JP2002280263A - Chip-type solid electrolytic capacitor - Google Patents
Chip-type solid electrolytic capacitorInfo
- Publication number
- JP2002280263A JP2002280263A JP2001073266A JP2001073266A JP2002280263A JP 2002280263 A JP2002280263 A JP 2002280263A JP 2001073266 A JP2001073266 A JP 2001073266A JP 2001073266 A JP2001073266 A JP 2001073266A JP 2002280263 A JP2002280263 A JP 2002280263A
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- JP
- Japan
- Prior art keywords
- solid electrolytic
- chip
- type solid
- connection terminals
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する分野】本発明は、狭い実装面積で大きな
容量を得ることのできる積み重ねコンデンサーユニッ
ト、該積み重ねコンデンサーユニットに用いるチップ型
固体電解コンデンサー及び積み重ねコンデンサーユニッ
トを実装した電子機器配線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stacked capacitor unit capable of obtaining a large capacitance with a small mounting area, a chip type solid electrolytic capacitor used for the stacked capacitor unit, and an electronic equipment wiring board on which the stacked capacitor unit is mounted. is there.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】図１０
に示す如く、２個のチップ型固体電解コンデンサー(１)
(２)を積み重ね、夫々対応する接続用端子(12)(22)、(1
3)(23)を接続板(７)(７)を介して溶接連結した積み重ね
コンデンサーユニット(５)が実施されている(特開昭１
１−２６３０４号)(国際分類Ｈ０１Ｇ ９／０５)。上
記積み重ねコンデンサーは、１個のチップ型固体電解コ
ンデンサーの取付けスペースで、２個分の容量を得るこ
とが出来る利点があった。2. Description of the Related Art FIG.
As shown in the figure, two chip type solid electrolytic capacitors (1)
(2) is stacked, and the corresponding connection terminals (12) (22), (1)
(3) A stacked capacitor unit (5) in which (23) is welded and connected via connecting plates (7) and (7) has been implemented.
No. 1-26304) (International classification H01G 9/05). The stacked capacitor has an advantage that a capacity for two capacitors can be obtained in a mounting space for one chip-type solid electrolytic capacitor.
【０００３】チップ型固体電解コンデンサー(１)(２)の
接続用端子(12)(22)、(13)(23)及び接続板(７)には、プ
リント配線基板(４)への半田付けの際に、半田との濡れ
性を良くするためにメッキが施されている。ところが、
接続板(７)を上下の両接続用端子(12)(22)、(13)(23)に
被せ、接続板と接続用端子を溶接すると、溶接部(３)に
おいて接続用端子(12)(22)、(13)(14)及び接続板(７)の
夫々両面のメッキ層が溶融して半田との濡れ性が低下す
る。The connection terminals (12) (22), (13) (23) and the connection plate (7) of the chip type solid electrolytic capacitors (1) and (2) are soldered to a printed wiring board (4). At this time, plating is applied to improve the wettability with the solder. However,
When the connection plate (7) is put on the upper and lower connection terminals (12) (22), (13) and (23), and the connection plate and the connection terminals are welded, the connection terminals (12) at the welded portion (3) The plating layers on both surfaces of (22), (13), (14) and the connection plate (7) are melted, and the wettability with solder is reduced.
【０００４】図９に示す如く、接続用端子(12)(13)のメ
ッキ層が溶融していないチップ型固体電解コンデンサー
(１)をプリント配線基板(４)に半田付けすると、溶融半
田(５)は接続用端子(12)上を表面張力により該端子(12)
の突出基端側へ這い上がる様に上昇して固化し、プリン
ト配線基板(４)と接続用端子(12)は強固に結合し、電気
的導通の信頼性も高い。As shown in FIG. 9, a chip type solid electrolytic capacitor in which the plating layers of the connection terminals (12, 13) are not melted.
When (1) is soldered to the printed wiring board (4), the molten solder (5) is placed on the connection terminals (12) by surface tension due to surface tension.
The printed wiring board (4) and the connection terminal (12) are firmly connected to each other and solidify, and the reliability of electrical conduction is high.
【０００５】しかし、前記の如く、上下のチップ型固体
電解コンデンサー(２)(１)の接続用端子(22)(12)、(23)
(13)と接続板(７)(７)の溶接により、溶接部(３)におい
てメッキ層が溶融して溶融半田との濡れ性が悪くなる
と、溶融半田(５)の這い上がりは溶接部(３)で遮断され
しまう。これによって、半田(５)と接続用端子(22)(23)
及び接続板(７)との固着面接が小さくなり、積み重ねコ
ンデンサーユニット(５)とプリント配線基板(４)との結
合力は小さく、電気的導通の信頼性も低い問題があっ
た。However, as described above, the connection terminals (22) (12), (23) of the upper and lower chip-type solid electrolytic capacitors (2) (1) are connected.
When the plating layer is melted at the welded portion (3) and the wettability with the molten solder is deteriorated due to the welding of the connection plate (13) and the connection plate (7), (7), the molten solder (5) creeps up. It is cut off in 3). Thereby, the solder (5) and the connection terminals (22) (23)
In addition, there is a problem in that the fixed surface contact with the connection plate (7) is reduced, the bonding force between the stacked capacitor unit (5) and the printed wiring board (4) is small, and the reliability of electrical conduction is low.
【０００６】本発明は上記問題を解決できるチップ型固
体電解コンデンサー、該コンデンサーを複数個積み重ね
た積み重ねコンデンサーユニット及び積み上げコンデン
サーユニットを実装した電子機器配線基板を明らかにす
るものである。The present invention clarifies a chip-type solid electrolytic capacitor capable of solving the above problems, a stacked capacitor unit in which a plurality of such capacitors are stacked, and an electronic device wiring board on which the stacked capacitor unit is mounted.
【０００７】[0007]
【課題を解決する手段】本発明のチップ型固体電解コン
デンサー(２)は、樹脂製外殻(21)から突出した帯板状の
接続用端子(22)(23)の先端部に切欠(24)を設けている。The chip-type solid electrolytic capacitor (2) of the present invention has a notch (24) at a tip end of a strip-shaped connection terminal (22) (23) protruding from a resin outer shell (21). ) Is provided.
【０００８】本発明の積み重ねコンデンサーユニット
(５)は、上記チップ型固体電解コンデンサーを含む２個
以上のチップ型固体電解コンデンサーを積み重ね、夫々
対応する接続用端子(12)(22)、(13)(23)を溶接により接
続したものであって、前記切欠(24)が外部に露出してい
ることを特徴とする。The stacked condenser unit of the present invention
(5) is a stack in which two or more chip-type solid electrolytic capacitors including the above-mentioned chip-type solid electrolytic capacitors are stacked, and the corresponding connection terminals (12) (22) and (13) (23) are connected by welding. Wherein the notch (24) is exposed to the outside.
【０００９】本発明の電子機器配線基板は、上記積み重
ねコンデンサーユニット(５)がプリント配線基板(４)に
半田付けされ、半田(５)は接続用端子(22)(23)の先端切
欠(24)(14)に侵入していることを特徴とする。In the electronic device wiring board of the present invention, the stacked capacitor unit (5) is soldered to the printed wiring board (4), and the solder (5) is cut off at the notch (24) of the connection terminals (22) (23). ) (14).
【００１０】[0010]
【作用及び効果】積み重ねコンデンサーユニット(５)を
プリント配線基板(４)に半田付けする際、下段コンデン
サー(１)の接続用端子(12)(13)に被さってプリント配線
基板(４)側へ延びた上段コンデンサー(２)の接続用端子
(22)(23)に溶融半田(５)が這い上がる。[Function and Effect] When soldering the stacked capacitor unit (5) to the printed wiring board (4), cover the connection terminals (12) and (13) of the lower capacitor (1) to the printed wiring board (4) side. Terminal for connecting extended upper capacitor (2)
(22) The molten solder (5) creeps up on (23).
【００１１】上下段のコンデンサー(２)(１)の接続用端
子(12)(22)、(13)(23)の溶接部(３)(３)は、メッキが溶
けて溶融半田との濡れ性が悪くなっており、表面張力に
より接続用端子(12)(22)の板面を伝って這い上がる溶融
半田は、該溶接部(３)の位置で這い上がりは阻止され
る。しかし、溶融半田(５)は上層の接続用端子(22)(23)
の先端部に施した切欠(24)の内縁を伝って這い上がって
固化する。これによってコンデンサーユニット(５)とプ
リント配線基板(４)の結合力を高めることが出来、電気
的導通の信頼性も向上させることが出来る。The welding portions (3) and (3) of the connection terminals (12) (22) and (13) and (23) of the upper and lower capacitors (2) and (1) melt the plating and wet the molten solder. The molten solder, which is poor in property and rises along the plate surfaces of the connection terminals (12) and (22) due to surface tension, is prevented from rising at the position of the welded portion (3). However, the molten solder (5) is connected to the upper connection terminals (22, 23).
Crawls and solidifies along the inner edge of the notch (24) made at the tip of the. As a result, the coupling force between the capacitor unit (5) and the printed wiring board (4) can be increased, and the reliability of electrical conduction can be improved.
【００１２】従来の積み重ねコンデンサーユニット(50)
に較べて、上段コンデンサー(２)の接続用端子(22)(23)
に切欠(24)を施しておくだけで可く、この切欠(24)は、
プレス加工にて簡単且つ能率的にできる。Conventional stacked condenser unit (50)
Terminals for connection of the upper condenser (2) (22) (23)
It is only necessary to make a notch (24) in the
Easy and efficient by press working.
【００１３】[0013]
【発明の実施の形態】図１は２個のチップ型固体電解コ
ンデンサー(１)(２)を積み重ねた積み重ねコンデンサー
ユニット(５)を示している。チップ型固体電解コンデン
サー(１)(２)の内部構造については周知であるため、説
明は省略する。以下の説明において、下段のチップ型固
体電解コンデンサー(１)は下段コンデンサーと呼び、上
段のチップ型固体電解コンデンサー(２)は上段コンデン
サーと呼ぶ。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a stacked capacitor unit (5) in which two chip type solid electrolytic capacitors (1) and (2) are stacked. Since the internal structure of the chip-type solid electrolytic capacitors (1) and (2) is well known, the description is omitted. In the following description, the lower chip solid electrolytic capacitor (1) is referred to as a lower capacitor, and the upper chip solid electrolytic capacitor (2) is referred to as an upper capacitor.
【００１４】上下段のコンデンサー(２)(１)は、夫々略
長方形の樹脂製外殻(21)(11)の両端面の略中央部から帯
板状の接続用端子(22)(23)、(12)(13)を突設している。
下段コンデンサー(１)と上段コンデンサー(２)の底面の
大きさは略同じである。各端子は、42アロイ合金等の金
属基板の全面に、半田メッキ或いはパラジウム−金メッ
キを施して半田(５)との濡れ性を良くしている。The upper and lower capacitors (2) and (1) are connected to the strip-shaped connection terminals (22) and (23) from substantially the center of both end surfaces of the substantially rectangular resin shells (21) and (11), respectively. , (12) and (13).
The sizes of the bottom surfaces of the lower condenser (1) and the upper condenser (2) are substantially the same. Each terminal is subjected to solder plating or palladium-gold plating on the entire surface of a metal substrate such as a 42 alloy alloy to improve the wettability with the solder (5).
【００１５】下段コンデンサー(１)の接続用端子(12)(1
3)は、外殻(11)の端面(10)に沿って下向きに屈曲し、更
に外殻(11)の底面(15)に沿って内向きに屈曲している。
上段コンデンサー(２)の接続用端子(22)(23)は、突出基
端をから下向きに屈曲して前記下段コンデンサー(１)の
接続用端子(12)(13)に被さり、下段コンデンサー(１)の
底面近傍まで延びている。The connection terminals (12) (1) for connecting the lower condenser (1)
3) is bent downward along the end surface (10) of the outer shell (11), and further bent inward along the bottom surface (15) of the outer shell (11).
The connection terminals (22) and (23) of the upper condenser (2) are bent downward from the protruding base end to cover the connection terminals (12) and (13) of the lower condenser (1), and are connected to the lower condenser (1). ).
【００１６】上段コンデンサー(２)の接続用端子(22)(2
3)の夫々の先端部に切欠(24)が設けられる。実施例の切
欠(24)は、接続用端子(22)(23)の先端縁の中央部から該
端子(22)(23)の突出基端側に延び奥端が拡大している。The connection terminals (22) (2) for the upper condenser (2)
A cutout (24) is provided at each tip of 3). The notch (24) of the embodiment extends from the center of the distal end edge of the connection terminal (22) (23) to the protruding base end side of the terminal (22) (23), and the back end is enlarged.
【００１７】上段コンデンサー(２)の接続用端子(22)(2
3)の先端部、実施例では切欠(24)の細幅部の両側が下段
コンデンサー(１)の接続用端子(12)(13)に溶接される。
実施例ではレーザ溶接が実施される。溶接部(３)は、下
段コンデンサー(１)の接続用端子突出端面(10)との対向
位置に有る。切欠(24)の拡大奥端は溶接部(３)よりも上
段コンデンサー(２)側に位置している。The connection terminals (22) (2) for the upper condenser (2)
The tip of (3), in this embodiment, both sides of the narrow portion of the notch (24) are welded to the connection terminals (12, 13) of the lower condenser (1).
In the embodiment, laser welding is performed. The welding portion (3) is located at a position facing the connecting terminal protruding end surface (10) of the lower capacitor (1). The enlarged rear end of the notch (24) is located closer to the upper condenser (2) than the welded portion (3).
【００１８】然して、上記積み重ねコンデンサーユニッ
ト(５)をプリント配線基板(４)の所定位置に載せ、半田
付け固定する。この半田付けの際、下段コンデンサー
(１)の接続用端子(12)(13)に被さってプリント配線基板
(４)側へ延びた上段コンデンサー(２)の接続用端子(22)
(23)に表面張力によって溶融半田(５)が這い上がる。The stacked capacitor unit (5) is mounted on a predetermined position on the printed wiring board (4) and fixed by soldering. During this soldering, the lower capacitor
Printed wiring board over the connection terminals (12) and (13) of (1)
(4) Terminal for connecting the upper capacitor (2) extending to the side (22)
At (23), the molten solder (5) rises due to the surface tension.
【００１９】上下段のコンデンサー(２)(１)の接続用端
子(22)(12)、(23)(13)の溶接部(３)(３)は、表面のメッ
キが溶けて溶融半田との濡れ性が悪くなっており、表面
張力により接続用端子(12)(22)の板面を伝って這い上が
る溶融半田は、該溶接部(３)の位置で這い上がりは阻止
される。しかし、外側の接続用端子(22)(23)の先端部に
施した切欠(24)の内縁を伝って溶融半田(５)が切欠(24)
に侵入し、溶接部(３)よりも上段コンデンサー(２)側に
近い位置まで這い上がって固化する。これによってコン
デンサーユニット(５)とプリント配線基板(４)の結合力
を高めることが出来、電気的導通の信頼性も向上させる
ことが出来る。The welding portions (3) and (3) of the connection terminals (22) (12) and (23) and (13) of the upper and lower capacitors (2) and (1) are melted by plating on the surface to form molten solder. Of the molten solder that rises along the plate surfaces of the connection terminals (12) and (22) due to surface tension is prevented from rising at the position of the welded portion (3). However, the molten solder (5) runs along the inner edge of the notch (24) formed at the tip of the outer connection terminals (22) (23).
And crawls to a position closer to the upper condenser (2) side than the welded part (3) and solidifies. As a result, the coupling force between the capacitor unit (5) and the printed wiring board (4) can be increased, and the reliability of electrical conduction can be improved.
【００２０】従来の積み重ねコンデンサーユニット(５)
に較べて、上段コンデンサー(２)の接続用端子(22)(23)
に切欠(24)を施しておくだけで可く、この切欠(24)は、
プレス加工にて簡単且つ能率的に施すことができる。実
施例の様に、奥が拡大する切欠(24)であれば、半田(５)
との引っ掛かりが大きく、結合力も一層増す。Conventional stacked capacitor unit (5)
Terminals for connection of the upper condenser (2) (22) (23)
It is only necessary to make a notch (24) in the
It can be easily and efficiently applied by pressing. As in the embodiment, if the notch (24) has an enlarged depth, the solder (5)
And the binding force is further increased.
【００２１】図４、図５は、接続用端子(22)の先端部に
施す切欠(24)の他の実施例を示しており、図４の切欠(2
4)は、接続用端子(22)の先端縁の中央部から接続用端子
(22)の長手方向に沿って同じ幅で延びている。図５の切
欠(24)は、接続用端子(22)の長手方向の両端縁を溶接部
(３)より僅か高い位置(上段コンデンサー寄り)にて対向
して切り欠いたものである。図５の切欠(24)(14)の場
合、溶融半田は、接続用端子(22)の長手方向の両端縁を
這い上がって切欠(24)(14)に侵入する。FIGS. 4 and 5 show another embodiment of the notch (24) formed at the tip of the connection terminal (22).
4) is the connection terminal from the center of the tip edge of the connection terminal (22).
It extends at the same width along the longitudinal direction of (22). The notch (24) in FIG. 5 is formed by welding both ends of the connection terminal (22) in the longitudinal direction.
(3) Notched opposing at a slightly higher position (closer to the upper condenser). In the case of the notches (24) and (14) in FIG. 5, the molten solder crawls up both longitudinal edges of the connection terminal (22) and enters the notches (24) and (14).
【００２２】図６は、接続用端子(22)の先端を厚みが徐
々に薄くなる様に楔状に形成した他の実施例を示してい
る。楔状斜面(22a)によって溶融半田が這い上がり易く
なり、又、接続用端子(22)と半田との接合面積を大きく
できる効果がある。FIG. 6 shows another embodiment in which the tip of the connection terminal (22) is formed in a wedge shape so that the thickness is gradually reduced. The wedge-shaped slope (22a) has the effect of making it easier for the molten solder to creep up and increasing the bonding area between the connection terminal (22) and the solder.
【００２３】図７、図８は、３個のチップ型固体電解コ
ンデンサーを積み重ねた他の実施例の積み重ねコンデン
サーユニット搭載した電子機器配線基板を示している。
図７の場合、最上段のコンデンサー(６)の接続用端子(6
2)(63)は、中段のコンデンサー(２)の接続用端子(22)(2
3)の基端側にレーザ溶接され、中段のコンデンサー(２)
の接続用端子(22)(23)は、下段コンデンサー(１)の接続
用端子(12)(13)に被さってレーザ溶接されている。中段
コンデンサー(２)の接続用端子(22)(23)の先端に切欠
(図７では隠れて見えない)が施され、プリント配線基板
(４)に固定するための半田(５)が前記同様にして該切欠
に侵入して固化している。FIGS. 7 and 8 show an electronic device wiring board on which a stacked capacitor unit according to another embodiment in which three chip-type solid electrolytic capacitors are stacked.
In the case of FIG. 7, the connection terminal (6
2) and (63) are the connection terminals (22) and (2) for the middle condenser (2).
Laser welded to the base end of 3), middle condenser (2)
The connection terminals (22) and (23) are laser-welded over the connection terminals (12) and (13) of the lower condenser (1). Notch at the end of the connection terminals (22) and (23) for the middle condenser (2)
(Hidden and invisible in Figure 7)
Solder (5) for fixing to (4) penetrates into the notch and is solidified in the same manner as described above.
【００２４】図８の積み重ねコンデンサーユニットは、
中段のコンデンサー(２)の接続用端子(22)(23)及び最上
段のコンデンサー(６)の接続用端子(62)(63)が下段コン
デンサー(１)の接続用端子(12)(13)に被さっており、最
上段のコンデンサー(６)の接続用端子(62)(63)の先端部
に切欠(図８では隠れて見えない)が施され、プリント配
線基板(４)に固定するための半田(５)が前記同様にして
該切欠に侵入して固化している。The stacked condenser unit of FIG.
The connection terminals (22) and (23) for the middle capacitor (2) and the connection terminals (62) and (63) for the top capacitor (6) are the connection terminals (12) and (13) for the lower capacitor (1). A notch (hidden and invisible in FIG. 8) is provided at the tip of the connection terminals (62) and (63) of the uppermost capacitor (6) to fix it to the printed wiring board (4). Of the solder (5) penetrates into the notch and solidifies in the same manner as described above.
【００２５】チップ型固体電解コンデンサーを４個以上
積み重ねて積み重ねコンデンサーユニットを構成する場
合でも、先端に切欠を施した接続用端子の該切欠が外部
に露出する様にし、半田が該切欠に侵入可能とすれば可
い。Even when four or more chip-type solid electrolytic capacitors are stacked to form a stacked capacitor unit, the notch of the connection terminal having a notch at the tip is exposed to the outside so that solder can enter the notch. It is possible.
【００２６】本発明は、上記実施例の構成に限定される
ことはなく、特許請求の範囲に記載の範囲で種々の変形
が可能である。The present invention is not limited to the configuration of the above embodiment, and various modifications can be made within the scope of the claims.
【図１】積み重ねコンデンサーユニットの正面図であ
る。FIG. 1 is a front view of a stacked condenser unit.
【図２】同上の側面図である。FIG. 2 is a side view of the same.
【図３】同上の斜面図である。FIG. 3 is a perspective view of the same.
【図４】接続用端子に施した切欠の第２実施例の正面図
である。FIG. 4 is a front view of a second embodiment of a cutout made in a connection terminal.
【図５】接続用端子に施した切欠の第３実施例の正面図
である。FIG. 5 is a front view of a third embodiment of a cutout made in a connection terminal.
【図６】接続用端子りの先端を楔状に形成した他の実施
例の説明図である。FIG. 6 is an explanatory view of another embodiment in which the tip of the connection terminal is formed in a wedge shape.
【図７】３個のチップ型固体電解コンデンサーを積み重
ねた積み重ねコンデサーユニットの正面図である。FIG. 7 is a front view of a stacked capacitor unit in which three chip-type solid electrolytic capacitors are stacked.
【図８】３個のチップ型固体電解コンデンサーを積み重
ねた積み重ねコンデサーユニットの第２実施例の正面図
である。FIG. 8 is a front view of a second embodiment of a stacked capacitor unit in which three chip-type solid electrolytic capacitors are stacked.
【図９】チップ型固体電解コンデンサーとプリント配線
基板の良好な半田付け状態の説明図である。FIG. 9 is an explanatory diagram of a good soldering state between the chip-type solid electrolytic capacitor and the printed wiring board.
【図１０】積み重ねコンデンサーユニットとプリント配
線基板の半田付け不良状態の説明図である。FIG. 10 is an explanatory diagram of a defective soldering state between the stacked capacitor unit and the printed wiring board.
(１) チップ型固体電解コンデンサー (11) 外殻 (12) 接続用端子 (13) 接続用端子 (24) 切欠 (２) チップ型固体電解コンデンサー (21) 外殻 (22) 接続用端子 (23) 接続用端子 (３) 溶接部 (４) プリント配線基板 (５) 半田 (1) Chip type solid electrolytic capacitor (11) Outer shell (12) Connection terminal (13) Connection terminal (24) Notch (2) Chip type solid electrolytic capacitor (21) Outer shell (22) Connection terminal (23 ) Connection terminal (3) Welded part (4) Printed wiring board (5) Solder
Claims (5)
続用端子(22)(23)の先端部に切欠(24)を設けたチップ型
固体電解コンデンサー。1. A chip type solid electrolytic capacitor in which a notch (24) is provided at the tip of a strip-shaped connection terminal (22) (23) protruding from a resin outer shell (21).
央部に施されている請求項１に記載のチップ型固体電解
コンデンサー。2. The chip-type solid electrolytic capacitor according to claim 1, wherein the notch (24) is formed at the center of the tip of the connection terminal (22) (23).
に薄くなる様に楔状に形成されている請求項１又は２に
記載のチップ型固体電解コンデンサー。3. The chip-type solid electrolytic capacitor according to claim 1, wherein the tips of the connection terminals (22) and (23) are formed in a wedge shape so that the thickness gradually decreases.
電解コンデンサー(２)が２段目以上の高さに位置する様
に複数のチップ型固体電解コンデンサー(１)(２)を積み
上げ、夫々対応する接続用端子(12)(22)、(13)(23)を溶
接により接続した積み重ねコンデンサーにおいて、前記
切欠(24)が外部に露出している積み重ねコンデンサーユ
ニット。4. A plurality of chip-type solid electrolytic capacitors (1) and (2) are stacked so that the chip-type solid electrolytic capacitors (2) according to any one of claims 1 to 3 are positioned at the second or higher level. A stacked capacitor unit in which the notch (24) is exposed to the outside in a stacked capacitor in which the corresponding connection terminals (12) (22) and (13) (23) are respectively connected by welding.
ト(５)がプリント配線基板(４)に半田付けされ、半田
(５)は接続用端子(22)(23)の先端切欠(24)に侵入して固
化している電子機器配線基板。5. The stacked capacitor unit (5) according to claim 4, which is soldered to a printed wiring board (4).
(5) is an electronic device wiring board that has penetrated into the notch (24) of the connection terminals (22) and (23) and is solidified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001073266A JP4233233B2 (en) | 2001-03-15 | 2001-03-15 | Chip type solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001073266A JP4233233B2 (en) | 2001-03-15 | 2001-03-15 | Chip type solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002280263A true JP2002280263A (en) | 2002-09-27 |
| JP4233233B2 JP4233233B2 (en) | 2009-03-04 |
Family
ID=18930719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001073266A Expired - Fee Related JP4233233B2 (en) | 2001-03-15 | 2001-03-15 | Chip type solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4233233B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6949815B2 (en) * | 2000-11-28 | 2005-09-27 | Nec Corporation | Semiconductor device with decoupling capacitors mounted on conductors |
| US7161796B2 (en) | 2002-07-18 | 2007-01-09 | Kemet Electronics Corporation | Surface-mountable component and method for the production thereof |
| JP2012243999A (en) * | 2011-05-20 | 2012-12-10 | Canon Inc | Component mounting method and substrate |
-
2001
- 2001-03-15 JP JP2001073266A patent/JP4233233B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6949815B2 (en) * | 2000-11-28 | 2005-09-27 | Nec Corporation | Semiconductor device with decoupling capacitors mounted on conductors |
| US7161796B2 (en) | 2002-07-18 | 2007-01-09 | Kemet Electronics Corporation | Surface-mountable component and method for the production thereof |
| JP2012243999A (en) * | 2011-05-20 | 2012-12-10 | Canon Inc | Component mounting method and substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4233233B2 (en) | 2009-03-04 |
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