EP2867954A1 - Contact element for connecting to a circuit board, contact system and method - Google Patents

Contact element for connecting to a circuit board, contact system and method

Info

Publication number
EP2867954A1
EP2867954A1 EP13720895.5A EP13720895A EP2867954A1 EP 2867954 A1 EP2867954 A1 EP 2867954A1 EP 13720895 A EP13720895 A EP 13720895A EP 2867954 A1 EP2867954 A1 EP 2867954A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
contact element
contact
electrically conductive
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13720895.5A
Other languages
German (de)
French (fr)
Other versions
EP2867954B1 (en
Inventor
Christian Klein
Thomas Wiesa
Rainer Schaefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2867954A1 publication Critical patent/EP2867954A1/en
Application granted granted Critical
Publication of EP2867954B1 publication Critical patent/EP2867954B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
    • H01R4/242—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
    • H01R12/67—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals
    • H01R12/675—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals with contacts having at least a slotted plate for penetration of cable insulation, e.g. insulation displacement contacts for round conductor flat cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits

Definitions

  • the invention relates to a contact element for connecting to a printed circuit board.
  • the printed circuit board has at least one in particular electrically insulating substrate layer.
  • the printed circuit board also has at least one in particular internal, electrically conductive layer.
  • the electrically conductive layer is preferably connected to the substrate layer.
  • the contact element is designed for connection to the electrically conductive layer.
  • an electrically conductive inner layer of the circuit board is connected to a connecting element, such as a soldering pin or the like.
  • the contact element can then be plugged onto the solder pin in the form of a plug.
  • the invention is particularly characterized in that the contact element is designed to be pushed onto a printed circuit board edge of the printed circuit board.
  • the contact element is designed to encompass the circuit board edge.
  • the contact element has at least one cutting blade with a cutting edge, wherein the cutting edge in the region of a separating section a harder metal than at a contact edge adjacent thereto along the cutting edge.
  • the cutting edge is formed to cut the substrate layer when pushed onto the printed circuit board edge with the separating section and to electrically contact the electrically conductive layer with the contact section.
  • an electrically conductive inner layer of a printed circuit board can be contacted without, for example, by means of milling or drilling, freeing and thus exposing the electrically conductive layer at least over a surface area of the substrate.
  • the electrically conductive layer of the printed circuit board preferably forms an inner layer of the printed circuit board.
  • the printed circuit board is preferably a multilayer printed circuit board, which has, for example, at least two electrically conductive layers, and-preferably according to a sandwich construction-the electrically conductive layers having insulating layers surrounding one another and the electrically conductive layers.
  • the substrate layer is preferably an epoxy resin layer, more preferably a fiber-reinforced, in particular glass-fiber-reinforced epoxy resin layer.
  • the contact element can advantageously cut through the substrate layer by means of the cutting edge formed in this way and, with the contact section, which preferably has a better electrical conductivity than the separating section, contact the electrically conductive layer in the region of the printed circuit board edge.
  • the contact element preferably has at least two cutting edges and is designed to encompass the circuit board edge and to contact the electrically conductive layer by means of the two cutting edges from two sides.
  • the contact element on two spaced-apart jaws, which engage around a longitudinally extending opening.
  • Jaws each have at least one cutting edge.
  • the cutting edges preferably extend with their longitudinal extent in the longitudinal direction of the opening.
  • the cutting edges of the cutting edges extend from the clamping Bake starting in the arranged between the jaws opening into it.
  • the contact element has an opening tapering towards one end and extending longitudinally, wherein the cutting edge forms an opening edge of the opening.
  • a pressing effect can advantageously be achieved, so that during insertion of the printed circuit board edge into the opening, the abovementioned clamping jaws can generate an increasing pressing force during insertion of the printed circuit board edge along the longitudinal extent of the opening.
  • the contact element is U-shaped, wherein the U-legs are each formed by a jaw. At least one of the clamping jaws of the U-shaped contact element preferably has at least one cutting edge. More preferably, both jaws have at least one cutting edge.
  • the cutting edges are each designed to extend in a straight line.
  • the at least one cutting edge extends circumferentially about an axis of rotation and spaced radially from the axis of rotation.
  • the contact element is preferably designed to cut by means of rotational movement about the axis of rotation in the circuit board edge. More preferably, the contact element is formed to sever the substrate layer with the separation section and to electrically contact the electrically conductive layer with the contact section.
  • the aforementioned contact element with the circumferentially arranged about the rotation axis cutting edge is cylindrical, wherein the axis of rotation is coaxial to a cylinder longitudinal axis.
  • the cylindrically shaped contact element is at least partially hollow cylindrical, so in the cavity when unscrewing the contact element on the circuit board edge of the circuit board edge can be at least partially received in the cavity.
  • the separating section of the cutting edge is designed to be severed when pushed on, or in the case of the cylindrical contact element when being turned up, to cut fibers bound to the printed circuit board edge in the substrate layer.
  • the fibers are for example glass fibers.
  • the material of the cutting edge in the separation section steel or ceramic, and in the contact section on copper is at least partially made of copper, preferably pure copper.
  • the copper is preferably oxygen-poor pure copper.
  • Advantageous embodiments of the copper in the region of the contact portion are copper alloys, for example a copper-tin alloy, in particular CuSn4, CuSn6, or a copper alloy according to the US Standard United Numbering System C18018.
  • the copper alloy comprises 0.8 to 1.8 percent nickel, 0.15 to 0.35 silicon, and 0.01 to 0.05 percent phosphorus.
  • the copper alloy is an alloy according to the standard UNS-C-19010.
  • the copper alloy preferably has an admixture comprising chromium, silver, iron, titanium, silicon and for the most part copper.
  • the proportions of the admixture are each preferably 0.5% chromium, 0.1% silver, 0.08% iron, 0.06% titanium and 0.03% silicon.
  • An electrical conductivity of the contact section is preferably at least 30, preferably 46 MegaSiemens per meter.
  • the cutting edge preferably has a coating comprising tin, bismuth, silver, gold, lead or a combination of these.
  • the invention also relates to a contact system having at least one contact element according to the above-described type.
  • the contact system comprises a printed circuit board with at least one substrate layer and at least one electrically conductive capable layer.
  • the material of the cutting edge of the contact element in the region of the contact portion is harder than the material of the electrically conductive layer.
  • the material of the electrically conductive layer of the printed circuit board is formed by a pure copper, which is softer than the material of the cutting edge, in particular in the region of the contact portion.
  • the harder or softer embodiment preferably refers to a Shore hardness and / or to a modulus of elasticity of the electrically conductive material.
  • a plastic deformation of the electrically conductive layer of the printed circuit board may preferably be effected by the tapered, longitudinally extending opening.
  • the contact element of the contact system is formed to be cold-welded between the contact portion of the cutting edge and the electrically conductive layer in the region of the printed circuit board edge when being pushed open or twisted open.
  • the substrate layer to be severed by the cutting edge in particular by a cutting edge of the cutting edges, preferably has a thickness between five percent and thirty percent of the thickness of the printed circuit board, more preferably of at least one tenth of the thickness of the printed circuit board.
  • a thickness of the substrate layer to be cut is at least 100 micrometers.
  • the electrically conductive layer may be produced, for example, prior to lamination with the substrate layers by means of stamping.
  • the electrically conductive layer has, for example, a layer thickness between 0, 1 and 2 millimeters.
  • the invention also relates to a method and connection of a printed circuit board with a contact element.
  • the printed circuit board has at least one electrically conductive layer and at least one electrically insulating substrate layer connected to the electrically conductive layer.
  • the substrate layer is severed, preferably by means of a separating section of a cutting knife, and the electrically conductive layer is electrically contacted in the region of the severed substrate layer, preferably by means of a contact section of the cutting knife.
  • the substrate layer preferably has fibers, in particular glass fibers, and is severed together with the fibers.
  • FIG. 1 shows an exemplary embodiment of a contact system comprising a multilayer printed circuit board with an inner layer of copper thick layers and with two contact elements contacting the copper thick layers in a longitudinal section;
  • Figure 2 shows the contact element shown in Figure 1 in a plan view of the cutting blade
  • Figure 3 shows a cylindrically shaped contact element, which can be turned on a circuit board edge
  • FIG. 4 shows the contact element shown in Figure 3 in a sectional view
  • FIG. 5 shows a variant for a cutting blade with a cutting edge which has teeth in the separating section.
  • FIG. 1 shows - schematically - an embodiment of a contact system 1.
  • the contact system 1 has a circuit board 3.
  • the printed circuit board 3 has a substrate layer 4 and a substrate layer 4a, which are each formed in this embodiment by fiber-reinforced epoxy resin.
  • the printed circuit board 1 also has three electrically conductive layers lying in the printed circuit board 1, namely the electrically conductive layer 5, the electrically conductive layer 6 and the electrically conductive layer 7.
  • the electrically conductive layers 6 and 7 extend parallel to one another and are spaced apart and through another substrate layer isolated from each other.
  • the electrically conductive layer 5 in this embodiment has a thickness dimension which is three times a thickness dimension of the substrate layers 4, and 4a, between which the electrically conductive layer 5 - in the manner of a sandwich - is included.
  • the contact system also has a contact element 8 and a contact element 9.
  • the contact element 8 is U-shaped in this embodiment, wherein the U-legs each form a clamping jaw 19 and a clamping jaw 20.
  • the jaws 19 and 20 together enclose an opening 13th
  • the contact element 8 has in this embodiment a connected to the jaw 20 cutting blade, which forms the aforementioned cutting edge.
