JP2002059823A - Semiconductor cooling device - Google Patents

Semiconductor cooling device

Info

Publication number
JP2002059823A
JP2002059823A JP2000249215A JP2000249215A JP2002059823A JP 2002059823 A JP2002059823 A JP 2002059823A JP 2000249215 A JP2000249215 A JP 2000249215A JP 2000249215 A JP2000249215 A JP 2000249215A JP 2002059823 A JP2002059823 A JP 2002059823A
Authority
JP
Japan
Prior art keywords
heat
cooling device
vehicle
semiconductor cooling
traveling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000249215A
Other languages
Japanese (ja)
Other versions
JP4011272B2 (en
Inventor
Masaki Miyairi
正樹 宮入
Kazuaki Fukuda
和明 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Transport Engineering Inc
Original Assignee
Toshiba Corp
Toshiba Transport Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Transport Engineering Inc filed Critical Toshiba Corp
Priority to JP2000249215A priority Critical patent/JP4011272B2/en
Publication of JP2002059823A publication Critical patent/JP2002059823A/en
Application granted granted Critical
Publication of JP4011272B2 publication Critical patent/JP4011272B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Power Conversion In General (AREA)
  • Inverter Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a small and lightweight semiconductor cooling device having enhanced cooling performance by effectively using a vehicle travelling wind. SOLUTION: Heat in the heat receiving part 5 of a cooler 1 is transferred to a radiation fin 3 divided into two parts through a heat pipe 2 in order to have heat exchange. A travelling wind flows in a travelling wind passage 14 formed in the center part of the radiation fin 3, and cooling is efficiently carried out.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、鉄道車両床下に設
置される電力変換装置の半導体素子を冷却する半導体冷
却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling device for cooling a semiconductor element of a power converter installed under a railway vehicle floor.

【０００２】[0002]

【従来の技術】車両駆動用の電力変換装置は、鉄道架線
から入力される電力を半導体素子のスイッチングにより
変換し、車両駆動用の電動機に電力を供給するものであ
る。この電力変換装置は鉄道車両床下に設置される。電
力変換装置の半導体素子より発生する熱は、半導体冷却
装置により外気へ放散するようにしている。2. Description of the Related Art An electric power converter for driving a vehicle converts electric power input from a railway overhead line by switching semiconductor elements and supplies electric power to an electric motor for driving the vehicle. This power converter is installed under the floor of a railway vehicle. The heat generated from the semiconductor element of the power converter is dissipated to the outside air by the semiconductor cooling device.

【０００３】半導体冷却装置は、複数個の冷却器を車両
進行方向に並べて配置されて形成される。冷却器は、電
力変換装置の半導体素子の発熱を受熱部で受熱し、車両
の走行風により放熱部で放散するものである。[0003] The semiconductor cooling device is formed by arranging a plurality of coolers side by side in the vehicle traveling direction. The cooler receives heat generated by the semiconductor element of the power conversion device at the heat receiving portion, and dissipates the heat at the heat radiating portion by the traveling wind of the vehicle.

【０００４】すなわち、冷却器は半導体素子の取り付く
受熱部と装置外部へ排熱を行う放熱部とから構成され、
鉄道車両床下に設置される車両駆動用では、多くの場
合、冷却器の放熱部が車両床下の車両側方側となるよう
設置され、自然冷却により放熱部から大気へ熱放散する
方式が採られている。That is, the cooler is composed of a heat receiving portion to which the semiconductor element is attached and a heat radiating portion for discharging heat outside the device.
In the case of vehicle driving installed under the floor of railway vehicles, in many cases, the radiator of the cooler is installed so that it is on the side of the vehicle under the vehicle floor, and heat is radiated from the radiator to the atmosphere by natural cooling. ing.

【０００５】これは、放熱部の冷却を自然冷却として送
風機を使用しないことで、機器のメンテナンス作業が不
要となるようにするためであり、車両側方側へ配置する
のは、車両床下へ排熱がこもることなく車両走行時の走
行風を受けやすくすることを考慮したものである。[0005] The purpose of this is to eliminate the necessity of maintenance work for the equipment by not using the blower as the natural cooling of the radiator, and to dispose it on the side of the vehicle below the floor of the vehicle. This is to make it easy to receive the traveling wind during traveling of the vehicle without retaining heat.

【０００６】図６は従来の半導体冷却装置の説明図であ
り、図６（ａ）は正面図、図６（ｂ）は車両の床下に取
り付けられた状態で図６（ａ）の矢印Ａ方向から見た側
面図である。図６（ａ）に示すように、半導体冷却装置
は、複数個（３個）の冷却器１が車両進行方向に並んで
配置されて形成されている。図６（ａ）では冷却器１の
放熱部の外観が示されており、各々の冷却器１の放熱部
は、受熱部の熱を車両の側方側に輸送するヒートパイプ
２と、このヒートパイプ２に取り付けられた放熱フィン
３とから構成されている。FIG. 6 is an explanatory view of a conventional semiconductor cooling device. FIG. 6 (a) is a front view, and FIG. 6 (b) is a state in which the semiconductor cooling device is installed under the floor of a vehicle in the direction of arrow A in FIG. 6 (a). It is the side view seen from. As shown in FIG. 6A, the semiconductor cooling device is formed by arranging a plurality of (three) coolers 1 side by side in the vehicle traveling direction. FIG. 6A shows the appearance of the heat radiating portion of the cooler 1. The heat radiating portion of each cooler 1 has a heat pipe 2 for transporting the heat of the heat receiving portion to the side of the vehicle, and the heat pipe 2. And a radiation fin 3 attached to the pipe 2.

【０００７】図６（ｂ）に示すように、冷却器１は、複
数個の半導体素子４が取り付けられた受熱部５と、大気
へ熱放散する放熱部６とで構成される。放熱部６は、受
熱部５の熱を車両の側方側に輸送するヒートパイプ２
と、ヒートパイプ２に取り付けられた複数個の放熱フィ
ン３とから形成される。放熱フィン３では、受熱部５か
らヒートパイプ２を介して輸送されてきた熱を放熱す
る。As shown in FIG. 6 (b), the cooler 1 is composed of a heat receiving section 5 to which a plurality of semiconductor elements 4 are attached, and a heat radiating section 6 for dissipating heat to the atmosphere. The heat radiating section 6 is a heat pipe 2 that transports the heat of the heat receiving section 5 to the side of the vehicle.
And a plurality of radiating fins 3 attached to the heat pipe 2. The radiating fins 3 radiate heat transferred from the heat receiving unit 5 via the heat pipe 2.

【０００８】冷却器１の受熱部５は、電力変換装置箱体
７の密閉部８へ収納される。これは、半導体素子４とそ
の周辺部品を汚損のない環境に置くためである。一方、
放熱部６は車体の側方側の電力変換装置箱体７の開放部
９に配置され、効率良く大気へ熱放散ができるようにし
ている。つまり、車両床下に排熱がこもり床下の配線や
配管等を暖めることがないようにしている。なお、密閉
部８と開放部９との間は境界板１０により区分され、開
放部９の走行風が通らない部分（走行風と平行になる部
分）には保護カバー１１が設けられている。The heat receiving section 5 of the cooler 1 is housed in the closed section 8 of the power conversion device box 7. This is for placing the semiconductor element 4 and its peripheral components in an environment free from contamination. on the other hand,
The heat dissipating part 6 is arranged in the opening part 9 of the power converter box 7 on the side of the vehicle body so as to efficiently dissipate heat to the atmosphere. In other words, the exhaust heat is not trapped under the floor of the vehicle, and wiring, piping, and the like under the floor are not heated. Note that the boundary between the closed portion 8 and the open portion 9 is separated by a boundary plate 10, and a protective cover 11 is provided at a portion of the open portion 9 where the traveling wind does not pass (a portion parallel to the traveling wind).

