JP2008227412A - 発光装置およびその製造方法 - Google Patents
発光装置およびその製造方法 Download PDFInfo
- Publication number
- JP2008227412A JP2008227412A JP2007067362A JP2007067362A JP2008227412A JP 2008227412 A JP2008227412 A JP 2008227412A JP 2007067362 A JP2007067362 A JP 2007067362A JP 2007067362 A JP2007067362 A JP 2007067362A JP 2008227412 A JP2008227412 A JP 2008227412A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- sealing body
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
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Abstract
【解決手段】絶縁基板上に、直線状の配線パターンが平行に配置されて複数形成され、その配線パターン間に複数個の発光素子が配線パターンに電気的に接続された状態で搭載され、封止体で封止された発光部を備える発光装置、ならびに、絶縁基板上に配線パターンを形成する工程と、配線パターン間に発光素子を搭載する工程と、発光素子と配線パターンとを電気的に接続する工程と、貫通孔を有するシリコーンゴムシートを絶縁基板上に載置する工程と、シリコーンゴムシートの貫通孔内に、発光素子を封止する封止体を形成する工程とを含む発光装置の製造方法。
【選択図】図1
Description
が透明樹脂で形成された樹脂封止体206により埋設されてなる。特許文献2には、このような構成を備えることによって、LEDチップの発熱を効率的に放熱させることができ、生産性に優れた表面実装型のLED部品およびその製造方法を提供できると記載されている。
Claims (23)
- 絶縁基板上に、直線状の配線パターンが平行に配置されて複数形成され、その配線パターン間に複数個の発光素子が配線パターンに電気的に接続された状態で搭載され、封止体で封止された発光部を備える、発光装置。
- 発光素子が、直線状の配線パターンを挟んで、配線パターンに沿って直線状に配列されて複数個搭載されている、請求項1に記載の発光装置。
- 配線パターンを挟んで搭載された発光素子は、側面同士が対向しないようにずらして配置されている、請求項2に記載の発光装置。
- 断面形状が長方形状である発光素子が、その短辺に沿った方向が配線パターンの長手方向と平行になるように搭載されている、請求項1〜3のいずれかに記載の発光装置。
- 発光素子が長尺状の断面形状を有するものである、請求項4に記載の発光装置。
- 直線状の配線パターンを挟んで搭載された発光素子同士が直列に電気的に接続されている、請求項1〜5のいずれかに記載の発光装置。
- 直線状の配線パターンに沿って直線状に搭載された発光素子同士が並列に電気的に接続されている、請求項1〜6のいずれかに記載の発光装置。
- 配線パターンが、発光素子との間の電気的接続の位置決め用のパターン、または、発光素子の搭載位置の目安用のパターンをさらに有する、請求項1〜7のいずれかに記載の発光装置。
- 発光素子と配線パターンとの間の直線距離が0.1mm以上である、請求項1〜8のいずれかに記載の発光装置。
- 絶縁基板が白色のセラミック基板である、請求項1〜9のいずれかに記載の発光装置。
- 白色のセラミック基板が、酸化アルミニウム、窒化アルミニウム、ボロンナイトライド、窒化ケイ素、酸化マグネシウム、フォルステライト、ステアタイト、低温焼結セラミックから選ばれるいずれか、または、これらの複合材料で形成されている、請求項10に記載の発光装置。
- 絶縁基板上の直線状の配線パターンおよび発光素子の全てが1つの封止体で封止されている、請求項1〜11のいずれかに記載の発光装置。
- 封止体が蛍光体を含有する、請求項1〜12のいずれかに記載の発光装置。
- 封止体が、第1の蛍光体を含有する第1の封止体層と、当該第1の封止体層上に積層された第2の蛍光体を含有する第2の封止体層とを備える、請求項13に記載の発光装置。
- 第2の封止体層が、第1の封止体層の少なくとも一部を覆うように第1の封止体層上に積層されている、請求項14に記載の発光装置。
- 封止体が、六角形状、円形状、長方形状または正方形状の断面を有する形状に形成されている、請求項1〜15のいずれかに記載の発光装置。
- 発光装置が、円形状または正方形状の断面を有する形状である、請求項1〜16のいずれかに記載の発光装置。
- 液晶ディスプレイのバックライト光源または照明用光源として用いられるものである、請求項1〜17のいずれかに記載の発光装置。
- 絶縁基板上に配線パターンを形成する工程と、
配線パターン間に発光素子を搭載する工程と、
発光素子と配線パターンとを電気的に接続する工程と、
貫通孔を有するシリコーンゴムシートを絶縁基板上に載置する工程と、
シリコーンゴムシートの貫通孔内に、発光素子を封止する封止体を形成する工程とを含む、発光装置の製造方法。 - 発光素子と配線パターンとを電気的に接続した後、発光素子の特性を検査する工程と、
検査の結果、特性不良があった場合に、予備の発光素子を配線パターンと接続する工程とをさらに含む、請求項19に記載の発光装置の製造方法。 - 封止体に蛍光体を含有させることを特徴とする、請求項19または20に記載の発光装置の製造方法。
- 封止体で発光素子を封止する工程が、
シリコーンゴムシートの貫通孔内に第1の蛍光体を含有する封止材料を注入する工程と、
第1の蛍光体を含有する封止材料を硬化させて第1の封止体層を形成する工程と、
第1の封止体層形成後の発光装置の色度特性を測定する工程とを含む、請求項21に記載の発光装置の製造方法。 - 第1の封止体層形成後の発光装置の色度特性を測定する工程の後に、
第1の封止体層上に、第2の蛍光体を含有する封止材料を注入する工程と、
第2の蛍光体を含有する封止材料を硬化させて第2の封止体層を形成する工程と、
第2の封止体層形成後の発光装置の色度特性を測定する工程と、
シリコーンゴムシートを除去する工程とをさらに含む、請求項22に記載の発光装置の製造方法。
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JP2007067362A JP4753904B2 (ja) | 2007-03-15 | 2007-03-15 | 発光装置 |
DE102008064802.7A DE102008064802B3 (de) | 2007-03-15 | 2008-02-29 | Lichtemittierendes Bauteil |
DE102008011810A DE102008011810B4 (de) | 2007-03-15 | 2008-02-29 | Lichtemittierendes Bauteil und Verwendung sowie Herstellungsverfahren eines solchen |
CN2008100833768A CN101266968B (zh) | 2007-03-15 | 2008-03-13 | 发光装置和制造该种发光装置的方法 |
CN201110432314.5A CN102522397B (zh) | 2007-03-15 | 2008-03-13 | 发光装置和制造该种发光装置的方法 |
US12/049,690 US7843131B2 (en) | 2007-03-15 | 2008-03-17 | Light emitting device and method for manufacturing the same |
US12/916,048 US8427048B2 (en) | 2007-03-15 | 2010-10-29 | Light emitting device and method for manufacturing the same |
US13/786,393 US8841838B2 (en) | 2007-03-15 | 2013-03-05 | Light emitting device and method for manufacturing the same |
US14/245,974 US9484502B2 (en) | 2007-03-15 | 2014-04-04 | Light emitting device and method for manufacturing the same |
US14/638,672 US9478716B2 (en) | 2007-03-15 | 2015-03-04 | Light emitting device and method for manufacturing the same |
US15/015,903 US9755115B2 (en) | 2007-03-15 | 2016-02-04 | Light emitting device and method for manufacturing the same |
US15/651,492 US9966504B2 (en) | 2007-03-15 | 2017-07-17 | Light emitting device and method for manufacturing the same |
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Also Published As
Publication number | Publication date |
---|---|
US20170317244A1 (en) | 2017-11-02 |
CN101266968B (zh) | 2012-02-15 |
US20130181250A1 (en) | 2013-07-18 |
US9478716B2 (en) | 2016-10-25 |
US7843131B2 (en) | 2010-11-30 |
US8427048B2 (en) | 2013-04-23 |
CN102522397B (zh) | 2015-12-16 |
US9484502B2 (en) | 2016-11-01 |
US20110044029A1 (en) | 2011-02-24 |
US9966504B2 (en) | 2018-05-08 |
DE102008011810A1 (de) | 2008-10-09 |
JP4753904B2 (ja) | 2011-08-24 |
US20140339594A1 (en) | 2014-11-20 |
US8841838B2 (en) | 2014-09-23 |
US20080224608A1 (en) | 2008-09-18 |
CN101266968A (zh) | 2008-09-17 |
DE102008011810B4 (de) | 2013-12-24 |
US9755115B2 (en) | 2017-09-05 |
DE102008064802B3 (de) | 2016-06-09 |
US20150176824A1 (en) | 2015-06-25 |
US20160149093A1 (en) | 2016-05-26 |
CN102522397A (zh) | 2012-06-27 |
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