JP2017500740A - ウエハをダイシングする方法及びそのためのキャリア - Google Patents
ウエハをダイシングする方法及びそのためのキャリア Download PDFInfo
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Abstract
Description
本願は、2013年7月2日出願の米国特許仮出願第61/914,323号の優先権を主張し、その全内容は参照によって本明細書に組み込まれる。
本発明の実施形態は半導体処理の分野に関し、具体的には、複数の集積回路を有する半導体ウエハをダイシングするための方法及びキャリアに関する。
半導体のウエハ処理においては、シリコン又は他の半導体材料で構成された集積回路がウエハ(基板とも称される)上に形成される。一般的には、半導電性、導電性、又は絶縁性の何れかの様々な材料層を用いて集積回路が形成される。これらの材料は、集積回路を形成するために、様々な周知のプロセスを用いて、ドープされ、堆積され、エッチングされる。各ウエハは処理されて、ダイとして知られる集積回路が含まれる多数の個別領域を形成する。
Claims (15)
- エッチング処理においてウエハ又は基板を支持するためのキャリアであって、
内側開口を囲む外周を有するフレーム、及び
前記フレームに連結され前記フレームの前記内側開口の下に配置されたテープであって、支持層の上に配置されたエッチング停止層を含む、テープ
を備える、キャリア。 - 前記エッチング停止層が、二酸化ケイ素の層又は有機ポリマーの層を含む、請求項1に記載のキャリア。
- 前記テープが、前記エッチング停止層の上に配置されたダイ接着膜(DAF)を更に含む、請求項1に記載のキャリア。
- 前記テープが、前記エッチング停止層の上に配置された接着剤層を更に含む、請求項1に記載のキャリア。
- 前記テープが、前記接着剤層の上に配置されたダイ接着膜(DAF)を更に含む、請求項4に記載のキャリア。
- 前記フレームがステンレス鋼を含む、請求項1に記載のキャリア。
- エッチング処理においてウエハ又は基板を支持するためのキャリアであって、
内側開口を囲む外周を有するフレーム、及び
前記フレームに連結され前記フレームの前記内側開口の下に配置されたテープであって、エッチング停止特性を有する層を含む、テープ
を備える、キャリア。 - 前記エッチング停止特性が、前記エッチング処理において、支持された前記ウエハのエッチング速度と比較して約20倍遅いエッチング速度である、請求項7に記載のキャリア。
- 前記エッチング停止特性が、光放射センサ(OES)エンドポイント検知システム又はレーザエンドポイントシステムによって検知可能な発光である、請求項7に記載のキャリア。
- キャリアによって支持されたウエハ又は基板をダイシングする方法であって、
前記ウエハ又は基板をプラズマ処理によりエッチングすること、及び
前記ウエハ又は基板を貫通してエッチングし前記キャリアを露出させる際のエッチング副生成物の変化を検知すること、
を含む、方法。 - 前記検知が、光放射センサ(OES)エンドポイント検知システム又はレーザエンドポイントシステムを用いて実施される、請求項10に記載の方法。
- 前記エッチングにおける副生成物の変化を検知したときに前記エッチングを終了させること
を更に含む、請求項10に記載の方法。 - 前記ウエハ又は基板を前記プラズマ処理によってエッチングすることにより、前記ウエハ又は基板が個々のダイ又は集積回路へと個片化される、請求項10に記載の方法。
- 前記ウエハ又は基板を前記プラズマ処理によってエッチングする前に、前記ウエハ又は基板上にエッチングマスクを形成すること
を更に含む、請求項10に記載の方法。 - 前記エッチングマスクの形成後、及び前記ウエハ又は基板のエッチング前に、前記ウエハ又は基板のダイシングストリートを露出させるために前記エッチングマスクをレーザスクライブすること
を更に含む、請求項14に記載の方法。
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US14/538,126 | 2014-11-11 | ||
US14/538,126 US9299614B2 (en) | 2013-12-10 | 2014-11-11 | Method and carrier for dicing a wafer |
PCT/US2014/067762 WO2015088791A1 (en) | 2013-12-10 | 2014-11-26 | Method and carrier for dicing a wafer |
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JP6527517B2 (ja) | 2019-06-05 |
CN105814666A (zh) | 2016-07-27 |
WO2015088791A1 (en) | 2015-06-18 |
TWI647783B (zh) | 2019-01-11 |
CN113421846A (zh) | 2021-09-21 |
KR20160097268A (ko) | 2016-08-17 |
US20150162244A1 (en) | 2015-06-11 |
KR102378339B1 (ko) | 2022-03-25 |
US9299614B2 (en) | 2016-03-29 |
JP6527517B6 (ja) | 2019-06-26 |
TW201528423A (zh) | 2015-07-16 |
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