【０００９】ここで、受熱部５にはヒートパイプ２の一
方の端部が埋め込まれ、もう一方側には多数枚の放熱フ
ィン３が取り付けられる。ヒートパイプ２は受熱部５側
が下方となるよう傾けて設置され、ヒートパイプ２内部
に封入された冷媒は受熱部５側で半導体素子４から発生
する熱により蒸発し、放熱部６の放熱フィン３側で凝縮
して大気へ熱放散を行うことになる。凝縮した冷媒はヒ
ートパイプ２内部を重力により受熱部５側へと戻るサイ
クルを繰り返す。Here, one end of the heat pipe 2 is buried in the heat receiving section 5, and a large number of radiating fins 3 are attached to the other side. The heat pipe 2 is installed so as to be inclined so that the heat receiving section 5 side is downward, and the refrigerant sealed in the heat pipe 2 evaporates on the heat receiving section 5 side by the heat generated from the semiconductor element 4, and the radiating fin 3 of the heat radiating section 6 is formed. The side will condense and dissipate heat to the atmosphere. The condensed refrigerant repeats a cycle in which the inside of the heat pipe 2 returns to the heat receiving unit 5 side by gravity.

【００１０】放熱フィン３は自然冷却により大気へ熱放
散を行うため、地面に対しほぼ垂直に設置され、放熱フ
ィン３間を上昇気流が通り易くなるようにしている。ヒ
ートパイプ２は放熱フィン３を貫通して接続されるの
で、ほぼ水平に取り付けられるが、前述の如く蒸発部で
ある受熱部５側を若干下方に傾け、放熱フィン３側で凝
縮した冷媒を受熱部５側へ戻すようにしている。The radiating fins 3 are disposed substantially perpendicular to the ground in order to dissipate heat to the atmosphere by natural cooling, so that an updraft can easily pass between the radiating fins 3. Since the heat pipe 2 is connected through the radiating fins 3, the heat pipe 2 is mounted substantially horizontally. However, as described above, the heat receiving portion 5, which is an evaporating portion, is inclined slightly downward to receive the refrigerant condensed on the radiating fin 3 side. It returns to the part 5 side.

【００１１】このように構成される半導体冷却装置は、
半導体素子実装部である受熱部５は電力変換装置箱体７
の内部（密閉部）に、放熱部６は電力変換装置箱体７の
外部（開放部）に境界板１０を境として取り付けられ
る。[0011] The semiconductor cooling device thus configured is
The heat receiving section 5 which is a semiconductor element mounting section includes a power converter box 7.
Inside (sealed portion), the heat radiating portion 6 is attached to the outside (open portion) of the power converter box 7 with the boundary plate 10 as a boundary.

【００１２】電力変換装置の箱体７は鉄道車両の車体１
２の床下に放熱部６が車体側方側となる向きに艤装され
る。また、車体床下には電力変換装置等の機器が艤装可
能なスペースとして艤装限界１３があり、冷却器１を含
めた電力変換装置はこの艤装限界１３内に取り付けられ
ることになる。艤装限界１３は、図６（ｂ）に示すよう
に、一般に下方コーナー部が面取りされた形となってい
る。The box 7 of the power converter is a vehicle body 1 of a railway car.
The radiator 6 is mounted below the floor of the vehicle 2 in a direction facing the vehicle body. There is an outfitting limit 13 below the vehicle body floor as a space where equipment such as a power conversion device can be installed, and the power conversion device including the cooler 1 is mounted in the outfitting limit 13. As shown in FIG. 6B, the outfitting limit 13 generally has a shape in which a lower corner portion is chamfered.

【００１３】[0013]

【発明が解決しようとする課題】ところが、このような
従来の半導体冷却装置では放熱部６が車体の側方側に設
置されており、多数枚の放熱フィン３が車体中央側（冷
却器受熱都側）から車体側方側（冷却器先端側）へと所
定のピッチで並んで取り付いているので、フィンピッチ
やパイプピッチの関係で、走行風の入風効率が悪くなる
ことがある。この場合、風下側の冷却器まで風が流れな
いことがある。However, in such a conventional semiconductor cooling device, the heat radiating section 6 is provided on the side of the vehicle body, and a large number of heat radiating fins 3 are provided on the center of the vehicle body (cooler heat receiving area). Side) to the side of the vehicle body (tip side of the cooler) side by side at a predetermined pitch, so that the airflow efficiency of the traveling wind may deteriorate due to the fin pitch and the pipe pitch. In this case, the wind may not flow to the cooler on the leeward side.

【００１４】また、走行風の流れが悪い箇所は、冷却器
１の上段が下段の放熱のあおりを受け、冷却効率が悪く
なることがある。Further, in places where the flow of the traveling wind is poor, the upper stage of the cooler 1 may be affected by the heat radiation of the lower stage, and the cooling efficiency may be deteriorated.

【００１５】本発明の目的は、車両走行風を有効に利用
し冷却性能の向上した小形軽量の半導体冷却装置を提供
することである。An object of the present invention is to provide a small and lightweight semiconductor cooling device having improved cooling performance by effectively utilizing the wind flowing through a vehicle.

【００１６】[0016]

【課題を解決するための手段】請求項１の発明に係わる
半導体冷却装置は、鉄道車両床下に設置された電力変換
装置の半導体素子の発熱を受熱部で受熱し車両の走行風
により放熱部で放散する冷却器が車両進行方向に複数個
並んで配置された半導体冷却装置において、前記冷却器
の放熱部は、前記受熱部の熱を車両の側方側に輸送する
ヒートパイプと、前記ヒートパイプに取り付けられ前記
受熱部から輸送された熱を放熱する放熱フィンとから形
成され、中央部に走行風通路を設けたことを特徴とす
る。According to a first aspect of the present invention, there is provided a semiconductor cooling device which receives heat generated by a semiconductor element of a power conversion device installed under the floor of a railway vehicle at a heat receiving portion, and generates heat at a heat radiating portion by wind of the vehicle. In a semiconductor cooling device in which a plurality of coolers that dissipate are arranged side by side in a vehicle traveling direction, a heat radiating portion of the cooler includes a heat pipe that transports heat of the heat receiving portion to a side of a vehicle, and a heat pipe. And a radiating fin for dissipating the heat transported from the heat receiving portion, and a traveling air passage is provided in a central portion.

【００１７】請求項１の発明に係わる半導体冷却装置に
おいては、冷却器の受熱部の熱は、ヒートパイプを介し
て放熱フィンに輸送され熱交換される。そして、放熱フ
ィンの中央部に形成された走行風通路に走行風が流れ、
効率よく冷却を行う。In the semiconductor cooling device according to the first aspect of the present invention, the heat of the heat receiving portion of the cooler is transported to the radiating fins via the heat pipe and exchanged heat. Then, the traveling wind flows in the traveling wind passage formed in the center of the radiation fin,
Cools efficiently.

