EP2443390A1 - Kühlkörper für halbleiterleuchtelemente - Google Patents
Kühlkörper für halbleiterleuchtelementeInfo
- Publication number
- EP2443390A1 EP2443390A1 EP10724018A EP10724018A EP2443390A1 EP 2443390 A1 EP2443390 A1 EP 2443390A1 EP 10724018 A EP10724018 A EP 10724018A EP 10724018 A EP10724018 A EP 10724018A EP 2443390 A1 EP2443390 A1 EP 2443390A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat sink
- control electronics
- mounting recess
- wall
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 238000001816 cooling Methods 0.000 title abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000012546 transfer Methods 0.000 claims abstract description 6
- 230000009969 flowable effect Effects 0.000 claims description 11
- 230000010512 thermal transition Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 210000004907 gland Anatomy 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241000230491 Gulo Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229940125810 compound 20 Drugs 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011440 grout Substances 0.000 description 1
- JAXFJECJQZDFJS-XHEPKHHKSA-N gtpl8555 Chemical compound OC(=O)C[C@H](N)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1CCC[C@@H]1C(=O)N[C@H](B1O[C@@]2(C)[C@H]3C[C@H](C3(C)C)C[C@H]2O1)CCC1=CC=C(F)C=C1 JAXFJECJQZDFJS-XHEPKHHKSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Definitions
- the invention relates to a heat sink for at least one semiconductor light-emitting element, in particular at least one light-emitting diode, an LED lamp with such a heat sink and a method for producing a lamp.
- LED lamps with high-performance light-emitting diodes in addition to the cooling of the light-emitting diode (s), sufficient cooling of a control electronics for operating the LED lamp or its light-emitting diode (s) is required.
- An electronic control system is so far used in conventional lamps with tar. LED drivers of low power LEDs can be cooled via air bridges.
- EP 1 047 903 B1 discloses an LED lamp having a pillar, a lamp cap connected to one end of the pillar, and a substrate connected to the other end of the pillar and provided with a number of LEDs, the pillar having a base Substrate comprises a regular polyhedron having at least four surfaces, wherein surfaces of the polyhedron are provided with at least one LED, which has a luminous flux of at least 5 Im in the operation of the lamp, and wherein the column is provided with heat dissipation means comprising the substrate and the lamp cap connect with each other.
- EP 1 503 139 A2 discloses a compact LED light source which provides LED positioning together with heat dissipation.
- the LED light source may be fabricated with a thermally conductive plate carrying a plurality of LEDs mounted on the plate and in thermal contact with the plate.
- the plate also carries an electrical circuit, which provides an electrical connection to the LEDs.
- a heat conversion shift spindle mechanically supports the plate and likes a heat conduction path from the Deploy LEDs away. LEDs can then be easily mounted in high concentration and kept ready for increased optical system intensity in the vicinity, while providing a heat dissipation path for the associated increase in heat concentration.
- the heat sink is provided for cooling at least one semiconductor light-emitting element, in particular LED, and has a mounting recess for at least partially accommodating a control electronics for operating the lamp.
- the heat sink of the lamp is thus used simultaneously for cooling the LEDs and the control electronics.
- the drive electronics can thus be cooled without introducing another component in the lamp. This can save space and costs. In particular, to achieve a smaller build volume of the space inside of heatsinks, which is not used anyway for the convective cooling and is not needed for a heat spread, can be effectively used.
- the control electronics which can get in the cavity of the heat sink on all sides, and in particular on both populated sides in the case of a board equipped with both sides, contact with the heat sink can be better cooled. As a result, the service life of the electronic components of the control electronics, in particular of electrolytic capacitors, can be significantly increased.
- the at least one semiconductor light-emitting element may have one light-emitting diode or a plurality of light-emitting diodes.
- the at least one light-emitting diode may comprise a high-power light-emitting diode, for example with a power of 2 watts.
- the term "light-emitting diode” is understood to mean any LED unit that can be mounted on the heat sink, eg. B. an LED chip, a potted LED, a LED package (with one or more LED chips by means of bonding (wire bonding, flip-chip bonding, etc.) connected housing or substrate) or a LED Module (housing or substrate connected to one or more LED chips or LED packages via conventional bonding methods (soldering, etc.)), with or without optical elements.
