JP2018108638A - エンドエフェクタ用の適合バキュームカップを与える装置及び方法 - Google Patents
エンドエフェクタ用の適合バキュームカップを与える装置及び方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0691—Suction pad made out of porous material, e.g. sponge or foam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Walking Sticks, Umbrellas, And Fans (AREA)
- Clamps And Clips (AREA)
Abstract
【解決手段】少なくともその基部がバキュームに接続的に関連し、基部よりもその最上部に大きな断面円周を有する少なくとも1つのバキュームドローアイレット52を含む。最上部の大きな断面円周をその中に受け入れるのに適した受け入れ部分を含む延伸カップ発泡体部分と、この延伸カップ発泡体部分の断面に沿って挿入された2つの脚部を有するワイヤクリップ102a、102bであって、その2つの脚部は、大きな断面円周の下で、バキュームドローホールの第2の断面円周上の2つの接線点で受け入れ部分を摩擦接触させるのに適した構成とした。
【選択図】図9
Description
Claims (20)
- エンドエフェクタ用のバキュームグリップであって、
その基部においてバキュームに接続的に関連し、該基部におけるよりもその最上部においてより大きな断面円周を有する少なくとも1つのバキュームドローアイレットと、
前記最上部のより大きな断面円周をその中に受け入れるのに適した受け入れ部分を含む延伸カップ発泡体部分と、
ワイヤクリップとを備え、このワイヤクリップは前記延伸カップ発泡体部分の断面平面に沿って挿入された2つの脚部を含み、この2つの脚部は、前記より大きな断面円周の下方で前記バキュームドローアイレットの第2の断面円周上の2つの接線点において前記受け入れ部分を摩擦接触させるように圧縮するのに適しているバキュームグリップ。 - 前記ワイヤクリップがステンレス鋼を含む請求項1に記載のバキュームグリップ。
- 前記延伸カップ発泡体部分がシリコンからなることを特徴とする請求項1に記載のバキュームグリップ。
- 前記ワイヤクリップは、前記ワイヤクリップを挿入するための力を受けることができる脚部結合部を更に含む請求項1に記載のバキュームグリップ。
- 前記ワイヤクリップは、前記脚部の重なり合った端部を更に含み、挿入点から遠位点で前記ワイヤクリップを閉止する請求項1に記載のバキュームグリップ。
- 前記断面平面が、前記延伸カップ発泡体部分の上面と下面との間の実質的に中間である請求項1に記載のバキュームグリップ。
- 前記バキュームドローアイレットは、ゴムとプラスチックとのうちの一方を含む請求項1に記載のバキュームグリップ。
- 前記延伸カップ発泡体部分と組み合わせた前記バキュームドローアイレットは、1mm乃至5mmの範囲の全高さを有する請求項1に記載のバキュームグリップ。
- 前記接続的に関連した部分が入口ポートを含む請求項1に記載のバキュームグリップ。
- 第2のワイヤクリップを更に備え、この第2のワイヤクリップは、前記断面平面に実質的に沿って挿入された2つの脚部を含むと共に、この2つの脚部に対して実質的に垂直な第2の2つの脚部を有し、前記受け入れ部分を前記バキュームドローアイレットの第2の断面円周上の第3の接線点と第4の接線点とに摩擦接触させるように圧縮するのに適している請求項1に記載のバキュームグリップ。
- 前記エンドエフェクタの遠位端に、前記バキュームドローアイレットが取り付けられている請求項1に記載のバキュームグリップ。
- 前記遠位端は、フォーク状遠位端を含む請求項11に記載のバキュームグリップ。
- 前記少なくとも1つのバキュームドローアイレットは、3つのバキュームドローアイレットからなる請求項12に記載のバキュームグリップ。
- 前記延伸カップ発泡体部分が開放セル形式を含む請求項1に記載のバキュームグリップ。
- エンドエフェクタであって、
支持アームと、
第1の端部で前記支持アームに接続された中間部分と、
前記中間部分の第2の端部上の前記中間部分に接続された遠位端と、
その基部においてバキュームに接続的に関連し、該基部におけるよりもその最上部においてより大きな断面円周を有する少なくとも1つのバキュームドローアイレットと、
延伸カップ発泡体部分であり、その中に前記最上部のより大きな断面円周を受け入れるのに適する受け入れ部分を有する延伸カップ発泡体部分と、
ワイヤクリップとを備え、このワイヤクリップは、断面平面に実質的に沿って挿入された2つの脚部を含むと共に、この2つの脚部に対して実質的に垂直な第2の2つの脚部を有し、前記受け入れ部分を前記より大きな断面円周の下方で前記バキュームドローアイレットの第2の断面円周上の二つの接線に摩擦接触させるように圧縮するのに適しているエンドエフェクタ。 - 前記中間部分は、少なくとも1つの角度部分を含む請求項15に記載のエンドエフェクタ。
- 前記支持アームは、ロボットフランジと、このロボットフランジに係合する電気機械要素とを備える請求項15に記載のエンドエフェクタ。
- 前記断面平面は、前記延伸カップ発泡体部分の上面と底面との間の実質的に中間である請求項15に記載のエンドエフェクタ。
- 前記バキュームドローアイレットは、ゴムとプラスチックとのうちの一方を含む請求項15に記載のエンドエフェクタ。
- 請求項15に記載のエンドエフェクタにおいて、前記延伸カップ発泡体部分と組み合わせた前記バキュームドローアイレットは、約2mmの全高さを有するエンドエフェクタ。
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US15/380,783 | 2016-12-15 | ||
US15/380,783 US9975255B1 (en) | 2016-12-15 | 2016-12-15 | Apparatus, system and method for providing a conformable vacuum cup for an end effector |
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EP (2) | EP3979302B1 (ja) |
JP (1) | JP7180975B2 (ja) |
KR (1) | KR102496933B1 (ja) |
CN (1) | CN108231650B (ja) |
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JP2012023174A (ja) * | 2010-07-14 | 2012-02-02 | Disco Abrasive Syst Ltd | 板状物の搬出入装置 |
US20140306474A1 (en) * | 2013-04-12 | 2014-10-16 | Varian Semiconductor Equipment Associates, Inc. | Spring retained end effector contact pad |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020136603A (ja) * | 2019-02-25 | 2020-08-31 | アスリートFa株式会社 | ワーク搬送用ハンド及びボール搭載装置 |
JP7222535B2 (ja) | 2019-02-25 | 2023-02-15 | アスリートFa株式会社 | ワーク搬送用ハンド及びボール搭載装置 |
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US20200206954A1 (en) | 2020-07-02 |
US9975255B1 (en) | 2018-05-22 |
EP3336882A1 (en) | 2018-06-20 |
TWI809480B (zh) | 2023-07-21 |
US20180311832A1 (en) | 2018-11-01 |
ES2904560T3 (es) | 2022-04-05 |
KR102496933B1 (ko) | 2023-02-06 |
EP3979302A1 (en) | 2022-04-06 |
TW201827186A (zh) | 2018-08-01 |
CN108231650B (zh) | 2023-07-14 |
JP7180975B2 (ja) | 2022-11-30 |
TW202348374A (zh) | 2023-12-16 |
EP3336882B1 (en) | 2021-10-27 |
CN108231650A (zh) | 2018-06-29 |
EP3979302B1 (en) | 2024-04-17 |
US11027437B2 (en) | 2021-06-08 |
TWI739972B (zh) | 2021-09-21 |
TW202216385A (zh) | 2022-05-01 |
KR20180069728A (ko) | 2018-06-25 |
US10518422B2 (en) | 2019-12-31 |
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