EP1458015A3 - Spin coating apparatus for coating photoresist - Google Patents

Spin coating apparatus for coating photoresist Download PDF

Info

Publication number
EP1458015A3
EP1458015A3 EP04251412A EP04251412A EP1458015A3 EP 1458015 A3 EP1458015 A3 EP 1458015A3 EP 04251412 A EP04251412 A EP 04251412A EP 04251412 A EP04251412 A EP 04251412A EP 1458015 A3 EP1458015 A3 EP 1458015A3
Authority
EP
European Patent Office
Prior art keywords
spin
coating
photoresist
coating apparatus
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04251412A
Other languages
German (de)
French (fr)
Other versions
EP1458015A2 (en
Inventor
Eun-Sung Lee
Sung-Hoon Choa
Min-Seog Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of EP1458015A2 publication Critical patent/EP1458015A2/en
Publication of EP1458015A3 publication Critical patent/EP1458015A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A spin coating apparatus for coating photoresist has a spin chuck and a nozzle part. The spin chuck has a mount part on which a wafer is mounted and an extended projection part on which edge-bead is formed. The nozzle part is for depositing photoresist onto the wafer mounted on the mount part of the spin chuck. By using the spin coating apparatus, edge-bead is formed on the extended projection part, and not on the wafer.
EP04251412A 2003-03-11 2004-03-11 Spin coating apparatus for coating photoresist Withdrawn EP1458015A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2003-0015154A KR100518788B1 (en) 2003-03-11 2003-03-11 Spin coating apparatus for coating photoresist
KR2003015154 2003-03-11

Publications (2)

Publication Number Publication Date
EP1458015A2 EP1458015A2 (en) 2004-09-15
EP1458015A3 true EP1458015A3 (en) 2007-07-18

Family

ID=32768631

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04251412A Withdrawn EP1458015A3 (en) 2003-03-11 2004-03-11 Spin coating apparatus for coating photoresist

Country Status (4)

Country Link
US (1) US20040231584A1 (en)
EP (1) EP1458015A3 (en)
JP (1) JP2004274066A (en)
KR (1) KR100518788B1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100619399B1 (en) 2004-06-03 2006-09-08 동부일렉트로닉스 주식회사 Apparatus for coating substrate with resist materials
KR100663847B1 (en) * 2004-09-03 2007-01-03 한국과학기술원 Spin coating apparatus and method tfereof
KR100620531B1 (en) * 2004-12-30 2006-09-08 주식회사 선진일렉트로닉스 Jig for Display Window Washing and Washing Method Using the Same
KR100758386B1 (en) * 2004-12-30 2007-09-14 주식회사 선진일렉트로닉스 A Coating Device for Display Windows and Coating Method Thereof
US7435692B2 (en) * 2005-10-19 2008-10-14 Tokyo Electron Limited Gas jet reduction of iso-dense field thickness bias for gapfill process
KR101654515B1 (en) * 2009-07-01 2016-09-07 주식회사 에스앤에스텍 Photo mask blank, method for manufacturing photo mask blank, and photo mask
JP5927037B2 (en) * 2012-05-25 2016-05-25 オリンパス株式会社 Thin film manufacturing method
NL2017053B1 (en) 2016-06-27 2018-01-05 Suss Microtec Lithography Gmbh Method for coating a substrate and also a coating system
CN107275263A (en) * 2017-06-08 2017-10-20 中国电子科技集团公司第四十四研究所 The spin coating device of webbing effect can be eliminated

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206626A (en) * 1990-11-30 1992-07-28 Tokyo Electron Ltd Removal of peripheral resist
JPH06216025A (en) * 1993-01-18 1994-08-05 Tokyo Electron Ltd Exposure device
US5993547A (en) * 1997-01-09 1999-11-30 Nec Corporation Edge rinse mechanism for removing a peripheral portion of a resist film formed on a wafer
US6012858A (en) * 1997-08-01 2000-01-11 Tokyo Electron Limited Apparatus and method for forming liquid film
WO2000032835A2 (en) * 1998-11-30 2000-06-08 Applied Materials, Inc. Electro-chemical deposition system
EP1118390A2 (en) * 2000-01-17 2001-07-25 Canon Kabushiki Kaisha Coating method and coating apparatus
US6402845B1 (en) * 1997-08-12 2002-06-11 Micron Technology, Inc. Process liquid dispense method and apparatus
US20020092917A1 (en) * 2001-01-12 2002-07-18 Applied Materials, Inc. Adjustable nozzle for wafer bevel cleaning
US6495205B1 (en) * 1998-02-17 2002-12-17 Fastar, Ltd. Linear extrusion coating system and method
US20050014390A1 (en) * 2003-07-18 2005-01-20 Honeywell International Inc. Edge bead control method and apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0444216Y2 (en) * 1985-10-07 1992-10-19
US4856456A (en) * 1988-10-03 1989-08-15 Machine Technology, Inc. Apparatus and method for the fluid treatment of a workpiece
US4989345A (en) * 1989-12-18 1991-02-05 Gill Jr Gerald L Centrifugal spin dryer for semiconductor wafer
US5294257A (en) * 1991-10-28 1994-03-15 International Business Machines Corporation Edge masking spin tool
TW329026B (en) * 1997-07-19 1998-04-01 Nanya Technology Co Ltd The photoresist developing apparatus in IC processes
US20030070695A1 (en) * 2001-10-16 2003-04-17 Applied Materials, Inc. N2 splash guard for liquid injection on the rotating substrate
JP3718647B2 (en) * 2001-10-19 2005-11-24 東京エレクトロン株式会社 Developing apparatus and developing method
US7223308B2 (en) * 2003-10-06 2007-05-29 Applied Materials, Inc. Apparatus to improve wafer temperature uniformity for face-up wet processing

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206626A (en) * 1990-11-30 1992-07-28 Tokyo Electron Ltd Removal of peripheral resist
JPH06216025A (en) * 1993-01-18 1994-08-05 Tokyo Electron Ltd Exposure device
US5993547A (en) * 1997-01-09 1999-11-30 Nec Corporation Edge rinse mechanism for removing a peripheral portion of a resist film formed on a wafer
US6012858A (en) * 1997-08-01 2000-01-11 Tokyo Electron Limited Apparatus and method for forming liquid film
US6402845B1 (en) * 1997-08-12 2002-06-11 Micron Technology, Inc. Process liquid dispense method and apparatus
US6495205B1 (en) * 1998-02-17 2002-12-17 Fastar, Ltd. Linear extrusion coating system and method
WO2000032835A2 (en) * 1998-11-30 2000-06-08 Applied Materials, Inc. Electro-chemical deposition system
EP1118390A2 (en) * 2000-01-17 2001-07-25 Canon Kabushiki Kaisha Coating method and coating apparatus
US20020092917A1 (en) * 2001-01-12 2002-07-18 Applied Materials, Inc. Adjustable nozzle for wafer bevel cleaning
US20050014390A1 (en) * 2003-07-18 2005-01-20 Honeywell International Inc. Edge bead control method and apparatus

Also Published As

Publication number Publication date
JP2004274066A (en) 2004-09-30
US20040231584A1 (en) 2004-11-25
KR20040080254A (en) 2004-09-18
EP1458015A2 (en) 2004-09-15
KR100518788B1 (en) 2005-10-05

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