【００１８】請求項２の発明に係わる半導体冷却装置
は、請求項１の発明において、前記走行風通路は、前記
放熱フィンを上段と下段とに２分割して、２分割した放
熱フィンの間に形成されたことを特徴とする。According to a second aspect of the present invention, in the semiconductor cooling device according to the first aspect, the traveling air passage divides the radiating fin into two parts, an upper part and a lower part, between the radiating fins. It is characterized by being formed.

【００１９】請求項２の発明に係わる半導体冷却装置に
おいては、請求項１の発明の作用に加え、冷却器の受熱
部の熱は、ヒートパイプを介して２分割された上段およ
び下段のそれぞれの放熱フィンに輸送され熱交換され
る。そして、２分割された上段および下段の放熱フィン
との間に形成された走行風通路に走行風が流れ、下段側
の放熱の上段側への影響が低減され冷却効果を高める。In the semiconductor cooling device according to the second aspect of the present invention, in addition to the operation of the first aspect of the present invention, the heat of the heat receiving portion of the cooler is transferred to each of the upper stage and the lower stage divided into two via a heat pipe. The heat is transferred to the radiating fins for heat exchange. The traveling wind flows through the traveling air passage formed between the upper and lower radiation fins divided into two, and the influence of the lower radiation on the upper side is reduced, and the cooling effect is enhanced.

【００２０】請求項３の発明に係わる半導体冷却装置
は、請求項１の発明において、前記走行風通路は、車両
進行方向に対し他の冷却器の走行風通路とそれぞれ連通
していることを特徴とする。According to a third aspect of the present invention, in the semiconductor cooling device according to the first aspect, the traveling air passage communicates with a traveling air passage of another cooler in the vehicle traveling direction. And

【００２１】請求項３の発明に係わる半導体冷却装置に
おいては、請求項１の発明の作用に加え、冷却器の受熱
部の熱は、ヒートパイプを介して２分割された上段およ
び下段のそれぞれの放熱フィンに輸送され熱交換され
る。そして、２分割された上段および下段の放熱フィン
との間に形成された走行風通路は他の冷却器の走行風通
路と連通しているので、複数個並んだ冷却器を走行風が
連続して通過でき冷却効果を高める。In the semiconductor cooling device according to the third aspect of the present invention, in addition to the function of the first aspect of the present invention, the heat of the heat receiving portion of the cooler is divided into two parts, the upper part and the lower part, via a heat pipe. The heat is transferred to the radiating fins for heat exchange. The traveling air passage formed between the upper and lower radiating fins that are divided into two sections communicates with the traveling air passages of the other coolers. To increase the cooling effect.

【００２２】請求項４の発明に係わる半導体冷却装置
は、請求項１の発明において、前記走行風通路は、前記
受熱部側の放熱フィンは一体構造とし、その先端部の放
熱フィンを上段と下段とに２分割して、２分割した放熱
フィンの間に形成されたことを特徴とする。According to a fourth aspect of the present invention, in the semiconductor cooling device according to the first aspect of the present invention, in the traveling air passage, the radiating fins on the side of the heat receiving portion have an integral structure, and the radiating fins at the tip end are formed in an upper stage and a lower stage. And formed between the radiation fins divided into two.

【００２３】請求項４の発明に係わる半導体冷却装置に
おいては、請求項１の発明の作用に加え、走行風の通過
が期待できない受熱部側の放熱フィンを一体構造とする
ことにより、その部分の放熱面積を広げ、自然対流によ
るフィン効率を高め冷却効果を高める。In the semiconductor cooling device according to the fourth aspect of the present invention, in addition to the operation of the first aspect of the present invention, the radiation fins on the side of the heat receiving section where the passage of the traveling wind is not expected can be formed as an integral structure, so Enlarges the heat radiation area, increases the fin efficiency by natural convection, and enhances the cooling effect.

【００２４】請求項５の発明に係わる半導体冷却装置
は、請求項４の発明において、前記受熱部側の一体構造
の放熱フィンにヒートパイプを付設したことを特徴とす
る。A semiconductor cooling device according to a fifth aspect of the present invention is the semiconductor cooling device according to the fourth aspect of the present invention, wherein a heat pipe is attached to a radiation fin having an integral structure on the heat receiving portion side.

【００２５】請求項５の発明に係わる半導体冷却装置に
おいては、請求項４の発明の作用に加え、受熱部の中央
部の熱をヒートパイプにより一体構造の放熱フィンに熱
輸送し、冷却効果を高める。In the semiconductor cooling device according to the fifth aspect of the present invention, in addition to the function of the fourth aspect of the present invention, the heat of the central portion of the heat receiving portion is transported to the integrated radiating fins by the heat pipe to reduce the cooling effect. Enhance.

【００２６】請求項６の発明に係わる半導体冷却装置
は、請求項４または請求項５の発明において、前記受熱
部側の一体構造の放熱フィンのピッチを狭く、２分割し
た放熱フィンのピッチを広くしたことを特徴とする。According to a sixth aspect of the present invention, in the semiconductor cooling device according to the fourth or fifth aspect, the pitch of the heat dissipating fins of the integrated structure on the heat receiving portion side is narrow, and the pitch of the heat dissipating fins divided into two is wide. It is characterized by having done.

【００２７】請求項６の発明に係わる半導体冷却装置に
おいては、請求項４または請求項５の発明の作用に加
え、放熱フィンのピッチを狭くした受熱部側の一体構造
の放熱フィンおよび放熱フィンのピッチを広くした２分
割の放熱フィンへの走行風の通過効率が向上し、冷却効
果を高める。In the semiconductor cooling device according to the sixth aspect of the present invention, in addition to the functions of the fourth or fifth aspect of the present invention, the radiation fin having the integral structure on the heat receiving portion side in which the pitch of the radiation fin is narrowed, The efficiency of the passage of the traveling wind to the radiation fins divided into two with a wide pitch is improved, and the cooling effect is enhanced.

【００２８】請求項７の発明に係わる半導体冷却装置
は、請求項１乃至請求項６のいずれか１項の発明におい
て、前記２分割された放熱フィンを貫通するヒートパイ
プは、長さが異なるヒートパイプを交互に組み合わせて
構成したことを特徴とする。According to a seventh aspect of the present invention, in the semiconductor cooling device according to any one of the first to sixth aspects, the heat pipes penetrating the divided heat radiation fins have different lengths. It is characterized by being constituted by alternately combining pipes.

【００２９】請求項７の発明に係わる半導体冷却装置に
おいては、請求項１乃至請求項６のいずれか１項の発明
の作用に加え、放熱フィンを貫通する長さが異なるヒー
トパイプを交互に組み合わせて放熱フィンとの熱交換を
効率的に行うと共に、走行風の通過効率を向上させ冷却
効果を高める。According to a seventh aspect of the present invention, there is provided a semiconductor cooling device according to any one of the first to sixth aspects, wherein heat pipes having different lengths penetrating the radiation fins are alternately combined. In addition to efficiently performing heat exchange with the radiating fins, the traveling air passage efficiency is improved and the cooling effect is enhanced.

