EP3679599A4 - High density multi-component and serial packages - Google Patents
High density multi-component and serial packages Download PDFInfo
- Publication number
- EP3679599A4 EP3679599A4 EP18853638.7A EP18853638A EP3679599A4 EP 3679599 A4 EP3679599 A4 EP 3679599A4 EP 18853638 A EP18853638 A EP 18853638A EP 3679599 A4 EP3679599 A4 EP 3679599A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- component
- high density
- density multi
- packages
- serial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81894—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
- H01L2224/81895—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
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- H01—ELECTRIC ELEMENTS
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83862—Heat curing
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83874—Ultraviolet [UV] curing
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83877—Moisture curing, i.e. curing by exposing to humidity, e.g. for silicones and polyurethanes
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/0651—Wire or wire-like electrical connections from device to substrate
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
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- H—ELECTRICITY
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
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- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
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- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15159—Side view
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Powder Metallurgy (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/699,654 US10681814B2 (en) | 2017-09-08 | 2017-09-08 | High density multi-component packages |
US15/804,515 US10707145B2 (en) | 2017-09-08 | 2017-11-06 | High density multi-component packages |
US15/852,799 US10178770B1 (en) | 2017-12-22 | 2017-12-22 | Higher density multi-component and serial packages |
PCT/US2018/050142 WO2019051346A1 (en) | 2017-09-08 | 2018-09-10 | High density multi-component and serial packages |
Publications (2)
Publication Number | Publication Date |
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EP3679599A1 EP3679599A1 (en) | 2020-07-15 |
EP3679599A4 true EP3679599A4 (en) | 2021-05-26 |
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EP18853638.7A Pending EP3679599A4 (en) | 2017-09-08 | 2018-09-10 | High density multi-component and serial packages |
Country Status (4)
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EP (1) | EP3679599A4 (en) |
JP (1) | JP7121797B2 (en) |
CN (1) | CN111052347B (en) |
WO (1) | WO2019051346A1 (en) |
Families Citing this family (2)
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WO2022055853A2 (en) * | 2020-09-10 | 2022-03-17 | Kemet Electronics Corporation | Dielectric ceramic composition and ceramic capacitor using the same |
KR20220078887A (en) | 2020-12-04 | 2022-06-13 | 삼성전기주식회사 | Electronic component |
Citations (4)
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US20140002952A1 (en) * | 2010-05-26 | 2014-01-02 | Kemet Electrinics Corporation | Leadless Multi-Layered Ceramic Capacitor Stacks |
US20160205769A1 (en) * | 2015-01-08 | 2016-07-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and board having the same |
US20170099727A1 (en) * | 2015-10-01 | 2017-04-06 | Samsung Electro-Mechanics Co., Ltd. | Composite electronic component and board on which composite electronic component is mounted |
US20170169956A1 (en) * | 2015-12-09 | 2017-06-15 | Kemet Electronics Corporation | Bulk MLCC Capacitor Module |
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JP2002280862A (en) * | 2001-03-19 | 2002-09-27 | Murata Mfg Co Ltd | Composite lc filter circuit and composite lc filter component |
JP2005216884A (en) * | 2004-01-27 | 2005-08-11 | Matsushita Electric Ind Co Ltd | Circuit board and chip mounting method |
CN101467500B (en) * | 2006-06-27 | 2012-08-08 | 松下电器产业株式会社 | Interconnect substrate and electronic circuit mounted structure |
US10366836B2 (en) * | 2010-05-26 | 2019-07-30 | Kemet Electronics Corporation | Electronic component structures with reduced microphonic noise |
JP2012248812A (en) * | 2011-05-31 | 2012-12-13 | Sumitomo Electric Ind Ltd | Manufacturing method of semiconductor optical integrated element |
US9171672B2 (en) * | 2011-06-27 | 2015-10-27 | Kemet Electronics Corporation | Stacked leaded array |
US8767408B2 (en) * | 2012-02-08 | 2014-07-01 | Apple Inc. | Three dimensional passive multi-component structures |
US9357634B2 (en) * | 2012-04-27 | 2016-05-31 | Kemet Electronics Corporation | Coefficient of thermal expansion compensating compliant component |
DE102013215149A1 (en) | 2013-08-01 | 2015-02-19 | Conti Temic Microelectronic Gmbh | Multi-stage sealing system for use in a motor vehicle control unit |
KR101607020B1 (en) * | 2014-10-23 | 2016-04-11 | 삼성전기주식회사 | Multi-layered ceramic electronic components and board having the same mounted thereon |
JP6358132B2 (en) * | 2015-03-03 | 2018-07-18 | オムロン株式会社 | 3D circuit structure |
JP6520398B2 (en) * | 2015-05-27 | 2019-05-29 | Tdk株式会社 | Electronic parts |
US9867285B2 (en) * | 2015-06-09 | 2018-01-09 | Apple Inc. | Printed circuit board components |
JP6547569B2 (en) * | 2015-10-08 | 2019-07-24 | Tdk株式会社 | Electronic parts |
CN205542769U (en) * | 2015-11-30 | 2016-08-31 | 奥特斯(中国)有限公司 | Electronic device and electronic apparatus |
-
2018
- 2018-09-10 CN CN201880051521.6A patent/CN111052347B/en active Active
- 2018-09-10 JP JP2020513548A patent/JP7121797B2/en active Active
- 2018-09-10 EP EP18853638.7A patent/EP3679599A4/en active Pending
- 2018-09-10 WO PCT/US2018/050142 patent/WO2019051346A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20140002952A1 (en) * | 2010-05-26 | 2014-01-02 | Kemet Electrinics Corporation | Leadless Multi-Layered Ceramic Capacitor Stacks |
US20160205769A1 (en) * | 2015-01-08 | 2016-07-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and board having the same |
US20170099727A1 (en) * | 2015-10-01 | 2017-04-06 | Samsung Electro-Mechanics Co., Ltd. | Composite electronic component and board on which composite electronic component is mounted |
US20170169956A1 (en) * | 2015-12-09 | 2017-06-15 | Kemet Electronics Corporation | Bulk MLCC Capacitor Module |
Non-Patent Citations (1)
Title |
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See also references of WO2019051346A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2020534675A (en) | 2020-11-26 |
WO2019051346A1 (en) | 2019-03-14 |
CN111052347A (en) | 2020-04-21 |
EP3679599A1 (en) | 2020-07-15 |
JP7121797B2 (en) | 2022-08-18 |
CN111052347B (en) | 2024-03-01 |
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