EP2867954B1 - Kontaktelement zum verbinden mit einer leiterplatte, kontaktsystem und verfahren - Google Patents
Kontaktelement zum verbinden mit einer leiterplatte, kontaktsystem und verfahren Download PDFInfo
- Publication number
- EP2867954B1 EP2867954B1 EP13720895.5A EP13720895A EP2867954B1 EP 2867954 B1 EP2867954 B1 EP 2867954B1 EP 13720895 A EP13720895 A EP 13720895A EP 2867954 B1 EP2867954 B1 EP 2867954B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact element
- circuit board
- contact
- printed circuit
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
- H01R4/242—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
- H01R12/67—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals
- H01R12/675—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals with contacts having at least a slotted plate for penetration of cable insulation, e.g. insulation displacement contacts for round conductor flat cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
Definitions
- the invention relates to a contact element for connecting to a printed circuit board.
- the printed circuit board has at least one in particular electrically insulating substrate layer.
- the printed circuit board also has at least one in particular internal, electrically conductive layer.
- the electrically conductive layer is preferably connected to the substrate layer.
- the contact element is designed for connection to the electrically conductive layer.
- an electrically conductive inner layer of the circuit board is connected to a connecting element, such as a soldering pin or the like.
- the contact element can then be plugged onto the solder pin in the form of a plug.
- EP0228723 A2 shows a contact element according to the preamble of claim 1.
- EP0239422 A1 shows another contact element.
- an electrically conductive inner layer of a printed circuit board can be contacted without, for example, by means of milling or drilling, freeing the electrically conductive layer from the substrate over at least a surface area and thus exposing it.
- the electrically conductive layer of the printed circuit board forms an inner layer of the printed circuit board.
- the printed circuit board is preferably a multilayer printed circuit board, which has, for example, at least two electrically conductive layers, and-preferably according to a sandwich construction-the electrically conductive layers having insulating layers surrounding one another and the electrically conductive layers.
- the substrate layer is preferably an epoxy resin layer, more preferably a fiber-reinforced, in particular glass-fiber-reinforced epoxy resin layer.
- the contact element can advantageously cut through the substrate layer by means of the cutting edge formed in this way and, with the contact section, which preferably has a better electrical conductivity than the separating section, contact the electrically conductive layer in the region of the printed circuit board edge.
- the contact element preferably has at least two cutting edges and is designed to encompass the circuit board edge and to contact the electrically conductive layer by means of the two cutting edges from two sides.
- the contact element on two spaced-apart jaws, which engage around a longitudinally extending opening.
- the jaws each have at least one cutting edge.
- the cutting edges preferably extend with their longitudinal extent in the longitudinal direction of the opening. The cutting edges of the cutting edges extend from the jaws starting in the arranged between the jaws opening into it.
- the contact element has an opening tapering towards one end and extending longitudinally, wherein the cutting edge forms an opening edge of the opening.
- a pressing effect can advantageously be achieved, so that during insertion of the printed circuit board edge into the opening, the abovementioned clamping jaws can generate an increasing pressing force during insertion of the printed circuit board edge along the longitudinal extent of the opening.
- the contact element is U-shaped, wherein the U-legs are each formed by a jaw. At least one of the clamping jaws of the U-shaped contact element preferably has at least one cutting edge. More preferably, both jaws have at least one cutting edge.
- the cutting edges are each designed to extend in a straight line.
- the at least one cutting edge extends circumferentially about an axis of rotation and spaced radially from the axis of rotation.
- the contact element is preferably designed to cut by means of rotational movement about the axis of rotation in the circuit board edge. More preferably, the contact element is formed to sever the substrate layer with the separation section and to electrically contact the electrically conductive layer with the contact section.
- the aforementioned contact element with the circumferentially arranged about the rotation axis cutting edge is cylindrical, wherein the axis of rotation is coaxial to a cylinder longitudinal axis.
- the cylindrically shaped contact element is at least partially hollow cylindrical, so in the cavity when unscrewing the contact element on the circuit board edge of the circuit board edge can be at least partially received in the cavity.
- the separating section of the cutting edge is designed to be severed when pushed on, or in the case of the cylindrical contact element when being turned up, to cut fibers bound to the printed circuit board edge in the substrate layer.
- the fibers are for example glass fibers.
- the material of the cutting edge in the separation section steel or ceramic, and in the contact section on copper is at least partially made of copper, preferably pure copper.
- the copper is preferably oxygen-poor pure copper.
