開口
2 切削装置
4 保持テーブル(チャックテーブル)
4a 保持面
6 切削ユニット
8 ハウジング
10 切削ブレード
12 ブレードカバー
14 接続部
16 ノズル
Claims (2)
- 切削ブレードをドレッシングするためのドレッサーボードであって、
結合材によって固定された砥粒を含み、第1面及び第2面を備えるドレッシング層と、
該ドレッシング層の該第1面側及び該第2面側に設けられ、該ドレッシング層からのパーティクルの飛散を防止する飛散防止膜と、を備えることを特徴とするドレッサーボード。 - 該飛散防止膜は、非水溶性の樹脂膜であることを特徴とする請求項1記載のドレッサーボード。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020028977A JP7430450B2 (ja) | 2020-02-25 | 2020-02-25 | ドレッサーボード |
KR1020210012613A KR20210108309A (ko) | 2020-02-25 | 2021-01-28 | 드레서 보드 |
CN202110196067.7A CN113370004A (zh) | 2020-02-25 | 2021-02-22 | 修整板 |
TW110106401A TW202133256A (zh) | 2020-02-25 | 2021-02-24 | 修整器板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020028977A JP7430450B2 (ja) | 2020-02-25 | 2020-02-25 | ドレッサーボード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021133433A true JP2021133433A (ja) | 2021-09-13 |
JP7430450B2 JP7430450B2 (ja) | 2024-02-13 |
Family
ID=77570610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020028977A Active JP7430450B2 (ja) | 2020-02-25 | 2020-02-25 | ドレッサーボード |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7430450B2 (ja) |
KR (1) | KR20210108309A (ja) |
CN (1) | CN113370004A (ja) |
TW (1) | TW202133256A (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000049120A (ja) | 1998-07-27 | 2000-02-18 | Disco Abrasive Syst Ltd | 切削装置 |
US20090090066A1 (en) | 2007-10-09 | 2009-04-09 | Chia-Pei Chen | Grinding tool and manufacturing method thereof |
JP4960395B2 (ja) | 2009-03-17 | 2012-06-27 | 株式会社東芝 | 研磨装置とそれを用いた半導体装置の製造方法 |
JP6906836B2 (ja) | 2017-01-27 | 2021-07-21 | 株式会社ディスコ | 積層ドレッシングボードの使用方法 |
-
2020
- 2020-02-25 JP JP2020028977A patent/JP7430450B2/ja active Active
-
2021
- 2021-01-28 KR KR1020210012613A patent/KR20210108309A/ko unknown
- 2021-02-22 CN CN202110196067.7A patent/CN113370004A/zh active Pending
- 2021-02-24 TW TW110106401A patent/TW202133256A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP7430450B2 (ja) | 2024-02-13 |
CN113370004A (zh) | 2021-09-10 |
TW202133256A (zh) | 2021-09-01 |
KR20210108309A (ko) | 2021-09-02 |
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