JP2013535807A - 接続部材 - Google Patents
接続部材 Download PDFInfo
- Publication number
- JP2013535807A JP2013535807A JP2013517288A JP2013517288A JP2013535807A JP 2013535807 A JP2013535807 A JP 2013535807A JP 2013517288 A JP2013517288 A JP 2013517288A JP 2013517288 A JP2013517288 A JP 2013517288A JP 2013535807 A JP2013535807 A JP 2013535807A
- Authority
- JP
- Japan
- Prior art keywords
- connection area
- edge region
- circuit board
- laminated
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Abstract
【解決手段】接続部材は、金属材料(2)を備え、当該金属材料(2)は、他の金属材料によって少なくとも部分的にコーティング(1)されている。接続部材は、回路基板(3)とのはんだ付け接続に用いられる積層状接続エリア(7)を備え、当該積層状接続エリアは、縁領域(4、5、6)を有する。はんだ付けによって回路基板(3)と接続された状態ではんだフィレットが形成されるよう、縁領域の少なくとも1つの部分が積層状接続エリア(7)から突出する。
【選択図】図3
Description
Claims (9)
- 回路基板とはんだ付け接続されるSMD部品に用いられる接続部材であり、
金属材料と、
回路基板とのはんだ付け接続に用いられる積層状接続エリアと、
導電領域と
を備え、
前記金属材料は、他の金属材料によって少なくとも部分的にコーティングされており、
前記積層状接続エリアは、縁領域を有し、
はんだ付けによって回路基板と接続された状態ではんだフィレットが形成され、前記縁領域(4、6)が前記積層状接続エリア上の前記導電領域に対し実質的に平行に配置されるよう、前記縁領域の少なくとも1つの部分が前記積層状接続エリアから突出する、接続部材。 - 前記縁領域が、前記積層状接続エリアの上方に、前記金属材料の厚さの20倍以下の距離だけ突出する、請求項1に記載の接続部材。
- 前記縁領域が、前記積層状接続エリアの上方に、前記金属材料の厚さの2倍以下の距離だけ突出する、請求項1または2に記載の接続部材。
- 前記縁領域の部分が、前記積層状接続エリアに対し、およそ45°からおよそ90°傾いている、請求項1から3のいずれか1項に記載の接続部材。
- 前記積層状接続エリア上の前記導電領域に対し略垂直に配置される縁領域をさらに備える、請求項1から4のいずれか1項に記載の接続部材。
- 回路基板とはんだ付け接続されるSMD部品に用いられる接続部材を製造する方法であり、
金属片を打ち抜く段階と、
前記金属片を曲げ、導電領域および積層状接続エリアを形成する段階と、
前記積層状接続エリア上に縁領域を形成する段階と
を備え、
はんだ付けによって前記回路基板と接続された状態ではんだフィレットが形成され、前記縁領域が前記積層状接続エリア上の前記導電領域に対し実質的に平行に配置されるよう、前記縁領域の少なくとも1つの部分が前記積層状接続エリアから突出するよう形成される、方法。 - 前記縁領域を形成する段階は、曲げる段階を有する、請求項6に記載の方法。
- 前記形成する段階および前記曲げる段階は、1つの段階である、請求項6または7に記載の方法。
- 前記形成する段階、前記曲げる段階および前記打ち抜く段階は、1つの段階である、請求項6から8のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010026312.5A DE102010026312B4 (de) | 2010-07-06 | 2010-07-06 | Anschlusskontakt und Verfahren zur Herstellung von Anschlusskontakten |
DE102010026312.5 | 2010-07-06 | ||
PCT/EP2011/060973 WO2012004177A1 (de) | 2010-07-06 | 2011-06-29 | Anschlusskontakt |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013535807A true JP2013535807A (ja) | 2013-09-12 |
JP2013535807A5 JP2013535807A5 (ja) | 2014-07-10 |
JP5725171B2 JP5725171B2 (ja) | 2015-05-27 |
Family
ID=44482073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013517288A Expired - Fee Related JP5725171B2 (ja) | 2010-07-06 | 2011-06-29 | 接続部材 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9065234B2 (ja) |
EP (1) | EP2591644A1 (ja) |
JP (1) | JP5725171B2 (ja) |
CN (1) | CN103098563B (ja) |
DE (1) | DE102010026312B4 (ja) |
WO (1) | WO2012004177A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016039413A1 (ja) * | 2014-09-11 | 2016-03-17 | 日本精工株式会社 | 多極リード部品及び基板の接続装置 |
US9668344B2 (en) * | 2015-04-23 | 2017-05-30 | SK Hynix Inc. | Semiconductor packages having interconnection members |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02292807A (ja) * | 1989-05-02 | 1990-12-04 | Nippondenso Co Ltd | 電子部品 |
JPH0371654U (ja) * | 1989-11-15 | 1991-07-19 | ||
JPH0555433A (ja) * | 1991-08-27 | 1993-03-05 | Nec Corp | 半導体装置 |
JPH0518043U (ja) * | 1991-08-09 | 1993-03-05 | ケル株式会社 | 表面実装用電子部品のリード |
JPH09130007A (ja) * | 1995-10-30 | 1997-05-16 | Murata Mfg Co Ltd | 表面実装型電子部品 |
JPH09232499A (ja) * | 1996-02-26 | 1997-09-05 | Canon Inc | 半導体装置 |
JPH10284666A (ja) * | 1997-04-01 | 1998-10-23 | Furukawa Electric Co Ltd:The | 電子部品機器 |
JP2003124074A (ja) * | 2001-10-10 | 2003-04-25 | Sanyo Electric Co Ltd | 面実装電子部品 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4777564A (en) | 1986-10-16 | 1988-10-11 | Motorola, Inc. | Leadform for use with surface mounted components |
JP2848682B2 (ja) * | 1990-06-01 | 1999-01-20 | 株式会社東芝 | 高速動作用半導体装置及びこの半導体装置に用いるフィルムキャリア |
KR940007757Y1 (ko) * | 1991-11-14 | 1994-10-24 | 금성일렉트론 주식회사 | 반도체 패키지 |
US6165819A (en) * | 1992-10-20 | 2000-12-26 | Fujitsu Limited | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
JPH08222681A (ja) * | 1995-02-14 | 1996-08-30 | Toshiba Corp | 樹脂封止型半導体装置 |
GB9513252D0 (en) | 1995-06-29 | 1995-09-06 | Rolls Royce Plc | An abradable composition |
US5925927A (en) | 1996-12-18 | 1999-07-20 | Texas Instruments Incoporated | Reinforced thin lead frames and leads |
US5986209A (en) * | 1997-07-09 | 1999-11-16 | Micron Technology, Inc. | Package stack via bottom leaded plastic (BLP) packaging |
JPH11145367A (ja) * | 1997-11-05 | 1999-05-28 | Nec Ibaraki Ltd | 表面実装部品のリード端子 |
JP3866572B2 (ja) * | 2000-03-15 | 2007-01-10 | 株式会社東芝 | 光ヘッド装置用基板ユニットとその製造方法 |
US6529027B1 (en) * | 2000-03-23 | 2003-03-04 | Micron Technology, Inc. | Interposer and methods for fabricating same |
US7920045B2 (en) * | 2004-03-15 | 2011-04-05 | Tyco Electronics Corporation | Surface mountable PPTC device with integral weld plate |
TWI255158B (en) * | 2004-09-01 | 2006-05-11 | Phoenix Prec Technology Corp | Method for fabricating electrical connecting member of circuit board |
FR2885739B1 (fr) * | 2005-05-11 | 2012-07-20 | Sonceboz Sa | Procede de connexion sans soudure d'un actionneur electrique, notamment pour application aux tableaux de bord automobile, a un circuit imprime |
JP4873005B2 (ja) * | 2006-03-29 | 2012-02-08 | 株式会社村田製作所 | 複合基板及び複合基板の製造方法 |
WO2008088291A1 (en) * | 2007-01-16 | 2008-07-24 | Infineon Technologies Ag | Method of semiconductor packaging and/or a semiconductor package |
DE102010010331A1 (de) * | 2010-03-04 | 2011-09-08 | Phoenix Contact Gmbh & Co. Kg | Elektrische Kontaktanordnung |
-
2010
- 2010-07-06 DE DE102010026312.5A patent/DE102010026312B4/de active Active
-
2011
- 2011-06-29 WO PCT/EP2011/060973 patent/WO2012004177A1/de active Application Filing
- 2011-06-29 CN CN201180032880.5A patent/CN103098563B/zh active Active
- 2011-06-29 EP EP11735824.2A patent/EP2591644A1/de not_active Withdrawn
- 2011-06-29 JP JP2013517288A patent/JP5725171B2/ja not_active Expired - Fee Related
