JP2009158863A - 半導体パッケージ及びカメラモジュール - Google Patents
半導体パッケージ及びカメラモジュール Download PDFInfo
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Abstract
【解決手段】シリコン基板10の第1の主面上には、固体撮像素子12、素子面電極27が形成されている。第1の主面上に形成された素子面電極27に対向する第2の主面と第1の主面との間のシリコン基板10を貫くように、貫通電極が形成されている。固体撮像素子12上に空洞18が形成されるように、パターニングされた接着剤20を介してガラス基板30が形成されている。そして、ガラス基板30から見て空洞18下のシリコン基板10の厚さは、接着剤20下のシリコン基板10の厚さより厚く形成されている。
【選択図】 図2
Description
まず、本発明の第1実施形態のカメラモジュールについて説明する。
次に、本発明の第2実施形態のカメラモジュールについて説明する。前記第1実施形態における構成と同様の部分には同じ符号を付してその説明は省略する。
次に、本発明の第3実施形態のカメラモジュールについて説明する。前記第1実施形態における構成と同様の部分には同じ符号を付してその説明は省略する。
Claims (5)
- 半導体基板の第1の主面上に形成された固体撮像素子と、
前記半導体基板の第1の主面上に形成された電極パッドと、
前記第1の主面上に形成された前記電極パッドに対向する第2の主面と前記第1の主面との間の半導体基板を貫くように形成された貫通電極と、
前記固体撮像素子上に空洞が形成されるように、パターニングされた接着剤を介して設置された光透過性支持基板とを具備し、
前記光透過性支持基板から見て前記空洞下の前記半導体基板の厚さは、前記接着剤下の前記半導体基板の厚さより厚いことを特徴とする半導体パッケージ。 - 半導体基板の第1の主面上に形成された固体撮像素子と、
前記半導体基板の第1の主面上に形成された電極パッドと、
前記第1の主面上に形成された前記電極パッドに対向する第2の主面と前記第1の主面との間の半導体基板を貫くように形成された貫通電極と、
前記固体撮像素子上に空洞が形成されるように、パターニングされた接着剤を介して設置された光透過性支持基板とを具備し、
前記光透過性支持基板から見て前記接着剤下の前記半導体基板の前記第2の主面は、前記空洞下の前記半導体基板の前記第2の主面より凹んでいることを特徴とする半導体パッケージ。 - 前記空洞下の前記半導体基板の前記第2の主面上には、樹脂材が形成されていることを特徴とする請求項1または2に記載の半導体パッケージ。
- 前記固体撮像素子に対応するように配置されたカラーフィルタと、
前記固体撮像素子に対応するように、前記カラーフィルタ上に配置されたマイクロレンズと、
をさらに具備することを特徴とする請求項1乃至3のいずれかに記載の半導体パッケージ。 - 前記請求項1または請求項2に記載の半導体パッケージと、
前記半導体パッケージにおける前記光透過性支持基板上に配置された赤外線カットフィルタと、
前記赤外線カットフィルタ上に配置された撮像レンズと、
を具備することを特徴とするカメラモジュール。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007338200A JP4799543B2 (ja) | 2007-12-27 | 2007-12-27 | 半導体パッケージ及びカメラモジュール |
EP08868575.5A EP2179445A4 (en) | 2007-12-27 | 2008-12-19 | SEMICONDUCTOR HOUSING AND CAMERA MODULE |
PCT/JP2008/073883 WO2009084701A1 (en) | 2007-12-27 | 2008-12-19 | Semiconductor package and camera module |
KR1020097014440A KR101032182B1 (ko) | 2007-12-27 | 2008-12-19 | 반도체 패키지 및 카메라 모듈 |
TW097150750A TWI387075B (zh) | 2007-12-27 | 2008-12-25 | 半導體封裝以及攝影機模組 |
US12/511,099 US8228426B2 (en) | 2007-12-27 | 2009-07-29 | Semiconductor package and camera module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007338200A JP4799543B2 (ja) | 2007-12-27 | 2007-12-27 | 半導体パッケージ及びカメラモジュール |
Publications (3)
Publication Number | Publication Date |
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JP2009158863A true JP2009158863A (ja) | 2009-07-16 |
JP2009158863A5 JP2009158863A5 (ja) | 2011-03-03 |
JP4799543B2 JP4799543B2 (ja) | 2011-10-26 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007338200A Expired - Fee Related JP4799543B2 (ja) | 2007-12-27 | 2007-12-27 | 半導体パッケージ及びカメラモジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US8228426B2 (ja) |
EP (1) | EP2179445A4 (ja) |
JP (1) | JP4799543B2 (ja) |
KR (1) | KR101032182B1 (ja) |
TW (1) | TWI387075B (ja) |
WO (1) | WO2009084701A1 (ja) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009253363A (ja) * | 2008-04-01 | 2009-10-29 | Iwate Toshiba Electronics Co Ltd | カメラモジュール |
JP2010021352A (ja) * | 2008-07-10 | 2010-01-28 | Oki Semiconductor Co Ltd | 半導体装置、半導体装置の製造方法および半導体パッケージの製造方法 |
JP2011147091A (ja) * | 2010-01-18 | 2011-07-28 | Sharp Corp | カメラモジュールおよびその製造方法、電子情報機器 |
JP2011205222A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | カメラモジュール |
JP2011205221A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | カメラモジュール |
WO2011145742A1 (en) | 2010-05-19 | 2011-11-24 | Fujifilm Corporation | Polymerizable composition |
WO2012015076A1 (en) | 2010-07-29 | 2012-02-02 | Fujifilm Corporation | Polymerizable composition |
JP2012044114A (ja) * | 2010-08-23 | 2012-03-01 | Canon Inc | 撮像モジュール及びカメラ |
JP2012059832A (ja) * | 2010-09-07 | 2012-03-22 | Sony Corp | 半導体パッケージおよび半導体パッケージの製造方法ならびに光学モジュール |
JP2012070102A (ja) * | 2010-09-21 | 2012-04-05 | Toshiba Corp | 撮像装置およびその製造方法 |
EP2498130A2 (en) | 2011-03-08 | 2012-09-12 | Fujifilm Corporation | Curable composition for solid-state imaging device, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition |
CN103081105A (zh) * | 2010-08-23 | 2013-05-01 | 佳能株式会社 | 图像拾取装置、图像拾取模块和照相机 |
WO2014084288A1 (ja) | 2012-11-30 | 2014-06-05 | 富士フイルム株式会社 | 硬化性樹脂組成物、これを用いたイメージセンサチップの製造方法及びイメージセンサチップ |
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Also Published As
Publication number | Publication date |
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TWI387075B (zh) | 2013-02-21 |
TW200933845A (en) | 2009-08-01 |
KR20090099552A (ko) | 2009-09-22 |
EP2179445A4 (en) | 2013-08-21 |
US8228426B2 (en) | 2012-07-24 |
US20090284631A1 (en) | 2009-11-19 |
JP4799543B2 (ja) | 2011-10-26 |
EP2179445A1 (en) | 2010-04-28 |
WO2009084701A1 (en) | 2009-07-09 |
KR101032182B1 (ko) | 2011-05-02 |
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