JP2001203306A - Radiating device for heat generating component - Google Patents
Radiating device for heat generating componentInfo
- Publication number
- JP2001203306A JP2001203306A JP2000011087A JP2000011087A JP2001203306A JP 2001203306 A JP2001203306 A JP 2001203306A JP 2000011087 A JP2000011087 A JP 2000011087A JP 2000011087 A JP2000011087 A JP 2000011087A JP 2001203306 A JP2001203306 A JP 2001203306A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generating component
- heat radiating
- joint
- radiating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、トランジスタやI
C等の発熱部品の放熱を目的とするL字状の放熱装置に
関し、さらに詳しくは、L字状継手を用いて曲げ部の熱
抵抗を最小限にすることができるL字状の発熱部品用放
熱装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention
More specifically, the present invention relates to an L-shaped heat radiating device for radiating heat generated by a heat-generating component such as C, and more particularly, to an L-shaped heat-generating component capable of minimizing the thermal resistance of a bent portion using an L-shaped joint. It relates to a heat dissipation device.
【0002】[0002]
【従来の技術】トランジスタやIC等の発熱部品の内部
で発生する熱を放熱する従来の放熱装置として、図3、
図4に示すような放熱装置が知られている。図3に示す
放熱装置は、アルミ、銅、鉄等からなる平板状の板体か
らなる放熱板11をプリント基板13に取り付け、この
放熱板11に発熱部品14を平面と平面が密着した状態
で取り付け、発熱部品14を冷却していた。また、図4
に示す放熱装置のように、放熱板12を断面L字状とす
ることにより、放熱板12の放熱面積を確保するように
したものも知られている。2. Description of the Related Art As a conventional radiator for radiating heat generated inside a heat-generating component such as a transistor or an IC, FIG.
A heat dissipation device as shown in FIG. 4 is known. In the heat radiating device shown in FIG. 3, a heat radiating plate 11 made of a flat plate made of aluminum, copper, iron, or the like is attached to a printed circuit board 13, and a heat-generating component 14 is attached to the heat radiating plate 11 in a state where the flat surfaces are in close contact with each other. The mounting and the heat-generating component 14 were cooled. FIG.
As shown in FIG. 2, there is also known a device in which the heat radiating plate 12 has an L-shaped cross section to secure a heat radiating area of the heat radiating plate 12.
【0003】[0003]
【発明が解決しようとする課題】ところで、電源の小型
化に伴い、図3に示すような平板状の放熱板を用いた放
熱装置では、大出力化による放熱に必要な面積が十分に
確保できない。また、図3の改良型としての図4に示す
ようなL字状の放熱板は、アルミ、銅、鉄等からなる平
板をほぼ直角に曲げ加工することにより形成するのが一
般的であるが、金属板を曲げ加工すると、曲げた部分で
の熱抵抗が増加し、曲げる前後で約15℃程の温度差が
生じ、放熱板の面積を増加しただけの効果が生じず、期
待したほどの放熱効果が得られないということがあっ
た。そこで、本発明の目的は、屈曲部での熱抵抗を増や
さず、放熱効果の高い発熱部品用放熱装置を提供するこ
とである。By the way, with the miniaturization of the power supply, a heat radiating device using a flat heat radiating plate as shown in FIG. 3 cannot secure a sufficient area for heat radiation by increasing the output. . Also, an L-shaped heat sink as shown in FIG. 4 as an improved type of FIG. 3 is generally formed by bending a flat plate made of aluminum, copper, iron, or the like at substantially right angles. However, when a metal plate is bent, the thermal resistance at the bent portion increases, a temperature difference of about 15 ° C. occurs before and after bending, and the effect of merely increasing the area of the heat sink does not occur. In some cases, a heat radiation effect could not be obtained. Therefore, an object of the present invention is to provide a heat radiating device for a heat generating component having a high heat radiating effect without increasing a thermal resistance at a bent portion.
【0004】[0004]
【課題を解決するための手段】本発明は、前記目的を達
成するためになされたものであって、第1の技術手段
は、発熱部品用放熱装置において、2枚の平板状放熱板
が接続部によってL字状に形成されることを特徴とす
る。Means for Solving the Problems The present invention has been made to achieve the above object, and a first technical means is a heat radiating device for a heat generating component, wherein two flat radiating plates are connected. It is characterized by being formed in an L shape by the portion.
【0005】第2の技術手段は、第1の技術手段の発熱
部品用放熱装置において、前記接続部はL字状継手から
なることを特徴とする。According to a second technical means, in the heat radiating device for a heat-generating component according to the first technical means, the connecting portion comprises an L-shaped joint.
【0006】第3の技術手段は、第2の技術手段の発熱
部品用放熱装置において、前記L字状継手の接続端部に
はコ字状の溝が形成され、該コ字状の溝に前記平板状放
熱板の端部が嵌合されることを特徴とする。According to a third technical means, in the heat radiating device for a heat generating component according to the second technical means, a U-shaped groove is formed at a connection end of the L-shaped joint, and the U-shaped groove is formed in the U-shaped groove. An end of the flat heat radiating plate is fitted.
【0007】第4の技術手段は、第3の技術手段の発熱
部品用放熱装置において、前記コ字状の溝の内面または
前記放熱板の端部に凹凸が形成されることを特徴とす
る。According to a fourth technical means, in the heat radiating device for a heat generating component according to the third technical means, irregularities are formed on an inner surface of the U-shaped groove or an end of the heat radiating plate.
【0008】(作用)本発明は、放熱板を直接曲げるの
ではなく、曲げ部と接続端部を備えた継手により2枚の
放熱板を接合して所望する形状にし、最小限の面積で最
大限の放熱効果を有する発熱部品用放熱装置を提供する
ことができる。(Function) In the present invention, instead of directly bending the heat sink, the two heat sinks are joined to each other by a joint having a bent portion and a connection end to form a desired shape, and a maximum area is obtained with a minimum area. It is possible to provide a heat radiating device for a heat generating component having a limited heat radiating effect.
【0009】[0009]
【発明の実施の形態】本発明の実施の形態を図1、図2
に示す実施例に基づいて説明する。図1は、本発明の実
施例の発熱部品用放熱装置を使用した放熱構造を示す側
面図であり、図2は図1に示す継手の部分を拡大して示
す斜視図である。以下の記載では、主に図3、図4に示
す従来例の放熱構造と異なる部分について説明する。1 and 2 show an embodiment of the present invention.
A description will be given based on the embodiment shown in FIG. FIG. 1 is a side view showing a heat radiating structure using a heat radiating device for a heat generating component according to an embodiment of the present invention, and FIG. 2 is an enlarged perspective view showing a joint part shown in FIG. In the following description, portions different from the heat dissipation structure of the conventional example shown in FIGS. 3 and 4 will be mainly described.
【0010】本実施例の放熱装置は、図4に示した従来
例のように平板を直接曲げるのではなく、平板状の放熱
板1,2を、曲げ部31と接続端部32,33を備えた
継手3により接続してL字状等の所望の形状に形成す
る。また、継手3は、金属板を曲げ加工するのではな
く、放熱板1と同様にアルミ、銅、鉄等の熱伝導率の良
い材料を用いて、例えば押し出し成形、または金型成形
等により作製する。このような製法によれば、曲げた部
分での金属の分子構造に変化が生じなく、金属素材の熱
伝導率が変化することがないので、熱抵抗もほぼ金属素
材の熱抵抗に保たれ、曲げ部の熱抵抗を最小限にするこ
とができる。The heat radiating device of the present embodiment does not directly bend a flat plate as in the conventional example shown in FIG. They are connected by the provided joint 3 to form a desired shape such as an L-shape. The joint 3 is not formed by bending a metal plate, but is formed by using a material having good thermal conductivity such as aluminum, copper, iron or the like, for example, by extrusion molding or die molding, similarly to the heat sink 1. I do. According to such a manufacturing method, the molecular structure of the metal at the bent portion does not change, and the thermal conductivity of the metal material does not change, so that the thermal resistance is almost maintained at the thermal resistance of the metal material, The thermal resistance of the bent part can be minimized.
【0011】図2は、継手3を拡大して詳細に示す斜視
図であって、継手3の略90゜をなす曲げ部31の接続
端部32,33の端面にコ字状の溝が形成され、コ字状
の溝の内面全体に細かな凹凸が設けられている。継手3
に放熱板1,2を取り付けるには、圧入、圧着などの方
法が考えられ、接続端部32,33と放熱板1,2との
密着が向上し、接続端部32,33での熱抵抗の増加は
最小限に抑えることができる。細かな凹凸は、放熱板
1,2側に設けてもよく、接続端部32,33側及び放
熱板1,2側の両者に設け、両者をより密接に嵌合する
ようにしてもよい。このように継手3で放熱板1,2を
接合して形成する放熱装置は、最小限の面積で最大限の
放熱効果を有する放熱装置とすることができる。なお、
さらに放熱効果を向上させるため、放熱板1,2、継手
3にフィンを形成することができる。FIG. 2 is an enlarged perspective view showing the joint 3 in detail, wherein a U-shaped groove is formed on the end surfaces of the connecting ends 32 and 33 of the bent portion 31 forming substantially 90 ° of the joint 3. Then, fine irregularities are provided on the entire inner surface of the U-shaped groove. Fitting 3
In order to attach the heat radiating plates 1 and 2 to the heat sink, press-fitting, crimping, and the like can be considered, the adhesion between the connecting ends 32 and 33 and the heat radiating plates 1 and 2 is improved, and the heat resistance at the connecting ends 32 and 33 is improved. Increase can be minimized. Fine irregularities may be provided on the heat radiating plates 1 and 2 side, and may be provided on both the connection end portions 32 and 33 and the heat radiating plates 1 and 2 side so that both are fitted more closely. Thus, the heat radiating device formed by joining the heat radiating plates 1 and 2 with the joint 3 can be a heat radiating device having the maximum heat radiating effect with the minimum area. In addition,
In order to further improve the heat radiation effect, fins can be formed on the heat radiation plates 1 and 2 and the joint 3.
【0012】以上のような構成の発熱部品用放熱装置
を、ビス5を用いてプリント基板4に取り付け、放熱板
1にトランジスタやIC等の発熱部品6を密着した状態
で取り付ける。なお、本実施例において、放熱板1はL
字状に形成されているが、このL字状は曲げ加工によっ
て形成すればよく、また放熱装置をビス5によってプリ
ント基板4に取り付けのためのものであるから必須のも
のではない。The heat radiating device for a heat-generating component having the above-mentioned structure is mounted on the printed circuit board 4 by using screws 5, and the heat-generating component 6 such as a transistor or an IC is mounted on the heat radiating plate 1 in a state of being in close contact therewith. In this embodiment, the heat sink 1 is L
The L-shape may be formed by bending, and is not essential because the heat radiating device is used for attaching the heat radiating device to the printed circuit board 4 with the screw 5.
【0013】[0013]
【発明の効果】本発明は、以上のような構成であるの
で、L字状の放熱装置の曲げ部の熱抵抗が、従来のL字
型の放熱板に比し小さく、同じ放熱容量であればより小
さな面積の放熱板とすることが可能になり、同サイズの
放熱板であればより大きな放熱容量となり、より高出力
タイプの電源に用いることができる。また、継手を標準
化することにより、作製する金型の簡素化を図ることが
でき、金型のコストダウンを図ることができるととも
に、継手のコストダウンが図れ、安価で効率のよい放熱
装置を提供することができる。According to the present invention having the above-described configuration, the heat resistance of the bent portion of the L-shaped heat radiating device is smaller than that of the conventional L-shaped heat radiating plate, and the heat radiating device has the same heat radiating capacity. In this case, a heat radiating plate having a smaller area can be used, and a heat radiating plate of the same size has a larger heat radiating capacity and can be used for a power supply of a higher output type. In addition, by standardizing the joint, the mold to be manufactured can be simplified, the cost of the mold can be reduced, and the cost of the joint can be reduced, thereby providing an inexpensive and efficient heat dissipation device. can do.
【図1】本発明の発熱部品用放熱装置を用いた放熱構造
を示す側面図である。FIG. 1 is a side view showing a heat radiating structure using a heat radiating device for a heat generating component of the present invention.
【図2】本発明の発熱部品用放熱装置の接続部を拡大し
て示す部分斜視図である。FIG. 2 is an enlarged partial perspective view showing a connection portion of the heat-radiating component heat radiating device of the present invention.
【図3】従来の平板状放熱板を用いた放熱構造を示す斜
視図である。FIG. 3 is a perspective view showing a heat dissipation structure using a conventional flat heat dissipation plate.
【図4】従来のL字状放熱板を用いた放熱構造を示す斜
視図である。FIG. 4 is a perspective view showing a heat dissipation structure using a conventional L-shaped heat dissipation plate.
1,2…放熱板、3…継手、4…プリント基板、5…ビ
ス、6…発熱部品、31…曲げ部、32,33…接続端
部。Reference numerals 1 and 2 radiator plates, 3 joints, 4 printed circuit boards, 5 screws, 6 heat generating components, 31 bent portions, 32, 33 connection end portions.
Claims (4)
字状に形成されることを特徴とする発熱部品用放熱装
置。1. The two flat heat radiating plates are connected to each other by a connecting portion.
A heat radiating device for a heat-generating component, which is formed in a letter shape.
おいて、前記接続部はL字状継手からなることを特徴と
する発熱部品用放熱装置。2. The heat-dissipating device for a heat-generating component according to claim 1, wherein said connecting portion comprises an L-shaped joint.
いて、前記L字状継手の接続端部にはコ字状の溝が形成
され、該コ字状の溝に前記平板状放熱板の端部が嵌合さ
れることを特徴とする発熱部品用放熱装置。3. The heat radiating device for a heat generating component according to claim 2, wherein a U-shaped groove is formed at a connection end of the L-shaped joint, and the U-shaped groove is provided with the flat plate radiating plate. A heat dissipating device for a heat-generating component, the end of which is fitted.
おいて、前記コ字状の溝の内面または前記放熱板の端部
に凹凸が形成されることを特徴とする発熱部品用放熱装
置。4. The heat radiating device for a heat generating component according to claim 3, wherein irregularities are formed on an inner surface of the U-shaped groove or an end of the heat radiating plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000011087A JP2001203306A (en) | 2000-01-20 | 2000-01-20 | Radiating device for heat generating component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000011087A JP2001203306A (en) | 2000-01-20 | 2000-01-20 | Radiating device for heat generating component |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001203306A true JP2001203306A (en) | 2001-07-27 |
Family
ID=18539000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000011087A Pending JP2001203306A (en) | 2000-01-20 | 2000-01-20 | Radiating device for heat generating component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001203306A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7733632B2 (en) | 2007-01-23 | 2010-06-08 | Sumitomo Wiring Systems, Ltd. | Vehicle-mounted electrical junction box |
CN115190740A (en) * | 2022-06-28 | 2022-10-14 | 江苏富联通讯技术有限公司 | High-heat-dissipation 5G communication module and rapid assembly method thereof |
-
2000
- 2000-01-20 JP JP2000011087A patent/JP2001203306A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7733632B2 (en) | 2007-01-23 | 2010-06-08 | Sumitomo Wiring Systems, Ltd. | Vehicle-mounted electrical junction box |
CN115190740A (en) * | 2022-06-28 | 2022-10-14 | 江苏富联通讯技术有限公司 | High-heat-dissipation 5G communication module and rapid assembly method thereof |
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