- 2011-06-29 US US13/808,429 patent/US9065234B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02292807A (ja) * | 1989-05-02 | 1990-12-04 | Nippondenso Co Ltd | 電子部品 |
JPH0371654U (ja) * | 1989-11-15 | 1991-07-19 | ||
JPH0518043U (ja) * | 1991-08-09 | 1993-03-05 | ケル株式会社 | 表面実装用電子部品のリード |
JPH0555433A (ja) * | 1991-08-27 | 1993-03-05 | Nec Corp | 半導体装置 |
JPH09130007A (ja) * | 1995-10-30 | 1997-05-16 | Murata Mfg Co Ltd | 表面実装型電子部品 |
JPH09232499A (ja) * | 1996-02-26 | 1997-09-05 | Canon Inc | 半導体装置 |
JPH10284666A (ja) * | 1997-04-01 | 1998-10-23 | Furukawa Electric Co Ltd:The | 電子部品機器 |
JP2003124074A (ja) * | 2001-10-10 | 2003-04-25 | Sanyo Electric Co Ltd | 面実装電子部品 |
Also Published As
Publication number | Publication date |
---|---|
EP2591644A1 (de) | 2013-05-15 |
US20130192874A1 (en) | 2013-08-01 |
CN103098563B (zh) | 2016-03-02 |
JP5725171B2 (ja) | 2015-05-27 |
CN103098563A (zh) | 2013-05-08 |
DE102010026312A1 (de) | 2012-01-12 |
DE102010026312B4 (de) | 2022-10-20 |
US9065234B2 (en) | 2015-06-23 |
WO2012004177A1 (de) | 2012-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6060875B2 (ja) | 基板用端子および基板コネクタ | |
JP6160910B2 (ja) | 電磁波シールド構造 | |
US20170155203A1 (en) | Terminal-equipped printed circuit board | |
JP5725171B2 (ja) | 接続部材 | |
JP2012033435A (ja) | 回路基板に実装する部品の固定金具 | |
JP2006228978A (ja) | 低抵抗のチップ抵抗器とその製造方法 | |
JP5559981B2 (ja) | プレスフィット用端子及びその製造方法 | |
JP2015177039A (ja) | プリント基板およびそれを用いた端子付プリント基板 | |
JP4797781B2 (ja) | 補強タブ、補強タブの製造方法、及びコネクタの実装構造 | |
US9543673B2 (en) | Connecting pin for electronic circuit boards | |
US6087596A (en) | Solder joints for printed circuit boards having intermediate metallic member | |
JP2013535807A5 (ja) | ||
JP5077458B2 (ja) | 回路基板用端子 | |
WO2019189040A1 (ja) | コンタクト及びその製造方法 | |
US20140011413A1 (en) | Connector terminal and method of fabricating the same | |
JP4823942B2 (ja) | チップ形電子部品 | |
WO2023090033A1 (ja) | バスバー、バスバーと回路基板との接続構造、および、バスバーと回路基板との接続方法 | |
US11432442B2 (en) | EMC shield and method of producing the same | |
KR101379108B1 (ko) | 회로기판에 실장하는 부품의 고정 메탈 브라켓 | |
JPH0670273U (ja) | 部品実装構造 | |
JP6358864B2 (ja) | 電子回路基板およびその製造方法、ならびに電気機器 | |
US20180062290A1 (en) | Substrate terminal-equipped printed circuit board | |
JP2018181735A (ja) | プレスフィット端子、電子装置、及びコネクタ | |
JP2000164802A (ja) | 表面実装型電子部品の実装方法 | |
JP2015522926A (ja) | 回路アッセンブリ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140219 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140225 |
|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20140526 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140930 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141226 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150303 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150316 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5725171 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |