JP2008026212A - パターン検査装置 - Google Patents

パターン検査装置 Download PDF

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Publication number
JP2008026212A
JP2008026212A JP2006200572A JP2006200572A JP2008026212A JP 2008026212 A JP2008026212 A JP 2008026212A JP 2006200572 A JP2006200572 A JP 2006200572A JP 2006200572 A JP2006200572 A JP 2006200572A JP 2008026212 A JP2008026212 A JP 2008026212A
Authority
JP
Japan
Prior art keywords
illumination
pattern
inspection
lens
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006200572A
Other languages
English (en)
Japanese (ja)
Inventor
Hiroki Hayashi
宏樹 林
Ryozo Matsuda
僚三 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Ushio Inc
Original Assignee
Ushio Denki KK
Ushio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK, Ushio Inc filed Critical Ushio Denki KK
Priority to JP2006200572A priority Critical patent/JP2008026212A/ja
Priority to TW096116158A priority patent/TW200806978A/zh
Priority to KR1020070050951A priority patent/KR20080009628A/ko
Priority to CNA2007101386269A priority patent/CN101113958A/zh
Publication of JP2008026212A publication Critical patent/JP2008026212A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2006200572A 2006-07-24 2006-07-24 パターン検査装置 Pending JP2008026212A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006200572A JP2008026212A (ja) 2006-07-24 2006-07-24 パターン検査装置
TW096116158A TW200806978A (en) 2006-07-24 2007-05-07 Pattern inspection device
KR1020070050951A KR20080009628A (ko) 2006-07-24 2007-05-25 패턴 검사 장치
CNA2007101386269A CN101113958A (zh) 2006-07-24 2007-07-24 图形检查装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006200572A JP2008026212A (ja) 2006-07-24 2006-07-24 パターン検査装置

Publications (1)

Publication Number Publication Date
JP2008026212A true JP2008026212A (ja) 2008-02-07

Family

ID=39022411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006200572A Pending JP2008026212A (ja) 2006-07-24 2006-07-24 パターン検査装置

Country Status (4)

Country Link
JP (1) JP2008026212A (ko)
KR (1) KR20080009628A (ko)
CN (1) CN101113958A (ko)
TW (1) TW200806978A (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101198406B1 (ko) 2010-04-21 2012-11-07 (주)에이앤아이 패턴 검사 장치
JP2013113750A (ja) * 2011-11-30 2013-06-10 Hitachi Zosen Corp 積層基板の検査装置および検査方法
CN103364412A (zh) * 2012-04-10 2013-10-23 北京兆维电子(集团)有限责任公司 胶印版材在线检测与分垛***
JP2016006422A (ja) * 2009-03-24 2016-01-14 オルボテック・リミテッド マルチモード・イメージング
JP2018009800A (ja) * 2016-07-11 2018-01-18 住友化学株式会社 欠陥検査用撮像装置、欠陥検査システム、フィルム製造装置、欠陥検査用撮像方法、欠陥検査方法、及び、フィルム製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5480149B2 (ja) 2008-09-18 2014-04-23 インターナショナル・ビジネス・マシーンズ・コーポレーション 検査対象物の欠陥の発見を支援するシステム及び方法
KR101115010B1 (ko) * 2010-07-13 2012-03-06 한미반도체 주식회사 웨이퍼 검사 장치
JP5559644B2 (ja) * 2010-09-03 2014-07-23 株式会社トプコン 検査装置
KR102023581B1 (ko) * 2012-11-23 2019-09-24 해성디에스 주식회사 릴-투-릴 검사장치 및 릴-투-릴 검사방법
JP6085188B2 (ja) * 2013-02-15 2017-02-22 株式会社Ｓｃｒｅｅｎホールディングス パターン検査装置
KR101464251B1 (ko) * 2014-05-20 2014-11-25 테크밸리 주식회사 반도체 테이프릴의 등록방법 및 그 디스플레이시스템
CN104330419A (zh) * 2014-11-20 2015-02-04 北京凌云光技术有限责任公司 菲林检测方法及装置
CN106249517B (zh) * 2016-09-29 2019-04-19 长春理工大学 单相机全视角线号识别装置
KR102611983B1 (ko) * 2018-10-29 2023-12-08 삼성전자주식회사 배선 회로 테스트 장치 및 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057192A (ja) * 2001-08-10 2003-02-26 Dainippon Screen Mfg Co Ltd 画像取得装置
JP2005024386A (ja) * 2003-07-02 2005-01-27 Ushio Inc 配線パターン検査装置
JP2006072147A (ja) * 2004-09-03 2006-03-16 Lasertec Corp 検査装置及び検査方法並びにパターン基板の製造方法
JP2009523228A (ja) * 2005-12-27 2009-06-18 ケーエルエー−テンカー テクノロジィース コーポレイション 複数画像の同時高速取得を行う方法および装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057192A (ja) * 2001-08-10 2003-02-26 Dainippon Screen Mfg Co Ltd 画像取得装置
JP2005024386A (ja) * 2003-07-02 2005-01-27 Ushio Inc 配線パターン検査装置
JP2006072147A (ja) * 2004-09-03 2006-03-16 Lasertec Corp 検査装置及び検査方法並びにパターン基板の製造方法
JP2009523228A (ja) * 2005-12-27 2009-06-18 ケーエルエー−テンカー テクノロジィース コーポレイション 複数画像の同時高速取得を行う方法および装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016006422A (ja) * 2009-03-24 2016-01-14 オルボテック・リミテッド マルチモード・イメージング
KR101198406B1 (ko) 2010-04-21 2012-11-07 (주)에이앤아이 패턴 검사 장치
JP2013113750A (ja) * 2011-11-30 2013-06-10 Hitachi Zosen Corp 積層基板の検査装置および検査方法
CN103364412A (zh) * 2012-04-10 2013-10-23 北京兆维电子(集团)有限责任公司 胶印版材在线检测与分垛***
JP2018009800A (ja) * 2016-07-11 2018-01-18 住友化学株式会社 欠陥検査用撮像装置、欠陥検査システム、フィルム製造装置、欠陥検査用撮像方法、欠陥検査方法、及び、フィルム製造方法

Also Published As

Publication number Publication date
KR20080009628A (ko) 2008-01-29
CN101113958A (zh) 2008-01-30
TW200806978A (en) 2008-02-01

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