JP2014212188A - 板状物の貼着方法 - Google Patents
板状物の貼着方法 Download PDFInfo
- Publication number
- JP2014212188A JP2014212188A JP2013087145A JP2013087145A JP2014212188A JP 2014212188 A JP2014212188 A JP 2014212188A JP 2013087145 A JP2013087145 A JP 2013087145A JP 2013087145 A JP2013087145 A JP 2013087145A JP 2014212188 A JP2014212188 A JP 2014212188A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- sheet
- plate
- wafer
- sticking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 82
- 230000001070 adhesive effect Effects 0.000 claims abstract description 79
- 239000000463 material Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- -1 polyethylene vinyl chloride Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
11 半導体ウエーハ
16 支持台
18 接着剤
20 プレス装置
22 保持テーブル
24 吸引保持部
28 吸引源
30 紫外線ランプ
Claims (3)
- 板状物をシート上に貼着する板状物の貼着方法であって、
シート上の一点に接着剤を供給して接着剤の山を形成する接着剤供給ステップと、
該接着剤供給ステップを実施した後、板状物の被貼着面を該シートに対面させた状態で板状物を該シートに対して相対移動させて、該接着剤の山の頂点から板状物で該接着剤の山を押し広げ該シート上に該接着剤を介して板状物を貼着する貼着ステップと、
を備えたことを特徴とする板状物の貼着方法。 - 前記接着剤は、前記接着剤供給ステップで前記シート上に供給された際に半球状の前記接着剤の山を形成するような粘度に設定されている請求項1記載の板状物の貼着方法。
- 前記接着剤は紫外線の照射で硬化する紫外線硬化樹脂から構成され、
前記シートは紫外線を透過し、
前記貼着ステップを実施した後、該シートを介して該接着剤に紫外線を照射して該接着剤を硬化させる硬化ステップ、を更に備えた請求項1又は2記載の板状物の貼着方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013087145A JP6149223B2 (ja) | 2013-04-18 | 2013-04-18 | 板状物の貼着方法 |
TW103108732A TWI601643B (zh) | 2013-04-18 | 2014-03-12 | Plate affixed to the method |
KR1020140040366A KR102144137B1 (ko) | 2013-04-18 | 2014-04-04 | 판형물의 접착 방법 |
CN201410151217.2A CN104112650A (zh) | 2013-04-18 | 2014-04-14 | 板状物粘贴方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013087145A JP6149223B2 (ja) | 2013-04-18 | 2013-04-18 | 板状物の貼着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014212188A true JP2014212188A (ja) | 2014-11-13 |
JP6149223B2 JP6149223B2 (ja) | 2017-06-21 |
Family
ID=51709394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013087145A Active JP6149223B2 (ja) | 2013-04-18 | 2013-04-18 | 板状物の貼着方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6149223B2 (ja) |
KR (1) | KR102144137B1 (ja) |
CN (1) | CN104112650A (ja) |
TW (1) | TWI601643B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020188230A (ja) * | 2019-05-17 | 2020-11-19 | 株式会社ディスコ | 保護部材形成装置 |
JP2020188058A (ja) * | 2019-05-10 | 2020-11-19 | 株式会社ディスコ | 保護部材形成装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7286250B2 (ja) * | 2019-08-07 | 2023-06-05 | 株式会社ディスコ | 保護部材形成装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307585A (ja) * | 1998-04-22 | 1999-11-05 | Sony Corp | 半導体装置 |
JP2002203828A (ja) * | 2000-12-28 | 2002-07-19 | Lintec Corp | ウエハの裏面研削方法 |
JP2004247611A (ja) * | 2003-02-14 | 2004-09-02 | Matsushita Electric Works Ltd | 半導体素子実装基板、半導体素子実装基板の製造方法 |
JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
JP2010155298A (ja) * | 2008-12-26 | 2010-07-15 | Disco Abrasive Syst Ltd | 樹脂被覆方法および樹脂被覆装置 |
JP2011119578A (ja) * | 2009-12-07 | 2011-06-16 | Disco Abrasive Syst Ltd | 貼着装置 |
JP2011216763A (ja) * | 2010-04-01 | 2011-10-27 | Disco Corp | ウェーハの加工方法 |
JP2011249652A (ja) * | 2010-05-28 | 2011-12-08 | Disco Abrasive Syst Ltd | ウェーハの平坦加工方法 |
JP2012124230A (ja) * | 2010-12-06 | 2012-06-28 | Three M Innovative Properties Co | フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置 |
JP2012143723A (ja) * | 2011-01-13 | 2012-08-02 | Disco Corp | 樹脂塗布装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5089370B2 (ja) | 2007-12-21 | 2012-12-05 | 株式会社ディスコ | 樹脂被覆方法および装置 |
