EP4059047A4 - An apparatus and method for the minimization of undercut during a ubm etch process - Google Patents
An apparatus and method for the minimization of undercut during a ubm etch process Download PDFInfo
- Publication number
- EP4059047A4 EP4059047A4 EP20887509.6A EP20887509A EP4059047A4 EP 4059047 A4 EP4059047 A4 EP 4059047A4 EP 20887509 A EP20887509 A EP 20887509A EP 4059047 A4 EP4059047 A4 EP 4059047A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- minimization
- etch process
- undercut during
- ubm
- ubm etch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/685,640 US11069583B2 (en) | 2018-06-20 | 2019-11-15 | Apparatus and method for the minimization of undercut during a UBM etch process |
PCT/US2020/058479 WO2021096712A1 (en) | 2019-11-15 | 2020-11-02 | An apparatus and method for the minimization of undercut during a ubm etch process |
Publications (2)
Publication Number | Publication Date |
---|---|
EP4059047A1 EP4059047A1 (en) | 2022-09-21 |
EP4059047A4 true EP4059047A4 (en) | 2024-01-03 |
Family
ID=75912522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20887509.6A Pending EP4059047A4 (en) | 2019-11-15 | 2020-11-02 | An apparatus and method for the minimization of undercut during a ubm etch process |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP4059047A4 (en) |
TW (1) | TW202135187A (en) |
WO (1) | WO2021096712A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023113088A (en) * | 2022-02-02 | 2023-08-15 | オムロン株式会社 | Deviation amount measurement method, measurement device and program |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040208359A1 (en) * | 2001-11-07 | 2004-10-21 | Davar Pishva | Image highlight correction using illumination specific hsv color coordinate |
US20090046922A1 (en) * | 2005-07-04 | 2009-02-19 | Toru Yoshikawa | Surface Inspecting Apparatus |
US20120114220A1 (en) * | 2010-11-05 | 2012-05-10 | Hseb Dresden Gmbh | Inspection method |
US20140242731A1 (en) * | 2013-02-28 | 2014-08-28 | Solid State Equipment Llc | System and method for performing a wet etching process |
US20180061032A1 (en) * | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
-
2020
- 2020-11-02 WO PCT/US2020/058479 patent/WO2021096712A1/en unknown
- 2020-11-02 EP EP20887509.6A patent/EP4059047A4/en active Pending
- 2020-11-06 TW TW109138896A patent/TW202135187A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040208359A1 (en) * | 2001-11-07 | 2004-10-21 | Davar Pishva | Image highlight correction using illumination specific hsv color coordinate |
US20090046922A1 (en) * | 2005-07-04 | 2009-02-19 | Toru Yoshikawa | Surface Inspecting Apparatus |
US20120114220A1 (en) * | 2010-11-05 | 2012-05-10 | Hseb Dresden Gmbh | Inspection method |
US20140242731A1 (en) * | 2013-02-28 | 2014-08-28 | Solid State Equipment Llc | System and method for performing a wet etching process |
US20180061032A1 (en) * | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
Non-Patent Citations (2)
Title |
---|
CHALUPA ADAM ET AL: "Using High-Speed Video Analysis for Defect Investigation and Process Improvement", 2019 30TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), IEEE, 6 May 2019 (2019-05-06), pages 1 - 4, XP033592203, DOI: 10.1109/ASMC.2019.8791795 * |
See also references of WO2021096712A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW202135187A (en) | 2021-09-16 |
EP4059047A1 (en) | 2022-09-21 |
WO2021096712A1 (en) | 2021-05-20 |
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Legal Events
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
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17P | Request for examination filed |
Effective date: 20220613 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Free format text: PREVIOUS MAIN CLASS: H01L0021670000 Ipc: H01L0021660000 |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20231204 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/485 20060101ALN20231128BHEP Ipc: H01L 21/3213 20060101ALN20231128BHEP Ipc: H01L 21/67 20060101ALI20231128BHEP Ipc: H01L 21/66 20060101AFI20231128BHEP |