JP2001277292A5 - - Google Patents
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- Publication number
- JP2001277292A5 JP2001277292A5 JP2000090239A JP2000090239A JP2001277292A5 JP 2001277292 A5 JP2001277292 A5 JP 2001277292A5 JP 2000090239 A JP2000090239 A JP 2000090239A JP 2000090239 A JP2000090239 A JP 2000090239A JP 2001277292 A5 JP2001277292 A5 JP 2001277292A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000090239A JP2001277292A (ja) | 2000-03-29 | 2000-03-29 | 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000090239A JP2001277292A (ja) | 2000-03-29 | 2000-03-29 | 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置 |
Publications (2)
Publication Number | Publication Date |
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JP2001277292A JP2001277292A (ja) | 2001-10-09 |
JP2001277292A5 true JP2001277292A5 (ja) | 2007-04-05 |
Family
ID=18605871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000090239A Pending JP2001277292A (ja) | 2000-03-29 | 2000-03-29 | 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001277292A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5237758B2 (ja) * | 2008-06-02 | 2013-07-17 | パナソニック株式会社 | 樹脂成形品及びその製造方法 |
JP2012040791A (ja) * | 2010-08-20 | 2012-03-01 | Toshiba Corp | 電子機器、コネクタ、および筐体の製造方法 |
EP3055749A4 (en) | 2013-10-10 | 2017-11-01 | Intel Corporation | Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices |
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2000
- 2000-03-29 JP JP2000090239A patent/JP2001277292A/ja active Pending