JP2015165228A - X線蛍光を用いた測定対象の測定方法 - Google Patents
X線蛍光を用いた測定対象の測定方法 Download PDFInfo
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- JP2015165228A JP2015165228A JP2015021867A JP2015021867A JP2015165228A JP 2015165228 A JP2015165228 A JP 2015165228A JP 2015021867 A JP2015021867 A JP 2015021867A JP 2015021867 A JP2015021867 A JP 2015021867A JP 2015165228 A JP2015165228 A JP 2015165228A
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- 238000005259 measurement Methods 0.000 title claims abstract description 147
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004876 x-ray fluorescence Methods 0.000 title claims abstract description 10
- 238000001228 spectrum Methods 0.000 claims abstract description 31
- 230000005855 radiation Effects 0.000 claims abstract description 27
- 238000011158 quantitative evaluation Methods 0.000 claims description 8
- 238000011156 evaluation Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000012935 Averaging Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 238000009681 x-ray fluorescence measurement Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/223—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/07—Investigating materials by wave or particle radiation secondary emission
- G01N2223/076—X-ray fluorescence
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6113—Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/633—Specific applications or type of materials thickness, density, surface weight (unit area)
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- Analytical Chemistry (AREA)
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- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
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- Analysing Materials By The Use Of Radiation (AREA)
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Abstract
Description
22 一次ビーム
24 測定対象
25 測定表面
26 二次放射線
27 検出器
29 評価デバイス
31 格子面
35 縁部
36 測定スポット
36’ 格子部分面
S1...Sn 列
Z1〜Zn 行
Claims (9)
- X線蛍光を用いた測定対象(24)の測定方法、特に前記測定対象(24)の薄い層の厚さ及び成分組成の測定方法であって:
‐前記方法において、一次ビーム(22)はX線放射線源(21)から前記測定対象(24)へと向けられ;
‐前記方法において、前記測定対象(24)から放射される二次放射線(26)は、検出器(27)によって検出され、評価デバイス(29)へと中継され;
‐前記方法において、前記一次ビーム(22)は格子面(31)内で移動し、前記格子面(31)は格子部分面(1...n)に分割され、並びに少なくとも1つの行(Z1〜Zn)及び少なくとも1つの列(S1...Sn)に細分化され、また前記一次ビーム(22)は各前記格子部分面(1...n)に対して前記格子面(31)へと向けられ、また前記一次ビーム(22)の測定スポット(36)は少なくとも格子部分面(36’)を含む、測定方法において、
‐前記測定対象(24)の測定表面(25)の横寸法を検出し;
‐前記測定対象(24)の前記測定表面(25)の前記横寸法を、前記測定対象(24)に出現する前記一次ビーム(22)の前記測定スポット(36)のサイズと比較し;
‐前記測定対象(24)の前記測定表面(25)のサイズ(これは前記測定スポット(36)よりも小さい)の決定中に、前記測定対象(24)の少なくとも1つの前記測定表面(25)を包含する前記格子表面(31)のサイズを選択し;
‐前記格子面(31)の前記サイズと前記測定対象(24)の前記測定表面(25)の前記サイズとの比から、スケーリング係数αを決定し;
‐前記二次放射線(26)の検出スペクトルを、前記各格子部分面(1...n)から集計して平均化し、続いて前記スケーリング係数αを乗算し;
‐前記スケーリング係数αによって補正された前記格子部分面(1...n)からの前記二次放射線(26)の前記スペクトルを、定量評価のために得る
ことを特徴とする、方法。 - 前記格子部分面(1...n)の間隔は、前記一次ビーム(22)の前記測定スポット(36)の前記サイズによって決定されることを特徴とする、請求項1に記載の方法。
- 前記格子面(31)の前記サイズは、上下方向に直接並んでいる又は重なっている前記一次ビーム(22)の前記測定スポット(36)の整数倍から形成されることを特徴とする、請求項1に記載の方法。
- 評価ソフトウェアを用いて、前記測定対象(24)の成分濃度又は層厚さを、前記格子部分面(1...n)における個別の測定の前記スペクトルから決定及び出力することを特徴とする、請求項1に記載の方法。
- 前記格子面(31)のある行又はある列内における、ある前記格子部分面から隣接する前記格子部分面への、前記測定対象(24)の移動距離は、前記放射線源(21)の前記一次ビーム(22)の前記測定スポット(36)の前記サイズによって決定されることを特徴とする、請求項1に記載の方法。
- 前記測定対象(24)の前記測定表面(25)の前記サイズは、光学測定方法によって決定されることを特徴とする、請求項1に記載の方法。
- 前記格子面(31)の前記サイズは、前記測定対象(24)の決定された前記測定表面(25)よりも大きくなるよう設計され、
また前記格子面(31)の前記サイズは、前記格子面(31)が、前記決定された測定表面(25)と、少なくとも部分的に前記測定表面(25)を包囲する縁部(35)とを含むように、より大きく設計される
ことを特徴とする、請求項6に記載の方法。 - 前記測定対象(24)の前記測定表面(25)を包囲する前記縁部(35)は、前記格子部分面(1...n)の少なくとも1つのサイズの幅に決定されることを特徴とする、請求項7に記載の方法。
- 前記測定スポット(36)の前記サイズよりも小さい、2つの前記測定対象(24)間の距離に関して、2つ以上の前記測定対象(24)は1つの総測定表面に結合され、
前記格子面(31)は前記総測定表面に関して決定され、これから、前記薄い層の平均厚さ又は平均成分濃度を、前記総測定表面に結合された個別の前記測定対象(24)に関して推定する
ことを特徴とする、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014102684.5 | 2014-02-28 | ||
DE102014102684.5A DE102014102684A1 (de) | 2014-02-28 | 2014-02-28 | Verfahren zur Messung eines Messobjektes mittels Röntgenfluoreszenz |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015165228A true JP2015165228A (ja) | 2015-09-17 |
JP6462389B2 JP6462389B2 (ja) | 2019-01-30 |
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Application Number | Title | Priority Date | Filing Date |
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JP2015021867A Active JP6462389B2 (ja) | 2014-02-28 | 2015-02-06 | X線蛍光を用いた測定対象の測定方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US9885676B2 (ja) |
EP (1) | EP2913632B1 (ja) |
JP (1) | JP6462389B2 (ja) |
KR (1) | KR102264842B1 (ja) |
CN (1) | CN104880475B (ja) |
CA (1) | CA2879037C (ja) |
DE (1) | DE102014102684A1 (ja) |
HK (1) | HK1210267A1 (ja) |
MX (1) | MX353531B (ja) |
TW (1) | TWI642897B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110132188B (zh) * | 2019-06-19 | 2020-11-10 | 中国人民解放军空军工程大学 | 一种基于多元素x射线特征光谱综合分析的涂渗层厚度计算方法 |
CN112268914B (zh) * | 2020-12-07 | 2021-04-30 | 西安稀有金属材料研究院有限公司 | 一种全尺寸核燃料包壳管元件耐事故涂层的无损检测方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07128259A (ja) * | 1993-10-29 | 1995-05-19 | Seiko Instr Inc | X線マッピング分析方法 |
US20030002620A1 (en) * | 2000-04-18 | 2003-01-02 | Isaac Mazor | Wafer with overlay test pattern |
JP2013015539A (ja) * | 2007-01-01 | 2013-01-24 | Jordan Valley Semiconductors Ltd | 検査方法及び検査装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3094199B2 (ja) * | 1994-04-01 | 2000-10-03 | セイコーインスツルメンツ株式会社 | 微小部分析方法 |
DE19836884C1 (de) * | 1998-08-14 | 2000-06-21 | Helmut Fischer Gmbh & Co | Bestimmung des Meßflecks bei der Röntgenfluoreszenzanalyse |
DE10013048A1 (de) * | 2000-03-17 | 2001-09-20 | Helmut Fischer Gmbh & Co | Verfahren zur Einstellung einer Lage eines Meßgegenstandes bei der Schichtdickenmessung mit Röntgenfluoreszenz |
US6891627B1 (en) * | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
JP2003050115A (ja) * | 2001-08-07 | 2003-02-21 | Seiko Instruments Inc | X線膜厚計 |
JP2004003959A (ja) * | 2002-01-16 | 2004-01-08 | Seiko Instruments Inc | 蛍光x線測定方法とそれを用いた測定装置、加工方法および加工装置 |
