JP2010062357A - シート剥離装置及び剥離方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 abstract description 5
- 230000014759 maintenance of location Effects 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
- Y10S156/941—Means for delaminating semiconductive product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1174—Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/15—Combined or convertible surface bonding means and/or assembly means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
- Y10T156/1956—Roller pair delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】接着シートSが貼付された半導体ウエハWを支持する支持手段11と、剥離用テープTを繰り出す繰出手段12と、剥離用テープTを接着シートSに貼付する貼付手段14と、剥離用テープTの繰出方向先端側を保持する保持手段15と、接着シートSに剥離力を付与する剥離手段16とを備えてシート剥離装置10が構成されている。剥離手段16は剥離用ローラ44を含み、当該剥離用ローラ44は、接着シートSに貼付された剥離用テープTの接着剤層側から当接して接着シートSの剥離端部側を折り返して折り返し部cを形成した状態で接着シートSを剥離するようになっている。
【選択図】図4
Description
前記接着シートの剥離装置としては、例えば、特許文献1に記載されているように、接着シートに細長い帯状の剥離用テープを貼付し、当該剥離用テープを巻き取ることで接着シートを剥離可能とした構成が知られている。
この一方、押圧ローラRの押し付け力を弱くすると、ウエハWが持ち上がってしまい、当該ウエハWが割れてしまう、という不都合を招来する。
本発明は、このような不都合に着目して案出されたものであり、その目的は、接着シートを剥離する際に、剥離端部側に剥離遅れを生じさせることがなく、ウエハ等の被着体の割れを防止しつつ接着シートを剥離することのできるシート剥離装置及び剥離方法を提供することにある。
また、前記保持手段が変位機構を備えた構成であれば、剥離用テープを弛ませることによって前述した折り返しを行う長さを確保することができ、張力が過大となることに起因した剥離不能を未然に防止することができる。
すなわち、本発明は、主に特定の実施形態に関して特に図示、説明されているが、本発明の技術的思想及び目的の範囲から逸脱することなく、以上説明した実施形態に対し、形状、位置若しくは配置等に関し、必要に応じて当業者が様々な変更を加えることができるものである。
11 支持手段
12 繰出手段
14 貼付手段
15 保持手段
16 剥離手段
40 チャックシリンダ(変位機構)
44 剥離用ローラ
c 折り返し部
S 接着シート
T 剥離用テープ
W 半導体ウエハ(被着体)
Claims (4)
- 接着シートが貼付された被着体を支持する支持手段と、接着シートを剥離するための剥離用テープを繰り出す繰出手段と、剥離用テープのリード端側が接着シートの外周から外側に突出する状態で剥離用テープを接着シートに貼付する貼付手段と、剥離用テープの前記リード端側を保持する保持手段と、前記支持手段との相対移動によって接着シートに剥離力を付与する剥離手段とを備えたシート剥離装置において、
前記剥離手段は剥離用ローラを含み、当該剥離用ローラは、前記接着シートに貼付された剥離用テープの接着剤層側から当接するとともに、接着シートの剥離端部側を折り返して折り返し部を形成した状態で当該接着シートを剥離することを特徴とするシート剥離装置。 - 前記保持手段は、変位機構を備え、前記剥離用テープを弛ませることで前記折り返し部を形成可能とすることを特徴とする請求項1記載のシート剥離装置。
- 被着体に貼付された接着シートに剥離用テープを貼付し、当該剥離用テープを介して前記接着シートを剥離するシート剥離方法において、
前記剥離用テープのリード端側が接着シートの外周から外側に突出する状態で剥離用テープを接着シートに貼付した後に、剥離用テープの接着剤層側に剥離手段を位置させ、
前記剥離手段を接着シートに沿う剥離方向に移動させて剥離を行う際に、前記接着シートの剥離端部側を被着体と剥離手段との間に折り返して折り返し部を形成し、
次いで、前記折り返し部を維持しつつ前記剥離手段を前記剥離方向に相対移動させることで接着シートを被着体から剥離することを特徴とするシート剥離方法。 - 前記剥離用テープを接着シートに貼付した後に当該剥離用テープに弛みを形成し、この弛みによって前記折り返し部を形成可能とすることを特徴とする請求項3記載のシート剥離方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008226917A JP4740298B2 (ja) | 2008-09-04 | 2008-09-04 | シート剥離装置及び剥離方法 |
PCT/JP2009/064911 WO2010026910A1 (ja) | 2008-09-04 | 2009-08-27 | シート剥離装置及び剥離方法 |
KR1020117005030A KR101579783B1 (ko) | 2008-09-04 | 2009-08-27 | 시트 박리 장치 |
CN2009801349905A CN102144287B (zh) | 2008-09-04 | 2009-08-27 | 薄片剥离装置及剥离方法 |
US13/062,409 US8171977B2 (en) | 2008-09-04 | 2009-08-27 | Sheet peeling apparatus and peeling method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2008226917A JP4740298B2 (ja) | 2008-09-04 | 2008-09-04 | シート剥離装置及び剥離方法 |
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JP2010062357A true JP2010062357A (ja) | 2010-03-18 |
JP4740298B2 JP4740298B2 (ja) | 2011-08-03 |
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JP2008226917A Active JP4740298B2 (ja) | 2008-09-04 | 2008-09-04 | シート剥離装置及び剥離方法 |
Country Status (5)
Country | Link |
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US (1) | US8171977B2 (ja) |
JP (1) | JP4740298B2 (ja) |
KR (1) | KR101579783B1 (ja) |
CN (1) | CN102144287B (ja) |
WO (1) | WO2010026910A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101277325B1 (ko) * | 2011-09-16 | 2013-06-20 | 주식회사 아이.엠.텍 | 필름의 보호시트 분리장치 |
JP2015177011A (ja) * | 2014-03-14 | 2015-10-05 | リンテック株式会社 | シート貼付装置および貼付方法 |
Families Citing this family (13)
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US8366873B2 (en) | 2010-04-15 | 2013-02-05 | Suss Microtec Lithography, Gmbh | Debonding equipment and methods for debonding temporary bonded wafers |
KR101869930B1 (ko) * | 2011-11-29 | 2018-06-22 | 삼성디스플레이 주식회사 | 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템 |
JP2013149919A (ja) * | 2012-01-23 | 2013-08-01 | Three M Innovative Properties Co | 部材剥離方法及び部材剥離装置並びに半導体チップ製造方法 |
KR102006876B1 (ko) * | 2012-09-04 | 2019-08-05 | 삼성디스플레이 주식회사 | 필름 박리장치 및 그것을 이용한 필름 박리방법 |
TWI585028B (zh) * | 2013-01-30 | 2017-06-01 | 斯克林集團公司 | 剝離裝置及剝離方法 |
NL2012668B1 (en) * | 2014-04-23 | 2016-07-04 | Vmi Holland Bv | Foil removal device and a method for removing a foil from a tire tread. |
KR101638070B1 (ko) * | 2015-12-21 | 2016-07-11 | 장규남 | 보호필름 제거중의 말림 방지장치 |
JP6621365B2 (ja) * | 2016-04-11 | 2019-12-18 | 株式会社ディスコ | 保護テープの剥離方法 |
TWI685905B (zh) * | 2017-07-12 | 2020-02-21 | 日商新川股份有限公司 | 接合裝置和接合方法 |
CN108231651B (zh) * | 2017-12-26 | 2020-02-21 | 厦门市三安光电科技有限公司 | 微元件转移装置和转移方法 |
KR102048747B1 (ko) * | 2018-04-16 | 2019-11-26 | 한국기계연구원 | 마이크로 소자 전사방법 |
KR20200144163A (ko) * | 2019-06-17 | 2020-12-29 | 삼성디스플레이 주식회사 | 표시장치의 제조설비 및 표시장치의 제조방법 |
US11889742B2 (en) * | 2020-11-04 | 2024-01-30 | Samsung Display Co., Ltd. | Apparatus of manufacturing display device and method of manufacturing display device |
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JP2006012971A (ja) * | 2004-06-23 | 2006-01-12 | Harmotec Corp | 保護テープ剥離装置 |
JP2009141314A (ja) * | 2007-11-13 | 2009-06-25 | Takatori Corp | ウエハの保護テープの剥離方法及び装置 |
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KR19990028523A (ko) * | 1995-08-31 | 1999-04-15 | 야마모토 히데키 | 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치 |
JP4204653B2 (ja) * | 1997-06-20 | 2009-01-07 | リンテック株式会社 | シート剥離装置および方法 |
JP2005175253A (ja) | 2003-12-12 | 2005-06-30 | Nitto Denko Corp | 保護テープ剥離方法およびこれを用いた装置 |
JP4538242B2 (ja) * | 2004-01-23 | 2010-09-08 | 株式会社東芝 | 剥離装置及び剥離方法 |
WO2005106937A1 (ja) * | 2004-04-28 | 2005-11-10 | Lintec Corporation | シート剥離装置及び剥離方法 |
JP2006156633A (ja) | 2004-11-29 | 2006-06-15 | Lintec Corp | 脆質部材の処理装置 |
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2008
- 2008-09-04 JP JP2008226917A patent/JP4740298B2/ja active Active
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- 2009-08-27 US US13/062,409 patent/US8171977B2/en active Active
- 2009-08-27 KR KR1020117005030A patent/KR101579783B1/ko active IP Right Grant
- 2009-08-27 CN CN2009801349905A patent/CN102144287B/zh active Active
- 2009-08-27 WO PCT/JP2009/064911 patent/WO2010026910A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006012971A (ja) * | 2004-06-23 | 2006-01-12 | Harmotec Corp | 保護テープ剥離装置 |
JP2009141314A (ja) * | 2007-11-13 | 2009-06-25 | Takatori Corp | ウエハの保護テープの剥離方法及び装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101277325B1 (ko) * | 2011-09-16 | 2013-06-20 | 주식회사 아이.엠.텍 | 필름의 보호시트 분리장치 |
JP2015177011A (ja) * | 2014-03-14 | 2015-10-05 | リンテック株式会社 | シート貼付装置および貼付方法 |
Also Published As
Publication number | Publication date |
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JP4740298B2 (ja) | 2011-08-03 |
WO2010026910A1 (ja) | 2010-03-11 |
KR101579783B1 (ko) | 2015-12-24 |
CN102144287A (zh) | 2011-08-03 |
US20110162790A1 (en) | 2011-07-07 |
KR20110050658A (ko) | 2011-05-16 |
CN102144287B (zh) | 2013-03-06 |
US8171977B2 (en) | 2012-05-08 |
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