【００３０】請求項８の発明に係わる半導体冷却装置
は、請求項１乃至請求項７のいずれか１項の発明におい
て、前記冷却器の受熱部の半導体素子取付け面の反対面
に凹凸のスリットを設けたことを特徴とする。The semiconductor cooling device according to an eighth aspect of the present invention is the semiconductor cooling device according to any one of the first to seventh aspects, wherein an uneven slit is formed on a surface of the heat receiving portion of the cooler opposite to the semiconductor element mounting surface. It is characterized by having been provided.

【００３１】請求項８の発明に係わる半導体冷却装置に
おいては、請求項１乃至請求項７のいずれか１項の発明
の作用に加え、受熱部の凹凸スリットにより、受熱部の
表面積が大きくなり、瞬時ピークロス時のヒートパイプ
にて熱輸送できない分の温度上昇をその受熱部表面より
放熱し冷却効果を高める。In the semiconductor cooling device according to an eighth aspect of the present invention, in addition to the function of the first aspect of the present invention, the surface area of the heat receiving portion is increased by the concave and convex slits of the heat receiving portion. The temperature rise that cannot be transported by the heat pipe during the instantaneous peak-crossing is radiated from the surface of the heat receiving portion to enhance the cooling effect.

【００３２】[0032]

【発明の実施の形態】以下、本発明の実施の形態を説明
する。図１は本発明の第１の実施の形態に係わる半導体
冷却装置の説明図であり、図１（ａ）は正面図、図１
（ｂ）は車両の床下に取り付けられた状態で図１（ａ）
の矢印Ａ方向から見た側面図、図１（ｃ）は図１（ｂ）
のＢ−Ｂ線での断面図である。Embodiments of the present invention will be described below. FIG. 1 is an explanatory view of a semiconductor cooling device according to a first embodiment of the present invention. FIG. 1 (a) is a front view, FIG.
FIG. 1 (b) shows a state where it is installed under the floor of a vehicle.
1 (c) is a side view as viewed from the direction of arrow A in FIG. 1 (b).
FIG. 7 is a sectional view taken along line BB of FIG.

【００３３】この第１の実施の形態は、図６に示す従来
例に対し、各々の冷却器１の冷却フィン３を２分割し中
央部に走行風通路１４を設け、冷却器１の受熱部５の半
導体素子取付け面の反対面に凹凸のスリット１５を設け
たものである。The first embodiment differs from the conventional example shown in FIG. 6 in that the cooling fins 3 of each cooler 1 are divided into two and a running air passage 14 is provided at the center, and a heat receiving portion of the cooler 1 is provided. 5 is provided with an uneven slit 15 on the surface opposite to the semiconductor element mounting surface.

【００３４】図１（ａ）には冷却器１の放熱部の外観が
示されており、半導体冷却装置は、複数個（３個）の冷
却器１が車両進行方向に並んで配置されて形成されてい
る。そして、各々の冷却器１は冷却フィン３が２分割さ
れ、中央部に走行風通路１４が形成されている。この走
行風通路１４は、車両進行方向に対し他の冷却器１の走
行風通路１４とそれぞれ同じ位置に設けられ、従って各
々の走行風通路１４は連通している。また、各々の冷却
器１の放熱部は、受熱部の熱を車両の側方側に輸送する
ヒートパイプ２と、このヒートパイプ２に取り付けられ
た放熱フィン３とから構成されている。FIG. 1A shows the appearance of the heat radiating portion of the cooler 1, and the semiconductor cooling device is formed by arranging a plurality of (three) coolers 1 arranged side by side in the vehicle traveling direction. Have been. In each cooler 1, the cooling fin 3 is divided into two, and a traveling air passage 14 is formed in the center. The traveling air passages 14 are provided at the same positions as the traveling air passages 14 of the other coolers 1 with respect to the traveling direction of the vehicle, so that the traveling air passages 14 communicate with each other. The heat radiating portion of each cooler 1 includes a heat pipe 2 for transporting heat of the heat receiving portion to the side of the vehicle, and a radiating fin 3 attached to the heat pipe 2.

【００３５】図１（ｂ）に示すように、冷却器ｌは電力
変換装置箱体７に取り付けられ、その電力変換装置箱体
７の境界板１０を境にして、内部側は密閉部８となり外
部側は開放部９となる。冷却器１は半導体素子４の取り
付く受熱部５と放熱部６とからなり、放熱部６は２分割
された多数枚の放熱フィン３により構成される。すなわ
ち、放熱フィン３を上段と下段とに２分割して、２分割
した放熱フィン３の間に走行風通路１４が形成されてい
る。２分割された放熱フィン３は車体１２に対して車体
側面側となるよう配置され、保護カバー１１に保護され
て艤装限界１３内に収まるよう艤装される。As shown in FIG. 1 (b), the cooler 1 is mounted on the power converter box 7, and with the boundary plate 10 of the power converter box 7 as a boundary, the inside becomes a sealed portion 8. The outside side is an opening 9. The cooler 1 includes a heat receiving section 5 to which the semiconductor element 4 is attached and a heat radiating section 6, and the heat radiating section 6 is constituted by a large number of divided heat radiating fins 3. In other words, the radiation fin 3 is divided into an upper part and a lower part, and the traveling air passage 14 is formed between the divided radiation fins 3. The radiation fins 3 divided into two parts are arranged on the side of the vehicle body 12 with respect to the vehicle body 12, protected by the protective cover 11, and fitted to fit within the fitting limit 13.

【００３６】また、図１（ｃ）に示すように、受熱部５
の半導体素子取付けの反対面に、凹凸スリット１５を設
けている。この受熱部５の凹凸スリット１５により、受
熱部の５表面積が大きくなり、瞬時ピークロス時のヒー
トパイプ２にて熱輸送できない分の温度上昇を放熱し冷
却効果を高めるようにしている。Further, as shown in FIG.
The concave and convex slits 15 are provided on the opposite surface of the semiconductor device mounting. Due to the concave and convex slits 15 of the heat receiving portion 5, the surface area of the heat receiving portion 5 is increased, and the temperature rise that cannot be transported by the heat pipe 2 during the instantaneous peak crossing is radiated to enhance the cooling effect.

【００３７】半導体素子４より発生する熱は、受熱部５
およびヒートパイプ２を介して２分割された放熱フィン
３に熱伝導され、２分割された放熱フィン３の表面から
大気へと熱放散される。また、半導体素子４の瞬時ピー
クロス時は、ヒートパイプ２にて熱輸送できない分の温
度上昇を受熱部５の凹凸スリット１５の表面より電力変
換装置箱体７内へ熱放散される。The heat generated by the semiconductor element 4 is
The heat is then conducted to the radiation fins 3 divided into two via the heat pipe 2, and the heat is dissipated to the atmosphere from the surface of the radiation fins 3 divided into two. In addition, during the instantaneous peak-crossing of the semiconductor element 4, the temperature rise that cannot be transported by the heat pipe 2 is dissipated into the power conversion device box 7 from the surface of the uneven slit 15 of the heat receiving unit 5.

【００３８】ここで、車両駆動用の電力変換装置では、
当然、半導体素子４から熱が発生するのは車両走行時で
あり、車両停止時は半導体素子４は通電されないので損
失を発生することはない。一方、車両走行時は車両に対
して走行風が車体床下に取り付けられた半導体冷却装置
に対し流れる。つまり、周囲から空気が流れ込むことに
なる。Here, in the power converter for driving a vehicle,
Naturally, heat is generated from the semiconductor element 4 when the vehicle is running, and when the vehicle is stopped, the semiconductor element 4 is not energized, so that no loss occurs. On the other hand, when the vehicle is traveling, the traveling wind flows to the semiconductor cooling device mounted below the floor of the vehicle body. That is, air flows from the surroundings.

