GB2326523B - Chemical mechanical polishing methods using low ph slurry mixtures - Google Patents
Chemical mechanical polishing methods using low ph slurry mixturesInfo
- Publication number
- GB2326523B GB2326523B GB9726685A GB9726685A GB2326523B GB 2326523 B GB2326523 B GB 2326523B GB 9726685 A GB9726685 A GB 9726685A GB 9726685 A GB9726685 A GB 9726685A GB 2326523 B GB2326523 B GB 2326523B
- Authority
- GB
- United Kingdom
- Prior art keywords
- low
- mechanical polishing
- chemical mechanical
- polishing methods
- slurry mixtures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
- 239000002002 slurry Substances 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/976,605 US6362101B2 (en) | 1997-11-24 | 1997-11-24 | Chemical mechanical polishing methods using low pH slurry mixtures |
JP9346644A JPH11186200A (en) | 1997-11-24 | 1997-12-16 | Chemically/mechanically polishing method using slurry mixture of low ph value |
GB9726685A GB2326523B (en) | 1997-11-24 | 1997-12-17 | Chemical mechanical polishing methods using low ph slurry mixtures |
NL1007819A NL1007819C2 (en) | 1997-11-24 | 1997-12-17 | Chemical mechanical polishing methods using low pH slurry mixtures. |
DE19757119A DE19757119A1 (en) | 1997-11-24 | 1997-12-20 | Chemical mechanical polishing of tungsten@ via plugs |
FR9716332A FR2772986B1 (en) | 1997-11-24 | 1997-12-23 | CHEMICAL MECHANICAL POLISHING PROCESS USING LOW PH SUSPENSIONS |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/976,605 US6362101B2 (en) | 1997-11-24 | 1997-11-24 | Chemical mechanical polishing methods using low pH slurry mixtures |
JP9346644A JPH11186200A (en) | 1997-11-24 | 1997-12-16 | Chemically/mechanically polishing method using slurry mixture of low ph value |
GB9726685A GB2326523B (en) | 1997-11-24 | 1997-12-17 | Chemical mechanical polishing methods using low ph slurry mixtures |
FR9716332A FR2772986B1 (en) | 1997-11-24 | 1997-12-23 | CHEMICAL MECHANICAL POLISHING PROCESS USING LOW PH SUSPENSIONS |
NL1007897A NL1007897C1 (en) | 1997-12-24 | 1997-12-24 | Tensioning device for fabric cover on road vehicle |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9726685D0 GB9726685D0 (en) | 1998-02-18 |
GB2326523A GB2326523A (en) | 1998-12-23 |
GB2326523B true GB2326523B (en) | 1999-11-17 |
Family
ID=27515630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9726685A Expired - Fee Related GB2326523B (en) | 1997-11-24 | 1997-12-17 | Chemical mechanical polishing methods using low ph slurry mixtures |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2326523B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100416446B1 (en) * | 1998-06-25 | 2004-01-31 | 우노바 유.케이. 리미티드 | Wafer edge polishing method and apparatus |
JP2000208454A (en) * | 1999-01-18 | 2000-07-28 | Tokyo Seimitsu Co Ltd | Method of supplying abrasives to wafer polisher |
US6555466B1 (en) * | 1999-03-29 | 2003-04-29 | Speedfam Corporation | Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5516346A (en) * | 1993-11-03 | 1996-05-14 | Intel Corporation | Slurries for chemical mechanical polishing |
-
1997
- 1997-12-17 GB GB9726685A patent/GB2326523B/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5516346A (en) * | 1993-11-03 | 1996-05-14 | Intel Corporation | Slurries for chemical mechanical polishing |
Also Published As
Publication number | Publication date |
---|---|
GB9726685D0 (en) | 1998-02-18 |
GB2326523A (en) | 1998-12-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL121813A0 (en) | Multi-oxidizer slurry for chemical mechanical polishing | |
IL140301A0 (en) | Chemical mechanical polishing slurry and method for using same | |
SG95588A1 (en) | Polishing method | |
EP0773269A3 (en) | Polishing slurry | |
GB9703571D0 (en) | Diamond-containing body | |
AU8677698A (en) | Chemical mechanical polishing composition | |
SG66487A1 (en) | Wafer polishing apparatus | |
SG84551A1 (en) | Abrasive slurry and preparation process thereof | |
SG80597A1 (en) | Wafer polishing apparatus | |
SG90227A1 (en) | Polishing slurry | |
EP1095734A4 (en) | Polishing machine | |
GB2342878B (en) | Orbital sander | |
SG77175A1 (en) | Polishing apparatus | |
GB2309693B (en) | Cement grinding aid | |
HK1017399A1 (en) | Slurry wall means | |
TW479841U (en) | Polishing slurry supply apparatus | |
SG83794A1 (en) | Polishing slurry | |
GB2325260B (en) | Abrasives for well cleaning | |
SG82086A1 (en) | Submerge chemical-mechanical polishing | |
GB2329350B (en) | Improved grinding process | |
GB2326523B (en) | Chemical mechanical polishing methods using low ph slurry mixtures | |
GB9909037D0 (en) | Chemical mechanical polishing apparatus | |
GB9912751D0 (en) | Orbital sander | |
GB2335874B (en) | Wafer polishing | |
TW415215U (en) | Improved grinder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20091217 |