JP2002120091A - Manufacturing method of solder alloy superfine particle and manufacturing method of solder paste - Google Patents
Manufacturing method of solder alloy superfine particle and manufacturing method of solder pasteInfo
- Publication number
- JP2002120091A JP2002120091A JP2000313634A JP2000313634A JP2002120091A JP 2002120091 A JP2002120091 A JP 2002120091A JP 2000313634 A JP2000313634 A JP 2000313634A JP 2000313634 A JP2000313634 A JP 2000313634A JP 2002120091 A JP2002120091 A JP 2002120091A
- Authority
- JP
- Japan
- Prior art keywords
- solder alloy
- ultrafine
- resistant belt
- transport position
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、融点を下げることが可
能な鉛フリー（無鉛）のハンダ合金超微粒子の製造方法
及びハンダペーストの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing lead-free (lead-free) ultrafine solder alloy particles capable of lowering the melting point and a method for producing a solder paste.
【０００２】[0002]
【従来の技術】ハンダ付けにはいわゆるリフロー方式と
フロー式がある。リフロー方式は、一般にハンダ合金粒
子とフラックスを混合したペースト状のものを塗布加熱
してハンダ接合するものである。フロー方式は、ハンダ
溶融槽で溶解したハンダを噴流させるなどして利用する
ものである。これらのハンダ付け方式に応じて、またハ
ンダ付けを行う電子部品の種類や要求される製品の信頼
性等に応じて、使用されるハンダ合金は種々異なってい
る。2. Description of the Related Art Soldering includes a so-called reflow method and a flow method. In the reflow method, generally, a paste in which solder alloy particles and flux are mixed is applied and heated to perform solder joining. In the flow method, the solder melted in a solder melting tank is jetted and used. Various solder alloys are used depending on the soldering method, the type of electronic component to be soldered, the required product reliability, and the like.
【０００３】一般的に用いられているハンダ合金は、融
点が低く、ハンダ付け時の加熱温度が低く、実装基板や
電子部品等に熱的悪影響を与えないものが主流である。
その金属成分は例えばＳｎ６０／Ｐｂ４０やＳｎ７０／
Ｐｂ３０などで、融点は１８３℃〜１９３℃前後であ
り、比較的低い温度でのハンダ付けが可能である。[0003] In general, solder alloys generally used have a low melting point, a low heating temperature at the time of soldering, and do not adversely affect the mounting board, electronic components and the like.
The metal component is, for example, Sn60 / Pb40 or Sn70 /
Pb30 or the like has a melting point of about 183 ° C. to 193 ° C., and can be soldered at a relatively low temperature.
【０００４】ところで、最近では、環境対策の観点か
ら、産業界に対し鉛を用いない鉛フリーのハンダ合金が
要求され、実用化が図られている。例えば、Ｓｎ９６．
５／Ａｇ３．５などのように融点が２２１℃前後のＳ
ｎ、Ａｇなどを主成分とした合金がある。[0004] Recently, from the viewpoint of environmental measures, a lead-free solder alloy that does not use lead has been demanded from the industry, and its practical use has been attempted. For example, Sn96.
5 / Sg with melting point of about 221 ° C such as Ag3.5
There is an alloy mainly containing n, Ag, or the like.
【０００５】ところが、この鉛フリーのハンダ合金は、
上記したＳｎ／Ｐｂ系ハンダ合金と比較して融点が４０
℃前後も高く、その分ハンダ付け温度を高くする必要が
あり、実装基板や電子部品に与える熱的悪影響が懸念さ
れる場合があった。また、ハンダ付け温度が高くなる
と、ハンダ付け時の電子部品や実装基板配線の酸化防止
の観点から、雰囲気ガスの制御がより厳格になる。However, this lead-free solder alloy is
The melting point is 40 compared with the above-mentioned Sn / Pb-based solder alloy.
° C, the soldering temperature needs to be increased accordingly, and there is a case where there is a concern about adverse thermal effects on the mounting board and electronic components. In addition, when the soldering temperature increases, the control of the atmosphere gas becomes stricter from the viewpoint of preventing oxidation of the electronic components and the wiring of the mounting board at the time of soldering.
