IL264175B1 - Processing apparatus managing method and processing apparatus - Google Patents
Processing apparatus managing method and processing apparatusInfo
- Publication number
- IL264175B1 IL264175B1 IL264175A IL26417519A IL264175B1 IL 264175 B1 IL264175 B1 IL 264175B1 IL 264175 A IL264175 A IL 264175A IL 26417519 A IL26417519 A IL 26417519A IL 264175 B1 IL264175 B1 IL 264175B1
- Authority
- IL
- Israel
- Prior art keywords
- processing apparatus
- managing method
- apparatus managing
- processing
- managing
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
- G05B19/40937—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine concerning programming of machining or material parameters, pocket machining
- G05B19/40938—Tool management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Automation & Control Theory (AREA)
- Geometry (AREA)
- Human Computer Interaction (AREA)
- Dicing (AREA)
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Multi-Process Working Machines And Systems (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018003121A JP7064887B2 (en) | 2018-01-12 | 2018-01-12 | Processing equipment management method and processing equipment |
Publications (3)
Publication Number | Publication Date |
---|---|
IL264175A IL264175A (en) | 2019-05-30 |
IL264175B1 true IL264175B1 (en) | 2023-09-01 |
IL264175B2 IL264175B2 (en) | 2024-01-01 |
Family
ID=66768910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL264175A IL264175B2 (en) | 2018-01-12 | 2019-01-09 | Processing apparatus managing method and processing apparatus |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7064887B2 (en) |
KR (1) | KR102592786B1 (en) |
CN (1) | CN110026884B (en) |
IL (1) | IL264175B2 (en) |
TW (1) | TWI805677B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017068630A (en) * | 2015-09-30 | 2017-04-06 | 株式会社牧野フライス製作所 | Control device of machine tool |
US20170132192A1 (en) * | 2014-03-20 | 2017-05-11 | Pfu Limited | Information processing device, display method and control program |
US20170308344A1 (en) * | 2016-04-25 | 2017-10-26 | Yokogawa Electric Corporation | Device maintenance apparatus, device maintenance method, and storage medium |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3076179B2 (en) | 1993-07-26 | 2000-08-14 | 株式会社ディスコ | Dicing equipment |
JP2002063240A (en) | 2000-06-06 | 2002-02-28 | Mori Seiki Co Ltd | Production management system |
US20050216228A1 (en) * | 2004-03-15 | 2005-09-29 | Tokyo Electron Limited | Method and system for correcting a fault in a semiconductor manufacturing system |
JP4777783B2 (en) | 2006-01-26 | 2011-09-21 | 株式会社ディスコ | Laser processing equipment |
JP5134216B2 (en) * | 2006-06-23 | 2013-01-30 | 株式会社ディスコ | Wafer processing result management method |
JP2008100247A (en) | 2006-10-18 | 2008-05-01 | Sintokogio Ltd | Safety starting method of facility apparatus in production of casting article and automobile internal article, and facility apparatus using the method |
JP5072691B2 (en) | 2008-04-04 | 2012-11-14 | 株式会社片岡製作所 | Laser light output measuring method and output measuring device |
JP2012043041A (en) | 2010-08-13 | 2012-03-01 | Disco Abrasive Syst Ltd | Remote control system |
JP2014154633A (en) | 2013-02-06 | 2014-08-25 | Disco Abrasive Syst Ltd | Processing device |
CN106461691A (en) | 2014-05-30 | 2017-02-22 | 株式会社日立高新技术 | Automatic analysis device |
US10139311B2 (en) | 2014-09-26 | 2018-11-27 | Palo Alto Research Center Incorporated | Computer-implemented method and system for machine tool damage assessment, prediction, and planning in manufacturing shop floor |
WO2016157402A1 (en) * | 2015-03-31 | 2016-10-06 | 株式会社日立国際電気 | Substrate processing device, semiconductor device production method, and recording medium |
JP6607639B2 (en) * | 2015-12-24 | 2019-11-20 | 株式会社ディスコ | Wafer processing method |
JP6716160B2 (en) | 2016-05-31 | 2020-07-01 | 株式会社ディスコ | Processing device and processing method |
-
2018
- 2018-01-12 JP JP2018003121A patent/JP7064887B2/en active Active
-
2019
- 2019-01-07 CN CN201910011007.6A patent/CN110026884B/en active Active
- 2019-01-09 IL IL264175A patent/IL264175B2/en unknown
- 2019-01-10 KR KR1020190003151A patent/KR102592786B1/en active IP Right Grant
- 2019-01-11 TW TW108101142A patent/TWI805677B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170132192A1 (en) * | 2014-03-20 | 2017-05-11 | Pfu Limited | Information processing device, display method and control program |
JP2017068630A (en) * | 2015-09-30 | 2017-04-06 | 株式会社牧野フライス製作所 | Control device of machine tool |
US20170308344A1 (en) * | 2016-04-25 | 2017-10-26 | Yokogawa Electric Corporation | Device maintenance apparatus, device maintenance method, and storage medium |
Also Published As
Publication number | Publication date |
---|---|
KR102592786B1 (en) | 2023-10-20 |
JP7064887B2 (en) | 2022-05-11 |
CN110026884A (en) | 2019-07-19 |
IL264175A (en) | 2019-05-30 |
TWI805677B (en) | 2023-06-21 |
JP2019124989A (en) | 2019-07-25 |
CN110026884B (en) | 2022-06-24 |
TW201931279A (en) | 2019-08-01 |
KR20190086388A (en) | 2019-07-22 |
IL264175B2 (en) | 2024-01-01 |
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