JP2015003356A

JP2015003356A - Cutting method

Info

Publication number: JP2015003356A
Application number: JP2013129279A
Authority: JP
Inventors: 鈴木　稔; Minoru Suzuki; 稔鈴木
Original assignee: Disco Abrasive Systems Ltd
Current assignee: Disco Corp
Priority date: 2013-06-20
Filing date: 2013-06-20
Publication date: 2015-01-08
Anticipated expiration: 2033-06-20
Also published as: JP6104070B2

Abstract

PROBLEM TO BE SOLVED: To provide a cutting method for sticking a workpiece on a support substrate and cutting the workpiece, capable of reusing the support substrate without lowering processing accuracy of the workpiece.SOLUTION: The cutting method includes: a sticking step of supplying mixed resin (4) in which particles (10) are dispersed, on a front face (2a) of a support substrate (2), pressing a workpiece against the support substrate so that a rear face (6b) of the workpiece (6) faces the front face of the support substrate, curing the mixed resin, and thereby sticking the workpiece to the support substrate via the mixed resin; a cutting step of making a side of a rear face (2b) of the support substrate be sucked to a holding table (14), and after that, making a cutting blade (16) cut in from a side of a front face (6a) of the workpiece to the mixed resin, and cutting the workpiece; and a peeling step of peeling the workpiece and the mixed resin from the support substrate. The thickness of the mixed resin is set so that the support substrate is not cut in by the cutting blade, even when the cutting blade is made to cut in so that a shape of a tip part (16a) of the cutting blade does not remain at the workpiece.

Description

本発明は、被加工物を支持基板に固定した上で切削する切削方法に関する。 The present invention relates to a cutting method in which a workpiece is fixed to a support substrate and then cut.

ウェーハ等の被加工物は、例えば、円環状の切削ブレードを備える切削装置を用いて複数のチップに分割される。この切削装置は、被加工物を吸引保持する保持テーブルを備えており、回転する切削ブレードで保持テーブルに吸引保持された被加工物を切削して複数のチップへと分割する。 A workpiece such as a wafer is divided into a plurality of chips using, for example, a cutting device including an annular cutting blade. This cutting apparatus includes a holding table that sucks and holds a workpiece, and cuts the workpiece sucked and held by the holding table with a rotating cutting blade and divides the workpiece into a plurality of chips.

保持テーブルで吸引保持できる被加工物の形状、大きさ等は、保持テーブルの保持面の形状、大きさ等で決まっている。そのため、例えば、保持面の形状と被加工物の形状とが合致しない場合や、被加工物が反っている場合等には、被加工物を保持テーブルで適切に吸引保持できない。 The shape, size, etc. of the workpiece that can be sucked and held by the holding table are determined by the shape, size, etc. of the holding surface of the holding table. Therefore, for example, when the shape of the holding surface does not match the shape of the workpiece, or when the workpiece is warped, the workpiece cannot be appropriately sucked and held by the holding table.

そこで、このような場合にも被加工物を保持できるように、保持テーブルで吸引可能な支持基板を被加工物に接着する方法が提案されている。例えば、保持面が円形状の保持テーブルを備える切削装置で矩形状の被加工物を切削する場合には、熱可塑性樹脂でなるワックス等を用いて、保持テーブルで吸引可能な円形状の支持基板に被加工物を貼着する。 Therefore, a method has been proposed in which a support substrate that can be sucked by a holding table is bonded to a workpiece so that the workpiece can be held even in such a case. For example, when a rectangular workpiece is cut with a cutting device having a holding table whose holding surface is circular, a circular support substrate that can be sucked by the holding table using wax made of thermoplastic resin or the like. Affix the work piece to.

そして、被加工物が貼着された支持基板を保持テーブルに吸引保持させ、回転する切削ブレードを支持基板上の被加工物に切り込ませる。被加工物の切削後には、例えば、熱でワックスを軟化させ、又は、溶剤でワックスを溶融させて、被加工物から支持基板を取り外す（例えば、特許文献１参照）。 Then, the support substrate on which the workpiece is adhered is sucked and held on the holding table, and the rotating cutting blade is cut into the workpiece on the support substrate. After cutting the workpiece, for example, the support substrate is removed from the workpiece by softening the wax with heat or melting the wax with a solvent (see, for example, Patent Document 1).