【０００６】そこで、ハンダ合金の融点を下げる一手法
として、ハンダ合金の成分は変えないで、ハンダ合金を
超微粒子化して融点を下げるという工夫が考えられた。
一般的にハンダペースト中に混合されペースト状で実装
基板の接合部に塗布されるタイプのハンダ合金の粒子径
は数μｍ〜数１０μｍ程度であるが、超微粒子化して融
点を下げる場合にはこれより更に微細化される。Therefore, as one method of lowering the melting point of the solder alloy, a method of reducing the melting point by making the solder alloy into ultrafine particles without changing the components of the solder alloy has been considered.
Generally, the particle size of a solder alloy mixed in a solder paste and applied to a joint of a mounting board in the form of a paste is about several μm to several tens μm. It is further miniaturized.
【０００７】固体を分割して小さくしていくと、原子、
分子にいたる前にもとの固体とは異なる性質を示すこと
が判明しており、粒径が２ｎｍ〜８００ｎｍ程度の超微
粒子になると、固体としての性質と異なる性質になるこ
とが判明している。すなわち、表面積が体積に比べて大
きくなり、材料の表面状態がその性質に大きな影響を与
えることとなって、その性質は表面積の小さな従来の粒
径の大きな材料と著しく異なってくる（表面効果）。ま
た、小さな材料内にある電子は、そこから出られなくな
るため３次元方向の空間を自由に動き回れなくなり、電
子のエネルギーが連続ではなくなって、そのエネルギー
が領域のサイズとともに変化することが知られている
（量子サイズ効果）。When a solid is divided into smaller pieces, atoms,
Before reaching the molecule, it has been found that it exhibits properties different from those of the original solid, and it has been found that ultrafine particles having a particle size of about 2 nm to 800 nm have properties different from those of the solid. . That is, the surface area becomes larger than the volume, and the surface condition of the material greatly affects its properties, and the properties are significantly different from those of conventional materials having a small surface area and a large particle size (surface effect). . Also, it is known that electrons in a small material cannot escape from there, and cannot move freely in a three-dimensional space, so that the energy of electrons is not continuous and the energy changes with the size of the region. (Quantum size effect).
【０００８】このように固体が超微粒子化すると、より
充填密度が高くよりコンパクトになるように原子の配列
が変化して結晶構造に変化が生じ、材料の性質も固体と
は異なることになる。そして、金属の超微粒子では、バ
ルクな物質よりもその融点が低下し、しかもその融点は
サイズが小さくなるほど低下することが多くの金属で確
認されている。When the solid is converted into ultrafine particles, the arrangement of atoms is changed so that the packing density is higher and the size is more compact, and the crystal structure is changed, and the properties of the material are different from those of the solid. It has been confirmed for many metals that the melting point of ultrafine metal particles is lower than that of a bulk substance, and that the melting point decreases as the size decreases.
【０００９】この金属の超微粒子を生成する方法として
は、従来では、金属塩溶液の加水分解による方法、金属
アルコキシドをアルコール中で加水分解する方法、金属
塩溶液の酸化還元による方法、金属化合物の分解反応を
利用する方法などのように反応相を液相として合成する
方法や、エアロゾル法などのように反応相を気相として
合成する方法が知られている。Conventionally, methods for producing ultrafine metal particles include a method of hydrolyzing a metal salt solution, a method of hydrolyzing a metal alkoxide in alcohol, a method of redoxing a metal salt solution, and a method of forming a metal compound. A method of synthesizing a reaction phase as a liquid phase such as a method utilizing a decomposition reaction and a method of synthesizing a reaction phase as a gas phase such as an aerosol method are known.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、このよ
うな相反応を液相として合成したり、気相として合成す
る手法はその処理が複雑であるばかりか、連続的な製造
方法とすることができず、量産性に欠けていた。However, the method of synthesizing such a phase reaction as a liquid phase or as a gas phase is not only complicated in processing but also can be a continuous production method. And lacked mass productivity.
【００１１】本発明は、上記の問題を解決するためにな
されたもので、その目的は、容易かつ連続的に所望の組
成の超微粒子を製造することができ、量産性を実現でき
るようにした鉛フリーのハンダ合金超微粒子の製造方法
及びこれを利用したハンダペーストの製造方法を提供す
ることである。The present invention has been made to solve the above problems, and an object of the present invention is to make it possible to easily and continuously produce ultrafine particles having a desired composition, thereby realizing mass productivity. An object of the present invention is to provide a method for producing ultrafine lead-free solder alloy particles and a method for producing a solder paste using the same.