DE102004039022B4 (de) * | 2004-08-11 | 2007-09-27 | Infineon Technologies Ag | xDSL-Multistandard-Treiberschaltung |
JP4881307B2 (ja) * | 2005-08-04 | 2012-02-22 | エスアイアイ・ナノテクノロジー株式会社 | 蛍光x線分析方法 |
KR101374308B1 (ko) * | 2005-12-23 | 2014-03-14 | 조르단 밸리 세미컨덕터즈 리미티드 | Xrf를 사용한 층 치수의 정밀 측정법 |
US8625737B2 (en) * | 2010-02-09 | 2014-01-07 | X-Ray Optical Systems, Inc. | Sample module with sample stream supported and spaced from window, for X-ray analysis system |
JP4914514B2 (ja) * | 2010-07-02 | 2012-04-11 | 株式会社リガク | 蛍光x線分析装置および方法 |
US8669524B2 (en) * | 2010-10-25 | 2014-03-11 | The Reseach Foundation of State University of New York | Scanning incremental focus microscopy |
US10013518B2 (en) * | 2012-07-10 | 2018-07-03 | Kla-Tencor Corporation | Model building and analysis engine for combined X-ray and optical metrology |
US9194829B2 (en) * | 2012-12-28 | 2015-11-24 | Fei Company | Process for performing automated mineralogy |
US9389192B2 (en) * | 2013-03-24 | 2016-07-12 | Bruker Jv Israel Ltd. | Estimation of XRF intensity from an array of micro-bumps |
US9535018B2 (en) * | 2013-07-08 | 2017-01-03 | Kla-Tencor Corporation | Combined x-ray and optical metrology |
US9188552B2 (en) * | 2014-03-26 | 2015-11-17 | Jeol Ltd. | X-ray spectrometer and sample analyzer |
-
2014
- 2014-02-28 DE DE102014102684.5A patent/DE102014102684A1/de not_active Withdrawn
-
2015
- 2015-01-16 TW TW104101456A patent/TWI642897B/zh active
- 2015-01-20 EP EP15151728.1A patent/EP2913632B1/de active Active
- 2015-01-22 CA CA2879037A patent/CA2879037C/en active Active
- 2015-02-04 KR KR1020150017104A patent/KR102264842B1/ko active IP Right Grant
- 2015-02-06 JP JP2015021867A patent/JP6462389B2/ja active Active
- 2015-02-26 MX MX2015002540A patent/MX353531B/es active IP Right Grant
- 2015-02-27 CN CN201510089380.5A patent/CN104880475B/zh active Active
- 2015-03-02 US US14/634,979 patent/US9885676B2/en active Active
- 2015-11-10 HK HK15111051.6A patent/HK1210267A1/xx not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07128259A (ja) * | 1993-10-29 | 1995-05-19 | Seiko Instr Inc | X線マッピング分析方法 |
US20030002620A1 (en) * | 2000-04-18 | 2003-01-02 | Isaac Mazor | Wafer with overlay test pattern |
JP2013015539A (ja) * | 2007-01-01 | 2013-01-24 | Jordan Valley Semiconductors Ltd | 検査方法及び検査装置 |
Also Published As
Publication number | Publication date |
---|---|
US20150247812A1 (en) | 2015-09-03 |
US9885676B2 (en) | 2018-02-06 |
HK1210267A1 (en) | 2016-04-15 |
DE102014102684A1 (de) | 2015-09-03 |
JP6462389B2 (ja) | 2019-01-30 |
KR20150102682A (ko) | 2015-09-07 |
TWI642897B (zh) | 2018-12-01 |
TW201534862A (zh) | 2015-09-16 |
KR102264842B1 (ko) | 2021-06-16 |
CA2879037C (en) | 2018-12-18 |
CA2879037A1 (en) | 2015-08-28 |
EP2913632A1 (de) | 2015-09-02 |
MX2015002540A (es) | 2016-01-12 |
MX353531B (es) | 2018-01-18 |
EP2913632B1 (de) | 2019-09-11 |
CN104880475A (zh) | 2015-09-02 |
CN104880475B (zh) | 2019-01-01 |
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