EP1453155A2 - Verfahren zur Herstellung von Schleifringbürsten und auf diese Weise hergestellte Schleifringbürste - Google Patents
Verfahren zur Herstellung von Schleifringbürsten und auf diese Weise hergestellte Schleifringbürste Download PDFInfo
- Publication number
- EP1453155A2 EP1453155A2 EP03026305A EP03026305A EP1453155A2 EP 1453155 A2 EP1453155 A2 EP 1453155A2 EP 03026305 A EP03026305 A EP 03026305A EP 03026305 A EP03026305 A EP 03026305A EP 1453155 A2 EP1453155 A2 EP 1453155A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- brush
- slip ring
- brush element
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims abstract description 30
- 238000005476 soldering Methods 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910000510 noble metal Inorganic materials 0.000 claims description 5
- 230000008901 benefit Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R39/00—Rotary current collectors, distributors or interrupters
- H01R39/02—Details for dynamo electric machines
- H01R39/18—Contacts for co-operation with commutator or slip-ring, e.g. contact brush
- H01R39/24—Laminated contacts; Wire contacts, e.g. metallic brush, carbon fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R39/00—Rotary current collectors, distributors or interrupters
- H01R39/02—Details for dynamo electric machines
- H01R39/38—Brush holders
- H01R39/383—Brush holders characterised by the electrical connection to the brush holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/12—Manufacture of brushes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49119—Brush
Definitions
- the invention relates to a method for producing slip ring brushes according to claim 1. Furthermore, the invention comprises, according to Claim 8 a slip ring brush itself.
- Slip ring units often consist of a slip ring brush, among other things and slip rings, the slip ring brush sliding during operation Has contact with rotating slip rings.
- slip ring units are used in many technical fields to electrical signals or electrical power from a fixed to a rotating electrical Transfer unit. It is important that, for example, by resilient Brush elements a good and lasting contact between the Slip ring brush and the slip rings is given, even if for example the entire slip ring unit is exposed to vibrations.
- US Pat. No. 4,583,797 describes a slip ring which also has substantially U-shaped brush wires.
- U-shaped brush wires through a brush block that is used as a circuit board Conductors can be formed, inserted through.
- the brush wires are soldered to the circuit board so that the solder joint is on the rotor facing surface of the circuit board.
- This design has the Disadvantage that the assembly of the corresponding slip ring brush is complex is.
- slip ring brushes manufactured in this way have regard to their spring properties a not optimal quality.
- the invention is therefore based on the object of a method for the production to create a slip ring brush, which requires minimal assembly effort conditioned, and by what high quality slip ring brushes can be produced with a small amount of installation space.
- the invention provides a new slip ring brush created by which the lifespan or the reliability of Slip ring units is significantly increased. This is done through the slip ring brush solved according to claim 8.
- the invention is based on the idea that at least one brush element is soldered to a first surface of a circuit board, the soldering process is made such that solder, from the second surface the circuit board coming through holes in the circuit board up to the brush element passes. Through this process, the conductor tracks the circuit board with the brush element electrically and mechanically connected.
- an opening or a hole is closed under the term bore understand which does not necessarily have to have a circular cross-section, rather, the bores can also have a polygonal cross section or have any other curve geometry as a perimeter limitation.
- the second Surface of the circuit board pads arranged on which the ends of a cable with the advantage of a ribbon cable, can be electrically contacted.
- Figure 1 is a plan view of a first surface A of a circuit board 1 shown.
- the circuit board 1 consists of epoxy resin, which is filled with glass fibers, and has a comparatively low Thermal conductivity.
- other materials for the circuit board 1 can be used, such as materials based on Polyamide or ceramic components are based.
- FIG. 2 is a top view of the second surface B of the circuit board 1 shown.
- holes 1.2, 1.21, 1.22 and further conductor tracks 1.1, 1.12 also pads 1.3, 1.31, 1.31a, 1.32, 1.32a shown.
- a virtual one runs parallel to the drawing plane of FIGS. 1 and 2 geometric plane, namely the central longitudinal section C, which in the Figures 3 and 5 is shown in the side views of the circuit board 1. Accordingly, the central longitudinal section C is located in the middle between the two Surfaces A and B.
- the slip ring brush according to the invention comprises Brush elements, which in the example shown are designed as wire brackets 2, 21 are.
- the wire bracket 2, 21, which are all identical in construction are, have three legs 2.1, 21.1; 2.2, 21.2; 2.3, 21.3 and have one essentially U-shaped or ⁇ -shaped shape, so that the wire bracket 2, 21 each have an opening 21.4.
- the wire bracket 2, 21 or their Leg 2.1, 21.1; 2.2, 21.2; 2.3, 21.3 have an inside I and one Outside O.
- the inside I is the geometric area of the Leg 2.1, 21.1; 2.2, 21.2; 2.3, 21.3, the center or the Center of gravity of the wire bracket 2, 21 points.
- the outside shows O away from the center of the U- or ⁇ -shaped wire bracket 2, 21.
- the outer side O is therefore on the outer circumference of the wire bracket 2, 21.
- the wire clips 2, 21 are produced from a 20 mm long wire with a diameter of 0.2 mm by a bending process. Due to the requirements regarding a design of the slip ring units that is as miniaturized as possible, the wire clips 2, 21 have a correspondingly small diameter. Such thin wire brackets 2, 21 have an extremely high volume-related surface area (approximately 20 mm 2 / mm 3 ), as a result of which they assume the ambient temperature in their entire volume within a very short time.
- the wire clips 2, 21 consist of a noble metal alloy. The main component of this noble metal alloy is the noble metal palladium with proportions of copper and silver.
- a mixture of gold, copper and silver can also be used, for example, as the noble metal alloy, in which case gold can be used as the main component.
- the components of the alloy advantageously have an electrochemical potential which is positive with respect to hydrogen as zero potential.
- step S3 the surface A of the circuit board 1 becomes the outside O of the leg 21.1 of the wire bracket 21 placed such that the Outside O of the leg 21.1 at the exit of the holes 1.21, 1.22 comes to lie.
- the wire bracket 21 is oriented so that related the opening 21.4 on the central cross section C of the circuit board 1 is on the same side as surface A, on which the leg 21.1 is attached.
- the respective elements in the following order surface A, leg 21.1, opening 21.4, so that the leg 21.1 between the circuit board 1 and the opening 21.4.
- the Leg 21.1 so placed on the surface A of the circuit board 1 that this to be centered over the respective exit of the holes 1.21, 1.22 comes. In practice, however, it shows that there are deviations from ⁇ 0.4 mm from the center of the holes 1.21, 1.22 can be tolerated, without noticeable loss of quality in the soldered connection become.
- the legs 21.1 are in any case at the exit of the holes 1.21, 1.22 placed on the circuit board 1.
- the term at the exit of the holes 1.21, 1.22 thus comprises an area within which an attached leg 21.1 still using Lot 3, which through the holes 1.21, 1.22 can pass through functionally soldered.
- wire clips 2, 21 are exposed to high temperatures, so that no impairment of their spring properties or their elasticity can be determined by the soldering, in particular in the areas which must have a high elasticity during operation, namely Legs 2.2, 21.2 and 2.3, 21.3, as well as the transition areas from these legs 2.2, 21.2, 2.3, 21.3 to leg 2.1, 21.1. All other wire clips 2 are then attached to the printed circuit board 1 using the same method.
- the circuit board 1 now also fulfills the function of a brush block of a slip ring brush.
- a wave soldering process can also be used, in which the legs 2.1, 21.1 of the wire clips 2, 21 are glued onto the surface A of the circuit board 1 before the actual soldering, the wire clips 2, 21 in turn being aligned such that the Opening 21.4 with respect to the central longitudinal section C of the circuit board 1 is on the same side as the surface A and the bores 1.2, 1.21, 1.22 which are relevant for the contacting are covered by the legs 2.1, 21.1 of the wire bracket 2, 21, respectively Legs 2.1, 21.1 are located at the exit of the holes 1.2, 1.21, 1.22.
- the circuit board 1 is moved over a transport system at a uniform speed through a soldering machine and subjected to a wave soldering process.
- these pads 1.3, 1.31, 1.31a, 1.32, 1.32a from accepting solder, or if certain holes 1.2, 1.21, 1.22 on the circuit board 1 are not to be filled with solder, these pads 1.3, 1.31, 1.31 Mask a, 1.32, 1.32a or the relevant holes 1.2, 1.21, 1.22 with wave-resistant adhesive strips before wave soldering.
- All legs 2.1, 21.1, 2.2, 21.2, 2.3, 21.3 of the wire bracket 2, 21 are located namely after step S4 on one side of the circuit board 2, 21 namely on the side of the surface A.
- This arrangement has the advantage that on the surface B of the circuit board 1 for soldering a cable, shown in Example of a ribbon cable 5, no legs 2.1, 21.1, 2.2, 21.2, 2.3, 21.3 of the wire bracket 2, 21 are arranged as geometric Obstacles or interference contours would affect the soldering process.
- the Ribbon cable 5 has, according to FIG. 5, six individual wires 5.1 to 5.6 with associated insulation, each individual wire is 5.1 to 5.6 to Purpose of its identification with a different colored one Surrounded by plastic insulation.
- Using a ribbon cable 5 has the advantage, among other things, that the order of the individual wires 5.1 to 5.6 given by their lateral connection of the plastic insulation is so that the individual wires 5.1 to 5.6 are mixed up when soldering to the respective pads 1.3, 1.31, 1.31a, 1.32, 1.32a largely avoided can be.
- the stripped ends of the individual wires 5.1 to 5.6 of the ribbon cable 5 are thus connected to the pads 1.3, 1.31, 1.32 soldered with a hand soldering process. Because the surface B the printed circuit board 1 has no geometric obstacles for soldering, the soldering can be done very quickly and a consistently high quality of the Soldering points between the ends of the ribbon cable 5 and the pads 1.3, 1.31, 1.32 can be achieved.
- FIG. 4 is a top view of a slip ring brush according to the invention shown.
- the soldered to the circuit board 1 protrude in the illustration Wire bracket 2, 21 out of the drawing plane. 4 is the Rotor 4, consisting of six individual axially lined up and against each other electrically insulated slip rings, such as those in the fully assembled Slip ring unit is provided, indicated by dashed lines.
- the ribbon cable 5, which on the Surface B of the circuit board 1 is shown attached, the one of the circuit board 1 hidden contours of the ribbon cable 5 shown in dashed lines are.
- FIG. 5 shows a side view of the slip ring brush according to the invention, consisting of the circuit board 1, which serves as a brush block and the Wire bracket 21, which is a brush element.
- the circuit board 1 On the slip ring brush, or on the circuit board 1 is a ribbon cable 5 according to the section Z-Z ( Figure 4) contacted.
- the outer individual wires 5.1, 5.2 are in the area of Connection end of the ribbon cable 5 according to the pattern of Pads 1.3, 1.31, 1.32 ( Figure 2) bent divergently.
- the legs 21.2, 21.3 of the wire bracket 21 lie according to the figure 4 on a slip ring of the Rotor 4. It is for a perfect function of the slip ring unit necessary that at least one of the legs 21.2, 21.3 always on one Slip ring is present.
- the electricity to be transmitted then arrives via the conductor track 1.12 on the surface B of the circuit board 1 to the pad 1:32.
- a single wire 5.2 of the ribbon cable 5 is soldered to this pad 1.32, so that the current to be transmitted flows into the ribbon cable 5 can.
Landscapes
- Motor Or Generator Current Collectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
- Figur 1
- eine Draufsicht auf eine erste Oberfläche einer Leiterplatte, die als Bürstenblock dient,
- Figur 2
- eine Draufsicht auf eine zweite, der ersten gegenüber liegenden, Oberfläche der Leiterplatte,
- Figur 3
- eine schematische Darstellung von Verfahrensschritten zur Herstellung einer erfindungsgemäßen Schleifringbürste,
- Figur 4
- eine Draufsicht der Schleifringbürste mit einem Flachbandkabel,
- Figur 5
- eine Seitenansicht der Schleifringbürste mit an der Leiterplatte befestigten Bürstenelementen und einem Flachbandkabel.
Alternativ zum Handlötverfahren kann auch ein Schwalllötverfahren angewendet werden, bei dem vor dem eigentlichen Löten die Schenkel 2.1, 21.1 der Drahtbügel 2, 21 auf die Oberfläche A der Leiterplatte 1 aufgeklebt werden, wobei die Drahtbügel 2, 21 wiederum so ausgerichtet werden, dass sich die Öffnung 21.4 bezogen auf den Mittenlängsschnitt C der Leiterplatte 1 auf der gleichen Seite befindet, wie die Oberfläche A und die für die Kontaktierung jeweils relevanten Bohrungen 1.2, 1.21, 1.22 von den Schenkeln 2.1, 21.1 der Drahtbügel 2, 21 abgedeckt werden, bzw. die Schenkel 2.1, 21.1 am Austritt der Bohrungen 1.2, 1.21, 1.22 liegen. Danach wird die Leiterplatte 1 über ein Transportsystem mit gleichmäßiger Geschwindigkeit durch eine Lötmaschine bewegt und einem Schwalllötverfahren ausgesetzt. Um zu verhindern, dass die Pads 1.3, 1.31, 1.31a, 1.32, 1.32a Lot annehmen, oder wenn bestimmte Bohrungen 1.2, 1.21, 1.22 auf der Leiterplatte 1 nicht mit Lot gefüllt werden sollen, kann man diese Pads 1.3, 1.31, 1.31a, 1.32, 1.32a oder die betreffende Bohrungen 1.2, 1.21, 1.22 vor dem Schwalllöten mit hitzebeständigem Klebestreifen abkleben.