【００１２】[0012]
【課題を解決するための手段】上記課題を解決するため
に、本発明のハンダ合金超微粒子の製造方法は、間欠的
に一定方向に搬送される絶縁耐熱性ベルト上に第１搬送
位置でハンダ合金成分を構成する所定種類の金属の薄層
を１つの島状に積層する第１工程と、上記絶縁耐熱性ベ
ルトの第２搬送位置で上記積層及び上記絶縁耐熱性ベル
トの上記積層部分を帯電させる第２工程と、上記絶縁耐
熱性ベルトの第３搬送位置で上記積層を加熱溶融して溶
融ハンダ合金超微粒子を生成する第３工程と、上記絶縁
耐熱性ベルトの第４搬送位置で上記溶融ハンダ合金超微
粒子の静電気を除去し上記絶縁耐熱性ベルトから剥離し
てハンダ合金超微粒子を形成する第４工程と、上記絶縁
耐熱性ベルトの第５搬送位置で上記ハンダ合金超微粒子
を回収する第５工程と、を有するよう構成した。In order to solve the above-mentioned problems, a method for producing ultrafine solder alloy particles according to the present invention comprises the steps of: providing a solder at a first transport position on an insulating heat-resistant belt which is transported intermittently in a fixed direction; A first step of laminating a thin layer of a predetermined type of metal constituting an alloy component into one island, and charging the lamination and the lamination portion of the insulating and heat resistant belt at a second transport position of the insulating and heat resistant belt A second step of causing the laminate to be heated and melted at a third transfer position of the insulating heat-resistant belt to generate molten solder alloy ultrafine particles; and a second step of forming the molten heat-resistant belt at the fourth transfer position. A fourth step of removing the static electricity of the solder alloy ultrafine particles and peeling the solder alloy ultrafine particles from the insulating heat resistant belt to form solder alloy ultrafine particles; and a fourth step of collecting the solder alloy ultrafine particles at a fifth transport position of the insulating heat resistant belt. 5 workers If, and configured to have a.
【００１３】第２の発明は、第１の発明において、上記
ハンダ合金超微粒子を構成する所定種類の金属が、Ａ
ｇ、Ｓｎ、Ｃｕ、Ｂｉ、Ｉｎ、Ｓｂの内から選択した２
以上の組み合わせから成るよう構成した。According to a second aspect, in the first aspect, the predetermined type of metal constituting the ultrafine solder alloy particles is A
2 selected from g, Sn, Cu, Bi, In, and Sb
It comprised so that it might consist of the above combinations.
【００１４】第３の発明は、第１又は第２の発明におい
て、上記絶縁耐熱性ベルトに代えて絶縁耐熱性平板を使
用し、該絶縁耐熱性平板を前記第１搬送位置に搬送して
前記第１工程を、前記第２搬送位置に搬送して前記第２
工程を、前記第３搬送位置に搬送して前記第３工程を、
前記第４搬送位置に搬送して前記第４工程を、前記第５
搬送位置に搬送して前記第５工程を順次処理するよう構
成した。According to a third aspect of the present invention, in the first or second aspect, an insulating heat-resistant flat plate is used in place of the insulating heat-resistant belt, and the insulating heat-resistant flat plate is transported to the first transport position, and Transporting the first step to the second transport position and
Transporting the process to the third transport position and performing the third process,
Transporting to the fourth transport position and performing the fourth step in the fifth
The fifth step is sequentially processed by being transported to the transport position.
【００１５】第４の発明のハンダペーストの製造方法
は、第１乃至第３の発明のいずれか１つの発明におい
て、請求項１乃至３のいずれかに記載の上記第５工程で
回収したハンダ合金超微粒子をハンダフラックス中に混
合させる第６工程を有するよう構成した。According to a fourth aspect of the present invention, there is provided a method of manufacturing a solder paste according to any one of the first to third aspects, wherein the solder alloy recovered in the fifth step according to any one of the first to third aspects. A sixth step of mixing the ultrafine particles into the solder flux was provided.
【００１６】[0016]
【発明の実施の形態】鉛フリーのハンダ合金としては、
Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ａｇ−Ｂｉ−Ｃｕ系、Ｓｎ
−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ｉｎ
系、Ｓｎ−Ｓｂ系、Ｂｉ−Ｉｎ系、Ｃｕ−Ｂｉ系などが
使用されているが、そのハンダ合金粒子径は、通常１０
μｍ前後以上の５０μｍや８０μｍの大きさであり、前
記したように融点が高かった。本発明では、リフロー方
式のハンダ用として、粒径が０．５μｍ以下のハンダ合
金超微粒子を製造する。本発明の製造方法によれば、容
易にかつ連続的にハンダ合金超微粒子を生成できるの
で、量産性に向く。また、このような粒径のハンダ合金
超微粒子は従来の鉛フリーのハンダ合金の融点の１／３
程度と低融点の性質を呈するので、ハンダ付け時の加熱
温度を低下させ、基板や電子部品等の被加熱物に対する
熱的悪影響が排除できる。以下、詳しく説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS As a lead-free solder alloy,
Sn-Ag-Cu system, Sn-Ag-Bi-Cu system, Sn
-Ag system, Sn-Cu system, Sn-Bi system, Sn-In
System, Sn-Sb system, Bi-In system, Cu-Bi system, etc. are used.
The size was 50 μm or 80 μm, which was about μm or more, and the melting point was high as described above. In the present invention, ultrafine solder alloy particles having a particle size of 0.5 μm or less are manufactured for reflow soldering. According to the production method of the present invention, ultrafine solder alloy particles can be easily and continuously generated, which is suitable for mass production. Further, the ultrafine particles of the solder alloy having such a particle size are １ ／ of the melting point of the conventional lead-free solder alloy.
Since the material has a degree and low melting point, the heating temperature at the time of soldering can be lowered, and a bad thermal effect on a heated object such as a substrate or an electronic component can be eliminated. The details will be described below.
【００１７】図１は本発明のハンダ合金超微粒子の製造
方法の説明図である。図１において、１はポリイミド樹
脂等より形成されたエンドレスの絶縁耐熱性ベルト、２
は図示しない真空チャンバー部を有する金属蒸着機構
部、３はコロナ放電機構部、４は加熱プレート部、５は
静電気除去機構を備えた超音波振動機構部、６はベルト
送り機構部、７は生成したハンダ合金超微粒子を回収す
る回収部である。FIG. 1 is an explanatory view of a method for producing ultrafine solder alloy particles of the present invention. In FIG. 1, reference numeral 1 denotes an endless insulating heat-resistant belt formed of a polyimide resin or the like;
Is a metal deposition mechanism having a vacuum chamber (not shown), 3 is a corona discharge mechanism, 4 is a heating plate, 5 is an ultrasonic vibration mechanism with a static electricity removing mechanism, 6 is a belt feed mechanism, and 7 is a generator. This is a recovery unit for recovering the solder alloy ultrafine particles.
【００１８】これらの金属蒸着機構部２、コロナ放電機
構部３、加熱プレート部４、超音波振動機構部５は、絶
縁性耐熱ベルト１の矢印Ａで示す移動方向の上流から下
流にかけて所定の間隔Ｄで順次配置され、その絶縁性耐
熱ベルト１はその間隔Ｄだけ移動して一旦停止するよう
間欠的に駆動制御される。The metal vapor deposition mechanism 2, corona discharge mechanism 3, heating plate 4, and ultrasonic vibration mechanism 5 are arranged at predetermined intervals from upstream to downstream in the direction of movement of the insulating heat-resistant belt 1 as indicated by arrow A. D, the insulating heat-resistant belt 1 is intermittently driven and controlled to move by the interval D and temporarily stop.
【００１９】さて、その絶縁耐熱性ベルト１が停止して
いるとき（第１搬送位置）に、まず、金属蒸着機構部２
において、絶縁耐熱性ベルト１上にハンダ合金成分を構
成する数種類の金属薄層からなる独立した島状の積層を
蒸着により形成する（第１工程）。このときの積層は、
共晶合金となる所定の割合に設定して行う。例えばＳｎ
を５００オングストローム、Ａｇを１０オングストロー
ムを各々積層する。When the insulating heat-resistant belt 1 is stopped (first transport position), first, the metal vapor deposition mechanism 2
In step (1), independent island-shaped laminations composed of several types of thin metal layers constituting a solder alloy component are formed on the insulating heat-resistant belt 1 by vapor deposition (first step). The lamination at this time is
The eutectic alloy is set at a predetermined ratio. For example, Sn
500 Å and Ag 10 Å.
【００２０】次に、絶縁耐熱性ベルト１を距離ＤだけＡ
方向に移動させる（第２搬送位置）と、金属蒸着機構部
２で形成した島状の積層がコロナ放電機構部３に送り込
まれるので、そこで絶縁耐熱性ベルト１を一旦停止させ
て、その絶縁耐熱製ベルト１及び積層の部分にコロナ放
電により静電気を帯電させる（第２工程）。コロナ帯電
の方法は、帯電させるべき表面（積層の表面と絶縁耐熱
性ベルト１の裏面）に対して所定の間隙をおいてステン
レス細線やタングステン細線などを対置し、その細線に
所要の極性で４〜８ｋＶの直流高電庄を加えてコロナ放
電を行い、表面に電荷密度１０-4〜１０-3Ｃ／ｍ2程度
の電荷を帯電させる。Next, the insulating heat-resistant belt 1 is moved by a distance D to A.
(The second transport position), the island-shaped laminate formed by the metal vapor deposition mechanism 2 is fed into the corona discharge mechanism 3, whereupon the insulation heat-resistant belt 1 is temporarily stopped and the insulation heat resistance belt 1 is stopped. Static electricity is charged by corona discharge to the belt 1 and the layered portion (second step). In the corona charging method, a stainless fine wire or a tungsten fine wire is placed at a predetermined gap from the surface to be charged (the surface of the laminate and the back surface of the insulating heat-resistant belt 1), and the fine wire has a required polarity. Corona discharge is performed by applying a DC high voltage of ８8 kV to charge the surface with a charge having a charge density of about 10 −4 to 10 −3 C / m 2 .
【００２１】次に、同様に絶縁耐熱性ベルト１を距離Ｄ
だけＡ方向に移動させる（第３搬送位置）と、静電気を
帯電した積層が加熱プレート部４に送り込まれるので、
そこで絶縁耐熱性ベルト１を一旦停止させて、当該帯電
した積層をバルクでの共晶溶融温度よりやや高い２３０
℃程度の温度で加熱溶融させる。このとき、積層は共晶
合金となる所定の割合に設定して形成されているので、
容易に溶融し、かつ、帯電した静電気の作用で相互に反
発し合い、溶融状態のハンダ合金の超微粒子となる（第
３工程）。このようにハンダ合金超微粒子８が溶融状態
で互いに反発している状態を図２に示した。Next, the insulating heat-resistant belt 1 is similarly moved to the distance D
Only in the direction A (third transport position), the layer charged with static electricity is sent to the heating plate unit 4.
Therefore, the insulation heat-resistant belt 1 is temporarily stopped, and the charged laminate is heated to a temperature slightly higher than the eutectic melting temperature 230 in the bulk.
Heat and melt at a temperature of about ° C. At this time, since the lamination is set at a predetermined ratio to be a eutectic alloy,
They are easily melted and repel each other by the action of the charged static electricity, and become ultrafine particles of a molten solder alloy (third step). FIG. 2 shows a state in which the solder alloy ultrafine particles 8 repel each other in a molten state.
【００２２】更に、同様に絶縁耐熱性ベルト１を距離Ｄ
だけＡ方向に移動させる（第４搬送位置）と、溶融状態
態になったハンダ合金超微粒子が次の超音波振動機構部
５に送り込まれるので、そこで絶縁耐熱性ベルト１を一
旦停止させ、自然又は強制冷却により固体状化させると
ともに、静電気除去機構を作動させて各超微粒子及び絶
縁耐熱性ベルト１に帯電した静電気を除去する。静電気
を除去されたハンダ合金超微粒子は、超音波振動が印加
されることにより絶縁耐熱性ベルト１より容易に剥離す
る（第４工程）。Further, the insulating heat-resistant belt 1 is similarly moved to the distance D
Is moved in the direction A (fourth transport position), the ultrafine solder alloy particles in the molten state are sent to the next ultrasonic vibration mechanism 5, where the insulating heat-resistant belt 1 is temporarily stopped, and Alternatively, it is solidified by forced cooling, and the static electricity removing mechanism is operated to remove static electricity charged on each ultrafine particle and the insulating heat-resistant belt 1. The ultrafine solder alloy particles from which the static electricity has been removed are easily separated from the insulating heat-resistant belt 1 by applying ultrasonic vibration (fourth step).
【００２３】更に、同様に絶縁耐熱性ベルト１を距離Ｄ
だけＡ方向に移動させる（第５搬送位置）と、そのハン
ダ合金超微粒子は、回収部７に設けたブラシ（図示せ
ず）により剥離されて落下し、そこに回収される（第５
工程）。Further, similarly, the insulating heat-resistant belt 1 is moved to the distance D.
Is moved in the direction A (fifth transport position), the solder alloy ultrafine particles are peeled off by a brush (not shown) provided in the recovery unit 7, fall, and are recovered there (fifth position).
Process).
【００２４】以上のように、エンドレスの絶縁耐熱性ベ
ルト１を間欠駆動し、距離Ｄだけ移動して一旦停止させ
る毎に、金属蒸着機構部２、コロナ放電機構部３、加熱
プレート部４、超音波振動機構部５の各処理部分での同
時処理を繰り返すことによって、ハンダ合金超微粒子が
連続的に形成されて回収されることになる。As described above, every time the endless insulated heat-resistant belt 1 is intermittently driven, moved by the distance D and once stopped, the metal vapor deposition mechanism 2, the corona discharge mechanism 3, the heating plate 4, By repeating the simultaneous processing in each processing part of the sonic vibration mechanism 5, the solder alloy ultrafine particles are continuously formed and collected.
【００２５】回収部７に回収されたハンダ合金超微粒子
は、そのままでは互いにくっつき合うが、液体中に懸濁
させて遠心分離器（図示せず）に投入することにより、
非常に小さい超微粒子と比較的粒径の大きい微粒子とに
分離することができ、超微粒子を選別できる。また、そ
のハンダ合金超微粒子はそのままでは酸化しやすいが、
液状フラックス中に混合懸濁して遠心分離することによ
り、超微粒子がフラックスで表面をコーティングされた
ハンダペーストを作ることができる（第６工程）。Although the solder alloy ultrafine particles collected in the collecting section 7 stick to each other as they are, they are suspended in a liquid and put into a centrifuge (not shown).
Ultrafine particles can be separated into very small ultrafine particles and relatively large fine particles, and ultrafine particles can be sorted out. Also, the ultrafine solder alloy particles are easily oxidized as they are,
By mixing and suspending in a liquid flux and centrifuging, a solder paste in which the ultrafine particles are coated on the surface with the flux can be produced (sixth step).
【００２６】以上において、金属蒸着薄層の積層厚さと
コロナ放電による静電気帯電量とを制御することによ
り、ハンダ合金超微粒子のサイズを制御することが可能
である。上述のハンダ合金の蒸着薄層では、０．５μｍ
以下程度の超微粒子の生成が可能である。In the above, it is possible to control the size of the ultrafine solder alloy particles by controlling the thickness of the metal-deposited thin layer and the amount of electrostatic charge by corona discharge. 0.5μm
The generation of the following ultrafine particles is possible.
【００２７】なお、上記の説明では、金属薄層の積層を
形成する基体としてエンドレスの絶縁耐熱性ベルト１を
使用したが、例えばポリイミド樹脂等より形成された所
定サイズの絶縁耐熱性平板を間欠送りできる搬送装置に
組み込み、上記の絶縁耐熱性ベルト１と同様に、絶縁耐
熱性平板上にて金属蒸着、コロナ放電による帯電、加熱
溶融、静電気除去／超音波振動を順次行ってハンダ合金
超微粒子を生成／剥離／回収することでも可能であるこ
とはいうまでもない。また、Ａｇ、Ｓｎ、Ｃｕ、Ｂｉ、
Ｉｎ、Ｓｂの内から選択した２以上の蒸着する金属の組
成、蒸着層の厚さ、加熱温度などを変更することで、所
望の組成のハンダ合金超微粒子を得ることができる。In the above description, the endless insulative heat-resistant belt 1 is used as a base for forming a laminate of thin metal layers. However, an insulative heat-resistant flat plate of a predetermined size made of, for example, polyimide resin is intermittently fed. In the same manner as the above-mentioned insulating heat-resistant belt 1, metal vapor deposition, charging by corona discharge, heating and melting, static electricity removal / ultrasonic vibration are sequentially performed on the insulating heat-resistant flat plate to remove solder alloy ultrafine particles. It goes without saying that it is also possible to generate / peel / collect. Ag, Sn, Cu, Bi,
By changing the composition of two or more metals to be deposited selected from In and Sb, the thickness of the deposited layer, the heating temperature, and the like, it is possible to obtain ultrafine solder alloy particles having a desired composition.
【００２８】[0028]
【発明の効果】以上から本発明によれば、容易に連続的
に所望の組成のハンダ合金超微粒子を生成することがで
き、融点の低い超微粒子ハンダ合金を量産することが可
能となる。これにより、いわゆる鉛フリーハンダにおい
ても容易に低融点のものを得ることができ、ハンダ付け
温度の上昇が不要になり、被加熱物への熱的悪影響を低
減することが可能となる。更に、信頼性を要求される装
置に適用が要求される鉛フリーハンダの実用化が容易に
なるという利点もある。As described above, according to the present invention, it is possible to easily and continuously produce ultrafine solder alloy particles having a desired composition and mass-produce ultrafine solder alloys having a low melting point. As a result, a so-called lead-free solder having a low melting point can be easily obtained, and it is not necessary to raise the soldering temperature, and it is possible to reduce the adverse thermal effect on the object to be heated. Further, there is an advantage that the practical use of lead-free solder which is required to be applied to a device requiring reliability is facilitated.
【図１】本発明のハンダ合金超微粒子の製造方法の説明
図である。FIG. 1 is an explanatory view of a method for producing ultrafine solder alloy particles of the present invention.
【図２】本発明のハンダ合金超微粒子の反発状態の説明
図である。FIG. 2 is an explanatory view of a repulsive state of the solder alloy ultrafine particles of the present invention.
１：絶縁耐熱性ベルト、２：金属蒸着機構部、３：コロ
ナ放電機構部、４：加熱プレート部、５：超音波振動機
構部、６：ベルト送り機構部、７：超微粒子回収部、
８：ハンダ合金超微粒子。1: Insulating heat-resistant belt, 2: Metal deposition mechanism, 3: Corona discharge mechanism, 4: Heating plate, 5: Ultrasonic vibration mechanism, 6: Belt feed mechanism, 7: Ultrafine particle collection section,
8: Ultrafine solder alloy particles.
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 3/34 ５１２ Ｈ０５Ｋ 3/34 ５１２Ｃ Ｆターム(参考） 4K017 AA04 BA01 BA02 BA05 BA10 CA01 DA09 EA13 EF10 EK08 FA04 FA29 5E319 BB01 BB08 BB10 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) H05K 3/34 512 H05K 3/34 512C F term (reference) 4K017 AA04 BA01 BA02 BA05 BA10 CA01 DA09 EA13 EF10 EK08 FA04 FA29 5E319 BB01 BB08 BB10
Claims (4)
ベルト上に第１搬送位置でハンダ合金成分を構成する所
定種類の金属の薄層を１つの島状に積層する第１工程
と、上記絶縁耐熱性ベルトの第２搬送位置で上記積層及
び上記絶縁耐熱性ベルトの上記積層部分を帯電させる第
２工程と、 上記絶縁耐熱性ベルトの第３搬送位置で上記積層を加熱
溶融して溶融ハンダ合金超微粒子を生成する第３工程
と、 上記絶縁耐熱性ベルトの第４搬送位置で上記溶融ハンダ
合金超微粒子の静電気を除去し上記絶縁耐熱性ベルトか
ら剥離してハンダ合金超微粒子を形成する第４工程と、 上記絶縁耐熱性ベルトの第５搬送位置で上記ハンダ合金
超微粒子を回収する第５工程と、を有することを特徴と
するハンダ合金超微粒子の製造方法。A first step of laminating a thin layer of a predetermined type of metal constituting a solder alloy component in an island shape on an insulating heat-resistant belt conveyed intermittently in a certain direction; A second step of charging the laminated portion and the laminated portion of the insulating and heat resistant belt at a second transport position of the insulating and heat resistant belt; and heating and melting the laminated portion at a third transport position of the insulating and heat resistant belt. A third step of generating molten solder alloy ultrafine particles; and removing the static electricity of the molten solder alloy ultrafine particles at the fourth transport position of the insulating heat resistant belt and peeling off the insulating heat resistant belt to form solder alloy ultrafine particles. And a fifth step of collecting the ultrafine solder alloy particles at a fifth transport position of the insulating heat-resistant belt.
類の金属が、Ａｇ、Ｓｎ、Ｃｕ、Ｂｉ、Ｉｎ、Ｓｂの内
から選択した２以上の組み合わせから成ることを特徴と
する請求項１記載のハンダ合金超微粒子の製造方法。2. The method according to claim 1, wherein the predetermined type of metal constituting the ultrafine solder alloy particles is a combination of two or more selected from Ag, Sn, Cu, Bi, In, and Sb. For producing ultrafine solder alloy particles.
平板を使用し、該絶縁耐熱性平板を前記第１搬送位置に
搬送して前記第１工程を、前記第２搬送位置に搬送して
前記第２工程を、前記第３搬送位置に搬送して前記第３
工程を、前記第４搬送位置に搬送して前記第４工程を、
前記第５搬送位置に搬送して前記第５工程を順次処理す
ることを特徴とする請求項１又は２記載のハンダ合金超
微粒子の製造方法。3. An insulated heat-resistant flat plate is used in place of the insulated heat-resistant belt, and the insulated heat-resistant flat plate is transported to the first transport position, and the first step is transported to the second transport position. Transporting the second step to the third transport position,
Transporting the process to the fourth transport position and performing the fourth process,
The method for producing ultrafine solder alloy particles according to claim 1 or 2, wherein the method is carried to the fifth carrying position to sequentially process the fifth step.
記第５工程で回収したハンダ合金超微粒子をハンダフラ
ックス中に混合させる第６工程を有することを特徴とす
るハンダペーストの製造方法。4. A method for producing a solder paste, comprising: a sixth step of mixing the ultrafine solder alloy particles recovered in the fifth step according to any one of claims 1 to 3 into a solder flux. Method.
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|---|---|---|---|
| JP2000313634A JP4509347B2 (en) | 2000-10-13 | 2000-10-13 | Method for producing solder alloy ultrafine particles and method for producing solder paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000313634A JP4509347B2 (en) | 2000-10-13 | 2000-10-13 | Method for producing solder alloy ultrafine particles and method for producing solder paste |
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| Publication Number | Publication Date |
|---|---|
| JP2002120091A true JP2002120091A (en) | 2002-04-23 |
| JP4509347B2 JP4509347B2 (en) | 2010-07-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008149365A (en) * | 2006-12-20 | 2008-07-03 | Mitsubishi Materials Corp | Solder powder, and soldering paste using the same |
| JP2015096627A (en) * | 2013-11-15 | 2015-05-21 | 尾池工業株式会社 | Method and apparatus for production of flaky fine powder |
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|---|---|---|---|---|
| JPH0466603A (en) * | 1990-07-06 | 1992-03-03 | Nippon Steel Corp | Production of fine metal ball |
| JPH0754007A (en) * | 1993-08-12 | 1995-02-28 | Agency Of Ind Science & Technol | Coated metal particle, metal-based sintered compact and production thereof |
| JPH07268409A (en) * | 1994-03-30 | 1995-10-17 | Ibiden Co Ltd | Production of solder ball |
| JPH09150296A (en) * | 1995-11-27 | 1997-06-10 | Nec Corp | Formation of metallic ball |
| JPH11246901A (en) * | 1998-03-02 | 1999-09-14 | Hitachi Zosen Corp | Production of metallic particulate and method for depositing the particular on porous carrier |
| JP2000094184A (en) * | 1998-09-17 | 2000-04-04 | Senju Metal Ind Co Ltd | Flux for soldering |
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2000
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0466603A (en) * | 1990-07-06 | 1992-03-03 | Nippon Steel Corp | Production of fine metal ball |
| JPH0754007A (en) * | 1993-08-12 | 1995-02-28 | Agency Of Ind Science & Technol | Coated metal particle, metal-based sintered compact and production thereof |
| JPH07268409A (en) * | 1994-03-30 | 1995-10-17 | Ibiden Co Ltd | Production of solder ball |
| JPH09150296A (en) * | 1995-11-27 | 1997-06-10 | Nec Corp | Formation of metallic ball |
| JPH11246901A (en) * | 1998-03-02 | 1999-09-14 | Hitachi Zosen Corp | Production of metallic particulate and method for depositing the particular on porous carrier |
| JP2000094184A (en) * | 1998-09-17 | 2000-04-04 | Senju Metal Ind Co Ltd | Flux for soldering |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008149365A (en) * | 2006-12-20 | 2008-07-03 | Mitsubishi Materials Corp | Solder powder, and soldering paste using the same |
| JP2015096627A (en) * | 2013-11-15 | 2015-05-21 | 尾池工業株式会社 | Method and apparatus for production of flaky fine powder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4509347B2 (en) | 2010-07-21 |
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