JP2001277292A5 - - Google Patents

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Publication number: JP2001277292A5
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2000090239A

Other versions

Filing date

2000-03-29

Publication date

2007-04-05

2000-03-29 Application filed filed Critical

2000-03-29 Priority to JP2000090239A priority Critical patent/JP2001277292A/ja

2000-03-29 Priority claimed from JP2000090239A external-priority patent/JP2001277292A/ja

2001-10-09 Publication of JP2001277292A publication Critical patent/JP2001277292A/ja

2007-04-05 Publication of JP2001277292A5 publication Critical patent/JP2001277292A5/ja

Status Pending legal-status Critical Current

JP2000090239A 2000-03-29 2000-03-29 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置 Pending JP2001277292A (ja)

Application Number	Priority Date	Filing Date	Title
JP2000090239A JP2001277292A (ja)	2000-03-29	2000-03-29	構造物およびその製造方法、ならびに筐体装置、携帯型端末装置

Application Number	Priority Date	Filing Date	Title
JP2000090239A JP2001277292A (ja)	2000-03-29	2000-03-29	構造物およびその製造方法、ならびに筐体装置、携帯型端末装置

Publication Number	Publication Date
JP2001277292A JP2001277292A (ja)	2001-10-09
JP2001277292A5 true JP2001277292A5 (ja)	2007-04-05

Application Number	Title	Priority Date	Filing Date
JP2000090239A Pending JP2001277292A (ja)	2000-03-29	2000-03-29	構造物およびその製造方法、ならびに筐体装置、携帯型端末装置

Country	Link
JP (1)	JP2001277292A (ja)

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JP2012040791A (ja) *	2010-08-20	2012-03-01	Toshiba Corp	電子機器、コネクタ、および筐体の製造方法
EP3055749A4 (en)	2013-10-10	2017-11-01	Intel Corporation	Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices