JP2017081781A - 膜付きガラス板の製造方法 - Google Patents
膜付きガラス板の製造方法 Download PDFInfo
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- JP2017081781A JP2017081781A JP2015211906A JP2015211906A JP2017081781A JP 2017081781 A JP2017081781 A JP 2017081781A JP 2015211906 A JP2015211906 A JP 2015211906A JP 2015211906 A JP2015211906 A JP 2015211906A JP 2017081781 A JP2017081781 A JP 2017081781A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
- C23C18/1817—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
2 積層膜
3 ガラス板
4 無機物膜
5 無電解めっき金属膜
6 電解めっき金属膜
S1 無機物膜形成工程
S2 加熱工程
S3 無電解めっき工程
S4 電解めっき工程
Claims (4)
- ガラス板側から見た場合に黒色であると共に複数の膜を積層してなる積層膜が、前記ガラス板上に形成された膜付きガラス板の製造方法であって、
前記積層膜を形成する工程が、前記ガラス板上に少なくとも貴金属を含む無機物膜を形成する無機物膜形成工程と、前記無機物膜上に無電解めっき金属膜を形成する無電解めっき工程と、前記無電解めっき金属膜上に電解めっき金属膜を形成する電解めっき工程とを備え、
前記電解めっき工程で、ピロリン酸無機物浴を使用することを特徴とする膜付きガラス板の製造方法。 - 前記無電解めっき金属膜がニッケルであることを特徴とする請求項1に記載の膜付きガラス板の製造方法。
- 前記電解めっき金属膜が銅であり、前記電解めっき工程で、ピロリン酸銅浴を使用することを特徴とする請求項1又は2に記載の膜付きガラス板の製造方法。
- 更に、前記無機物膜形成工程と前記無電解めっき工程の間に、前記無機物膜を加熱する加熱工程を備えることを特徴とする請求項1〜3の何れか1項に記載の膜付きガラス板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015211906A JP6652740B2 (ja) | 2015-10-28 | 2015-10-28 | 膜付きガラス板の製造方法 |
CN201680037948.1A CN107709262A (zh) | 2015-10-28 | 2016-08-23 | 附膜玻璃板的制造方法 |
KR1020177035993A KR20180074619A (ko) | 2015-10-28 | 2016-08-23 | 막이 부착된 유리판의 제조 방법 |
PCT/JP2016/074503 WO2017073147A1 (ja) | 2015-10-28 | 2016-08-23 | 膜付きガラス板の製造方法 |
TW105129814A TWI686361B (zh) | 2015-10-28 | 2016-09-13 | 附膜玻璃板之製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015211906A JP6652740B2 (ja) | 2015-10-28 | 2015-10-28 | 膜付きガラス板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017081781A true JP2017081781A (ja) | 2017-05-18 |
JP6652740B2 JP6652740B2 (ja) | 2020-02-26 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015211906A Active JP6652740B2 (ja) | 2015-10-28 | 2015-10-28 | 膜付きガラス板の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6652740B2 (ja) |
KR (1) | KR20180074619A (ja) |
CN (1) | CN107709262A (ja) |
TW (1) | TWI686361B (ja) |
WO (1) | WO2017073147A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019244687A1 (ja) | 2018-06-19 | 2019-12-26 | 凸版印刷株式会社 | ガラス配線基板 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022270253A1 (ja) | 2021-06-24 | 2022-12-29 | 奥野製薬工業株式会社 | めっき皮膜及びめっき皮膜の製造方法 |
CN116615575B (zh) * | 2021-06-24 | 2024-04-30 | 奥野制药工业株式会社 | 镀敷皮膜和镀敷皮膜的制造方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56158424A (en) * | 1980-05-13 | 1981-12-07 | Asahi Chem Ind Co Ltd | Electrolytic copper plating for compound semiconductor |
JPS575856A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Plating method |
JPS61261237A (ja) * | 1985-05-16 | 1986-11-19 | Asahi Glass Co Ltd | 導電性セラミツクカラ−プリントガラス |