- the control electronics in particular for at least one LED, can be designed as a driver or as another control device, for. B. based on a voltage or power control.
- a fixing means for fixing the control electronics for example a slot for fixing a board of the control electronics.
- control electronics can be completely accommodated in the mounting recess.
- the mounting recess can be shaped so that a material consumption and thus a weight are low.
- the mounting recess may have a light bulb shape as a basic shape.
- a wall thickness of a Heatsink core heat sink without external cooling fins
- the wall thickness can be designed so that it does not fall below a minimum thickness. To optimize the relationship between weight and heat conduction, it may be preferable for the wall thickness to decrease with distance from the LED.
- the shape of the mounting recess and the shape of the control electronics can be coordinated so that sets a predetermined distance between at least one electronic component of the control electronics and a wall of the mounting recess.
- At least one wall portion of the wall of the mounting recess may be formed plane-parallel to an opposite surface of an electronic component.
- At least one wall region of the wall which is formed plane-parallel to an opposite surface of the electronic component, can be formed on a projection or recess of the mounting recess.
- the wall of the mounting recess at least one recess for receiving an electronic component of the control electronics, in particular a transformer having.
- the heat sink can be made in several parts, in particular in two parts, whereby at least two parts of the heat sink are provided. because they have a part of a wall of the mounting recess.
- the multi-part design of the heat sink allows the mounting recess to be easily manufactured, can be well adapted to the control electronics, and therefore better cooling is possible. In addition, the control electronics and a thermal transfer material can also be introduced more easily and locally targeted.
- the multi-part design of the heat sink also makes it possible to create cable feedthroughs between the individual parts, in order to reduce production costs ("threading" cables through holes).
- the heat sink may in particular be separated along planes that lie parallel to an axis of symmetry, in particular the longitudinal axis, of the heat sink. This includes a parting plane which receives the symmetry axis.
- the heat sink can be configured in two parts with mirror-symmetrical basic shape of the two parts. Specifically, the heat sink can be mirror-symmetrically separated along a vertical.
- the heat sink may further comprise at least one thermal transition material, TIM ('Thermal Interface Material'), between at least one electronic component of the control electronics and the heat sink.
- TIM 'Thermal Interface Material'
- a very good price / performance ratio can be achieved by simultaneous, targeted use of various TIM materials.
- a thermal transition material with a thermal conductivity of at least 5 W / (mK) can be introduced between at least one electronic component of the control electronics and the heat sink, in particular in the form of a heat conduction mat.
- the lamp is equipped with one or more light-emitting diodes and with at least one such heat sink, wherein the control electronics is at least partially added to the mounting recess.
- the lamp is designed in particular as a retrofit lamp, d. h., that with the help of standard versions (E12, E14, E26, E27, GUlO ...) as a substitute for z.
- B. incandescent lamps can be used.
- the external shape and appearance are usually similar to incandescent lamps and satisfy the standards, e.g. for the outer dimensions.
- the method for producing such a lamp has at least the following steps: at least partial introduction of the control electronics into the mounting recess; at least partially filling the mounting recess with at least one flowable thermal transition material;
- the step of introducing the driving electronics into the mounting recess may include the step of introducing the driving electronics into a mounting recess portion of a heat sink member.
- the step of introducing the control electronics a step of attaching a non-flowable (solid) thermal transfer material, in particular a TIM mat, on at least one component of the An Kunststoffungselek- tronik, in particular on a region of the component which is intended for positioning in relation to a plane-parallel surface of the mounting recess, that is to say to preferably thermally bridge a narrow gap between the control electronics and the cooling body part.
- the attachment can be carried out, for example, by applying or gluing the solid TIM material.
- the individual heat sink parts can be joined together to form the entire heat sink.
- the mounting recess of the entire (integral or assembled) heat sink can be filled with at least one or another thermal transition material, in particular a flowable TIM material.
- a thermal transition material in particular a flowable TIM material.
- a "flowable material” is understood to mean both a material which is capable of flowing alone and a material which is flowable only under an external influence.
- the flowable materials include gels, foams and pastes.
- FIG. 1 shows a sectional view in cross-sectional view of a schematic diagram of an LED lamp with a heat sink, which has a mounting recess for receiving a control electronics
- Fig. 2 shows an oblique view of a heat sink part of a heat sink of an LED lamp of Fig. 1;
- Fig. 3 shows a sectional view in cross-sectional view of the LED lamp of Figure 1 in greater detail with recorded in the recording control electronics.