  • the cutting blade has a cutting edge 10 and has along its longitudinal extent two mutually different materials, namely a harder material 24, in this embodiment steel, and a softer material compared to 21, in this embodiment, copper.
  • the copper is formed in this embodiment by the aforementioned copper alloy C18018.
  • the contact section 21 extends through a connecting section 27 connecting the clamping jaws 19 and 20, wherein in the region of an end which projects out of the connecting section 27, a terminal 16 is formed.
  • the terminal 16 is connected in this embodiment with an electrical connection wire 25.
  • the clamping jaw 19 has a cutting blade which has a separating section 23 and a contact section 22 along its longitudinal extent.
  • the partition portion 23 is formed by steel in this embodiment, the contact portion 22 by the aforementioned copper alloy.
  • the contact portion 22 is like the contact portion 21 passed through the connecting portion 27 and protrudes with an end portion of the connecting portion 27 and forms there a contact 17.
  • the contact 17 is connected to an electrical connection line 26.
  • the cutting edge 10 cuts into the substrate layer 4a in the region of the separating section 24. If the contact element 8 is pushed further in the direction of the arrow 18 onto the end section of the printed circuit board 3, then the cutting edge 10 contacts the electrically conductive layer 5 on one side in the region of the contact section 21 and intersects there.
  • Cutting edge 12 has with the separating portion 23, the substrate layer 4 on the opposite side, on which the cutting edge 10 has cut into the substrate layer 4 a, cut into the substrate layer 4 and contacted there the electrically conductive layer 5.
  • the end portion of the circuit board 3 contacts the contact portion 22, the electrically conductive layer 5 on the opposite side.
  • the cutting edges 10 and 12 are in the region of the separating section
  • the cutting edges 10 and 12 are at a distance from each other in the region of the contact portion 21 and 22, wherein the distance is equal to or smaller than the thickness dimension of the electrically conductive layer
  • the cutting edges 10 and 12 include in this embodiment, an angle 15 between each other, so that the opening 13 is formed between the legs in the region of the cutting edges 10 and 12 to the clamping jaws 19 and 20 connecting connecting portion tapers. So can too Cut the cutting edges 10 and 12 in the electrically conductive layer and are each cold-welded with this.
  • the elements of the contact element 9 with the same reference number correspond in property and function to those of the contact element 8 with the same reference numeral.
  • the contact element 9 is already pushed onto an end section of the printed circuit board 3, which is opposite to the end section with the electrically conductive layer 5.
  • the electrically conductive layer is contacted by the separating section 23 and by the contact section 22.
  • the electrical connection 17 is thus in electrical operative connection with the electrically conductive layer 7.
  • the separating section 24 has the substrate layer 4 a, which covers the electrically conductive layer 6 outwardly cut through, in particular cut or milled through, so that the separating portion 24 and the contact portion 21, the electrically conductive layer 6 by means of the cutting edge 10 plastically deforming contact can. As a result, a cold welding is formed, so that the contact portion 21 is in a particularly good and gas-tight electrically conductive connection with the electrically conductive layer 6.
  • the electrical connection 16 thus contacts the electrically conductive layer 6 via the contact section 21 in the region of the incision or the plastic deformation of the electrically conductive layer 6 through the contact section 21, and additionally in the region of the separating section 24.
  • FIG. 2 shows the clamping jaw 20 already shown in FIG. 1 in a plan view of the opening 13 on the cutting blades.
  • the clamping jaw 20 has four cutting blades, wherein the cutting blade already shown in FIG. 1 has the separating section 24 in the region of the entrance of the opening 13 and the contact section 21 along a longitudinal direction of the cutting edge and the contact portion 21, parallel to this spaced running cutting blade has a separating portion 30 and a contact portion 31.
  • a third cutting blade which leads to the cutting blade with the contact Section 31 is spaced and parallel, has a separating portion 31 and a contact portion 33.
  • a fourth cutting blade has a separating section 34 and a contact section 35.
  • Figure 3 shows an embodiment of a contact element, which can contact an end portion of a printed circuit board according to the same principle as the previously described contact element 8, but not by means of a translational movement, but by means of a rotational movement about an axis of rotation 50.
  • the contact element 40 is cylindrical, and has two mutually spaced cutting edges 44 and 42, which include an opening 55 between each other.
  • the cutting edges 42 and 44 are each radially around the axis of rotation 50, which forms a cylindrical vertical axis of the contact element 40 in this embodiment, radially circumferentially spaced.
  • the cutting edge 42 is part of a cutting blade, which in the region of an inlet region of the opening 55 has a separating section 46 and further along a longitudinal extension of the cutting edge 42 a contact section 45.
  • the separating portion 46 is formed of steel in this embodiment, and the contact portion 45 of copper.
  • the cutting edge 44 is part of another cutting blade, comprising the separating portion 48 and the contact portion 47, wherein the separating portion 48 made of steel and the contact portion 47 is formed of copper.
  • the separating section 46 cuts into the substrate layer 4a, and the separating section 48 into the substrate layer 4.
  • the electrically conductive layer 5 is sandwiched between the substrate layers 4 and 4a. If the contact element 40 is further rotated about the axis of rotation 50, the cutting edge 42 can follow the cutting track worked out in the substrate layer 4a by means of the separating section 46 and moving in the cutting track of the substrate layer 4a, contacting the electrically conductive layer 5 and cutting into it in a pressing manner.
  • the cutting edges 42 and 44 are formed tapering towards one end of the opening 55, so that the opening 55 is formed tapered towards the end.
  • FIG. 4 shows the contact element 40 shown in FIG. 3 in a sectional representation along the section 51 shown in FIG. 3.
  • the sectional plane of the sectional view illustrated in FIG. 4 runs perpendicular to the axis of rotation 50.
  • the contact element 40 has in the region of the axis of rotation 50 to a center column 53, which - as shown in Figure 3 - opens into a port 58.
  • the contact element 40 can be so connected by means of the terminal 58 with an electrical connection line - for example via a plug connection.
  • the contact element 40 is - as shown in Figure 4 - partially hollow and has for this purpose a cavity 56 in which the end portion of the circuit board 3 can be received during the unscrewing of the contact element 40 on the circuit board edge.
  • the cutting edge 42 has thereby cut into the electrically conductive layer 5 through the substrate layer 4a.
  • FIG. 5 shows a variant for a cutting knife, comprising a longitudinal section 67, in which the separating section 64 is formed.
  • the cutting edge 61 has in the region of the separating section 64 teeth 65, by means of the teeth 65, the cutting edge 61 fibers, in particular glass fibers of an epoxy substrate layer easily cut.
  • the teeth 65 are in this embodiment For example, formed by hardened steel and are formed to cut a substrate layer comprising epoxy resin and glass fibers.
  • the cutting blade 60 has a contact section 62 in the region of a longitudinal section 66.
  • the contact portion 62 is made of copper, in particular a copper alloy, for example, an alloy according to the US-standard C18018 or the standard UNS
  • the cutting blade 60 may be formed as a cutting blade on the contact element 8 shown in FIG. 1, the contact element 9 and / or the contact element 40 in FIG.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The invention relates to a contact element for connecting to a circuit board. The circuit board has at least one substrate layer, particularly an electrically insulating substrate layer. The circuit board also has at least one electrically conductive layer. The contact element is designed for connecting to the electrically conductive layer. According to the invention, the contact element is designed to be pushed onto a circuit board edge of the circuit board. The contact element is designed to reach over the circuit board edge and has at least one cutting blade with a cutting edge, the cutting edge having a harder metal in the area of a severing section than in an adjoining contact section alongside the cutting edge. The cutting edge is designed to cut through the substrate layer with the severing section when pushed onto the circuit board edge and to contact the electrically conductive layer electrically with the contact section.

Description

Beschreibung  description
Titel title
Kontaktelement zum Verbinden mit einer Leiterplatte, Kontaktsystem und Verfahren  Contact element for connection to a printed circuit board, contact system and method
Stand der Technik State of the art
Die Erfindung betrifft ein Kontaktelement zum Verbinden mit einer Leiterplatte. Die Leiterplatte weist wenigstens eine insbesondere elektrisch isolierende Substratschicht auf. Die Leiterplatte weist auch wenigstens eine insbesondere innenliegende, elektrisch leitfähige Schicht auf. Die elektrisch leitfähige Schicht ist bevorzugt mit der Substratschicht verbunden. Das Kontaktelement ist zum Verbinden mit der elektrisch leitfähigen Schicht ausgebildet.  The invention relates to a contact element for connecting to a printed circuit board. The printed circuit board has at least one in particular electrically insulating substrate layer. The printed circuit board also has at least one in particular internal, electrically conductive layer. The electrically conductive layer is preferably connected to the substrate layer. The contact element is designed for connection to the electrically conductive layer.
Bei aus dem Stand der Technik bekannten Systemen, bei denen ein Kontaktelement, welches beispielsweise mit einem Anschluss oder einem Anschlussdraht verbunden ist, wird eine elektrisch leitfähige Innenlage der Leiterplatte mit einem Anschlusselement, beispielsweise einem Lötnagel oder dergleichen verbunden. Das Kontaktelement kann dann in Form eines Steckers auf den Lötpin aufgesteckt werden. In known from the prior art systems in which a contact element which is connected, for example, with a terminal or a connecting wire, an electrically conductive inner layer of the circuit board is connected to a connecting element, such as a soldering pin or the like. The contact element can then be plugged onto the solder pin in the form of a plug.
Offenbarung der Erfindung  Disclosure of the invention
Die Erfindung ist insbesondere dadurch gekennzeichnet, dass das Kontaktelement ausgebildet ist, auf einen Leiterplattenrand der Leiterplatte aufgeschoben zu werden. Bevorzugt ist das Kontaktelement ausgebildet, den Leiterplattenrand zu umgreifen. Das Kontaktelement weist wenigstens ein Schneidmesser mit einer Schneidkante auf, wobei die Schneidkante im Bereich eines Trennabschnitts ein härteres Metall aufweist, als an einem entlang der Schneidkante dazu benachbarten Kontaktabschnitt. Bevorzugt ist die Schneidkante ausgebildet, die Substratschicht beim Aufgeschobenwerden auf den Leiterplattenrand mit dem Trennabschnitt zu durchtrennen und die elektrisch leitfähige Schicht mit dem Kontaktabschnitt elektrisch zu kontaktieren. The invention is particularly characterized in that the contact element is designed to be pushed onto a printed circuit board edge of the printed circuit board. Preferably, the contact element is designed to encompass the circuit board edge. The contact element has at least one cutting blade with a cutting edge, wherein the cutting edge in the region of a separating section a harder metal than at a contact edge adjacent thereto along the cutting edge. Preferably, the cutting edge is formed to cut the substrate layer when pushed onto the printed circuit board edge with the separating section and to electrically contact the electrically conductive layer with the contact section.
So kann vorteilhaft eine elektrisch leitfähige Innenschicht einer Leiterplatte kontaktiert werden, ohne beispielsweise mittels Fräsen oder Bohren die elektrisch leitfähige Schicht wenigstens auf einem Flächenbereich von dem Substrat zu be- freien und so freizulegen. Thus, advantageously, an electrically conductive inner layer of a printed circuit board can be contacted without, for example, by means of milling or drilling, freeing and thus exposing the electrically conductive layer at least over a surface area of the substrate.
Die elektrisch leitfähige Schicht der Leiterplatte bildet bevorzugt eine Innenlage der Leiterplatte. Die Leiterplatte ist bevorzugt eine Mehrschichtleiterplatte, welche beispielsweise wenigstens zwei elektrisch leitfähige Schichten, und - bevorzugt entsprechend einem Sandwichaufbau - die elektrisch leitfähigen Schichten einander isolierende, und die elektrisch leitfähigen Schichten umgebende Substratschichten aufweist. Die Substratschicht ist bevorzugt eine Epoxidharzschicht, weiter bevorzugt eine faserverstärkte, insbesondere glasfaserverstärkte Epoxidharzschicht. The electrically conductive layer of the printed circuit board preferably forms an inner layer of the printed circuit board. The printed circuit board is preferably a multilayer printed circuit board, which has, for example, at least two electrically conductive layers, and-preferably according to a sandwich construction-the electrically conductive layers having insulating layers surrounding one another and the electrically conductive layers. The substrate layer is preferably an epoxy resin layer, more preferably a fiber-reinforced, in particular glass-fiber-reinforced epoxy resin layer.
Das Kontaktelement kann mittels der so ausgebildeten Schneidkante vorteilhaft die Substratschicht durchtrennen und mit dem Kontaktabschnitt, welcher bevorzugt eine bessere elektrische Leitfähigkeit aufweist als der Trennabschnitt, die elektrisch leitfähige Schicht im Bereich des Leiterplattenrandes kontaktieren. The contact element can advantageously cut through the substrate layer by means of the cutting edge formed in this way and, with the contact section, which preferably has a better electrical conductivity than the separating section, contact the electrically conductive layer in the region of the printed circuit board edge.
Das Kontaktelement weist bevorzugt wenigstens zwei Schneidkanten auf und ist ausgebildet, den Leiterplattenrand zu umgreifen und die elektrisch leitfähige Schicht mittels der zwei Schneidkanten von zwei Seiten zu kontaktieren. Bevorzugt weist das Kontaktelement zwei zueinander beabstandete Klemmbacken auf, welche gemeinsam eine sich längs erstreckende Öffnung umgreifen. Die The contact element preferably has at least two cutting edges and is designed to encompass the circuit board edge and to contact the electrically conductive layer by means of the two cutting edges from two sides. Preferably, the contact element on two spaced-apart jaws, which engage around a longitudinally extending opening. The
Klemmbacken weisen jeweils wenigstens eine Schneidkante auf. Die Schneidkanten erstrecken sich bevorzugt mit ihrer Längserstreckung in Längsrichtung der Öffnung. Die Schneiden der Schneidkanten erstrecken sich von den Klemm- backen ausgehend in die zwischen den Klemmbacken angeordnete Öffnung hinein. Jaws each have at least one cutting edge. The cutting edges preferably extend with their longitudinal extent in the longitudinal direction of the opening. The cutting edges of the cutting edges extend from the clamping Bake starting in the arranged between the jaws opening into it.
In einer bevorzugten Ausführungsform weist das Kontaktelement eine sich zu einem Ende hin verjüngende und längs erstreckende Öffnung auf, wobei die Schneidkante einen Öffnungsrand der Öffnung bildet. In a preferred embodiment, the contact element has an opening tapering towards one end and extending longitudinally, wherein the cutting edge forms an opening edge of the opening.
Mittels der sich verjüngenden und längs erstreckenden Öffnung kann vorteilhaft eine Presswirkung erzielt werden, sodass beim Einführen des Leiterplattenrandes in die Öffnung die zuvor erwähnten Klemmbacken während des Einführens des Leiterplattenrandes entlang der Längserstreckung der Öffnung eine zunehmende Presskraft erzeugen können. By means of the tapering and longitudinally extending opening, a pressing effect can advantageously be achieved, so that during insertion of the printed circuit board edge into the opening, the abovementioned clamping jaws can generate an increasing pressing force during insertion of the printed circuit board edge along the longitudinal extent of the opening.
In einer bevorzugten Ausführungsform ist das Kontaktelement U-förmig ausgebildet, wobei die U-Schenkel jeweils durch eine Klemmbacke gebildet sind. Bevorzugt weist wenigstens eine der Klemmbacken des U-förmig ausgebildeten Kontaktelements wenigstens eine Schneidkante auf. Weiter bevorzugt weisen beide Klemmbacken wenigstens eine Schneidkante auf. In a preferred embodiment, the contact element is U-shaped, wherein the U-legs are each formed by a jaw. At least one of the clamping jaws of the U-shaped contact element preferably has at least one cutting edge. More preferably, both jaws have at least one cutting edge.
Bevorzugt sind die Schneidkanten jeweils geradlinig verlaufend ausgebildet.  Preferably, the cutting edges are each designed to extend in a straight line.
In einer bevorzugten Ausführungsform verläuft die wenigstens eine Schneidkante um eine Drehachse umlaufend und radial von der Drehachse beabstandet. Das Kontaktelement ist bevorzugt ausgebildet, mittels Drehbewegen um die Drehachse in den Leiterplattenrand einzuschneiden. Weiter bevorzugt ist das Kontaktelement ausgebildet, die Substratschicht mit dem Trennabschnitt zu durchtrennen und die elektrisch leitfähige Schicht mit dem Kontaktabschnitt elektrisch zu kontaktieren. In a preferred embodiment, the at least one cutting edge extends circumferentially about an axis of rotation and spaced radially from the axis of rotation. The contact element is preferably designed to cut by means of rotational movement about the axis of rotation in the circuit board edge. More preferably, the contact element is formed to sever the substrate layer with the separation section and to electrically contact the electrically conductive layer with the contact section.
Bevorzugt ist das zuvor erwähnte Kontaktelement mit der um die Drehachse umlaufend angeordneten Schneide zylinderförmig ausgebildet, wobei die Drehachse koaxial zu einer Zylinderlängsachse verläuft. Das zylinderförmig ausgebildete Kontaktelement ist wenigstens teilweise hohlzylinderförmig ausgebildet, sodass in dem Hohlraum beim Aufdrehen des Kontaktelements auf den Leiterplattenrand der Leiterplattenrand wenigstens teilweise in dem Hohlraum aufgenommen werden kann. Preferably, the aforementioned contact element with the circumferentially arranged about the rotation axis cutting edge is cylindrical, wherein the axis of rotation is coaxial to a cylinder longitudinal axis. The cylindrically shaped contact element is at least partially hollow cylindrical, so in the cavity when unscrewing the contact element on the circuit board edge of the circuit board edge can be at least partially received in the cavity.
In einer bevorzugten Ausführungsform ist der Trennabschnitt der Schneidkante ausgebildet, beim Aufgeschobenwerden, beziehungsweise im Falle des zylinderförmigen Kontaktelements beim Aufgedrehtwerden, auf den Leiterplattenrand in der Substratschicht eingebundene Fasern zu durchtrennen. Die Fasern sind beispielsweise Glasfasern. In a preferred embodiment, the separating section of the cutting edge is designed to be severed when pushed on, or in the case of the cylindrical contact element when being turned up, to cut fibers bound to the printed circuit board edge in the substrate layer. The fibers are for example glass fibers.
Bevorzugt weist das Material der Schneidkante im Trennabschnitt Stahl oder Keramik, und im Kontaktabschnitt Kupfer auf. Bevorzugt ist der Kontaktabschnitt wenigstens teilweise aus Kupfer, bevorzugt Reinkupfer gebildet. Das Kupfer ist bevorzugt sauerstoffarmes Reinkupfer. Vorteilhafte Ausführungsformen für das Kupfer im Bereich des Kontaktabschnitts sind Kupferlegierungen, beispielsweise eine Kupfer-Zinnlegierung, insbesondere CuSn4, CuSn6, oder eine Kupferlegierung gemäß der US-Norm United Numbering System C18018. In einer anderen Ausführungsform weist die Kupferlegierung 0,8 bis 1 ,8 Prozent Nickel, 0,15 bis 0,35 Silizium und 0,01 bis 0,05 Prozent Phosphor auf. Bevorzugt ist die Kupferlegierung eine Legierung gemäß der Norm UNS-C-19010. Preferably, the material of the cutting edge in the separation section steel or ceramic, and in the contact section on copper. Preferably, the contact portion is at least partially made of copper, preferably pure copper. The copper is preferably oxygen-poor pure copper. Advantageous embodiments of the copper in the region of the contact portion are copper alloys, for example a copper-tin alloy, in particular CuSn4, CuSn6, or a copper alloy according to the US Standard United Numbering System C18018. In another embodiment, the copper alloy comprises 0.8 to 1.8 percent nickel, 0.15 to 0.35 silicon, and 0.01 to 0.05 percent phosphorus. Preferably, the copper alloy is an alloy according to the standard UNS-C-19010.
Die Kupferlegierung weist bevorzugt eine Beimengung umfassend Chrom, Silber, Eisen, Titan, Silizium und zum größten Teil Kupfer auf. The copper alloy preferably has an admixture comprising chromium, silver, iron, titanium, silicon and for the most part copper.
Die Anteile der Beimengung betragen jeweils bevorzugt 0,5 % Chrom, 0,1 % Silber, 0,08 % Eisen, 0,06 % Titan und 0,03 % Silizium. Eine elektrische Leitfähigkeit des Kontaktabschnitts beträgt bevorzugt wenigstens 30, bevorzugt 46 MegaSiemens pro Meter.  The proportions of the admixture are each preferably 0.5% chromium, 0.1% silver, 0.08% iron, 0.06% titanium and 0.03% silicon. An electrical conductivity of the contact section is preferably at least 30, preferably 46 MegaSiemens per meter.
Bevorzugt weist die Schneide im Bereich des Kontaktabschnitts eine Beschich- tung umfassend Zinn, Wismut, Silber, Gold, Blei oder eine Kombination aus diesen auf.  In the area of the contact section, the cutting edge preferably has a coating comprising tin, bismuth, silver, gold, lead or a combination of these.
Die Erfindung betrifft auch ein Kontaktsystem mit wenigstens einem Kontaktelement gemäß der vorbeschriebenen Art. Das Kontaktsystem umfasst eine Leiterplatte mit wenigstens einer Substratschicht und wenigstens einer elektrisch leit- fähigen Schicht. Bevorzugt ist das Material der Schneide des Kontaktelements im Bereich des Kontaktabschnitts härter ausgebildet als das Material der elektrisch leitfähigen Schicht. Beispielsweise ist das Material der elektrisch leitfähigen Schicht der Leiterplatte durch ein Reinkupfer gebildet, welches weicher ausgebildet ist, als das Material der Schneide, insbesondere im Bereich des Kontaktabschnitts. Die härtere, beziehungsweise weichere Ausbildung bezieht sich bevorzugt auf eine Shore-Härte und/oder auf ein Elastizitätsmodul des elektrisch leitfähigen Materials. The invention also relates to a contact system having at least one contact element according to the above-described type. The contact system comprises a printed circuit board with at least one substrate layer and at least one electrically conductive capable layer. Preferably, the material of the cutting edge of the contact element in the region of the contact portion is harder than the material of the electrically conductive layer. For example, the material of the electrically conductive layer of the printed circuit board is formed by a pure copper, which is softer than the material of the cutting edge, in particular in the region of the contact portion. The harder or softer embodiment preferably refers to a Shore hardness and / or to a modulus of elasticity of the electrically conductive material.
Durch die härtere Ausbildung der Schneide im Bereich des Kontaktabschnitts kann bevorzugt eine plastische Verformung der elektrisch leitfähigen Schicht der Leiterplatte durch die sich verjüngende, längs erstreckende Öffnung, bewirkt werden. Weiter bevorzugt ist das Kontaktelement des Kontaktsystems ausgebildet, beim Aufgeschobenwerden, beziehungsweise Aufgedrehtwerden eine Kalt- verschweißung zwischen dem Kontaktabschnitt der Schneide und der elektrisch leitfähigen Schicht im Bereich des Leiterplattenrandes zu erzeugen. Due to the harder formation of the cutting edge in the region of the contact section, a plastic deformation of the electrically conductive layer of the printed circuit board may preferably be effected by the tapered, longitudinally extending opening. Further preferably, the contact element of the contact system is formed to be cold-welded between the contact portion of the cutting edge and the electrically conductive layer in the region of the printed circuit board edge when being pushed open or twisted open.
Bevorzugt weist die von der Schneidkante, insbesondere von einer Schneidkante der Schneidkanten, zu durchtrennende Substratschicht eine Dicke zwischen fünf Prozent und dreißig Prozent der Dicke der Leiterplatte auf, weiter bevorzugt von wenigstens einem Zehntel der Dicke der Leiterplatte auf. The substrate layer to be severed by the cutting edge, in particular by a cutting edge of the cutting edges, preferably has a thickness between five percent and thirty percent of the thickness of the printed circuit board, more preferably of at least one tenth of the thickness of the printed circuit board.
Bevorzugt beträgt eine Dicke der zu durchtrennenden Substratschicht wenigstens 100 Mikrometer.  Preferably, a thickness of the substrate layer to be cut is at least 100 micrometers.
Die elektrisch leitfähige Schicht kann beispielsweise vor einem Einlaminieren mit den Substratschichten mittels Stanzen erzeugt sein. Die elektrische leitfähige Schicht weist beispielsweise eine Schichtdicke zwischen 0, 1 und 2 Millimeter auf. The electrically conductive layer may be produced, for example, prior to lamination with the substrate layers by means of stamping. The electrically conductive layer has, for example, a layer thickness between 0, 1 and 2 millimeters.
Die Erfindung betrifft auch ein Verfahren und Verbinden einer Leiterplatte mit einem Kontaktelement. Die Leiterplatte weist wenigstens eine elektrisch leitfähige Schicht auf und wenigstens eine mit der elektrisch leitfähigen Schicht verbundene elektrisch isolierende Substratschicht. Bei dem Verfahren wird beim Aufschieben des Kontaktelements auf einen Leiterplattenrand der Leiterplatte die Substratschicht - bevorzugt mittels eines Trennabschnitts eines Schneidmessers - durchtrennt und die elektrisch leitfähige Schicht im Bereich der durchtrennten Substratschicht - bevorzugt mittels eines Kontaktabschnitts des Schneidmessers - elektrisch kontaktiert. The invention also relates to a method and connection of a printed circuit board with a contact element. The printed circuit board has at least one electrically conductive layer and at least one electrically insulating substrate layer connected to the electrically conductive layer. In the method, when the contact element is pushed onto a printed circuit board edge of the printed circuit board, the substrate layer is severed, preferably by means of a separating section of a cutting knife, and the electrically conductive layer is electrically contacted in the region of the severed substrate layer, preferably by means of a contact section of the cutting knife.
Bevorzugt weist die Substratschicht Fasern, insbesondere Glasfasern auf und wird zusammen mit den Fasern durchtrennt. The substrate layer preferably has fibers, in particular glass fibers, and is severed together with the fibers.
Die Erfindung wird nun im Folgenden anhand von Figuren und weiteren Ausführungsbeispielen beschrieben. Weitere vorteilhafte Ausführungsformen ergeben sich aus den Merkmalen der abhängigen Ansprüche und der Merkmale der Figuren. The invention will now be described below with reference to figures and further embodiments. Further advantageous embodiments will become apparent from the features of the dependent claims and the features of the figures.
Figur 1 zeigt ein Ausführungsbeispiel für ein Kontaktsystem umfassend eine mehrschichtig ausgebildete Leiterplatte mit einer innenliegenden Kupferdickschichten und mit zwei die Kupferdickschichten kontaktierenden Kontaktelementen in einem Längsschnitt; FIG. 1 shows an exemplary embodiment of a contact system comprising a multilayer printed circuit board with an inner layer of copper thick layers and with two contact elements contacting the copper thick layers in a longitudinal section;
Figur 2 zeigt das in Figur 1 gezeigte Kontaktelement in einer Aufsicht auf die Schneidmesser; Figure 2 shows the contact element shown in Figure 1 in a plan view of the cutting blade;
Figur 3 zeigt ein zylindrisch ausgebildetes Kontaktelement, welches auf einen Leiterplattenrand aufgedreht werden kann; Figure 3 shows a cylindrically shaped contact element, which can be turned on a circuit board edge;
Figur 4 zeigt das in Figur 3 dargestellte Kontaktelement in einer Schnittdarstellung; Figur 5 zeigt eine Variante für ein Schneidmesser mit einer Schneidkante, die im Trennabschnitt Zähne aufweist. Figure 4 shows the contact element shown in Figure 3 in a sectional view; FIG. 5 shows a variant for a cutting blade with a cutting edge which has teeth in the separating section.
Figur 1 zeigt - schematisch - ein Ausführungsbeispiel für ein Kontaktsystem 1. Das Kontaktsystem 1 weist eine Leiterplatte 3 auf. Die Leiterplatte 3 weist eine Substratschicht 4 und eine Substratschicht 4a auf, welche in diesem Ausführungsbeispiel jeweils durch faserverstärktes Epoxidharz gebildet sind. Die Leiterplatte 1 weist auch drei in der Leiterplatte 1 liegende elektrisch leitfähige Schichten auf, nämlich die elektrisch leitfähige Schicht 5, die elektrisch leitfähige Schicht 6 und die elektrisch leitfähige Schicht 7. Die elektrisch leitfähigen Schichten 6 und 7 verlaufen parallel zueinander und beabstandet und sind durch eine weitere Substratschicht voneinander isoliert. Die elektrisch leitfähige Schicht 5 weist in diesem Ausführungsbeispiel eine Dickenabmessung auf, welche das Dreifache einer Dickenabmessung der Substratschichten 4, und 4a beträgt, zwischen denen die elektrisch leitfähige Schicht 5 - nach Art eines Sandwichs - eingeschlossen ist. Figure 1 shows - schematically - an embodiment of a contact system 1. The contact system 1 has a circuit board 3. The printed circuit board 3 has a substrate layer 4 and a substrate layer 4a, which are each formed in this embodiment by fiber-reinforced epoxy resin. The printed circuit board 1 also has three electrically conductive layers lying in the printed circuit board 1, namely the electrically conductive layer 5, the electrically conductive layer 6 and the electrically conductive layer 7. The electrically conductive layers 6 and 7 extend parallel to one another and are spaced apart and through another substrate layer isolated from each other. The electrically conductive layer 5 in this embodiment has a thickness dimension which is three times a thickness dimension of the substrate layers 4, and 4a, between which the electrically conductive layer 5 - in the manner of a sandwich - is included.
Das Kontaktsystem weist auch ein Kontaktelement 8 und ein Kontaktelement 9 auf. Das Kontaktelement 8 ist in diesem Ausführungsbeispiel U-förmig ausgebildet, wobei die U-Schenkel jeweils eine Klemmbacke 19 und eine Klemmbacke 20 bilden. Die Klemmbacken 19 und 20 umschließen gemeinsam eine Öffnung 13. The contact system also has a contact element 8 and a contact element 9. The contact element 8 is U-shaped in this embodiment, wherein the U-legs each form a clamping jaw 19 and a clamping jaw 20. The jaws 19 and 20 together enclose an opening 13th
Das Kontaktelement 8 weist in diesem Ausführungsbeispiel ein mit der Klemmbacke 20 verbundenes Schneidmesser auf, welches die zuvor erwähnte Schneide bildet. Das Schneidmesser weist eine Schneidkante 10 auf und weist entlang seiner Längserstreckung zwei zueinander verschiedene Materialien auf, nämlich ein härteres Material 24, in diesem Ausführungsbeispiel Stahl, und ein im Vergleich dazu weicheres Material 21 , in diesem Ausführungsbeispiel Kupfer. Das Kupfer ist in diesem Ausführungsbeispiel durch die zuvor erwähnte Kupferlegierung C18018 gebildet. Der Kontaktabschnitt 21 erstreckt sich durch einen die Klemmbacken 19 und 20 verbindenden Verbindungsabschnitt 27 hindurch, wobei im Bereich eines Endes, welches aus dem Verbindungsabschnitt 27 hinausragt, ein Anschluss 16 ausgebildet ist. Der Anschluss 16 ist in diesem Ausführungsbeispiel mit einem elektrischen Verbindungsdraht 25 verbunden. The contact element 8 has in this embodiment a connected to the jaw 20 cutting blade, which forms the aforementioned cutting edge. The cutting blade has a cutting edge 10 and has along its longitudinal extent two mutually different materials, namely a harder material 24, in this embodiment steel, and a softer material compared to 21, in this embodiment, copper. The copper is formed in this embodiment by the aforementioned copper alloy C18018. The contact section 21 extends through a connecting section 27 connecting the clamping jaws 19 and 20, wherein in the region of an end which projects out of the connecting section 27, a terminal 16 is formed. The terminal 16 is connected in this embodiment with an electrical connection wire 25.
Die Klemmbacke 19 weist ein Schneidmesser auf, welches entlang seiner Längserstreckung einen Trennabschnitt 23 und einen Kontaktabschnitt 22 aufweist. Der Trennabschnitt 23 ist in diesem Ausführungsbeispiel durch Stahl gebildet, der Kontaktabschnitt 22 durch die zuvor erwähnte Kupferlegierung. Der Kontaktabschnitt 22 ist wie der Kontaktabschnitt 21 durch den Verbindungsabschnitt 27 hindurchgeführt und ragt mit einem Endabschnitt aus dem Verbin- dungsabschnitt 27 heraus und bildet dort einen Kontakt 17. Der Kontakt 17 ist mit einer elektrischen Verbindungsleitung 26 verbunden. The clamping jaw 19 has a cutting blade which has a separating section 23 and a contact section 22 along its longitudinal extent. The partition portion 23 is formed by steel in this embodiment, the contact portion 22 by the aforementioned copper alloy. The contact portion 22 is like the contact portion 21 passed through the connecting portion 27 and protrudes with an end portion of the connecting portion 27 and forms there a contact 17. The contact 17 is connected to an electrical connection line 26.
Wenn das Kontaktelement 8 entlang der Pfeilrichtung 18 auf einen Endabschnitt der Leiterplatte 3 aufgeschoben wird, so schneidet die Schneidkante 10 im Be- reich des Trennabschnitts 24 in die Substratschicht 4a ein. Wird das Kontaktelement 8 in Pfeilrichtung 18 weiter auf den Endabschnitt der Leiterplatte 3 aufgeschoben, so kontaktiert die Schneide 10 im Bereich des Kontaktabschnitts 21 die elektrisch leitfähige Schicht 5 auf einer Seite und schneidet dort ein. Die When the contact element 8 is pushed along the direction of the arrow 18 onto an end section of the printed circuit board 3, the cutting edge 10 cuts into the substrate layer 4a in the region of the separating section 24. If the contact element 8 is pushed further in the direction of the arrow 18 onto the end section of the printed circuit board 3, then the cutting edge 10 contacts the electrically conductive layer 5 on one side in the region of the contact section 21 and intersects there. The
Schneidkante 12 hat mit dem Trennabschnitt 23 die Substratschicht 4 auf der gegenüberliegenden Seite, auf der sich die Schneidkante 10 in die Substratschicht 4a eingeschnitten hat, in die Substratschicht 4 eingeschnitten und kontaktiert dort die elektrisch leitfähige Schicht 5. Während eines weiteren Aufschiebens des Kontaktelements 8 auf den Endabschnitt der Leiterplatte 3 kontaktiert der Kontaktabschnitt 22 die elektrisch leitfähige Schicht 5 auf der gegenüberlie- genden Seite. Die Schneidkanten 10 und 12 sind im Bereich des TrennabschnittsCutting edge 12 has with the separating portion 23, the substrate layer 4 on the opposite side, on which the cutting edge 10 has cut into the substrate layer 4 a, cut into the substrate layer 4 and contacted there the electrically conductive layer 5. During a further sliding of the contact element 8 the end portion of the circuit board 3 contacts the contact portion 22, the electrically conductive layer 5 on the opposite side. The cutting edges 10 and 12 are in the region of the separating section
23 beziehungsweise 24 mit einem Abstand voneinander beabstandet, wobei der Abstand der Dickenabmessung 14 der elektrisch leitfähigen Schicht 5 entspricht. Die Schneidkanten 10 und 12 sind im Bereich des Kontaktabschnitts 21 beziehungsweise 22 mit einem Abstand voneinander beabstandet, wobei der Abstand gleich oder kleiner ist als die Dickenabmessung der elektrisch leitfähigen Schicht23 and 24 at a distance from each other, wherein the distance of the thickness dimension 14 of the electrically conductive layer 5 corresponds. The cutting edges 10 and 12 are at a distance from each other in the region of the contact portion 21 and 22, wherein the distance is equal to or smaller than the thickness dimension of the electrically conductive layer
5. Die Schneidkanten 10 und 12 schließen in diesem Ausführungsbeispiel einen Winkel 15 zwischeneinander ein, sodass die Öffnung 13 zwischen den Schenkeln im Bereich der Schneidkanten 10 und 12 zum die Klemmbacken 19 und 20 verbindenden Verbindungsabschnitt hin verjüngt ausgebildet ist. So können auch die Schneidkanten 10 und 12 in die elektrisch leitfähige Schicht einschneiden und mit dieser jeweils kaltverschweißt werden. 5. The cutting edges 10 and 12 include in this embodiment, an angle 15 between each other, so that the opening 13 is formed between the legs in the region of the cutting edges 10 and 12 to the clamping jaws 19 and 20 connecting connecting portion tapers. So can too Cut the cutting edges 10 and 12 in the electrically conductive layer and are each cold-welded with this.
Dargestellt ist auch ein Kontaktelement 9, welches wie das Kontaktelement 8 ausgebildet ist. Die Elemente des Kontaktelements 9 mit demselben Bezugszeichen entsprechen in Eigenschaft und Funktion denen des Kontaktelements 8 mit demselben Bezugszeichen. Das Kontaktelement 9 ist bereits auf einen Endabschnitt der Leiterplatte 3 aufgeschoben, welcher dem Endabschnitt mit der elektrisch leitfähigen Schicht 5 gegenüberliegt. Die elektrisch leitfähige Schicht wird dabei von dem Trennabschnitt 23 und von dem Kontaktabschnitt 22 kontaktiert. Der elektrische Anschluss 17 steht somit in elektrischer Wirkverbindung mit der elektrisch leitfähigen Schicht 7. Shown is also a contact element 9, which is designed as the contact element 8. The elements of the contact element 9 with the same reference number correspond in property and function to those of the contact element 8 with the same reference numeral. The contact element 9 is already pushed onto an end section of the printed circuit board 3, which is opposite to the end section with the electrically conductive layer 5. The electrically conductive layer is contacted by the separating section 23 and by the contact section 22. The electrical connection 17 is thus in electrical operative connection with the electrically conductive layer 7.
Der Trennabschnitt 24 hat die Substratschicht 4a, welche die elektrisch leitfähige Schicht 6 nach außen hin bedeckt, durchtrennt, insbesondere durchschnitten o- der durchfräst, sodass der Trennabschnitt 24 und der Kontaktabschnitt 21 die e- lektrisch leitfähige Schicht 6 mittels der Schneidkante 10 plastisch verformend kontaktieren kann. Dadurch ist eine Kaltverschweißung gebildet, sodass der Kontaktabschnitt 21 in besonders guter und gasdichter elektrisch leitender Verbindung mit der elektrisch leitfähigen Schicht 6 steht. Der elektrische Anschluss 16 kontaktiert somit die elektrisch leitfähige Schicht 6 über den Kontaktabschnitt 21 im Bereich des Einschnitts beziehungsweise der plastischen Verformung der e- lektrisch leitfähigen Schicht 6 durch den Kontaktabschnitt 21 , und zusätzlich im Bereich des Trennabschnitts 24. The separating section 24 has the substrate layer 4 a, which covers the electrically conductive layer 6 outwardly cut through, in particular cut or milled through, so that the separating portion 24 and the contact portion 21, the electrically conductive layer 6 by means of the cutting edge 10 plastically deforming contact can. As a result, a cold welding is formed, so that the contact portion 21 is in a particularly good and gas-tight electrically conductive connection with the electrically conductive layer 6. The electrical connection 16 thus contacts the electrically conductive layer 6 via the contact section 21 in the region of the incision or the plastic deformation of the electrically conductive layer 6 through the contact section 21, and additionally in the region of the separating section 24.
Figur 2 zeigt die in Figur 1 bereits dargestellte Klemmbacke 20 in einer Aufsicht der Öffnung 13 auf die Schneidmesser. Die Klemmbacke 20 weist in diesem Ausführungsbeispiel vier Schneidmesser auf, wobei das in Figur 1 bereits dargestellte Schneidmesser im Bereich des Eintritts der Öffnung 13 den Trennabschnitt 24 aufweist, und entlang einer Längsrichtung der Schneide den Kontaktabschnitt 21. Ein zu dem Schneidmesser, umfassend den Trennabschnitt 24 und den Kontaktabschnitt 21 , parallel zu diesem beabstandet verlaufendes Schneidmesser weist einen Trennabschnitt 30 und einen Kontaktabschnitt 31 auf. Ein drittes Schneidmesser, welches zu dem Schneidmesser mit dem Kontaktab- schnitt 31 beabstandet und parallel verläuft, weist einen Trennabschnitt 31 und einen Kontaktabschnitt 33 auf. Ein viertes Schneidmesser weist einen Trennabschnitt 34 und einen Kontaktabschnitt 35 auf. Beim Aufschieben des Kontaktelements mit der Klemmbacke 20 schneiden somit die Trennabschnitte 24, 30, 32 und 34 gemeinsam in ein Substrat, insbesondere eine eine elektrisch leitfähige Schicht bedeckende Substratschicht, einer Leiterplatte gemeinsam ein. Beim weiteren Aufschieben entlang der Längsrichtung der Schneidkanten schneiden dann die Kontaktabschnitte 21 , 31 , 33 und 35 gemeinsam in die elektrisch leitfähige Schicht, welche unter der Substratschicht angeordnet ist, pressend ein und kontaktieren die elektrisch leitfähige Schicht so plastisch verformend und mittels Kaltverschweißung elektrisch. Dargestellt ist auch der bereits dargestellte An- schluss 16, über welchen das Kontaktelement mit der Klemmbacke 20 nach außen hin kontaktiert werden kann. Der Anschluss 16 kann mit entsprechenden Anschlüssen der Kontaktabschnitte 31 , 33 und 35 elektrisch verbunden sein. Die Verbindungsleitung 25 steht somit mit den Kontaktabschnitten 21 , 31 , 33 und 35 in elektrischer Wirkverbindung. FIG. 2 shows the clamping jaw 20 already shown in FIG. 1 in a plan view of the opening 13 on the cutting blades. In this exemplary embodiment, the clamping jaw 20 has four cutting blades, wherein the cutting blade already shown in FIG. 1 has the separating section 24 in the region of the entrance of the opening 13 and the contact section 21 along a longitudinal direction of the cutting edge and the contact portion 21, parallel to this spaced running cutting blade has a separating portion 30 and a contact portion 31. A third cutting blade, which leads to the cutting blade with the contact Section 31 is spaced and parallel, has a separating portion 31 and a contact portion 33. A fourth cutting blade has a separating section 34 and a contact section 35. When sliding the contact element with the jaw 20 thus cut the separating sections 24, 30, 32 and 34 together in a substrate, in particular a covering an electrically conductive layer substrate layer, a circuit board together. Upon further pushing along the longitudinal direction of the cutting edges, the contact portions 21, 31, 33 and 35 together cut into the electrically conductive layer which is disposed below the substrate layer, pressing and contact the electrically conductive layer so plastically deforming and electrically by cold welding. Shown is also the connection 16 already shown, via which the contact element with the clamping jaw 20 can be contacted outwardly. The terminal 16 may be electrically connected to respective terminals of the contact portions 31, 33 and 35. The connecting line 25 is thus in electrical connection with the contact sections 21, 31, 33 and 35.
Figur 3 zeigt eine Ausführungsform für ein Kontaktelement, welches nach demselben Wirkprinzip wie das zuvor geschilderte Kontaktelement 8 einen Endabschnitt einer Leiterplatte kontaktieren kann, jedoch nicht mittels einer Translationsbewegung, sondern mittels einer Rotationsbewegung um eine Drehachse 50. Dazu ist das Kontaktelement 40 zylindrisch ausgebildet, und weist zwei zueinander beabstandete Schneiden 44 und 42 auf, welche eine Öffnung 55 zwischenei- nander einschließen. Die Schneiden 42 und 44 sind jeweils radial um die Drehachse 50, welche in diesem Ausführungsbeispiel auch eine Zylinderhochachse des Kontaktelements 40 bildet, radial umlaufend beabstandet. Die Schneidkante 42 ist Bestandteil eines Schneidmessers, welches im Bereich eines Eintrittsbereiches der Öffnung 55 einen Trennabschnitt 46 und weiter entlang einer Längserstreckung der Schneidkante 42 einen Kontaktabschnitt 45 aufweist. Der Trennabschnitt 46 ist in diesem Ausführungsbeispiel aus Stahl gebildet, und der Kontaktabschnitt 45 aus Kupfer. Die Schneidkante 44 ist Bestandteil eines weiteren Schneidmessers, umfassend den Trennabschnitt 48 und den Kontaktabschnitt 47, wobei der Trennabschnitt 48 aus Stahl und der Kontaktabschnitt 47 aus Kupfer gebildet ist. Wird das Kontaktelement 40 mit der Öffnung 55 im Bereich der Trennabschnitte 46 und 48 auf eine Kante eines Endabschnitts der Leiterplatte 3 aufgesetzt, so kann mittels einer Drehbewegung des Kontaktelements 40 um die Drehachse 50 der Leiterplattenendabschnitt in die Öffnung 55 eingeführt werden. Dabei schneidet der Trennabschnitt 46 in die Substratschicht 4a ein, und der Trennabschnitt 48 in die Substratschicht 4. Die elektrisch leitfähige Schicht 5 ist - nach Art eines Sandwichs - zwischen die Substratschichten 4 und 4a eingeschlossen. Wird das Kontaktelement 40 um die Drehachse 50 weiter gedreht, so kann die Schneidkante 42 der mittels des Trennabschnitts 46 in der Substratschicht 4a herausgearbeiteten Schneidspur folgen und sich in der Schneidspur der Substratschicht 4a bewegend, die elektrisch leitfähige Schicht 5 kontaktieren und in diese pressend einschneiden. Dazu sind die Schneidkanten 42 und 44 zu einem Ende der Öffnung 55 hin einander zulaufend ausgebildet, sodass die Öffnung 55 zu dem Ende hin verjüngt ausgebildet ist. Figure 3 shows an embodiment of a contact element, which can contact an end portion of a printed circuit board according to the same principle as the previously described contact element 8, but not by means of a translational movement, but by means of a rotational movement about an axis of rotation 50. For this, the contact element 40 is cylindrical, and has two mutually spaced cutting edges 44 and 42, which include an opening 55 between each other. The cutting edges 42 and 44 are each radially around the axis of rotation 50, which forms a cylindrical vertical axis of the contact element 40 in this embodiment, radially circumferentially spaced. The cutting edge 42 is part of a cutting blade, which in the region of an inlet region of the opening 55 has a separating section 46 and further along a longitudinal extension of the cutting edge 42 a contact section 45. The separating portion 46 is formed of steel in this embodiment, and the contact portion 45 of copper. The cutting edge 44 is part of another cutting blade, comprising the separating portion 48 and the contact portion 47, wherein the separating portion 48 made of steel and the contact portion 47 is formed of copper. If the contact element 40 with the opening 55 in the region of the separating portions 46 and 48 placed on an edge of an end portion of the printed circuit board 3, so by means of a rotary movement of the contact element 40 about the axis of rotation 50 of the printed circuit board end portion can be inserted into the opening 55. In this case, the separating section 46 cuts into the substrate layer 4a, and the separating section 48 into the substrate layer 4. The electrically conductive layer 5 is sandwiched between the substrate layers 4 and 4a. If the contact element 40 is further rotated about the axis of rotation 50, the cutting edge 42 can follow the cutting track worked out in the substrate layer 4a by means of the separating section 46 and moving in the cutting track of the substrate layer 4a, contacting the electrically conductive layer 5 and cutting into it in a pressing manner. For this purpose, the cutting edges 42 and 44 are formed tapering towards one end of the opening 55, so that the opening 55 is formed tapered towards the end.
Figur 4 zeigt das in Figur 3 dargestellte Kontaktelement 40 in einer Schnittdarstellung entlang des in Figur 3 dargestellten Schnitts 51. Die Schnittebene der in Figur 4 dargestellten Schnittdarstellung verläuft senkrecht zur Drehachse 50. FIG. 4 shows the contact element 40 shown in FIG. 3 in a sectional representation along the section 51 shown in FIG. 3. The sectional plane of the sectional view illustrated in FIG. 4 runs perpendicular to the axis of rotation 50.
Das Kontaktelement 40 weist im Bereich der Drehachse 50 eine Mittelsäule 53 auf, welche - wie in Figur 3 dargestellt - in einen Anschluss 58 mündet. Das Kontaktelement 40 kann so mittels des Anschlusses 58 mit einer elektrischen Verbindungsleitung - beispielsweise über eine Steckverbindung - verbunden werden. Das Kontaktelement 40 ist - wie in Figur 4 dargestellt - teilweise hohl ausgebildet und weist dazu einen Hohlraum 56 auf, in welchem der Endabschnitt der Leiterplatte 3 beim Aufdrehen des Kontaktelements 40 auf den Leiterplattenrand aufgenommen werden kann. Die Schneidkante 42 hat dabei durch die Substratschicht 4a hindurch in die elektrisch leitfähige Schicht 5 eingeschnitten. The contact element 40 has in the region of the axis of rotation 50 to a center column 53, which - as shown in Figure 3 - opens into a port 58. The contact element 40 can be so connected by means of the terminal 58 with an electrical connection line - for example via a plug connection. The contact element 40 is - as shown in Figure 4 - partially hollow and has for this purpose a cavity 56 in which the end portion of the circuit board 3 can be received during the unscrewing of the contact element 40 on the circuit board edge. The cutting edge 42 has thereby cut into the electrically conductive layer 5 through the substrate layer 4a.
Figur 5 zeigt eine Variante für ein Schneidmesser, umfassend einen Längsabschnitt 67, in welchem der Trennabschnitt 64 ausgebildet ist. Die Schneidkante 61 weist im Bereich des Trennabschnitts 64 Zähne 65 auf, mittels der Zähne 65 kann die Schneidkante 61 Fasern, insbesondere Glasfasern einer Epoxidharz- Substratschicht leicht durchtrennen. Die Zähne 65 sind in diesem Ausführungs- beispiel durch gehärteten Stahl gebildet und sind ausgebildet, eine Substratschicht umfassend Epoxidharz und Glasfasern zu durchtrennen. Das Schneidmesser 60 weist im Bereich eines Längsabschnitts 66 einen Kontaktabschnitt 62 auf. Der Kontaktabschnitt 62 ist aus Kupfer, insbesondere einer Kupferlegierung, beispielsweise eine Legierung gemäß der US-Norm C18018 oder der Norm UNSFIG. 5 shows a variant for a cutting knife, comprising a longitudinal section 67, in which the separating section 64 is formed. The cutting edge 61 has in the region of the separating section 64 teeth 65, by means of the teeth 65, the cutting edge 61 fibers, in particular glass fibers of an epoxy substrate layer easily cut. The teeth 65 are in this embodiment For example, formed by hardened steel and are formed to cut a substrate layer comprising epoxy resin and glass fibers. The cutting blade 60 has a contact section 62 in the region of a longitudinal section 66. The contact portion 62 is made of copper, in particular a copper alloy, for example, an alloy according to the US-standard C18018 or the standard UNS
C-19010 gebildet. Das Schneidmesser 60 kann als Schneidmesser an dem in Figur 1 dargestellten Kontaktelement 8, dem Kontaktelement 9 und/oder dem Kontaktelement 40 in Figur 3 ausgebildet sein. C-19010 made. The cutting blade 60 may be formed as a cutting blade on the contact element 8 shown in FIG. 1, the contact element 9 and / or the contact element 40 in FIG.

Claims

Ansprüche claims
1. Kontaktelement (8, 9, 40) zum Verbinden mit einer Leiterplatte (3) mit wenigstens einer insbesondere elektrisch isolierenden Substratschicht (4, 4a) und mit wenigstens einer mit der Substratschicht (4, 4a) verbundenen, insbesondere in- nenliegenden, elektrisch leitfähigen Schicht(5, 6, 7), wobei das Kontaktelement 1. contact element (8, 9, 40) for connection to a printed circuit board (3) with at least one particular electrically insulating substrate layer (4, 4a) and at least one with the substrate layer (4, 4a) connected, in particular innenliegenden, electrically conductive layer (5, 6, 7), wherein the contact element
(8, 9, 40) zum Verbinden mit der elektrisch leitfähigen Schicht (5, 6, 7) ausgebildet ist, (8, 9, 40) is designed for connection to the electrically conductive layer (5, 6, 7),
dadurch gekennzeichnet, dass characterized in that
das Kontaktelement (8, 9, 40) ausgebildet ist, auf einen Leiterplattenrand der Leiterplatte (3) aufgeschoben zu werden und den Leiterplattenrand zu umgreifen, wobei das Kontaktelement (8, 9, 40) wenigstens ein Schneidmesser mit einer Schneidkante (10, 12, 42, 44, 61) aufweist, wobei die Schneidkante (10, 12, 42, 44, 61) im Bereich eines Trennabschnitts (23, 24, 46, 48, 67) ein härteres Material aufweist als an einem entlang der Schneidkante (10, 12, 42, 44, 61) dazu benachbarten Kontaktabschnitt (21 , 22, 44, 45, 62) und die Schneidkante (10, 12, 42, 44, 61) ausgebildet ist, die Substratschicht (4, 4a) beim Aufgeschobenwerden mit dem Trennabschnitt (23, 24, 46, 48, 67) zu durchtrennen und die elektrisch leitfähige Schicht (5, 6, 7) mit dem Kontaktabschnitt (21 , 22, 44, 45, 62) elektrisch zu kontaktieren. the contact element (8, 9, 40) is designed to be pushed onto a printed circuit board edge of the printed circuit board (3) and to encompass the printed circuit board edge, wherein the contact element (8, 9, 40) comprises at least one cutting knife with a cutting edge (10, 12, 42, 44, 61), wherein the cutting edge (10, 12, 42, 44, 61) in the region of a separating portion (23, 24, 46, 48, 67) comprises a harder material than at a along the cutting edge (10, 12, 42, 44, 61) adjacent thereto contact portion (21, 22, 44, 45, 62) and the cutting edge (10, 12, 42, 44, 61) is formed, the substrate layer (4, 4a) when pushed with the Severing section (23, 24, 46, 48, 67) and electrically contacting the electrically conductive layer (5, 6, 7) with the contact section (21, 22, 44, 45, 62).
2. Kontaktelement (8, 9, 40) nach Anspruch 1 , Second contact element (8, 9, 40) according to claim 1,
dadurch gekennzeichnet, dass characterized in that
das Kontaktelement (8, 9, 40) wenigstens zwei Schneidkanten (10, 12, 42, 44, 61) aufweist, und ausgebildet ist, den Leiterplattenrand zu umgreifen und die zumindest eine elektrisch leitfähige Schicht (8, 9, 40) mittels der Schneidkanten (10, 12, 42, 44, 61) von zwei Seiten zu kontaktieren. the contact element (8, 9, 40) has at least two cutting edges (10, 12, 42, 44, 61) and is designed to encompass the circuit board edge and the at least one electrically conductive layer (8, 9, 40) by means of the cutting edges (10, 12, 42, 44, 61) from two sides to contact.
3. Kontaktelement (8, 9, 40) nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass 3. contact element (8, 9, 40) according to claim 1 or 2, characterized in that
das Kontaktelement (8, 9, 40) eine sich zu einem Ende hin verjüngende und längserstreckende Öffnung (13, 55) aufweist, wobei die Schneidkante (10, 12, 42, 44, 61) einen Öffnungsrand der Öffnung (13, 55) bildet. the contact element (8, 9, 40) has an opening (13, 55) tapering towards one end and extending longitudinally, wherein the cutting edge (10, 12, 42, 44, 61) forms an opening edge of the opening (13, 55) ,
4. Kontaktelement (8, 9, 40) nach einem der vorhergehenden Ansprüche, 4. contact element (8, 9, 40) according to one of the preceding claims,
dadurch gekennzeichnet, dass characterized in that
das Kontaktelement (8, 9, 40) U-Förmig ausgebildet ist wobei U-Schenkel des Kontaktelements jeweils als Klemmbacke (19, 20) ausgebildet sind. the contact element (8, 9, 40) is U-shaped, U-legs of the contact element being in each case designed as a clamping jaw (19, 20).