【００３９】走行風は、車両走行時、車両の周囲の空気
が車両と相対的に動くことで車両１２および車両１２と
一体になって運動する車両床下に設置された機器類に対
して働く。この走行風は車両走行時、２分割された放熱
フィン３間および放熱部６の中央部の走行風通路１４を
流れることになり、放熱フィン３の表面では空気流速が
自然対流のみの時と比較し速くなる。従って、熱伝達率
が向上し放熱フィン３の放熱性能が向上する。また、放
熱部６の中央部の走行風通路１４では、下段の放熱フィ
ン３からの放熱の一部が上昇気流により上昇した所を走
行風により熱放散する。The traveling wind acts on the vehicle 12 and devices installed under the vehicle floor that move integrally with the vehicle 12 when the air around the vehicle moves relative to the vehicle when the vehicle travels. When the vehicle travels, the traveling wind flows between the divided radiating fins 3 and the traveling wind passage 14 at the center of the radiating portion 6. And faster. Therefore, the heat transfer coefficient is improved, and the heat radiation performance of the radiation fins 3 is improved. In the traveling air passage 14 at the center of the heat radiating portion 6, a part of the heat radiation from the lower radiating fins 3 is dissipated by the traveling wind at a place where a part of the heat is raised by the ascending airflow.

【００４０】この第１の実施の形態によれば、車両走行
時の走行風が車両進行方向より放熱フィン３間と放熱フ
ィン３の中央部の走行風通路１４とを流れることで、放
熱フィン３の上部へのあおりが減少し、放熱フィン３の
放熱効率が向上し、冷却器１の小形化や高性能化が可能
である。According to the first embodiment, the traveling wind when the vehicle travels flows between the radiation fins 3 and the traveling wind passage 14 at the center of the radiation fins 3 in the traveling direction of the vehicle. Of the cooling fin 3 is improved, and the size and performance of the cooler 1 can be reduced.

【００４１】次に、本発明の第２の実施の形態を説明す
る。図２は本発明の第２の実施の形態に係わる半導体冷
却装置の説明図であり、図２（ａ）は正面図、図２
（ｂ）は車両の床下に取り付けられた状態で図２（ａ）
の矢印Ａ方向から見た側面図である。この第２の実施の
形態は、図１に示す第１の実施の形態に対し、受熱部５
側の放熱フィン３Ａは一体構造とし、その先端部の放熱
フィン３を上段と下段とに２分割して、２分割した放熱
フィン３の間に走行風通路１４を形成したものである。
その他の構成は、図１に示した第１の実施の形態と同一
であるので、同一要素には同一符号を付し重複する説明
は省略する。Next, a second embodiment of the present invention will be described. FIG. 2 is an explanatory view of a semiconductor cooling device according to a second embodiment of the present invention. FIG. 2 (a) is a front view, FIG.
FIG. 2 (b) shows a state where it is installed under the floor of the vehicle.
2 is a side view as viewed from the direction of arrow A. FIG. This second embodiment is different from the first embodiment shown in FIG.
The radiating fins 3A on the side have an integral structure, and the radiating fins 3 at the distal end are divided into an upper part and a lower part, and a traveling air passage 14 is formed between the divided radiating fins 3.
The other configuration is the same as that of the first embodiment shown in FIG. 1, and therefore, the same components are denoted by the same reference symbols and overlapping description will be omitted.

【００４２】放熱部６が車体側面側となるように、冷却
器１は電力変換装置箱体７に取り付けられ、受熱部５の
半導体素子４の取り付く面の反対側の面には２分割され
た放熱フィン３が設けられ、その間に走行風通路１４を
形成している。また、放熱部６の受熱部５側には一体構
造の放熱フィン３Ａを設けている。つまり、走行風がよ
く当る側は、第１の実施の形態と同様に、上段と下段と
に２分割にした放熱フィン３とし、走行風が当たりにく
い受熱部５側の放熱フィンを一体構造の放熱フィン３Ａ
としている。The cooler 1 is mounted on the power converter box 7 so that the heat radiating portion 6 is on the side of the vehicle body, and is divided into two parts on the surface of the heat receiving portion 5 opposite to the surface on which the semiconductor element 4 is mounted. The radiation fins 3 are provided, and a traveling air passage 14 is formed therebetween. Further, on the heat receiving portion 5 side of the heat radiating portion 6, a heat radiating fin 3A having an integral structure is provided. In other words, the side on which the traveling wind is well hit is the radiation fin 3 divided into two parts, an upper stage and a lower stage, as in the first embodiment. Radiation fin 3A
And

【００４３】次に作用を説明する。半導体素子４より発
生する熱は、受熱部５からヒートパイプ３を介して一体
構造の放熱フィン３Ａおよび２分割された放熱フィン３
に熱伝導され、これら放熱フィン３Ａ、３の表面から大
気へと熱放散される。Next, the operation will be described. The heat generated from the semiconductor element 4 is transferred from the heat receiving portion 5 via the heat pipe 3 to the integrated radiation fin 3A and the radiation fin 3 divided into two parts.
And the heat is dissipated to the atmosphere from the surfaces of the radiating fins 3A and 3A.

【００４４】第１の実施の形態と同様に、車両走行時の
走行風は、車側側では、２分割された放熱フィン３間お
よび２分割された放熱フィン３の中央部の走行風通路１
４を流れ、２分割された放熱フィン３から大気への放熱
性能が向上する。また、受熱部５側では、一体構造の放
熱フィン３Ａを設けていることから放熱面積が広がるこ
とにより、放熱性能が向上する。As in the first embodiment, the traveling wind at the time of traveling of the vehicle is, on the vehicle side, between the radiation fins 3 divided into two parts and the traveling air passage 1 at the center of the radiation fins 3 divided into two parts.
4, the heat radiation performance to the atmosphere from the heat radiation fins 3 divided into two is improved. Further, on the side of the heat receiving portion 5, the radiation fins 3A having an integral structure are provided, so that the radiation area is increased, so that the radiation performance is improved.

【００４５】このように、車両走行時の走行風が車両進
行方向より分割された放熱フィン３間と走行風通路１４
とを流れることで、分割された放熱フィン３の上部への
あおりが減少し、走行風が流れにくい受熱部５側では、
放熱面積を増やしたことにより放熱フィン３Ａの放熱効
率が向上し、冷却器１の小形化や高性能化が可能とな
る。As described above, the traveling wind when the vehicle is traveling is divided between the radiation fins 3 divided in the traveling direction of the vehicle and the traveling wind passage 14.
, The tilt to the upper part of the divided radiating fins 3 is reduced, and on the heat receiving unit 5 side where the traveling wind is less likely to flow,
By increasing the heat radiation area, the heat radiation efficiency of the heat radiation fins 3A is improved, and the size and performance of the cooler 1 can be reduced.