- Fig. 4 shows the heat sink in oblique view from the rear
- Fig. 1 shows the basic structure of an LED lamp 1 with a heat sink 2, which has a mounting recess 3 for receiving a control electronics 4.
- the heat sink 2 is constructed from a full-volume heat sink core 5, in which the mounting recess 3 is introduced at a bottom 6, while its top 7 is provided with a high-power light emitting diode 8 with a power of two watts or more.
- Laterally (laterally) of the heat sink core 5 integrally connect cooling elements in the form of vertically (in z-orientation) aligned cooling fins 9.
- the light-emitting diode 8 is connected to the mounting recess 3 via a current through the heat sink core 5 cable gland 10, in order to create an installation channel for at least one electrical connection line between the LED 8 and the control electronics 4 fen.
- the heat sink 1 is composed of two substantially mirror-symmetrical heat sink parts, as described in more detail in FIG. The sectional view shown in Fig. 1 can then - without the LED 8 and the control electronics - also correspond to a side view of an open side of the heat sink parts.
- the control electronics 4 can thus be cooled without having to introduce another component into the LED lamp 1. It consumes no more space than for a conventional heat sink 2 without Montageaussparung.
- the life of the control electronics 4 can be significantly higher, since the control electronics 4 lateral all sides can get in contact with the heat sink 2 and thus can be better cooled.
- the heat sink 2 is a protective sheath to protect the control electronics 4 from mechanical stress and - in the case of suitable electrically insulating material of the heat sink or the thermal transition material - for electrical isolation of the electronics from the environment.
- both heat generated by the LED 8 and heat generated by the drive electronics 4 are picked up by the heat sink core 5 and distributed to the cooling fins 9.
- the heat can be dissipated in a known manner by means of (free or forced) thermal convection to the environment.
- FIG. 2 shows an oblique view of a possible structural design of the heat sink 2 of the LED lamp 1 from FIG. 1 on the basis of a heat sink part 11, which represents essentially one half of the heat sink 2 in a section through the vertical xz plane of FIG.
- Both the heat sink core 5 and the mounting recess 3 are not rectilinear in the z-direction (eg cylindrical or cylindrical tube-shaped), but widen from the bottom 6 to the top 7.
- Such a shape of the mounting recess 3 can be achieved with a heat sink part 11, which has a part of the wall 12 of the mounting recess 3, ie in which the mounting recess 3 is exposed, in a particularly simple and versatile manner.
- the shown heat sink part 11 is to complete the heat sink 2 with another, in the way significant mirror-symmetrical heat sink part, joined together on the open surface.
- the mounting recess 3 has an extension 24 for the use of an insulating body, as will be explained below with reference to FIG. 5.
- Fig. 3 shows a sectional view in cross-sectional view, the LED lamp 1 of FIG. 1 in greater detail with a recorded in the receptacle 3 on both sides populated control electronics 4.
- the wall 12 has planar surface areas 15, which leads to a closely adjacent planar surface 16 of a electronic component 17 of the control electronics 4 fit. More precisely, an outer surface region 15 of the wall 12 is plane-parallel to the associated surface 16 of the closely adjacent electronic component 17.
- a very small, constant distance d between the control electronics 4 or an electronic component 17 and the heat sink 2 can be achieved.
- the critical e.g. B. the particularly overheating endangered, components 17 to be arranged.
- the mounting recess 3 no longer has purely smooth walls 12, but also has inwardly extending projections 14, which with a respective planar surface 15 in the direction of an associated planar surface 16 of an electronic Protect component 17 and so achieve a small distance d even at different levels of components 17.
- the distance is less than 1 mm, in particular less than 0.5 mm.
- the space between them is as completely as possible.
- only the critical components 17 may be thermally linked to the heat sink 2 via a thermally conductive material 19.
- the respective distance d between the critical components 17 and the wall 12 is thermally bridged by inserting a heat conducting mat 19 with a thermal conductivity of at least 5 W / (mK), z.
- a heat conducting mat 19 with a thermal conductivity of at least 5 W / (mK), z.
- an easily fillable, in particular flowable potting compound 20 can be used with a lower coefficient of thermal conductivity, for.
- the heat sink 2 can thus be adapted in a simple manner to the position and geometry of the electronic components 17 to be cooled particularly. As a result, an optimal cooling of the control electronics 4 can be achieved with a compact design and ease of manufacture at the same time.
- the arrangement of the critical electronic components 17 can be matched to the feasible mounting recess 3 in the board design of the control electronics 4. In the design of mounting recess 3 and control electronics 4, it is not necessary to pay attention to whether the control electronics 4 can be inserted into the mounting recess 3 in the case of the split heat sink 2 used in this embodiment.
- the control electronics 4 are first occupied by the thermal conduction mat 19 and the control electronics 4 are then placed in a mounting position.
- Recess part 3 of the cooling body parts 11 introduced. This is particularly easy with exposed mounting recess part 3, since it is easily accessible.
- the control electronics 4 fixing means not shown here can be used, such as grooves, lands, locking elements, etc.
- the mounting recess part 3 is filled with at least one flowable thermal transition material; Again, the completion is particularly easy to carry out.
- the heat sink parts 11 are brought together to form the complete heat sink 2.
- the light-emitting diode 8 is fixed to the heat sink 2, specifically to an LED mounting area 13. In the unassembled state, the LED mounting area 13 is also divided onto the heat sink parts 11.
- Fig. 4 shows the heat sink 2 in a view obliquely from behind on its back or bottom 6.
- the heat sink 2 is substantially angularly symmetrical along its longitudinal axis L.
- FIG. 5 shows an oblique view of an embodiment of an LED lamp 1 with a heat sink 2 according to FIG. 2 to FIG. 4 without control electronics 4.
- This LED lamp 1 also has the LED 8 on a corresponding printed circuit board a translucent protective cover
- the protective cover 21 is attached to the top 7 of the heat sink 2.
- a wider portion 25 of an insulating part 22 made of plastic in the extension 24 of the mounting recess is inserted.
- a lamp cap 23 for power supply is a narrower portion 26 of the insulating part
- the lamp base 23 is designed as a standard base (eg E12, E14, E26, E27, GU10, etc.), so that the
- LED lamp can be used directly as replacement for eg incandescent lamps (also called “retrofit”) .
- incandescent lamps also called “retrofit”
- the external shape eg a rotational symmetry about the longitudinal axis
- the appearance are usually based on incandescent lamps and meet the requirements.
- the invention is also applicable to lamps with one or more low-power LEDs, or to lamps with other types of light sources, such as laser diodes or compact fluorescent tubes.
- the lamp may include one or more light emitting diodes. These can be present as a single diode (s) and / or as an LED module (s), with an LED module (s) having a plurality of LED chips being mounted on a common submount.
- the LEDs can be monochrome or different colors.
- the light-emitting diodes can each shine white or shine in different colors and produce a white mixed light.
- Differently colored light-emitting diodes can be present in particular as an RGB, RGBA, RGBW, RGBAW, etc. combination, wherein a luminous intensity of a color can also be adjusted by providing a specific number of light-emitting diodes of this color.
- the individual light-emitting diodes and / or the modules can be equipped with suitable optics for beam guidance, z. B. Fresnel lenses, collimators, and so on.
- suitable optics for beam guidance z. B. Fresnel lenses, collimators, and so on.
- z. B. based on InGaN or AlInGaP organic LEDs (OLEDs) are generally used.