JPS63241846A (ja) * | 1987-03-30 | 1988-10-07 | Ise Electronics Corp | 耐熱性黒色電極およびその製造方法 |
JPH0575238A (ja) * | 1991-03-06 | 1993-03-26 | Nau Chem:Yugen | 回路基板とその製造方法 |
JPH08144061A (ja) * | 1994-11-24 | 1996-06-04 | Japan Energy Corp | 絶縁体のメタライズ方法 |
JPH08333685A (ja) * | 1995-06-07 | 1996-12-17 | Kondo Mekki Kogyo Kk | 鍍金方法 |
JP2009024203A (ja) * | 2007-07-18 | 2009-02-05 | Okuno Chem Ind Co Ltd | 電気銅めっき方法 |
JP2014089689A (ja) * | 2012-10-29 | 2014-05-15 | Samsung Electro-Mechanics Co Ltd | タッチパネル及びその製造方法 |
WO2016052306A1 (ja) * | 2014-10-03 | 2016-04-07 | 日本電気硝子株式会社 | 膜付きガラス板、タッチセンサ、膜及び膜付きガラス板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2974665B1 (ja) * | 1998-08-28 | 1999-11-10 | 日本写真印刷株式会社 | 透光性電磁波シールド材とその製造方法 |
CN103342471B (zh) * | 2013-07-05 | 2015-10-21 | 西北师范大学 | 一种光电纳米复合膜材料及其制备方法和应用 |
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2015
- 2015-10-28 JP JP2015211906A patent/JP6652740B2/ja active Active
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2016
- 2016-08-23 CN CN201680037948.1A patent/CN107709262A/zh active Pending
- 2016-08-23 WO PCT/JP2016/074503 patent/WO2017073147A1/ja active Application Filing
- 2016-08-23 KR KR1020177035993A patent/KR20180074619A/ko unknown
- 2016-09-13 TW TW105129814A patent/TWI686361B/zh not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56158424A (en) * | 1980-05-13 | 1981-12-07 | Asahi Chem Ind Co Ltd | Electrolytic copper plating for compound semiconductor |
JPS575856A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Plating method |
JPS61261237A (ja) * | 1985-05-16 | 1986-11-19 | Asahi Glass Co Ltd | 導電性セラミツクカラ−プリントガラス |
JPS63241846A (ja) * | 1987-03-30 | 1988-10-07 | Ise Electronics Corp | 耐熱性黒色電極およびその製造方法 |
JPH0575238A (ja) * | 1991-03-06 | 1993-03-26 | Nau Chem:Yugen | 回路基板とその製造方法 |
JPH08144061A (ja) * | 1994-11-24 | 1996-06-04 | Japan Energy Corp | 絶縁体のメタライズ方法 |
JPH08333685A (ja) * | 1995-06-07 | 1996-12-17 | Kondo Mekki Kogyo Kk | 鍍金方法 |
JP2009024203A (ja) * | 2007-07-18 | 2009-02-05 | Okuno Chem Ind Co Ltd | 電気銅めっき方法 |
JP2014089689A (ja) * | 2012-10-29 | 2014-05-15 | Samsung Electro-Mechanics Co Ltd | タッチパネル及びその製造方法 |
WO2016052306A1 (ja) * | 2014-10-03 | 2016-04-07 | 日本電気硝子株式会社 | 膜付きガラス板、タッチセンサ、膜及び膜付きガラス板の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019244687A1 (ja) | 2018-06-19 | 2019-12-26 | 凸版印刷株式会社 | ガラス配線基板 |
US11516907B2 (en) | 2018-06-19 | 2022-11-29 | Toppan Printing Co., Ltd. | Glass wiring board |
Also Published As
Publication number | Publication date |
---|---|
TWI686361B (zh) | 2020-03-01 |
TW201722880A (zh) | 2017-07-01 |
WO2017073147A1 (ja) | 2017-05-04 |
JP6652740B2 (ja) | 2020-02-26 |
CN107709262A (zh) | 2018-02-16 |
KR20180074619A (ko) | 2018-07-03 |
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