FR2917535B1 - Dispositif de protection electrique d'une charge - Google Patents

Dispositif de protection electrique d'une charge

Info

Publication number
FR2917535B1
FR2917535B1 FR0755766A FR0755766A FR2917535B1 FR 2917535 B1 FR2917535 B1 FR 2917535B1 FR 0755766 A FR0755766 A FR 0755766A FR 0755766 A FR0755766 A FR 0755766A FR 2917535 B1 FR2917535 B1 FR 2917535B1
Authority
FR
France
Prior art keywords
load
electrically protecting
protecting
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0755766A
Other languages
English (en)
Other versions
FR2917535A1 (fr
Inventor
Fabrice Guitton
Philippe Merceron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0755766A priority Critical patent/FR2917535B1/fr
Publication of FR2917535A1 publication Critical patent/FR2917535A1/fr
Application granted granted Critical
Publication of FR2917535B1 publication Critical patent/FR2917535B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05541—Structure
    • H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Fuses (AREA)
FR0755766A 2007-06-14 2007-06-14 Dispositif de protection electrique d'une charge Expired - Fee Related FR2917535B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0755766A FR2917535B1 (fr) 2007-06-14 2007-06-14 Dispositif de protection electrique d'une charge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0755766A FR2917535B1 (fr) 2007-06-14 2007-06-14 Dispositif de protection electrique d'une charge

Publications (2)

Publication Number Publication Date
FR2917535A1 FR2917535A1 (fr) 2008-12-19
FR2917535B1 true FR2917535B1 (fr) 2009-11-27

Family

ID=38947464

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0755766A Expired - Fee Related FR2917535B1 (fr) 2007-06-14 2007-06-14 Dispositif de protection electrique d'une charge

Country Status (1)

Country Link
FR (1) FR2917535B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0906750D0 (en) * 2009-04-18 2009-06-03 Nokia Corp A voltage suppressor component
US8659118B2 (en) 2011-07-29 2014-02-25 Infineon Technologies Ag Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1467631A (en) * 1974-03-01 1977-03-16 Lucas Electrical Ltd Fuse assembly
JPH05160265A (ja) * 1991-04-26 1993-06-25 American Teleph & Telegr Co <Att> 可遮断性接続
JP3067011B2 (ja) * 1994-11-30 2000-07-17 ソニーケミカル株式会社 保護素子及びその製造方法
US7205672B1 (en) * 2001-12-05 2007-04-17 National Semiconductor Corporation Flip chip mounted to thermal sensing element through the back side of the chip
GB0307306D0 (en) * 2003-03-29 2003-05-07 Goodrich Control Sys Ltd Fuse arrangement

Also Published As

Publication number Publication date
FR2917535A1 (fr) 2008-12-19

Similar Documents

Publication Publication Date Title
FR2931594B1 (fr) Dispositif de protection d&#39;un circuit electrique contre les surtensions
FR2884723B1 (fr) Dispositif de protection d&#39;un dispositif d&#39;injection
FR2925216B1 (fr) Dispositif de protection contre les surtensions comportant un auxiliaire de deconnexion
EP2061123A4 (fr) Dispositif de protection contre les esd
TWI347667B (en) Esd protection circuit with active triggering
GB2422957B (en) Circuit protection devices having an integral barrier with grounding provision
ZA200802713B (en) Electrical distribution device including protection for overheating conditions
FR2917110B1 (fr) Dispositif de protection d&#39;une ouverture
FR2916909B1 (fr) Dispositif de protection des elements emboitables d&#39;un connecteur
EP2133973A4 (fr) Dispositif de protection de circuit
GB0719229D0 (en) Circuit protection device
FR2901816B1 (fr) Structure d&#39;enveloppe de protection pour un pilon
FR2918002B1 (fr) Agencement de securite pour le montage d&#39;une batterie
GB0608773D0 (en) An electrical generator protection system
FR2914348B1 (fr) Dispositif de protection d&#39;une ouverture d&#39;une construction
FR2965597B1 (fr) Dispositif de protection d&#39;un palier a roulement
FR2917535B1 (fr) Dispositif de protection electrique d&#39;une charge
FR2918216B3 (fr) Dispositif de connecteur electrique avec moyens de protection et maintien magnetique pour eclairage
FR2932214B1 (fr) Dispositif de protection d&#39;un ouvrant de vehicule
FR2864714B1 (fr) Dispositif de protection contre des surtensions a capacite de coupure de courant de suite amelioree
FR2958738B1 (fr) Dispositif de protection d&#39;un ouvrant d&#39;un vehicule assurant une optimisation du gabarit d&#39;ouverture.
FR2880468B1 (fr) Appareil de protection d&#39;une installation electrique a capacite de coupure amelioree
FR2877154B1 (fr) Dispositif perfectionne de protection d&#39;appareils electriques contre des surtensions
FR2952811B1 (fr) Dispositif de protection d&#39;une oreille
FR2920911B1 (fr) Dispositif electrique a protection differentielle

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20140228