US9368374B2 (en) * | 2009-02-27 | 2016-06-14 | Dexerials Corporation | Method of manufacturing semiconductor device |
EP2416633A1 (de) * | 2010-08-04 | 2012-02-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Verfahren ur Festlegung und/oder Einbettung eines elektronischen Bauteils sowie Kleber zur Verwendung in einem derartigen Verfahren |
-
2013
- 2013-04-18 JP JP2013087145A patent/JP6149223B2/ja active Active
-
2014
- 2014-03-12 TW TW103108732A patent/TWI601643B/zh active
- 2014-04-04 KR KR1020140040366A patent/KR102144137B1/ko active IP Right Grant
- 2014-04-14 CN CN201410151217.2A patent/CN104112650A/zh active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307585A (ja) * | 1998-04-22 | 1999-11-05 | Sony Corp | 半導体装置 |
JP2002203828A (ja) * | 2000-12-28 | 2002-07-19 | Lintec Corp | ウエハの裏面研削方法 |
JP2004247611A (ja) * | 2003-02-14 | 2004-09-02 | Matsushita Electric Works Ltd | 半導体素子実装基板、半導体素子実装基板の製造方法 |
JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
JP2010155298A (ja) * | 2008-12-26 | 2010-07-15 | Disco Abrasive Syst Ltd | 樹脂被覆方法および樹脂被覆装置 |
JP2011119578A (ja) * | 2009-12-07 | 2011-06-16 | Disco Abrasive Syst Ltd | 貼着装置 |
JP2011216763A (ja) * | 2010-04-01 | 2011-10-27 | Disco Corp | ウェーハの加工方法 |
JP2011249652A (ja) * | 2010-05-28 | 2011-12-08 | Disco Abrasive Syst Ltd | ウェーハの平坦加工方法 |
JP2012124230A (ja) * | 2010-12-06 | 2012-06-28 | Three M Innovative Properties Co | フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置 |
JP2012143723A (ja) * | 2011-01-13 | 2012-08-02 | Disco Corp | 樹脂塗布装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020188058A (ja) * | 2019-05-10 | 2020-11-19 | 株式会社ディスコ | 保護部材形成装置 |
JP7339768B2 (ja) | 2019-05-10 | 2023-09-06 | 株式会社ディスコ | 保護部材形成装置 |
JP2020188230A (ja) * | 2019-05-17 | 2020-11-19 | 株式会社ディスコ | 保護部材形成装置 |
JP7339771B2 (ja) | 2019-05-17 | 2023-09-06 | 株式会社ディスコ | 保護部材形成装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6149223B2 (ja) | 2017-06-21 |
TWI601643B (zh) | 2017-10-11 |
TW201446532A (zh) | 2014-12-16 |
KR20140125296A (ko) | 2014-10-28 |
CN104112650A (zh) | 2014-10-22 |
KR102144137B1 (ko) | 2020-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101860210B1 (ko) | 웨이퍼 프로세싱 방법 | |
JP6475519B2 (ja) | 保護部材の形成方法 | |
CN102197470A (zh) | 制造晶片层合体的方法、制造晶片层合体的装置、晶片层合体、剥离支撑体的方法以及制造晶片的方法 | |
JP5762213B2 (ja) | 板状物の研削方法 | |
JP6149223B2 (ja) | 板状物の貼着方法 | |
TWI685556B (zh) | 被加工物的切割加工方法 | |
JP6288935B2 (ja) | シート | |
JP6209097B2 (ja) | ウェーハの加工方法 | |
JP6013850B2 (ja) | ウェーハの加工方法 | |
KR102181999B1 (ko) | 확장 시트, 확장 시트의 제조 방법 및 확장 시트의 확장 방법 | |
JP2012023244A (ja) | 半導体素子の製造方法、並びに、その製造方法によって作製された半導体素子を有する発光ダイオードおよびパワーデバイス | |
JP6230354B2 (ja) | デバイスウェーハの加工方法 | |
JP6132502B2 (ja) | ウェーハの加工方法 | |
JP2019009372A (ja) | ウエーハの研削方法 | |
JP2013243310A (ja) | 表面保護テープ及びウエーハの加工方法 | |
JP2014152287A (ja) | 粘着シートの貼着方法 | |
JP2020035918A (ja) | 被加工物の加工方法 | |
JP2012115911A (ja) | 基板の研削方法およびそれを用いて作製された半導体素子 | |
JP6061731B2 (ja) | 表面保護部材及びウエーハの加工方法 | |
JP2013258364A (ja) | 板状物の貼着方法 | |
JP7166728B2 (ja) | 被加工物の加工方法 | |
JP2024077094A (ja) | チップの製造方法 | |
JP2020068342A (ja) | ウェーハの加工方法 | |
JP2020205357A (ja) | テープ貼着方法 | |
JP2014220418A (ja) | 積層ウェーハの加工方法及び粘着シート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160217 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161212 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161220 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170203 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170411 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6149223 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |