JP2009267413A - 幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージの製造方法 - Google Patents
幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージの製造方法 Download PDFInfo
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- JP2009267413A JP2009267413A JP2009106731A JP2009106731A JP2009267413A JP 2009267413 A JP2009267413 A JP 2009267413A JP 2009106731 A JP2009106731 A JP 2009106731A JP 2009106731 A JP2009106731 A JP 2009106731A JP 2009267413 A JP2009267413 A JP 2009267413A
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- lead frame
- die attach
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53539—Means to assemble or disassemble including work conveyor
- Y10T29/53543—Means to assemble or disassemble including work conveyor including transporting track
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53687—Means to assemble or disassemble by rotation of work part
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
【解決手段】第1面とその反対側の第2面とを有するリードフレーム70を両方向へ移送するインデックス・レール120、インデックス・レール120の一端部に連結されてインデックス・レール120にリードフレーム70を供給するローダ部110、インデックス・レール120の一端部の反対側端部に連結されてリードフレーム70を第1面に対する垂線を中心に回転させるフレーム駆動部140、及びインデックス・レール120に供給されたリードフレーム70に半導体チップを付着するダイアタッチ部130を備える半導体パッケージ製造装置である。
【選択図】図4
Description
11,31 第1半導体チップ
13,33 第2半導体チップ
15,61 成形樹脂
20,40 リードフレーム
21,41,81 ダイパッド
23,43 リードフィンガ
25,45 第1接着層
26,47 第2接着層
27,28,51,53,55,57 ワイヤボンド
30 QDP
35 第3半導体チップ
37 第4半導体チップ
46 第3接着層
48 第4接着層
70 幅広リードフレーム
72 モールディング領域
80 単位リードフレーム
83 リードフィンガ部
100,500 半導体パッケージ製造装置
110 ローダ部
120 インデックス・レール
125 吸着ブロック
130 ダイアタッチ部
132 アタッチヘッド
132a チップ吸着部
132b ピックアップ・モジュール
132c ヘッドブロック部
134 移送レール
140 フレーム駆動部
142 回転テーブル
144 フレームローティング・テーブル
146 フレーム固定装置
148 回転装置
148a 回転軸
148b 駆動装置
150 ウェーハテーブル
160 ウェーハカセットローダ部
170 アンローダ部
180 反転装置
182 反転回転軸
184 反転駆動装置
210 半導体チップ
510 第1ダイアタッチ装置
520 第2ダイアタッチ装置
C 幅広リードフレームの幅中心線
L 幅広リードフレームの長さ
W 幅広リードフレームの幅
WB 有効移動距離
WI インデックス・レールの幅
Claims (20)
- 第1面とその反対側の第2面とを有するリードフレームを両方向へ移送するインデックス・レールと、
前記インデックス・レールの一端部に連結され、前記インデックス・レールに前記リードフレームを供給するローダ部と、
前記インデックス・レールの前記一端部の反対側端部に連結され、前記リードフレームを前記第1面に対する垂線を中心に回転させるフレーム駆動部と、
前記インデックス・レールに供給された前記リードフレームに半導体チップを付着するダイアタッチ部とを備えることを特徴とする半導体パッケージ製造装置。 - 前記ダイアタッチ部は、
半導体チップをピックアップし、前記リードフレームに付着するアタッチヘッドと、
前記アタッチヘッドを前記インデックス・レール上に移送する移送レールとを備えることを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 前記アタッチヘッドは、前記移送レールに沿って前記インデックス・レールの幅方向に、前記インデックス・レールの幅方向の一端上から少なくとも前記インデックス・レールの幅方向の中心部上まで移動することを特徴とする請求項2に記載の半導体パッケージ製造装置。
- 前記リードフレームを外部に排出するために、前記フレーム駆動部と連結されるアンローダ部をさらに備え、
前記フレーム駆動部は、前記リードフレームの状態によって選択的に、前記リードフレームをアンローダ部に送ったり、または前記インデックス・レールにさらに供給することを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 前記フレーム駆動部は、前記リードフレームを前記第1面に対する垂線を中心に回転させるために、
前記リードフレームを支持するためのフレームローディング・レールと、
前記フレームローディング・レールを支持する回転テーブルと、
前記第1面に対する垂線の方向に前記回転テーブルと連結された回転軸と、
前記回転軸に回転駆動力を供給する回転駆動装置を含むことを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 前記フレームローディング・レールは、前記フレーム駆動部によって1個のリードフレームずつ回転するように、前記1個のリードフレームを支持することを特徴とする請求項5に記載の半導体パッケージ製造装置。
- 前記フレーム駆動部は、前記リードフレームを180°回転させることを特徴とする請求項1に記載の半導体パッケージ製造装置。
- 前記ローダ部は、
前記インデックス・レールから移送された前記リードフレームを外部に排出するためのアンローディング機能を備えることを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 前記フレーム駆動部は、
前記リードフレームの前記第1面と第2面とのうち、上方を向く面が下方を向くように、前記リードフレームを反転させる反転装置をさらに具備することを特徴とする請求項1に記載の半導体パッケージ製造装置。 - 第1面とその反対側の第2面とを有するリードフレームを両方向へ移送するインデックス・レールと、前記インデックス・レール上に位置する前記リードフレームに半導体チップを付着するダイアタッチ部とをそれぞれ備える第1ダイアタッチ装置及び第2ダイアタッチ装置と、
前記第1ダイアタッチ装置の一端部に連結され、前記第1ダイアタッチ装置に前記リードフレームを供給するローダ部と、
前記第2ダイアタッチ装置の一端部に連結され、前記第2ダイアタッチ装置から前記リードフレームが排出されるアンローダ部と、
前記第1ダイアタッチ装置及び前記第2ダイアタッチ装置のそれぞれ前記一端部の反対側端部間に連結され、前記リードフレームを前記第1面に対する垂線を中心に回転させるフレーム駆動部とを備えることを特徴とする半導体パッケージ製造装置。 - 前記ダイアタッチ部は、
半導体チップをピックアップし、前記リードフレームに付着するアタッチヘッドと、
前記アタッチヘッドを前記インデックス・レール上に移送する移送レールとを備えることを特徴とする請求項10に記載の半導体パッケージ製造装置。 - 前記アタッチヘッドは、前記移送レールに沿って前記インデックス・レールの幅方向に、前記インデックス・レールの幅方向の一端上から少なくとも前記インデックス・レールの幅方向の中心部上まで移動することを特徴とする請求項11に記載の半導体パッケージ製造装置。
- 前記フレーム駆動部は、
前記リードフレームの状態によって選択的に、前記リードフレームを前記第1ダイアタッチ装置、または前記第2ダイアタッチ装置に供給することを特徴とする請求項10に記載の半導体パッケージ製造装置。 - 前記フレーム駆動部は、
前記リードフレームの上方を向く面が下方を向くように、前記リードフレームを反転させる反転装置をさらに具備することを特徴とする請求項13に記載の半導体パッケージ製造装置。 - 複数のダイパッドを有する第1面とその反対側の第2面とを有するリードフレームを前記第1面が上方を向くようにダイアタッチ部に供給する段階と、
前記ダイアタッチ部で、前記リードフレームの第1面上のダイパッドうち一部分に半導体チップを付着する第1ダイアタッチ段階と、
前記リードフレームを前記第1面に対する垂線を中心に回転させる段階と、
前記ダイアタッチ部で、前記リードフレームの第1面上のダイパッドうち半導体チップが付着されていない残りのダイパッドに半導体チップを付着する第2ダイアタッチ段階とを含むことを特徴とする半導体パッケージの製造方法。 - 前記第1ダイアタッチ段階は、
前記リードフレーム第1面の第1方向への中心線を基準に、少なくとも一側半分のダイパッドに全て半導体チップを付着することを特徴とする請求項15に記載の半導体パッケージの製造方法。 - 前記第2ダイアタッチ段階は、
前記リードフレーム第1面の第1方向への中心線を基準に、少なくとも一側半分のダイパッドに全て半導体チップを付着することを特徴とする請求項15に記載の半導体パッケージの製造方法。 - 前記リードフレームの前記第2面が上方を向くように、前記リードフレームを反転する段階と、
前記ダイアタッチ部で、前記リードフレームの第2面上のダイパッドうち一部分に半導体チップを付着する第3ダイアタッチ段階と、
前記リードフレームを前記第2面に対する垂線を中心に回転させる段階と、
前記ダイアタッチ部で、前記リードフレームの第2面上のダイパッドうち半導体チップが付着されていない残りのダイパッドに半導体チップを付着する第4ダイアタッチ段階とをさらに含むことを特徴とする請求項15に記載の半導体パッケージの製造方法。 - 前記第3ダイアタッチ段階は、
前記リードフレームを第1方向に順次に移動させ、
前記リードフレーム第2面の前記第1方向への中心線を基準に、少なくとも一側半分のダイパッドに全て半導体チップを付着することを特徴とする請求項18に記載の半導体パッケージの製造方法。 - 前記第4ダイアタッチ段階は、
前記リードフレーム第2面の前記第1方向への中心線を基準に、少なくとも一側半分のダイパッドに全て半導体チップを付着することを特徴とする請求項18に記載の半導体パッケージの製造方法。
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CN103594400B (zh) * | 2013-11-29 | 2016-02-17 | 如皋市大昌电子有限公司 | 一种轴向二极管芯片自动化芯片装填生产*** |
JP6316340B2 (ja) * | 2016-06-02 | 2018-04-25 | 株式会社カイジョー | ボンディング装置、ボンディング方法及びボンディング制御プログラム |
CN108231651B (zh) * | 2017-12-26 | 2020-02-21 | 厦门市三安光电科技有限公司 | 微元件转移装置和转移方法 |
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TWI489581B (zh) * | 2011-05-25 | 2015-06-21 | Asm Tech Singapore Pte Ltd | 半導體封裝製造過程中用於傳送半導體元件到襯底的裝置 |
WO2018003519A1 (ja) * | 2016-06-28 | 2018-01-04 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
JP2018026473A (ja) * | 2016-08-10 | 2018-02-15 | 株式会社カイジョー | ボンディング方法 |
WO2018029881A1 (ja) * | 2016-08-10 | 2018-02-15 | 株式会社カイジョー | ボンディング方法 |
CN108028207A (zh) * | 2016-08-10 | 2018-05-11 | 株式会社海上 | 键合方法 |
US10600754B2 (en) | 2016-08-10 | 2020-03-24 | Kaijo Corporation | Bonding method |
CN108028207B (zh) * | 2016-08-10 | 2021-01-08 | 株式会社海上 | 键合方法 |
Also Published As
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KR100967526B1 (ko) | 2010-07-05 |
KR20090113101A (ko) | 2009-10-29 |
JP5060510B2 (ja) | 2012-10-31 |
HK1132089A1 (en) | 2010-02-12 |
CN101567308A (zh) | 2009-10-28 |
US20090269887A1 (en) | 2009-10-29 |
US8424195B2 (en) | 2013-04-23 |
CN101567308B (zh) | 2011-04-13 |
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