- Advantageous embodiments of the copper in the region of the contact portion are copper alloys, for example a copper-tin alloy, in particular CuSn4, CuSn6, or a copper alloy according to the US Standard United Numbering System C18018.
- the copper alloy comprises 0.8 to 1.8 percent nickel, 0.15 to 0.35 silicon and 0.01 to 0.05 percent phosphorus.
- the copper alloy is an alloy according to the standard UNS-C-19010.
- the copper alloy preferably has an admixture comprising chromium, silver, iron, titanium, silicon and for the most part copper.
- the proportions of the admixture are each preferably 0.5% chromium, 0.1% silver, 0.08% iron, 0.06% titanium and 0.03% silicon.
- An electrical conductivity of the contact portion is preferably at least 30, preferably 46 Mega-Siemens per meter.
- the cutting edge preferably has a coating comprising tin, bismuth, silver, gold, lead or a combination of these.
- the invention also relates to a contact system having at least one contact element according to the above-described type.
- the contact system comprises a printed circuit board with at least one substrate layer and at least one electrically conductive Layer.
- the material of the cutting edge of the contact element in the region of the contact portion is harder than the material of the electrically conductive layer.
- the material of the electrically conductive layer of the printed circuit board is formed by a pure copper, which is softer than the material of the cutting edge, in particular in the region of the contact portion.
- the harder or softer embodiment preferably refers to a Shore hardness and / or to a modulus of elasticity of the electrically conductive material.
- a plastic deformation of the electrically conductive layer of the printed circuit board may preferably be effected by the tapered, longitudinally extending opening.
- the contact element of the contact system is formed to be cold-welded between the contact portion of the cutting edge and the electrically conductive layer in the region of the printed circuit board edge when being pushed open or twisted open.
- the substrate layer to be severed by the cutting edge in particular by a cutting edge of the cutting edges, preferably has a thickness between five percent and thirty percent of the thickness of the printed circuit board, more preferably of at least one tenth of the thickness of the printed circuit board.
- a thickness of the substrate layer to be cut is at least 100 micrometers.
- the electrically conductive layer may be produced, for example, prior to lamination with the substrate layers by means of stamping.
- the electrically conductive layer has, for example, a layer thickness between 0.1 and 2 millimeters.
- the invention also relates to a method and connection of a printed circuit board with a contact element.
- the printed circuit board has at least one electrically conductive layer and at least one electrically insulating substrate layer connected to the electrically conductive layer.
- the substrate layer is severed, preferably by means of a separating section of a cutting knife, and the electrically conductive layer is electrically contacted in the region of the severed substrate layer, preferably by means of a contact section of the cutting knife.
- the substrate layer preferably has fibers, in particular glass fibers, and is severed together with the fibers.
- FIG. 1 shows - schematically - an embodiment of a contact system 1.
- the contact system 1 has a printed circuit board 3.
- the printed circuit board 3 has a substrate layer 4 and a substrate layer 4a, which are each formed in this embodiment by fiber-reinforced epoxy resin.
- the printed circuit board 1 also has three electrically conductive layers lying in the printed circuit board 1, namely the electrically conductive layer 5, the electrically conductive layer 6 and the electrically conductive layer 7.
- the electrically conductive layers 6 and 7 extend parallel to one another and are spaced apart and through another substrate layer isolated from each other.
- the electrically conductive layer 5 in this embodiment has a thickness dimension which is three times a thickness dimension of the substrate layers 4, and 4a, between which the electrically conductive layer 5 - is sandwiched - included.
- the contact system also has a contact element 8 and a contact element 9.
- the contact element 8 is U-shaped in this embodiment, wherein the U-legs each form a clamping jaw 19 and a clamping jaw 20.
- the jaws 19 and 20 together enclose an opening 13th
- the contact element 8 has in this embodiment a connected to the jaw 20 cutting blade, which forms the aforementioned cutting edge.
- the cutting blade has a cutting edge 10 and has along its longitudinal extent two mutually different materials, namely a harder material 24, in this embodiment steel, and a softer material compared to 21, in this embodiment, copper.
- the copper is formed in this embodiment by the aforementioned copper alloy C18018.
- the contact section 21 extends through a connecting section 27 connecting the clamping jaws 19 and 20, wherein in the region of an end which projects out of the connecting section 27, a terminal 16 is formed.
- the terminal 16 is connected in this embodiment with an electrical connection wire 25.
- the clamping jaw 19 has a cutting blade which has a separating section 23 and a contact section 22 along its longitudinal extent.
- the partition portion 23 is formed by steel in this embodiment, the contact portion 22 by the aforementioned copper alloy.
- the contact portion 22 is like the contact portion 21 passed through the connecting portion 27 and protrudes with an end portion of the connecting portion 27 and forms there a contact 17.
- the contact 17 is connected to an electrical connecting line 26.
- the cutting edge 10 cuts into the substrate layer 4a in the region of the separating section 24. If the contact element 8 is pushed further in the direction of the arrow 18 onto the end section of the printed circuit board 3, then the cutting edge 10 contacts the electrically conductive layer 5 on one side in the region of the contact section 21 and intersects there.
- the cutting edge 12 has with the separating portion 23, the substrate layer 4 on the opposite side on which the cutting edge 10 has cut into the substrate layer 4 a, cut into the substrate layer 4 and contacted there the electrically conductive layer 5.
- the contact portion 22 contacts the electrically conductive layer 5 on the opposite side.
- the cutting edges 10 and 12 are at a distance from each other in the region of the separating section 23 and 24, wherein the distance of the thickness dimension 14 of the electrically conductive layer 5 corresponds.
- the cutting edges 10 and 12 are at a distance from each other in the region of the contact portion 21 and 22, wherein the distance is equal to or smaller than the thickness dimension of the electrically conductive layer 5.
- the cutting edges 10 and 12 include in this embodiment, an angle 15 between them, so that the opening 13 between the legs in the region of the cutting edges 10 and 12 to the clamping jaws 19 and 20 connecting connecting portion is formed tapered. So can too Cut the cutting edges 10 and 12 in the electrically conductive layer and are each cold-welded with this.
- the elements of the contact element 9 with the same reference number correspond in property and function to those of the contact element 8 with the same reference numeral.
- the contact element 9 is already pushed onto an end section of the printed circuit board 3, which is opposite to the end section with the electrically conductive layer 5.
- the electrically conductive layer is contacted by the separating section 23 and by the contact section 22.
- the electrical connection 17 is thus in electrical operative connection with the electrically conductive layer 7.
- the separating section 24 has the substrate layer 4 a, which covers the electrically conductive layer 6 to the outside, cut, or in particular cut through, so that the separating portion 24 and the contact portion 21 can contact the electrically conductive layer 6 by means of the cutting edge 10 plastically deforming. As a result, a cold welding is formed, so that the contact portion 21 is in a particularly good and gas-tight electrically conductive connection with the electrically conductive layer 6.
- the electrical connection 16 thus contacts the electrically conductive layer 6 via the contact section 21 in the region of the incision or the plastic deformation of the electrically conductive layer 6 through the contact section 21, and additionally in the region of the separating section 24.
- FIG. 2 shows the in FIG. 1 already illustrated clamping jaw 20 in a plan view of the opening 13 on the cutting blade.
- the jaw 20 has in this embodiment four cutting blades, wherein the in FIG. 1 cutting knife already shown in the region of the entrance of the opening 13, the separating portion 24, and along a longitudinal direction of the cutting edge the contact portion 21.
- a to the cutting blade, comprising the separating portion 24 and the contact portion 21, parallel to this extending cutting blade has a separating portion 30 and a contact portion 31.
- a third cutting blade which leads to the cutting blade with the contact section 31 spaced apart and parallel, has a separating portion 31 and a contact portion 33.
- a fourth cutting blade has a separating section 34 and a contact section 35.
- FIG. 3 shows an embodiment of a contact element, which can contact an end portion of a printed circuit board according to the same principle as the previously described contact element 8, but not by means of a translational movement, but by means of a rotational movement about a rotation axis 50.
- the contact element 40 is cylindrical, and has two spaced blades 44 and 42 which enclose an opening 55 between them.
- the cutting edges 42 and 44 are each radially around the axis of rotation 50, which forms a cylindrical vertical axis of the contact element 40 in this embodiment, radially circumferentially spaced.
- the cutting edge 42 is part of a cutting blade, which in the region of an inlet region of the opening 55 has a separating section 46 and further along a longitudinal extension of the cutting edge 42 a contact section 45.
- the separating portion 46 is formed of steel in this embodiment, and the contact portion 45 of copper.
- the cutting edge 44 is part of another cutting blade, comprising the separating portion 48 and the contact portion 47, wherein the separating portion 48 made of steel and the contact portion 47 is formed of copper.
- the separating section 46 cuts into the substrate layer 4a, and the separating section 48 into the substrate layer 4.
- the electrically conductive layer 5 is sandwiched between the substrate layers 4 and 4a.
- the cutting edge 42 can follow the cutting track worked out in the substrate layer 4a by means of the separating section 46 and moving in the cutting track of the substrate layer 4a, contacting the electrically conductive layer 5 and cutting into it in a pressing manner.
- the cutting edges 42 and 44 are formed tapering towards one end of the opening 55, so that the opening 55 is formed tapered towards the end.
- FIG. 4 shows that in FIG. 3 illustrated contact element 40 in a sectional view along the in FIG. 3 Section 51 shown.
- the sectional plane of in FIG. 4 shown sectional view perpendicular to the axis of rotation 50.
- the contact element 40 has in the region of the axis of rotation 50, a center column 53, which - as in FIG. 3 shown - opens into a port 58.
- the contact element 40 can be so connected by means of the terminal 58 with an electrical connection line - for example via a plug connection.
- the contact element 40 is - as in FIG. 4 shown - partially hollow and has for this purpose a cavity 56, in which the end portion of the circuit board 3 can be received during the unscrewing of the contact element 40 on the circuit board edge.
- the cutting edge 42 has thereby cut into the electrically conductive layer 5 through the substrate layer 4a.
- FIG. 5 shows a cutting knife according to the invention, comprising a longitudinal portion 67, in which the separating portion 64 is formed.
- the cutting edge 61 has in the region of the separating portion 64 teeth 65, by means of the teeth 65, the cutting edge 61 fibers, especially glass fibers of an epoxy substrate layer easily cut.
- the teeth 65 are in this embodiment formed by hardened steel and are adapted to sever a substrate layer comprising epoxy resin and glass fibers.
- the cutting blade 60 has a contact section 62 in the region of a longitudinal section 66.
- the contact portion 62 is formed of copper, in particular a copper alloy, for example, an alloy according to the US-standard C18018 or the standard UNS C-19010.
- the cutting blade 60 can be used as a cutting blade on the contact element 8 shown in FIG. 1, the contact element 9 and / or the contact element 40 in FIG FIG. 3 be educated.
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012210921.8A DE102012210921A1 (de) | 2012-06-27 | 2012-06-27 | Kontaktelement zum Verbinden mit einer Leiterplatte, Kontaktsystem und Verfahren |
PCT/EP2013/058883 WO2014000920A1 (de) | 2012-06-27 | 2013-04-29 | Kontaktelement zum verbinden mit einer leiterplatte, kontaktsystem und verfahren |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2867954A1 EP2867954A1 (de) | 2015-05-06 |
EP2867954B1 true EP2867954B1 (de) | 2016-07-27 |
Family
ID=48325670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13720895.5A Not-in-force EP2867954B1 (de) | 2012-06-27 | 2013-04-29 | Kontaktelement zum verbinden mit einer leiterplatte, kontaktsystem und verfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US9484643B2 (zh) |
EP (1) | EP2867954B1 (zh) |
CN (1) | CN104412454A (zh) |
DE (1) | DE102012210921A1 (zh) |
WO (1) | WO2014000920A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012210921A1 (de) * | 2012-06-27 | 2014-01-23 | Robert Bosch Gmbh | Kontaktelement zum Verbinden mit einer Leiterplatte, Kontaktsystem und Verfahren |
US10132452B2 (en) * | 2013-03-14 | 2018-11-20 | Apex Technologies, Inc. | Suspended track and planar electrode systems and methods |
US10680383B2 (en) | 2013-03-14 | 2020-06-09 | Apex Technologies, Inc. | Linear electrode systems for module attachment with non-uniform axial spacing |
US20170299545A1 (en) * | 2016-04-19 | 2017-10-19 | Tyco Electronics Corporation | Sensor package having an electrical contact |
CN108054034B (zh) * | 2017-11-28 | 2019-03-15 | 宁波伊顿电力科技有限公司 | 一种闸刀 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3780431A (en) * | 1972-09-25 | 1973-12-25 | Bowmar Ali Inc | Process for producing computer circuits utilizing printed circuit boards |
US4490004A (en) * | 1982-08-11 | 1984-12-25 | Amp Incorporated | Connector for connecting insulated wires to a circuit board |
US4586772A (en) * | 1983-06-13 | 1986-05-06 | Amp Incorporated | Improved card edge connector |
EP0228723A3 (en) * | 1985-11-12 | 1987-12-23 | Reed Devices, Inc. | Modular idc terminal block assembly |
JPH0411346Y2 (zh) * | 1986-03-28 | 1992-03-19 | ||
GB8908411D0 (en) * | 1989-04-13 | 1989-06-01 | Amp Holland | Surface mount electrical connector |
US5006077A (en) * | 1989-07-28 | 1991-04-09 | Amp Incorporated | Insulation displacing barrel terminal |
US5345364A (en) * | 1993-08-18 | 1994-09-06 | Minnesota Mining And Manufacturing Company | Edge-connecting printed circuit board |
DE19921768A1 (de) * | 1999-05-11 | 2000-11-16 | Siemens Ag | Schneidklemmkontakt und Verbindungsklemme |
DE20008305U1 (de) * | 1999-10-13 | 2001-03-01 | Weidmüller Interface GmbH & Co, 32760 Detmold | Anschlußvorrichtung für elektrische Leiter |
US6616819B1 (en) * | 1999-11-04 | 2003-09-09 | Therasense, Inc. | Small volume in vitro analyte sensor and methods |
US20080286990A1 (en) * | 2003-12-02 | 2008-11-20 | Super Talent Electronics, Inc. | Direct Package Mold Process For Single Chip SD Flash Cards |
DE50000619D1 (de) * | 2000-02-04 | 2002-11-14 | Siemens Ag | Schneidklemmkontakt und Verbindungsklemme |
GB2360397A (en) * | 2000-03-15 | 2001-09-19 | Yazaki Europe Ltd | Connector with flexible circuit contacts |
US8102657B2 (en) * | 2003-12-02 | 2012-01-24 | Super Talent Electronics, Inc. | Single shot molding method for COB USB/EUSB devices with contact pad ribs |
DE102005005917B4 (de) * | 2005-02-09 | 2006-12-21 | Siemens Ag | Anschlussklemme für einen isolierten elektrischen Leiter |
JP4722756B2 (ja) * | 2006-04-14 | 2011-07-13 | モレックス インコーポレイテド | ケーブル接続用コネクタ |
EP2018702A1 (de) * | 2006-05-12 | 2009-01-28 | Baumer Electric AG | Näherungsschalter und verfahren zum kontaktieren eines sensorprints |
US8564986B2 (en) * | 2007-02-06 | 2013-10-22 | Kenneth E. Wing | Regulated output current and slope control |
CH699105A1 (de) * | 2008-07-11 | 2010-01-15 | Reichle & De Massari Fa | Schneidklemmkontakt und Kontaktierungsvorrichtung. |
US7736173B2 (en) * | 2008-09-16 | 2010-06-15 | Surtec Industries, Inc. | Insulation displacement contact (IDC) and IDC mounting system |
JP5353614B2 (ja) * | 2008-10-06 | 2013-11-27 | 日立化成株式会社 | 基板挿入用コネクタ及びその製造方法 |
US7749020B1 (en) * | 2008-12-22 | 2010-07-06 | Moxa Inc. | Positioning and grounding structure for ring connectors |
WO2010096714A2 (en) * | 2009-02-19 | 2010-08-26 | Touchdown Technologies, Inc. | Probe head for a microelectronic contactor assembly, the probe head having smt electronic components thereon |
DE102010014295A1 (de) * | 2010-04-08 | 2011-10-13 | Phoenix Contact Gmbh & Co. Kg | Steckverbinder zur Aufnahme eines mehradrigen Kabels |
KR20130143339A (ko) * | 2012-06-21 | 2013-12-31 | 삼성전자주식회사 | 각도조절 이어잭 모듈 |
DE102012210921A1 (de) * | 2012-06-27 | 2014-01-23 | Robert Bosch Gmbh | Kontaktelement zum Verbinden mit einer Leiterplatte, Kontaktsystem und Verfahren |
US20150099398A1 (en) * | 2013-10-07 | 2015-04-09 | Eli Benoliel | Connector for printed circuit boards |
-
2012
- 2012-06-27 DE DE102012210921.8A patent/DE102012210921A1/de not_active Withdrawn
-
2013
- 2013-04-29 EP EP13720895.5A patent/EP2867954B1/de not_active Not-in-force
- 2013-04-29 CN CN201380033956.5A patent/CN104412454A/zh active Pending
- 2013-04-29 US US14/411,551 patent/US9484643B2/en not_active Expired - Fee Related
- 2013-04-29 WO PCT/EP2013/058883 patent/WO2014000920A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20150162669A1 (en) | 2015-06-11 |
CN104412454A (zh) | 2015-03-11 |
DE102012210921A1 (de) | 2014-01-23 |
EP2867954A1 (de) | 2015-05-06 |
US9484643B2 (en) | 2016-11-01 |
WO2014000920A1 (de) | 2014-01-03 |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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17P | Request for examination filed |
Effective date: 20150127 |
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