【００４６】次に、本発明の第３の実施の形態を説明す
る。図３は本発明の第３の実施の形態に係わる半導体冷
却装置の説明図であり、図３（ａ）は正面図、図３
（ｂ）は車両の床下に取り付けられた状態で図３（ａ）
の矢印Ａ方向から見た側面図である。この第３の実施の
形態は、図２に示す第２の実施の形態に対し、受熱部５
側の一体構造の放熱フィン３Ａにヒートパイプ２Ａを付
設したものである。これにより、受熱部５の中央部の熱
をヒートパイプ２Ａにより一体構造の放熱フィン３Ａに
熱輸送し冷却効果を高める。その他の構成は、図２に示
す第２の実施の形態と同一であるので、同一要素には同
一符号を付し重複する説明は省略する。Next, a third embodiment of the present invention will be described. FIG. 3 is an explanatory view of a semiconductor cooling device according to a third embodiment of the present invention. FIG. 3 (a) is a front view, FIG.
FIG. 3 (b) shows a state where it is installed under the floor of the vehicle.
2 is a side view as viewed from the direction of arrow A. FIG. This third embodiment is different from the second embodiment shown in FIG.
A heat pipe 2A is attached to a radiation fin 3A having an integral structure on the side. Thereby, the heat of the central part of the heat receiving part 5 is transported by the heat pipe 2A to the radiating fins 3A having an integral structure, thereby enhancing the cooling effect. The other configuration is the same as that of the second embodiment shown in FIG. 2, and therefore, the same components are denoted by the same reference characters and overlapping description will be omitted.

【００４７】この第３の実施の形態においても放熱部６
が車体側面側となるよう、冷却器１が電力変換装置箱体
７に取り付けられ、受熱部５の半導体素子４の取り付く
面の反対側の面には２分割された放熱フィン３が設けら
れる。In the third embodiment, the heat radiating section 6 is also provided.
The cooler 1 is attached to the power converter box 7 so that the heat sink is located on the side of the vehicle body, and the heat radiating fin 3 divided into two is provided on the surface of the heat receiving portion 5 opposite to the surface on which the semiconductor element 4 is mounted.

【００４８】また、放熱部６の受熱部５側には一体構造
の放熱フィン３Ａが設けられており、一体構造の放熱フ
ィン３Ａの中央部には垂直に貫通するヒートパイプ２Ａ
が取り付けられている。このヒートパイプ２Ａは、上段
および下段の放熱フィン３に取り付けられたヒートパイ
プ２より短く構成されている。A radiating fin 3A having an integral structure is provided on the heat receiving portion 5 side of the radiating portion 6, and a heat pipe 2A vertically penetrating the central portion of the radiating fin 3A having the integral structure.
Is attached. The heat pipe 2A is shorter than the heat pipe 2 attached to the upper and lower radiating fins 3.

【００４９】次に作用を説明する。半導体素子４より発
生する熱は受熱部５からヒートパイプ２を介して２分割
された放熱フィン３に熱伝導され、２分割された放熱フ
ィン３の表面から大気へと熱放散される。Next, the operation will be described. The heat generated by the semiconductor element 4 is thermally conducted from the heat receiving portion 5 to the radiation fin 3 divided into two via the heat pipe 2, and is radiated from the surface of the radiation fin 3 into the atmosphere.

【００５０】車両走行時の走行風は車両走行時、車側側
では各々の放熱フィン３間および走行風通路１４を流
れ、大気への放熱性能が向上する。また、放熱フィン３
の受熱部５側では、上下段より短いヒートパイプ２Ａと
それに貫通する放熱フィン３Ａにより放熱が行われる。During traveling of the vehicle, the traveling wind flows between the radiation fins 3 and the traveling air passage 14 on the vehicle side on the vehicle side, and the heat radiation performance to the atmosphere is improved. In addition, the radiation fins 3
On the side of the heat receiving section 5, heat is radiated by the heat pipe 2A shorter than the upper and lower stages and the radiating fins 3A penetrating therethrough.

【００５１】この第３の実施の形態によれば、車両走行
時の走行風が車両進行方向より放熱フィン３間と走行風
通路１ ４を流れることで、上段の放熱フィン３上部へ
のあおりが減少し、走行風が流れにくい受熱部５側で
は、上下段より短いヒートパイプ２Ａにより、受熱部５
中段の熱を放熱フィン３Ａに熱輸送する。これにより、
受熱部５から放熱フィン３、３Ａへの熱輸送能力が向上
し、冷却器１の小形化や高性能化が可能となる。According to the third embodiment, the traveling wind at the time of traveling of the vehicle flows between the radiating fins 3 and the traveling wind passage 14 in the traveling direction of the vehicle. On the heat receiving section 5 side where the traveling wind is reduced and the traveling wind is difficult to flow, the heat receiving section 5 is formed by a heat pipe 2A shorter than the upper and lower stages.
The heat in the middle stage is transported to the radiation fins 3A. This allows
The ability to transport heat from the heat receiving portion 5 to the radiating fins 3 and 3A is improved, and the cooler 1 can be downsized and have high performance.

【００５２】次に、本発明の第４の実施の形態を説明す
る。図４は本発明の第４の実施の形態に係わる半導体冷
却装置の説明図であり、図４（ａ）は正面図、図４
（ｂ）は車両の床下に取り付けられた状態で図４（ａ）
の矢印Ａ方向から見た側面図である。Next, a fourth embodiment of the present invention will be described. FIG. 4 is an explanatory view of a semiconductor cooling device according to a fourth embodiment of the present invention. FIG.
FIG. 4 (b) shows a state where it is installed under the floor of the vehicle.
2 is a side view as viewed from the direction of arrow A. FIG.

【００５３】この第４の実施の形態は、図３に示す第３
の実施の形態に対し、受熱部５側の一体構造の放熱フィ
ン３Ａのピッチを狭く、２分割した放熱フィン３のピッ
チを広くしたものである。これにより、ピッチを狭くし
た受熱部５側の一体構造の放熱フィン３Ａおよびピッチ
を広くした２分割の放熱フィン３への走行風の通過効率
が向上し冷却効果を高める。その他の構成は、図３に示
す第３の実施の形態と同一であるので、同一要素には同
一符号を付し重複する説明は省略する。The fourth embodiment is similar to the third embodiment shown in FIG.
In this embodiment, the pitch of the heat dissipating fins 3A of the integral structure on the heat receiving portion 5 side is narrower and the pitch of the heat dissipating fins 3 divided into two is wider. Thereby, the passage efficiency of the traveling wind to the radiation fins 3A of the integral structure on the side of the heat receiving portion 5 with the narrower pitch and the radiation fins 3 of the two divisions with the wider pitch is improved, and the cooling effect is enhanced. The other configuration is the same as that of the third embodiment shown in FIG. 3, and therefore, the same components are denoted by the same reference characters and overlapping description will be omitted.

【００５４】冷却器１は、放熱部６が車体側面側となる
ように電力変換装置箱体７に取り付けられ、受熱部５の
半導体素子４の取り付く面の反対側の面には２分割され
た放熱フィン３が設けられる。The cooler 1 is mounted on the power converter box 7 such that the heat radiating portion 6 is on the side of the vehicle body, and is divided into two on the surface of the heat receiving portion 5 opposite to the surface on which the semiconductor element 4 is mounted. The radiation fins 3 are provided.

