JP2013131669A - 電子装置及びその製造方法 - Google Patents
電子装置及びその製造方法 Download PDFInfo
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Abstract
【解決手段】部品実装領域Aを備えた第1配線基板3と、第1配線基板3の上に積層され、部品実装領域Aに対応する部分に開口部4xが設けられ、部品実装領域Aの周囲の枠状領域に並んで配置されたはんだバンプ50を介して第1配線基板3に接続された第2配線基板4と、部品実装領域Aの周囲のはんだバンプ50の間に繋がって形成されて部品実装領域Aを取り囲む枠状の樹脂ダム層60とを含み、第1配線基板3と第2配線基板4との間に、樹脂ダム層60によって部品実装領域Aが樹脂非形成領域となるように封止樹脂64が充填される。
【選択図】図13
Description
図1〜図11は第1実施形態の電子装置の製造方法を示す図、図12は第1実施形態の電子装置を示す図である。
図14〜図20は第2実施形態の電子装置の製造方法を示す図、図21は第2実施形態の電子装置を示す図である。
Claims (9)
- 部品実装領域を備えた第1配線基板と、
前記第1配線基板の上に積層され、前記部品実装領域に対応する部分に開口部が設けられ、前記部品実装領域の周囲の枠状領域に並んで配置されたはんだバンプを介して前記第1配線基板に接続された第2配線基板と、
前記部品実装領域の周囲の前記はんだバンプの間に繋がって形成され、前記部品実装領域を取り囲む枠状の樹脂ダム層とを有し、
前記第1配線基板と前記第2配線基板との間に、前記樹脂ダム層によって前記部品実装領域が樹脂非形成領域となるように封止樹脂が充填されることを特徴とする電子装置。 - 前記第1配線基板の前記部品実装領域に実装された撮像素子をさらに有することを特徴とする請求項1に記載の電子装置。
- 前記第1配線基板の前記部品実装領域に実装された受動素子部品又は受光素子部品と、
前記枠状の樹脂ダム層の外側の前記第1配線基板の上に実装され、前記封止樹脂で封止された半導体チップをさらに有することを特徴とする請求項1に記載の電子装置。 - 前記樹脂ダム層は、フラックス機能を含む樹脂から形成されることを特徴とする請求項1乃至3のいずれか一項に記載の電子装置。
- 前記はんだバンプは、金属コアボールの外面がはんだ層で被覆された金属コアはんだボール、樹脂コアボールの外面がはんだ層で被覆された樹脂コアはんだボール、又は、前記第1配線基板と接続する箇所の少なくとも一部がはんだ層で被覆された金属柱から形成されることを特徴とする請求項1乃至4のいずれか一項に記載の電子装置。
- 部品実装領域を備えた第1配線基板と、前記部品実装領域に対応する部分に開口部が設けられ、前記部品実装領域の周囲の枠状領域に対応する部分に並んで配置されたはんだバンプを備えた第2配線基板とを用意し、
前記第2配線基板の前記はんだバンプにフラックス機能含有樹脂を付着させた後に、前記第2配線基板の前記はんだバンプを前記第1配線基板の上に配置し、リフロー加熱することにより、前記第2配線基板の前記はんだバンプを前記第1配線基板に接続すると共に、前記フラックス機能含有樹脂から、前記部品実装領域の周囲の前記はんだバンプの間に繋がって形成される枠状の樹脂ダム層を得る工程と、
前記第1配線基板と前記第2配線基板との間に封止樹脂を充填する工程とを有し、
前記樹脂ダム層によって前記封止樹脂が堰き止められて、前記部品実装領域が樹脂非形成領域となることを特徴とする電子装置の製造方法。 - 前記第1配線基板の前記部品実装領域に撮像素子が実装されていることを特徴とする請求項6に記載の電子装置の製造方法。
- 前記第1配線基板の前記部品実装領域の外側領域に半導体チップが実装されており、
前記封止樹脂を充填する工程で、前記半導体チップが前記封止樹脂で封止され、
前記封止樹脂を充填する工程の後に、前記第1配線基板の前記部品実装領域に受動素子部品又は受光素子部品を実装する工程をさらに有することを特徴とする請求項6に記載の電子装置の製造方法。 - 前記はんだバンプは、金属コアボールの外面がはんだ層で被覆された金属コアはんだボール、樹脂コアボールの外面がはんだ層で被覆された樹脂コアはんだボール、又は、前記第1配線基板と接続する箇所の少なくとも一部がはんだ層で被覆された金属柱から形成されることを特徴とする請求項6乃至8のいずれか一項に記載の電子装置の製造方法。
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