特開２０００−１８２９９７号公報JP 2000-182997 A

ところで、切削をある程度継続的に行っていくと、切削ブレードの先端部分は、平坦ではなく円形に摩耗していく。よって、上述の切削方法においては、切削ブレードの先端部分の形状が切削後の被加工物に残らないように、切削ブレードを支持基板にある程度の深さまで切り込ませている。切削ブレードで切り込まれた支持基板は、再び利用できないので廃棄される。 By the way, when cutting is continued to some extent, the tip portion of the cutting blade is worn in a circular shape rather than a flat shape. Therefore, in the above-described cutting method, the cutting blade is cut into the support substrate to a certain depth so that the shape of the tip portion of the cutting blade does not remain on the workpiece after cutting. The support substrate cut by the cutting blade is discarded because it cannot be used again.

被加工物の加工精度を高く維持するには、加工の際の基準の高さ位置となる表裏面の平坦性を十分に確保した精度の高い支持基板が必要である。一方、上述の切削方法では、表裏面の精度が高い支持基板を、被加工物の切削の度に廃棄することになるので、コストが大きくなり過ぎてしまう。 In order to maintain the processing accuracy of the workpiece at a high level, a highly accurate support substrate that sufficiently ensures the flatness of the front and back surfaces, which are the reference height positions during processing, is required. On the other hand, in the above-described cutting method, since the support substrate having high accuracy on the front and back surfaces is discarded every time the workpiece is cut, the cost becomes too high.

本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、被加工物を支持基板に貼着して切削する切削方法において、被加工物の加工精度を低下させることなく支持基板を再利用可能な切削方法を提供することである。 The present invention has been made in view of such problems, and an object of the present invention is to reduce the processing accuracy of a workpiece in a cutting method in which a workpiece is attached to a support substrate and cut. It is to provide a cutting method capable of reusing a support substrate.

本発明によれば、両面が平坦面で形成された支持基板の表面に被加工物の裏面側を樹脂で貼着して、被加工物を切削する切削方法であって、粒子が分散含有した混合樹脂を該支持基板上に供給し、被加工物の裏面側を該混合樹脂側に対面させ被加工物の裏面側の全面に渡って該混合樹脂が広がるまで被加工物を押圧して載置し、該混合樹脂を硬化させて、該支持基板上に所定厚みを規定する該混合樹脂を介して被加工物を貼着する貼着工程と、該貼着工程を実施した後、該支持基板側を保持テーブルで保持して、切削ブレードによって被加工物の表面から該混合樹脂の厚み方向の途中まで切り込み、被加工物を完全切断して個片化する切削工程と、該切削工程の後に、該支持基板の表面から該個片化された被加工物及び該混合樹脂を剥離する剥離工程と、を備え、該所定厚みは、該切削ブレードが被加工物を切断する際に該切削ブレードの先端形状が被加工物に転写せず且つ該支持基板まで切り込まない厚みに規定されていることを特徴とする切削方法が提供される。 According to the present invention, there is provided a cutting method for cutting a workpiece by sticking the back side of the workpiece to the surface of a support substrate formed with flat surfaces on both sides with a resin, in which particles are dispersed and contained. The mixed resin is supplied onto the support substrate, the back surface side of the workpiece is opposed to the mixed resin side, and the workpiece is pressed until the mixed resin spreads over the entire back surface side of the workpiece. And then curing the mixed resin to adhere a workpiece on the support substrate through the mixed resin defining a predetermined thickness, and after performing the adhering step, the support A cutting process in which the substrate side is held by a holding table and cut by a cutting blade from the surface of the workpiece to the middle in the thickness direction of the mixed resin, and the workpiece is completely cut into individual pieces, Later, the individualized workpiece and the mixed resin are peeled off from the surface of the support substrate. The predetermined thickness is defined as a thickness that does not transfer the tip shape of the cutting blade to the workpiece and cut into the support substrate when the cutting blade cuts the workpiece. A cutting method is provided.

本発明によれば、被加工物の支持基板への貼着に、粒子が分散された混合樹脂を用いるので、支持基板と被加工物と間の混合樹脂を容易に厚くできる。そのため、切削ブレードを深く切り込ませても、支持基板が切削ブレードで切り込まれないように混合樹脂を十分に厚くすることで、被加工物の加工精度を低下させることなく支持基板を再利用できる。 According to the present invention, since the mixed resin in which particles are dispersed is used for attaching the workpiece to the support substrate, the mixed resin between the support substrate and the workpiece can be easily thickened. Therefore, even if the cutting blade is cut deeply, the support substrate can be reused without reducing the processing accuracy of the workpiece by making the mixed resin sufficiently thick so that the support substrate is not cut by the cutting blade. it can.

本実施の形態に係る貼着工程を模式的に示す斜視図である。It is a perspective view which shows typically the sticking process which concerns on this Embodiment. 本実施の形態に係る貼着工程を模式的に示す模式的断面図である。It is typical sectional drawing which shows typically the sticking process which concerns on this Embodiment. 本実施の形態に係る切削工程を模式的に示す模式的断面図である。It is typical sectional drawing which shows typically the cutting process which concerns on this Embodiment. 本実施の形態に係る剥離工程を模式的に示す模式的断面図である。It is typical sectional drawing which shows typically the peeling process which concerns on this Embodiment.

以下、添付図面を参照して、本発明の実施の形態について説明する。本実施の形態の切削方法は、貼着工程（図１、図２参照）、切削工程（図３参照）、及び剥離工程（図４参照）を含む。 Embodiments of the present invention will be described below with reference to the accompanying drawings. The cutting method of the present embodiment includes a sticking step (see FIGS. 1 and 2), a cutting step (see FIG. 3), and a peeling step (see FIG. 4).

貼着工程では、粒子が分散された混合樹脂を支持基板の表面に供給し、被加工物の裏面を支持基板の表面に対面させるように被加工物を支持基板に押し付け、混合樹脂を広げた後に硬化させる。これにより、被加工物は、混合樹脂を介して支持基板に貼着される。 In the sticking process, the mixed resin in which the particles are dispersed is supplied to the surface of the support substrate, and the workpiece is pressed against the support substrate so that the back surface of the workpiece faces the surface of the support substrate, and the mixed resin is spread. It is cured later. Thereby, a to-be-processed object is affixed on a support substrate through mixed resin.

切削工程では、支持基板の裏面側を保持テーブルに吸引させた上で、回転する切削ブレードを被加工物の表面側から混合樹脂まで切り込ませ、被加工物を完全に切断して個片化する。剥離工程では、支持基板の表面側から個片化された被加工物及び混合樹脂を剥離する。 In the cutting process, after the back side of the support substrate is sucked into the holding table, the rotating cutting blade is cut from the surface side of the workpiece to the mixed resin, and the workpiece is completely cut into individual pieces. To do. In the peeling step, the workpiece and the mixed resin separated from the surface side of the support substrate are peeled off.

本実施の形態の切削方法に用いられる混合樹脂は、接着剤として機能する樹脂に、球状の粒子が分散されている。これにより、切削ブレードを深く切り込ませても、支持基板が切削ブレードで切り込まれないように、支持基板と被加工物と間の混合樹脂を十分に厚くできる。以下、本実施の形態に係る切削方法の詳細について説明する。 In the mixed resin used in the cutting method of the present embodiment, spherical particles are dispersed in a resin that functions as an adhesive. Thus, even if the cutting blade is deeply cut, the mixed resin between the support substrate and the workpiece can be sufficiently thick so that the support substrate is not cut by the cutting blade. Hereinafter, the details of the cutting method according to the present embodiment will be described.

本実施の形態に係る切削方法では、まず、支持基板に被加工物を貼着する貼着工程を実施する。図１は、貼着工程を模式的に示す斜視図であり、図２は、貼着工程を模式的に示す模式的断面図である。 In the cutting method according to the present embodiment, first, an attaching step of attaching a workpiece to a support substrate is performed. FIG. 1 is a perspective view schematically showing the sticking process, and FIG. 2 is a schematic cross-sectional view schematically showing the sticking process.

貼着工程では、図１（Ａ）に示すように、まず、支持基板２の表面２ａに混合樹脂４を供給する。そして、混合樹脂４を挟むように支持基板２の上方に被加工物６を重ね、図１（Ｂ）及び図２に示すように、被加工物６を押圧して混合樹脂４を広げる。その後、広げられた混合樹脂４を硬化させる。 In the sticking step, first, the mixed resin 4 is supplied to the surface 2a of the support substrate 2 as shown in FIG. Then, the workpiece 6 is stacked above the support substrate 2 so as to sandwich the mixed resin 4 and, as shown in FIGS. 1B and 2, the workpiece 6 is pressed to spread the mixed resin 4. Thereafter, the spread mixed resin 4 is cured.

支持基板２は、表面２ａ及び裏面２ｂが平坦な矩形状の平板であり、後述する切削装置１２の保持テーブル１４（図３参照）に吸引保持される。本実施の形態では、支持基板２として、サイズが２０ｍｍ×２０ｍｍ×０．８ｍｍの青板ガラス（フロートガラス）でなるガラス基板を用いる。 The support substrate 2 is a rectangular flat plate having a flat front surface 2a and a back surface 2b, and is sucked and held by a holding table 14 (see FIG. 3) of the cutting device 12 described later. In the present embodiment, a glass substrate made of blue plate glass (float glass) having a size of 20 mm × 20 mm × 0.8 mm is used as the support substrate 2.

なお、支持基板２の材質は特に限定されない。支持基板２としては、他にも、アルミニウム、ステンレス、銅等の金属材料でなる金属基板、樹脂材料でなる樹脂基板等を用いることができる。青板ガラス以外のガラス基板を用いても良い。 The material of the support substrate 2 is not particularly limited. As the support substrate 2, a metal substrate made of a metal material such as aluminum, stainless steel, or copper, a resin substrate made of a resin material, or the like can be used. A glass substrate other than blue plate glass may be used.

また、支持基板２の形状、サイズについても特に限定されない。支持基板２は、少なくとも、保持テーブル１４で吸引保持可能な形状、サイズに形成されていれば良い。支持基板２の表面２ａ及び裏面２ｂは、被加工物６の切削精度を低下させない程度に平坦化されている。 Further, the shape and size of the support substrate 2 are not particularly limited. The support substrate 2 may be formed in at least a shape and size that can be sucked and held by the holding table 14. The front surface 2a and the back surface 2b of the support substrate 2 are flattened to such an extent that the cutting accuracy of the workpiece 6 is not lowered.

混合樹脂４は、図２に示すように、接着剤として機能する樹脂８に球状の粒子１０が分散含有されており、支持基板２の表面２ａと被加工物６の裏面６ｂとの間に所定の間隔を形成するように、支持基板２上に被加工物６を固定する。 As shown in FIG. 2, the mixed resin 4 includes spherical resin particles 10 dispersed in a resin 8 that functions as an adhesive, and a predetermined gap between the front surface 2 a of the support substrate 2 and the rear surface 6 b of the workpiece 6. The workpiece 6 is fixed on the support substrate 2 so as to form an interval of.

本実施の形態では、樹脂８として、熱可塑性樹脂でなるシフトワックス（ホットメルトタイプの仮止め接着剤）を用いる。ただし、樹脂８はこれに限定されず、例えば、紫外光の照射で硬化するＵＶ硬化樹脂等を用いても良い。 In the present embodiment, a shift wax (hot melt type temporary fixing adhesive) made of a thermoplastic resin is used as the resin 8. However, the resin 8 is not limited thereto, and for example, a UV curable resin that is cured by irradiation with ultraviolet light may be used.

また、本実施の形態では、粒子１０として、粒径が１００μｍ〜２００μｍのガラスビーズを使用する。ガラスビーズの材質は、特に限定されないが、例えば、ＳｉＯ_２、Ａｌ_２Ｏ_３、ＳｉＣ等を成分として含ませることができる。粒子１０の粒径は、後述のように、硬化後の混合樹脂４に要求される厚み等に応じて変更できる。 In the present embodiment, glass beads having a particle diameter of 100 μm to 200 μm are used as the particles 10. The material of the glass beads is not particularly limited, for _example, it may be included _{_{SiO 2, Al 2 O 3,}} SiC or the like as a component. The particle size of the particles 10 can be changed according to the thickness required for the mixed resin 4 after curing, as will be described later.

なお、混合樹脂４には、切削装置１２の切削ブレード１６（図３参照）に含まれる砥粒の径より小径の砥粒を含ませても良い。この場合、後の切削工程において、被加工物６の切断と共に切削ブレード１６の目立てを実施できるので、切削の前後に必要な目立て工程を、省略又は簡略化できる。 The mixed resin 4 may contain abrasive grains having a diameter smaller than that of the abrasive grains contained in the cutting blade 16 (see FIG. 3) of the cutting device 12. In this case, since the cutting blade 16 can be sharpened together with the cutting of the workpiece 6 in the subsequent cutting process, the sharpening process necessary before and after the cutting can be omitted or simplified.

被加工物６は、切削ブレード１６で切削可能な矩形状の平板であり、その表面６ａは、分割予定ライン（不図示）で複数の領域に区画されている。本実施の形態では、被加工物６として、サイズが１５ｍｍ×１３ｍｍ×０．５ｍｍのソーダガラスでなるガラス基板を用いる。 The workpiece 6 is a rectangular flat plate that can be cut by the cutting blade 16, and the surface 6 a is partitioned into a plurality of regions by scheduled division lines (not shown). In the present embodiment, a glass substrate made of soda glass having a size of 15 mm × 13 mm × 0.5 mm is used as the workpiece 6.

なお、被加工物６の材質は特に限定されない。被加工物６としては、他のガラス基板、樹脂基板、金属基板、又は樹脂や金属の複合材料等の難切削材を用いることもできる。また、被加工物６の形状、サイズ等も特に限定されない。 Note that the material of the workpiece 6 is not particularly limited. As the workpiece 6, other glass substrates, resin substrates, metal substrates, or difficult-to-cut materials such as resin or metal composite materials can also be used. Moreover, the shape, size, etc. of the workpiece 6 are not particularly limited.

本実施の形態の貼着工程では、上述の支持基板２を、例えば、８０℃に加熱したホットプレート上に載置して、表面２ａ側に供給された混合樹脂４を溶融させる。その後、被加工物６の裏面６ｂ側を支持基板２の表面２ａ側に対面させるように支持基板２の上方に被加工物６を重ね、プレス装置（不図示）で被加工物６の表面６ａ側を押圧する。 In the adhering step of the present embodiment, the above-described support substrate 2 is placed on, for example, a hot plate heated to 80 ° C., and the mixed resin 4 supplied to the surface 2a side is melted. Thereafter, the workpiece 6 is stacked above the support substrate 2 so that the back surface 6b side of the workpiece 6 faces the surface 2a side of the support substrate 2, and the surface 6a of the workpiece 6 is pressed by a press device (not shown). Press the side.

被加工物６を支持基板２側に押圧することで、混合樹脂４は、被加工物６の裏面６ｂ側の全面に広げられる。次に、被加工物６の押圧状態を保ちつつ、混合樹脂４を冷却して硬化させる。その結果、図１（Ｂ）及び図２に示すように、被加工物６は、所定の厚みの混合樹脂４を介して支持基板２に貼着される。 By pressing the workpiece 6 toward the support substrate 2, the mixed resin 4 is spread over the entire surface of the workpiece 6 on the back surface 6 b side. Next, the mixed resin 4 is cooled and cured while maintaining the pressed state of the workpiece 6. As a result, as shown in FIGS. 1B and 2, the workpiece 6 is attached to the support substrate 2 via the mixed resin 4 having a predetermined thickness.

混合樹脂４の供給量、混合樹脂４に分散される粒子１０の粒径及び量、被加工物６を押圧する押圧力等の条件は、支持基板２と被加工物６との間の混合樹脂４を十分に厚くできるように調整される。これにより、混合樹脂４は、切削ブレード１６を十分に深く切り込ませても、支持基板２が切削ブレード１６で切り込まれない程度に厚く形成される。 Conditions such as the supply amount of the mixed resin 4, the particle size and amount of the particles 10 dispersed in the mixed resin 4, and the pressing force for pressing the workpiece 6 are the mixed resin between the support substrate 2 and the workpiece 6. 4 is adjusted to be sufficiently thick. As a result, the mixed resin 4 is formed thick enough to prevent the support substrate 2 from being cut by the cutting blade 16 even when the cutting blade 16 is cut sufficiently deep.

本実施の形態では、混合樹脂４を、２５０μｍ程度の厚みに形成する。ただし、混合樹脂４の厚みはこれに限定されず、切削ブレード１６の形状や、混合樹脂４への切削ブレード１６の切り込み量ｔ（図３参照）等に応じて変更できる。 In the present embodiment, the mixed resin 4 is formed to a thickness of about 250 μm. However, the thickness of the mixed resin 4 is not limited to this, and can be changed according to the shape of the cutting blade 16, the cutting amount t of the cutting blade 16 into the mixed resin 4 (see FIG. 3), and the like.

このように混合樹脂４を厚く形成することで、切削ブレード１６の先端部分１６ａの形状（先端形状）が切削後の被加工物６に残らないように切削ブレード１６を深く切り込ませても、支持基板２は切削ブレード１６で切り込まれずに済む。本実施の形態の混合樹脂４は、樹脂８に所定の粒径の球状の粒子１０が分散されているので、混合樹脂４を容易に厚く形成できる。 By forming the mixed resin 4 thick in this way, even if the cutting blade 16 is deeply cut so that the shape (tip shape) of the tip portion 16a of the cutting blade 16 does not remain in the workpiece 6 after cutting, The support substrate 2 need not be cut by the cutting blade 16. In the mixed resin 4 of the present embodiment, since the spherical particles 10 having a predetermined particle diameter are dispersed in the resin 8, the mixed resin 4 can be easily formed thick.

なお、切削ブレード１６の先端から厚みの半分程度の範囲において、切削ブレード１６は平坦でないことが多いので、混合樹脂４を、切削ブレード１６の厚みの半分よりも厚く形成することが好ましい。この場合、混合樹脂４への切り込み量ｔを切削ブレード１６の厚みの半分以上としても、支持基板２が切削ブレード１６で切り込まれるのを防止できる。 Since the cutting blade 16 is often not flat in the range of about half the thickness from the tip of the cutting blade 16, it is preferable to form the mixed resin 4 thicker than half the thickness of the cutting blade 16. In this case, the support substrate 2 can be prevented from being cut by the cutting blade 16 even if the cutting amount t into the mixed resin 4 is set to be more than half of the thickness of the cutting blade 16.

貼着工程を実施した後には、切削工程を実施する。図３は、切削工程を模式的に示す模式的断面図である。切削工程では、支持基板２の裏面２ｂ側を切削装置１２の保持テーブル１４に吸引させた上で、回転する切削ブレード１６を被加工物６の表面６ａ側から混合樹脂４の途中の深さまで切り込ませる。 After performing the sticking process, the cutting process is performed. FIG. 3 is a schematic cross-sectional view schematically showing the cutting process. In the cutting process, the back surface 2b side of the support substrate 2 is sucked by the holding table 14 of the cutting device 12, and the rotating cutting blade 16 is cut from the surface 6a side of the workpiece 6 to a depth in the middle of the mixed resin 4. Let me.

図３に示すように、保持テーブル１４の表面は、支持基板２を吸引保持する保持面１４ａとなっている。この保持面１４ａには、保持テーブル１４の内部に形成された吸引路１４ｂを通じて吸引源（不図示）の負圧が作用し、支持基板２の裏面２ｂ側を吸引する吸引力が発生する。 As shown in FIG. 3, the surface of the holding table 14 is a holding surface 14 a that holds the support substrate 2 by suction. A negative pressure of a suction source (not shown) acts on the holding surface 14a through a suction path 14b formed inside the holding table 14, and a suction force for sucking the back surface 2b side of the support substrate 2 is generated.

保持テーブル１４の下方には、保持面１４ａに垂直な回転軸の周りに保持テーブル１４を回転させる回転機構（不図示）及び加工送り機構（不図示）が設けられている。保持テーブル１４に保持された支持基板２及び被加工物６は、回転機構で回転されると共に、加工送り機構で加工送り方向に移動される。 Below the holding table 14, there are provided a rotation mechanism (not shown) and a machining feed mechanism (not shown) for rotating the holding table 14 around a rotation axis perpendicular to the holding surface 14a. The support substrate 2 and the workpiece 6 held by the holding table 14 are rotated by the rotation mechanism and moved in the machining feed direction by the machining feed mechanism.

保持テーブル１４の上方には、円環状の切削ブレード１６が配置されている。切削ブレード１６は、スピンドル（不図示）を介してモータ（不図示）と連結されており、モータの回転力で高速に回転する。また、切削ブレード１６は、昇降機構（不図示）及び割り出し送り機構（不図示）を介して設けられており、昇降機構で昇降されると共に、割り出し送り機構で割り出し送り方向に移動される。 An annular cutting blade 16 is disposed above the holding table 14. The cutting blade 16 is connected to a motor (not shown) via a spindle (not shown), and rotates at high speed by the rotational force of the motor. The cutting blade 16 is provided via an elevating mechanism (not shown) and an index feed mechanism (not shown). The cutting blade 16 is moved up and down by the elevating mechanism and moved in the index feed direction by the index feed mechanism.

切削ブレード１６としては、０．３ｍｍの厚みのメタルレジンブレードを用いる。ただし、切削ブレード１６の材質、厚み等は特に限定されず、被加工物６に応じて変更できる。 As the cutting blade 16, a metal resin blade having a thickness of 0.3 mm is used. However, the material, thickness, etc. of the cutting blade 16 are not particularly limited and can be changed according to the workpiece 6.

本実施の形態の切削工程では、上述した切削装置１２の保持テーブル１４に、支持基板２を介して被加工物６を保持させる。そして、被加工物６の表面６ａ側に回転する切削ブレード１６を切り込ませる。 In the cutting process of the present embodiment, the workpiece 6 is held via the support substrate 2 on the holding table 14 of the cutting device 12 described above. Then, the cutting blade 16 that rotates on the surface 6a side of the workpiece 6 is cut.

ここで、切削ブレード１６の先端部分１６ａの断面形状は、例えば、図３に示すように、円弧状になっており、切削ブレード１６の他の部分のように平坦ではない。そのため、混合樹脂４への切り込み量ｔを十分に大きくしないと、切削ブレード１６の先端部分１６ａの形状（先端形状）（ここでは、円弧状の断面形状）が切削後の被加工物６に残ってしまう。 Here, for example, as shown in FIG. 3, the cross-sectional shape of the tip portion 16 a of the cutting blade 16 is arcuate and is not flat like the other portions of the cutting blade 16. Therefore, unless the cut amount t into the mixed resin 4 is sufficiently increased, the shape (tip shape) of the tip portion 16a of the cutting blade 16 (here, the arc-shaped cross-sectional shape) remains on the workpiece 6 after cutting. End up.

そこで、切削ブレード１６の先端部分１６ａの形状が切削後の被加工物６に残らない程度に、切削ブレード１６を深く切り込ませる。上述のように、厚みの半分程度の範囲において切削ブレード１６が平坦でない場合、混合樹脂４への切り込み量ｔは、切削ブレード１６の厚みの半分以上とすることが好ましい。本実施の形態では、混合樹脂４への切り込み量ｔを０．２ｍｍとする。ただし、切り込み量ｔはこれに限定されない。 Therefore, the cutting blade 16 is deeply cut so that the shape of the tip portion 16a of the cutting blade 16 does not remain in the workpiece 6 after cutting. As described above, when the cutting blade 16 is not flat in the range of about half of the thickness, it is preferable that the cutting amount t into the mixed resin 4 is not less than half the thickness of the cutting blade 16. In the present embodiment, the cut amount t into the mixed resin 4 is 0.2 mm. However, the cutting amount t is not limited to this.

そして、加工送りと割り出し送りとを繰り返し、必要に応じて保持テーブル１４を回転させることで、全ての分割予定ラインに沿って切削ブレード１６を切り込ませる。その結果、被加工物２は、切削溝１８に沿って複数のチップ２０に切断される。 Then, the machining blade and the index feed are repeated, and the holding table 14 is rotated as necessary, so that the cutting blade 16 is cut along all the division lines. As a result, the workpiece 2 is cut into a plurality of chips 20 along the cutting grooves 18.

本実施の形態では、切削ブレード１６の切り込み量ｔは十分に大きくなっているので、切削ブレード１６の先端部分１６ａの形状が切断後のチップ２０に残ることはない。また、本実施の形態では、十分に厚く形成された混合樹脂４を用いているので、切削ブレード１６を深く切り込ませても、支持基板２は切削ブレード１６で切り込まれずに済む。よって、被加工物６の切削後に支持基板２を再利用できる。 In the present embodiment, since the cutting amount t of the cutting blade 16 is sufficiently large, the shape of the tip portion 16a of the cutting blade 16 does not remain on the chip 20 after cutting. Further, in the present embodiment, since the mixed resin 4 formed to be sufficiently thick is used, even if the cutting blade 16 is cut deeply, the support substrate 2 does not need to be cut by the cutting blade 16. Therefore, the support substrate 2 can be reused after the workpiece 6 is cut.

ところで、切削ブレード１６を樹脂に切り込ませると、切削ブレード１６に目詰まりが生じて切削性能は低下してしまう。これに対して、本実施の形態では、樹脂８にＳｉＯ_２、Ａｌ_２Ｏ_３、ＳｉＣ等を成分として含む粒子１０が分散されているので、樹脂８と共に粒子１０が切削され、目詰まりによる切削性能の低下を抑制できる。なお、混合樹脂４に切削ブレード１６を目立てできるような砥粒を分散させている場合には、目詰まりの抑制と共に、切削ブレード１６の目立てが実現される。 By the way, when the cutting blade 16 is cut into the resin, the cutting blade 16 is clogged and the cutting performance is deteriorated. On the other hand, in this embodiment, since particles 10 containing SiO ₂ , Al ₂ O ₃ , SiC and the like as components are dispersed in the resin 8, the particles 10 are cut together with the resin 8, and cutting due to clogging. A decrease in performance can be suppressed. In addition, when the abrasive grains that can sharpen the cutting blade 16 are dispersed in the mixed resin 4, the cutting blade 16 is sharpened together with the suppression of clogging.

切削工程を実施した後には、剥離工程を実施する。図４は、剥離工程を模式的に示す模式的断面図である。剥離工程では、支持基板２を溶剤に浸して混合樹脂４を溶融させる。これにより、複数のチップ２０及び混合樹脂４は、支持基板２の表面２ａ側から剥離される。 After performing the cutting process, the peeling process is performed. FIG. 4 is a schematic cross-sectional view schematically showing the peeling process. In the peeling process, the support substrate 2 is immersed in a solvent to melt the mixed resin 4. As a result, the plurality of chips 20 and the mixed resin 4 are peeled from the surface 2 a side of the support substrate 2.

なお、混合樹脂４を熱で軟化させても良い。樹脂８としてＵＶ硬化樹脂を用いる場合には、例えば、支持基板２を温水等に浸して混合樹脂４を膨潤させる方法等で、複数のチップ２０及び混合樹脂４を剥離させることもできる。 The mixed resin 4 may be softened by heat. When a UV curable resin is used as the resin 8, the plurality of chips 20 and the mixed resin 4 can be peeled off by, for example, a method of swelling the mixed resin 4 by immersing the support substrate 2 in warm water or the like.

以上のように、本実施の形態の切削方法は、被加工物６の支持基板２への貼着に、粒子１０が分散された混合樹脂４を用いるので、支持基板２と被加工物６と間に位置する混合樹脂４を容易に厚くすることができる。 As described above, the cutting method according to the present embodiment uses the mixed resin 4 in which the particles 10 are dispersed to adhere the workpiece 6 to the support substrate 2, and thus the support substrate 2, the workpiece 6, and the like. The mixed resin 4 located between them can be easily thickened.

そのため、本実施の形態で示すように、切削ブレード１６の先端部分１６ａの形状（先端形状）が被加工物２に残らないように切削ブレード１６を深く切り込ませても、支持基板２が切削ブレード１６で切り込まれないように混合樹脂４を十分に厚くすることで、被加工物６の加工精度を低下させることなく支持基板２を再利用できる。 Therefore, as shown in the present embodiment, even if the cutting blade 16 is deeply cut so that the shape (tip shape) of the tip portion 16a of the cutting blade 16 does not remain on the workpiece 2, the support substrate 2 is cut. By making the mixed resin 4 sufficiently thick so as not to be cut by the blade 16, the support substrate 2 can be reused without reducing the processing accuracy of the workpiece 6.

なお、本発明は上記実施の形態の記載に限定されず、種々変更して実施可能である。例えば、上記実施の形態では、あらかじめ粒子１０が分散された混合樹脂４を用いる切削方法を例示しているが、本発明の切削方法はこれに限定されない。例えば、支持基板２と被加工物６とを貼着する際に、樹脂８を溶融させるタイミングで粒子１０を添加しても良い。 In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the said embodiment, although the cutting method using the mixed resin 4 by which the particle | grains 10 were disperse | distributed previously is illustrated, the cutting method of this invention is not limited to this. For example, when the support substrate 2 and the workpiece 6 are pasted, the particles 10 may be added at the timing when the resin 8 is melted.

その他、上記実施の形態に係る構成、方法などは、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the configurations, methods, and the like according to the above-described embodiments can be changed as appropriate without departing from the scope of the object of the present invention.

２支持基板
２ａ表面
２ｂ裏面
４混合樹脂
６被加工物
６ａ表面
６ｂ裏面
８樹脂
１０粒子
１２切削装置
１４保持テーブル
１４ａ保持面
１４ｂ吸引路
１６切削ブレード
１６ａ先端部分
１８切削溝
２０チップ
2 support substrate 2a surface 2b back surface 4 mixed resin 6 work piece 6a surface 6b back surface 8 resin 10 particle 12 cutting device 14 holding table 14a holding surface 14b suction path 16 cutting blade 16a tip portion 18 cutting groove 20 chip

Claims

両面が平坦面で形成された支持基板の表面に被加工物の裏面側を樹脂で貼着して、被加工物を切削する切削方法であって、
粒子が分散含有した混合樹脂を該支持基板上に供給し、被加工物の裏面側を該混合樹脂側に対面させ被加工物の裏面側の全面に渡って該混合樹脂が広がるまで被加工物を押圧して載置し、該混合樹脂を硬化させて、該支持基板上に所定厚みを規定する該混合樹脂を介して被加工物を貼着する貼着工程と、
該貼着工程を実施した後、該支持基板側を保持テーブルで保持して、切削ブレードによって被加工物の表面から該混合樹脂の厚み方向の途中まで切り込み、被加工物を完全切断して個片化する切削工程と、
該切削工程の後に、該支持基板の表面から該個片化された被加工物及び該混合樹脂を剥離する剥離工程と、を備え、
該所定厚みは、該切削ブレードが被加工物を切断する際に該切削ブレードの先端形状が被加工物に転写せず且つ該支持基板まで切り込まない厚みに規定されていることを特徴とする切削方法。 A cutting method of cutting a workpiece by sticking the back side of the workpiece with a resin on the surface of a support substrate formed with a flat surface on both sides,
A mixed resin containing dispersed particles is supplied onto the support substrate, and the work piece is processed until the mixed resin spreads over the entire back surface of the work piece with the back side of the work piece facing the mixed resin side. Pressing and placing, curing the mixed resin, and sticking a workpiece through the mixed resin defining a predetermined thickness on the support substrate; and
After carrying out the adhering step, the support substrate side is held by a holding table, and is cut from the surface of the workpiece to the middle of the thickness direction of the mixed resin by a cutting blade, and the workpiece is completely cut and cut. A cutting process to be separated,
After the cutting step, a separation step of peeling the individual workpiece and the mixed resin from the surface of the support substrate,
The predetermined thickness is defined such that when the cutting blade cuts the workpiece, the tip shape of the cutting blade is not transferred to the workpiece and does not cut into the support substrate. Cutting method.