5. Kontaktelement (8, 9, 40) nach einem der vorhergehenden Ansprüche, 5. contact element (8, 9, 40) according to any one of the preceding claims,
dadurch gekennzeichnet, dass characterized in that
die wenigstens eine Schneidkante (10, 12, 42, 44, 61) um eine Drehachse (50) umlaufend radial beabstandet verläuft und das Kontaktelement (40) ausgebildet ist, mittels Drehbewegen um die Drehachse (50) in den Leiterplattenrand einzuschneiden. the at least one cutting edge (10, 12, 42, 44, 61) is circumferentially radially spaced around an axis of rotation (50) and the contact element (40) is adapted to cut into the circuit board edge by means of rotational movement about the axis of rotation (50).
6. Kontaktelement (8, 9, 40) nach einem der vorhergehenden Ansprüche, 6. contact element (8, 9, 40) according to one of the preceding claims,
dadurch gekennzeichnet, dass die Schneidkante (10, 12, 42, 44, 61) im Trennabschnitt ausgebildet ist, beim Aufgeschobenwerden auf den Leiterplattenrand in der Substratschicht (4) eingebundene Fasern zu durchtrennen. characterized in that the cutting edge (10, 12, 42, 44, 61) is formed in the separating portion to be severed when being pushed onto the printed circuit board edge in the substrate layer (4) embedded fibers.
7. Kontaktsystem (1) mit wenigstens einem Kontaktelement (8, 9, 40) gemäß einem der vorhergehenden Ansprüche, 7. contact system (1) with at least one contact element (8, 9, 40) according to one of the preceding claims,
umfassend eine Leiterplatte (3) mit wenigstens einer Substratschicht (4, 4a) und mit wenigstens einer elektrisch leitfähigen Schicht (5, 6, 7) , wobei das Material des Schneidmessers im Bereich des Kontaktabschnitts (21 , 22, 42, 44, 62) härter ausgebildet ist als das Material der elektrisch leitfähigen Schicht (5, 6, 7). comprising a printed circuit board (3) with at least one substrate layer (4, 4a) and with at least one electrically conductive layer (5, 6, 7), wherein the material of the cutting knife in the region of the contact section (21, 22, 42, 44, 62) harder than the material of the electrically conductive layer (5, 6, 7).
8. Kontaktsystem (1) nach Anspruch 7, 8. contact system (1) according to claim 7,
dadurch gekennzeichnet, dass die von der Schneidkante (23, 24) zu durchtrennende Substratschicht (4, 4a) eine Dicke von wenigstens einem Zehntel der Dicke der Leiterplatte (3) aufweist. characterized in that the substrate layer (4, 4a) to be severed by the cutting edge (23, 24) has a thickness of at least one tenth of the thickness of the printed circuit board (3).
9. Verfahren zum Verbinden einer Leiterplatte (3) mit einem Kontaktelement (8,9. A method for connecting a printed circuit board (3) to a contact element (8,
9, 40) , wobei die Leiterplatte (3) wenigstens eine elektrisch leitfähige Schicht (5, 6, 7) aufweist und wenigstens eine mit der elektrisch leitfähigen Schicht (5, 6, 7) verbundene elektrisch isolierende Substratschicht (4, 4a) aufweist, wobei beim Aufschieben des Kontaktelements (8, 9, 40) auf einen Leiterplattenrand der Leiterplatte (3) die Substratschicht (4, 4a) durchtrennt wird und die elektrisch leitfähige Schicht (5, 6, 7) im Bereich der durchtrennten Substratschicht (4, 4a) elektrisch kontaktiert wird. 9, 40), wherein the printed circuit board (3) has at least one electrically conductive layer (5, 6, 7) and at least one electrically insulating substrate layer (4, 4a) connected to the electrically conductive layer (5, 6, 7), wherein when the contact element (8, 9, 40) is pushed onto a printed circuit board edge of the printed circuit board (3), the substrate layer (4, 4a) is severed and the electrically conductive layer (5, 6, 7) in the region of the severed substrate layer (4, 4a ) is contacted electrically.
10. Verfahren nach Anspruch 9, 10. The method according to claim 9,
bei dem die Substratschicht (4, 4a) Fasern aufweist und zusammen mit den Fasern durchtrennt wird. wherein the substrate layer (4, 4a) comprises fibers and is severed along with the fibers.
EP13720895.5A 2012-06-27 2013-04-29 Contact element for connecting to a circuit board, contact system and method Not-in-force EP2867954B1 (en)

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DE102012210921.8A DE102012210921A1 (en) 2012-06-27 2012-06-27 Contact element for connection to a printed circuit board, contact system and method
PCT/EP2013/058883 WO2014000920A1 (en) 2012-06-27 2013-04-29 Contact element for connecting to a circuit board, contact system and method

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012210921A1 (en) * 2012-06-27 2014-01-23 Robert Bosch Gmbh Contact element for connection to a printed circuit board, contact system and method
US10132452B2 (en) * 2013-03-14 2018-11-20 Apex Technologies, Inc. Suspended track and planar electrode systems and methods
US10680383B2 (en) 2013-03-14 2020-06-09 Apex Technologies, Inc. Linear electrode systems for module attachment with non-uniform axial spacing
US20170299545A1 (en) * 2016-04-19 2017-10-19 Tyco Electronics Corporation Sensor package having an electrical contact
CN108054034B (en) * 2017-11-28 2019-03-15 宁波伊顿电力科技有限公司 A kind of plug-in strip

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780431A (en) * 1972-09-25 1973-12-25 Bowmar Ali Inc Process for producing computer circuits utilizing printed circuit boards
US4490004A (en) * 1982-08-11 1984-12-25 Amp Incorporated Connector for connecting insulated wires to a circuit board
US4586772A (en) * 1983-06-13 1986-05-06 Amp Incorporated Improved card edge connector
EP0228723A3 (en) * 1985-11-12 1987-12-23 Reed Devices, Inc. Modular idc terminal block assembly
JPH0411346Y2 (en) * 1986-03-28 1992-03-19
GB8908411D0 (en) * 1989-04-13 1989-06-01 Amp Holland Surface mount electrical connector
US5006077A (en) * 1989-07-28 1991-04-09 Amp Incorporated Insulation displacing barrel terminal
US5345364A (en) * 1993-08-18 1994-09-06 Minnesota Mining And Manufacturing Company Edge-connecting printed circuit board
DE19921768A1 (en) * 1999-05-11 2000-11-16 Siemens Ag Insulation displacement contact and connection clamp
DE20008305U1 (en) * 1999-10-13 2001-03-01 Weidmüller Interface GmbH & Co, 32760 Detmold Connection device for electrical conductors
US6616819B1 (en) * 1999-11-04 2003-09-09 Therasense, Inc. Small volume in vitro analyte sensor and methods
US20080286990A1 (en) * 2003-12-02 2008-11-20 Super Talent Electronics, Inc. Direct Package Mold Process For Single Chip SD Flash Cards
DE50000619D1 (en) * 2000-02-04 2002-11-14 Siemens Ag Insulation displacement contact and connection clamp
GB2360397A (en) * 2000-03-15 2001-09-19 Yazaki Europe Ltd Connector with flexible circuit contacts
US8102657B2 (en) * 2003-12-02 2012-01-24 Super Talent Electronics, Inc. Single shot molding method for COB USB/EUSB devices with contact pad ribs
DE102005005917B4 (en) * 2005-02-09 2006-12-21 Siemens Ag Terminal for an insulated electrical conductor
JP4722756B2 (en) * 2006-04-14 2011-07-13 モレックス インコーポレイテド Connector for cable connection
EP2018702A1 (en) * 2006-05-12 2009-01-28 Baumer Electric AG Proximity switch and method for contacting a sensor pcb
US8564986B2 (en) * 2007-02-06 2013-10-22 Kenneth E. Wing Regulated output current and slope control
CH699105A1 (en) * 2008-07-11 2010-01-15 Reichle & De Massari Fa IDC and contacting.
US7736173B2 (en) * 2008-09-16 2010-06-15 Surtec Industries, Inc. Insulation displacement contact (IDC) and IDC mounting system
JP5353614B2 (en) * 2008-10-06 2013-11-27 日立化成株式会社 Board insertion connector and manufacturing method thereof
US7749020B1 (en) * 2008-12-22 2010-07-06 Moxa Inc. Positioning and grounding structure for ring connectors
WO2010096714A2 (en) * 2009-02-19 2010-08-26 Touchdown Technologies, Inc. Probe head for a microelectronic contactor assembly, the probe head having smt electronic components thereon
DE102010014295A1 (en) * 2010-04-08 2011-10-13 Phoenix Contact Gmbh & Co. Kg Connector for receiving a multi-core cable
KR20130143339A (en) * 2012-06-21 2013-12-31 삼성전자주식회사 Angle adjustable ear jack module
DE102012210921A1 (en) * 2012-06-27 2014-01-23 Robert Bosch Gmbh Contact element for connection to a printed circuit board, contact system and method
US20150099398A1 (en) * 2013-10-07 2015-04-09 Eli Benoliel Connector for printed circuit boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2014000920A1 *

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CN104412454A (en) 2015-03-11
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US9484643B2 (en) 2016-11-01
WO2014000920A1 (en) 2014-01-03

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