【００５５】放熱部５の受熱部６側には、一体構造とし
た放熱フィン３Ａを構成し、その一体構造の放熱フィン
３Ａの中央部に垂直に貫通するヒートパイプ２Ａを設け
る。このヒートパイプ２Ａは、上段および下段のヒート
パイプ２より短く形成されている。車側側の上下段の放
熱フィン３は、その取付けピッチが、受熱部５側の放熱
フィン３Ａの取付けピッチより広く取り付けている。On the heat receiving section 6 side of the heat radiating section 5, a heat radiating fin 3A having an integral structure is formed, and a heat pipe 2A vertically penetrating the center of the heat radiating fin 3A having the integral structure is provided. The heat pipe 2A is formed shorter than the upper and lower heat pipes 2. The mounting pitch of the upper and lower radiating fins 3 on the vehicle side is wider than the mounting pitch of the radiating fins 3A on the heat receiving unit 5 side.

【００５６】従って、放熱フィン３間の走行風の流れが
向上し、放熱フィン３の放熱効率が向上し、冷却器の小
形化や高性能化が可能となる。Therefore, the flow of the traveling wind between the radiating fins 3 is improved, the radiation efficiency of the radiating fins 3 is improved, and the cooler can be downsized and its performance can be improved.

【００５７】次に、本発明の第５の実施の形態を説明す
る。図５は本発明の第５の実施の形態に係わる半導体冷
却装置の説明図であり、図５（ａ）は正面図、図５
（ｂ）は車両の床下に取り付けられた状態で図５（ａ）
の矢印Ａ方向から見た側面図である。Next, a fifth embodiment of the present invention will be described. FIG. 5 is an explanatory view of a semiconductor cooling device according to a fifth embodiment of the present invention. FIG.
FIG. 5 (b) shows a state where it is mounted under the floor of the vehicle.
2 is a side view as viewed from the direction of arrow A. FIG.

【００５８】この第５の実施の形態は、図４に示す第４
の実施の形態に対し、２分割された放熱フィン３を貫通
するヒートパイプは、長さが異なるヒートパイプ２ａ、
２ｂを交互に組み合わせて構成したものである。これに
より、放熱フィン３との熱交換を効率的に行うと共に、
走行風の通過効率を向上させ冷却効果を高める。その他
の構成は、図４に示す第４の実施の形態と同一であるの
で、同一要素には同一符号を付し重複する説明は省略す
る。The fifth embodiment is similar to the fourth embodiment shown in FIG.
In the embodiment, the heat pipes penetrating the radiation fins 3 divided into two parts are heat pipes 2a having different lengths,
2b are alternately combined. Thereby, heat exchange with the radiation fins 3 is efficiently performed, and
Improves the passage efficiency of traveling wind and enhances the cooling effect. The other configuration is the same as that of the fourth embodiment shown in FIG. 4, and therefore, the same elements are denoted by the same reference numerals and overlapping description will be omitted.

【００５９】この第５の実施の形態においても、冷却器
１は、放熱部６が車体側面側となるように電力変換装置
箱体７に取り付けられ、受熱部５の半導体素子４の取り
付く面の反対側の面には２分割された放熱フィン３が設
けられる。Also in the fifth embodiment, the cooler 1 is mounted on the power conversion device box 7 so that the heat radiating portion 6 is on the side of the vehicle body, and the heat receiving portion 5 has a surface on which the semiconductor element 4 is mounted. The radiation fin 3 divided into two is provided on the opposite surface.

【００６０】また、放熱部６の受熱部５側には一体構造
の放熱フィン３Ａが設けられており、一体構造の放熱フ
ィン３Ａの中央部には垂直に貫通するヒートパイプ２Ａ
が取り付けられている。このヒートパイプ２Ａは、上段
および下段の放熱フィン３に取り付けられたヒートパイ
プ２より短く構成されている。また、２分割された上下
段の放熱フィン３には、垂直に貫通する長さが異なるヒ
ートパイプ２ａ、２ｂを交互に設けている。これによ
り、放熱フィン３間の走行風の流れが向上し、放熱フィ
ンの放熱効率を向上させる。A heat radiating fin 3A having an integral structure is provided on the heat receiving portion 5 side of the heat radiating portion 6, and a heat pipe 2A vertically penetrating the central portion of the heat radiating fin 3A having the integral structure.
Is attached. The heat pipe 2A is shorter than the heat pipe 2 attached to the upper and lower radiating fins 3. Further, heat pipes 2a and 2b having different lengths penetrating vertically are alternately provided in the upper and lower radiation fins 3 divided into two. Thereby, the flow of the traveling wind between the radiation fins 3 is improved, and the radiation efficiency of the radiation fins is improved.

【００６１】以上の説明では、第４の実施の形態に対し
てヒートパイプ２ａ、２ｂの長さを異なるようにした
が、第１の実施の形態乃至第３の実施の形態に対しても
同様に適用できることは言うまでもない。In the above description, the lengths of the heat pipes 2a and 2b are different from those of the fourth embodiment. However, the same applies to the first to third embodiments. Needless to say, it can be applied to.

【００６２】[0062]

【発明の効果】以上述べたように、本発明によれば、車
両走行時の走行風を有効に冷却器の冷却風として活用で
きるので、装置の小形軽量化が図れる。例えば、ブロア
の削除により装置の構成が簡素化され、部品種類や部品
点数の少ない信頼性の向上した装置が実現できる。As described above, according to the present invention, the traveling wind at the time of traveling of the vehicle can be effectively used as the cooling wind of the cooler, so that the device can be reduced in size and weight. For example, the configuration of the device is simplified by removing the blower, and a device with improved reliability with a small number of components and a small number of components can be realized.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１の実施の形態に係わる半導体冷却
装置の説明図。FIG. 1 is an explanatory view of a semiconductor cooling device according to a first embodiment of the present invention.

【図２】本発明の第２の実施の形態に係わる半導体冷却
装置の説明図。FIG. 2 is an explanatory view of a semiconductor cooling device according to a second embodiment of the present invention.

【図３】本発明の第３の実施の形態に係わる半導体冷却
装置の説明図。FIG. 3 is an explanatory view of a semiconductor cooling device according to a third embodiment of the present invention.

【図４】本発明の第４の実施の形態に係わる半導体冷却
装置の説明図。FIG. 4 is an explanatory diagram of a semiconductor cooling device according to a fourth embodiment of the present invention.

【図５】本発明の第５の実施の形態に係わる半導体冷却
装置の説明図。FIG. 5 is an explanatory view of a semiconductor cooling device according to a fifth embodiment of the present invention.

【図６】従来の半導体冷却装置の説明図。FIG. 6 is an explanatory view of a conventional semiconductor cooling device.