- z. B. diode lasers are used.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009024907A DE102009024907A1 (de) | 2009-06-15 | 2009-06-15 | Kühlkörper für Halbleiterleuchtelemente |
PCT/EP2010/057250 WO2010145925A1 (de) | 2009-06-15 | 2010-05-26 | Kühlkörper für halbleiterleuchtelemente |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2443390A1 true EP2443390A1 (de) | 2012-04-25 |
EP2443390B1 EP2443390B1 (de) | 2014-11-19 |
Family
ID=42358592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10724018.6A Not-in-force EP2443390B1 (de) | 2009-06-15 | 2010-05-26 | Kühlkörper für halbleiterleuchtelemente |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120176796A1 (de) |
EP (1) | EP2443390B1 (de) |
CN (1) | CN102803846A (de) |
DE (1) | DE102009024907A1 (de) |
WO (1) | WO2010145925A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8602597B2 (en) * | 2010-11-16 | 2013-12-10 | Cree, Inc. | Heat sink retaining structure for light emitting device board assemblies, and methods |
JP2012199008A (ja) * | 2011-03-18 | 2012-10-18 | Sharp Corp | 照明装置、およびそれを備えた照明機器 |
CN103090338B (zh) | 2011-11-03 | 2018-10-09 | 欧司朗股份有限公司 | 驱动器组件及其制造方法 |
DE202013007592U1 (de) * | 2013-08-26 | 2013-09-06 | Osram Gmbh | Halbleiterlampe mit Wärmeleitkörper zwischen Treiber und Treibergehäuse |
CA2909331A1 (en) * | 2014-10-27 | 2016-04-27 | National Chemical Company | Led lamp |
DE102015206802A1 (de) * | 2015-04-15 | 2016-10-20 | Osram Gmbh | Leuchtmittel mit LEDs |
DE102017120023B4 (de) | 2017-08-31 | 2019-10-31 | Ledvance Gmbh | Halbleiterlampe und Verfahren zum Herstellen einer Halbleiterlampe |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69936375T2 (de) | 1998-09-17 | 2008-02-28 | Koninklijke Philips Electronics N.V. | Led-leuchte |
US7093958B2 (en) | 2002-04-09 | 2006-08-22 | Osram Sylvania Inc. | LED light source assembly |
US7758223B2 (en) * | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
CN100559073C (zh) * | 2005-04-08 | 2009-11-11 | 东芝照明技术株式会社 | 灯 |
US9412926B2 (en) * | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
US7766512B2 (en) * | 2006-08-11 | 2010-08-03 | Enertron, Inc. | LED light in sealed fixture with heat transfer agent |
DE102007024390A1 (de) * | 2006-11-16 | 2008-05-21 | Robert Bosch Gmbh | LED-Modul mit integrierter Ansteuerung |
US20080175003A1 (en) * | 2007-01-22 | 2008-07-24 | Cheng Home Electronics Co., Ltd. | Led sunken lamp |
DE202007008258U1 (de) * | 2007-04-30 | 2007-10-31 | Lumitech Produktion Und Entwicklung Gmbh | LED-Leuchtmittel |
EP2163808B1 (de) * | 2007-05-23 | 2014-04-23 | Sharp Kabushiki Kaisha | Beleuchtungsvorrichtung |
CN202040773U (zh) * | 2007-07-20 | 2011-11-16 | 奥斯兰姆有限公司 | 照明装置 |
CN101368719B (zh) * | 2007-08-13 | 2011-07-06 | 太一节能***股份有限公司 | 发光二极管灯具 |
US7637635B2 (en) * | 2007-11-21 | 2009-12-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp with a heat sink |
CN201110496Y (zh) * | 2007-12-04 | 2008-09-03 | 讯凯国际股份有限公司 | 具有导热构造的灯罩 |
TW200940881A (en) * | 2008-03-18 | 2009-10-01 | Pan Jit Internat Inc | LED lamp with thermal convection and thermal conduction heat dissipating effect, and heat dissipation module thereof |
DE202008006321U1 (de) * | 2008-05-08 | 2008-07-31 | Unity Opto Technology Co., Ltd., San Chung City | Verstellbares Lampengerät |
US8021027B2 (en) * | 2008-09-05 | 2011-09-20 | Philips Electronics Ltd | LED based acorn style luminaire |
DE202008016870U1 (de) * | 2008-12-19 | 2009-03-19 | Osram Gesellschaft mit beschränkter Haftung | Leuchte |
-
2009
- 2009-06-15 DE DE102009024907A patent/DE102009024907A1/de not_active Withdrawn
-
2010
- 2010-05-26 WO PCT/EP2010/057250 patent/WO2010145925A1/de active Application Filing
- 2010-05-26 EP EP10724018.6A patent/EP2443390B1/de not_active Not-in-force
- 2010-05-26 CN CN2010800266912A patent/CN102803846A/zh active Pending
- 2010-05-26 US US13/378,667 patent/US20120176796A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP2443390B1 (de) | 2014-11-19 |
WO2010145925A1 (de) | 2010-12-23 |
CN102803846A (zh) | 2012-11-28 |
DE102009024907A1 (de) | 2010-12-16 |
US20120176796A1 (en) | 2012-07-12 |
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