【符号の説明】[Explanation of symbols]

１…冷却器、２…ヒートパイプ、３…放熱フィン、４…
半導体素子、５…受熱部、６…放熱部、７…電力変換装
置箱体、８…密閉部、９…開放部、１０…境界板、１１
…保護カバー、１２…車体、１３…艤装限界、１４…走
行風通路1 ... cooler, 2 ... heat pipe, 3 ... radiator fin, 4 ...
Semiconductor element, 5: heat receiving section, 6: heat radiating section, 7: power converter box, 8: closed section, 9: open section, 10: boundary plate, 11
... Protective cover, 12 ... Car body, 13 ... Outfitting limit, 14 ... Running wind passage

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０２Ｍ 7/48 Ｈ０１Ｌ 23/46 Ｂ (72)発明者 福田 和明 東京都府中市東芝町１番地 株式会社東芝 府中事業所内 Ｆターム(参考） 5F036 AA01 BA08 BA25 BB05 BB60 5H007 BB06 CC03 HA06 5H740 BA01 BA11 BB07 BB08 MM08 NN17 PP06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H02M 7/48 H01L 23/46 B (72) Inventor Kazuaki Fukuda 1st Toshiba-cho, Fuchu-shi, Tokyo F-term (reference) at Toshiba Fuchu Office 5F036 AA01 BA08 BA25 BB05 BB60 5H007 BB06 CC03 HA06 5H740 BA01 BA11 BB07 BB08 MM08 NN17 PP06

Claims (8)

【特許請求の範囲】[Claims] 【請求項１】 鉄道車両床下に設置された電力変換装置
の半導体素子の発熱を受熱部で受熱し車両の走行風によ
り放熱部で放散する冷却器が車両進行方向に複数個並ん
で配置された半導体冷却装置において、前記冷却器の放
熱部は、前記受熱部の熱を車両の側方側に輸送するヒー
トパイプと、前記ヒートパイプに取り付けられ前記受熱
部から輸送された熱を放熱する放熱フィンとから形成さ
れ、中央部に走行風通路を設けたことを特徴とする半導
体冷却装置。1. A plurality of coolers for receiving heat generated by a semiconductor element of a power conversion device installed under a floor of a railway vehicle in a heat receiving portion and dissipating the heat in a heat radiating portion by a traveling wind of the vehicle are arranged side by side in the vehicle traveling direction. In the semiconductor cooling device, a radiator of the cooler includes a heat pipe for transporting heat of the heat receiver to a side of a vehicle, and a radiator fin attached to the heat pipe and radiating heat transported from the heat receiver. And a traveling air passage is provided at a central portion of the semiconductor cooling device. 【請求項２】 前記走行風通路は、前記放熱フィンを上
段と下段とに２分割して、２分割した放熱フィンの間に
形成されたことを特徴とする請求項１に記載の半導体冷
却装置。2. The semiconductor cooling device according to claim 1, wherein the traveling wind passage is formed between the radiation fins divided into two parts, the radiation fins being divided into an upper part and a lower part. . 【請求項３】 前記走行風通路は、車両進行方向に対し
他の冷却器の走行風通路とそれぞれ連通していることを
特徴とする請求項１に記載の半導体冷却装置。3. The semiconductor cooling device according to claim 1, wherein each of the traveling air passages communicates with a traveling air passage of another cooler in a traveling direction of the vehicle. 【請求項４】 前記走行風通路は、前記受熱部側の放熱
フィンは一体構造とし、その先端部の放熱フィンを上段
と下段とに２分割して、２分割した放熱フィンの間に形
成されたことを特徴とする請求項１に記載の半導体冷却
装置。4. The traveling wind passage is formed between the radiation fins divided into two by dividing the radiation fin on the side of the heat receiving portion into an integral structure and dividing the radiation fin at the tip into an upper stage and a lower stage. The semiconductor cooling device according to claim 1, wherein: 【請求項５】 前記受熱部側の一体構造の放熱フィンに
ヒートパイプを付設したことを特徴とする請求項４に記
載の半導体冷却装置。5. The semiconductor cooling device according to claim 4, wherein a heat pipe is attached to the radiation fin having an integral structure on the heat receiving portion side. 【請求項６】 前記受熱部側の一体構造の放熱フィンの
ピッチを狭く、２分割した放熱フィンのピッチを広くし
たことを特徴とする請求項４または請求項５に記載の半
導体冷却装置。6. The semiconductor cooling device according to claim 4, wherein the pitch of the radiation fins of the integral structure on the heat receiving portion side is narrow and the pitch of the radiation fins divided into two is wide. 【請求項７】 前記２分割された放熱フィンを貫通する
ヒートパイプは、長さが異なるヒートパイプを交互に組
み合わせて構成したことを特徴とする請求項１乃至請求
項６のいずれか１項に記載の半導体冷却装置。7. The heat pipe according to claim 1, wherein the heat pipe penetrating the radiation fins is formed by alternately combining heat pipes having different lengths. The semiconductor cooling device according to claim 1. 【請求項８】 前記冷却器の受熱部の半導体素子取付け
面の反対面に凹凸のスリットを設けたことを特徴とする
請求項１乃至請求項７のいずれか１項に記載の半導体冷
却装置。8. The semiconductor cooling device according to claim 1, wherein an uneven slit is provided on a surface of the heat receiving portion of the cooler opposite to a semiconductor element mounting surface.
JP2000249215A 2000-08-21 2000-08-21 Semiconductor cooling device Expired - Lifetime JP4011272B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009123755A (en) * 2007-11-12 2009-06-04 Toshiba Corp Electric power conversion device for railway vehicle
JP2012214222A (en) * 2012-06-15 2012-11-08 Toshiba Corp Power conversion device for rolling stock
CN103987607A (en) * 2011-12-09 2014-08-13 三菱电机株式会社 Cooling device for under-floor device for vehicle
JP2019179836A (en) * 2018-03-30 2019-10-17 日本電産株式会社 Cooling device

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JPS5447217A (en) * 1977-09-21 1979-04-13 Hitachi Ltd Self-cooling ventilation system for vehicle radiator
JPH06163770A (en) * 1992-11-25 1994-06-10 Hitachi Ltd Cooling device of inverter apparatus for electric train
JPH07190655A (en) * 1993-12-28 1995-07-28 Hitachi Ltd Heat pipe type cooling device
JPH08213522A (en) * 1995-02-02 1996-08-20 Toshiba Transport Eng Kk Control box of electric vehicle
JPH11201667A (en) * 1998-01-12 1999-07-30 Furukawa Electric Co Ltd:The Heat-pipe type cooler
JP2000161880A (en) * 1998-11-26 2000-06-16 Toshiba Corp Heat pipe type cooler

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549814A (en) * 1977-06-24 1979-01-25 Mitsubishi Electric Corp Cooler of electric apparatus for car
JPS5447217A (en) * 1977-09-21 1979-04-13 Hitachi Ltd Self-cooling ventilation system for vehicle radiator
JPH06163770A (en) * 1992-11-25 1994-06-10 Hitachi Ltd Cooling device of inverter apparatus for electric train
JPH07190655A (en) * 1993-12-28 1995-07-28 Hitachi Ltd Heat pipe type cooling device
JPH08213522A (en) * 1995-02-02 1996-08-20 Toshiba Transport Eng Kk Control box of electric vehicle
JPH11201667A (en) * 1998-01-12 1999-07-30 Furukawa Electric Co Ltd:The Heat-pipe type cooler
JP2000161880A (en) * 1998-11-26 2000-06-16 Toshiba Corp Heat pipe type cooler

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009123755A (en) * 2007-11-12 2009-06-04 Toshiba Corp Electric power conversion device for railway vehicle
CN103987607A (en) * 2011-12-09 2014-08-13 三菱电机株式会社 Cooling device for under-floor device for vehicle
CN103987607B (en) * 2011-12-09 2016-08-24 三菱电机株式会社 The cooling device of device under vehicle floor
JP2012214222A (en) * 2012-06-15 2012-11-08 Toshiba Corp Power conversion device for rolling stock
JP2019179836A (en) * 2018-03-30 2019-10-17 日本電産株式会社 Cooling device
JP7139656B2 (en) 2018-03-30 2022-09-21 日本電産株式会社 Cooling system

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