Claims (13)
- Verfahren zur Herstellung einer Schleifringbürste umfassendeine Leiterplatte (1), die eine erste Oberfläche (A) und eine der erste Oberfläche (A) gegenüberliegende zweite Oberfläche (B) aufweist,
mit einer Leiterbahn (1.1, 1.11, 1.12) und einer Bohrung (1.2, 1.21, 1.22), welche die Leiterplatte (1) durch die Oberfläche (A) und die Oberfläche (B) hindurch durchdringt, undeinem Bürstenelement (2, 21), wobei
ein elektrischer Kontakt zwischen dem Bürstenelement (2) und der Leiterbahn (1.1, 1.11, 1.12) durch Löten hergestellt wird, dadurch gekennzeichnet dass,
das Bürstenelement (2, 21), in der Weise verlötet wird, dass das Lot (3), kommend von der zweiten Oberfläche (B) der Leiterplatte (1)
durch die Bohrung (1.2, 1.21, 1.22) der Leiterplatte (1) bis hin zum Bürstenelement (2, 21) an der Oberfläche (A) hindurchtritt. - Verfahren gemäß dem Anspruch 1, dadurch gekennzeichnet dass das Bürstenelement (2, 21) eine Innenseite (I) und eine Außenseite (O) aufweist, und vor dem Löten die Außenseite (O) des Bürstenelementes (2, 21) auf die erste Oberfläche (A) der Leiterplatte (1) aufgesetzt wird.
- Verfahren gemäß dem Anspruch 1 oder 2, dadurch gekennzeichnet dass, das Bürstenelement (2, 21) vor dem Löten so ausgerichtet wird, dass das Bürstenelement (2, 21) am Austritt der Bohrung (1.2, 1.21, 1.22) aus der ersten Oberfläche (A) der Leiterplatte (1) zu liegen kommt.
- Verfahren gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Bohrung (1.2, 1.21, 1.22) vor dem Löten metallisiert wird.
- Verfahren gemäß einem der vorhergehenden Ansprüche, wobei ein Handlöt- oder ein Schwalllötprozess angewendet wird.
- Verfahren gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Bürstenelement (2, 21) aus mehreren Schenkeln (2.1, 21.1, 2.2, 21.2, 2.3, 21.3) besteht.
- Verfahren gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass auf der zweiten Oberfläche (B) der Leiterplatte (1) ein Pad (1.3, 1.31, 1.31a, 1.32, 1.32a) vorgesehen ist, an dem in einem weiteren Verfahrensschritt das Ende eines Kabels (5), insbesondere eines Flachbandkabels, kontaktiert wird (S5).
- Schleifringbürste, bestehend auseiner Leiterplatte (1), die eine erste Oberfläche (A) und eine der erste Oberfläche (A) gegenüberliegende zweite Oberfläche (B) aufweist,
mit einer Leiterbahn (1.1, 1.11, 1.12) und einer Bohrung (1.2, 1.21, 1.22), welche die Leiterplatte (1) durch die Oberfläche (A) und die Oberfläche (B) hindurch durchdringt, undeinem Bürstenelement (2, 21), wobei
das Bürstenelement (2) und die Leiterbahn (1.1, 1.11, 1.12) durch eine Lötverbindung in elektrischem Kontakt stehen, dadurch gekennzeichnet dass, das Bürstenelement (2, 21), in der Weise verlötet ist, dass das Lot (3), von der zweiten Oberfläche (B) der Leiterplatte (1) durch die Bohrung (1.2, 1.21, 1.22) der Leiterplatte (1) bis hin zum Bürstenelement (2, 21) an der Oberfläche (A) hindurchgetreten ist. - Schleifringbürste, gemäß dem Anspruch 8, dadurch gekennzeichnet dass das Bürstenelement (2, 21) eine Innenseite (I) und eine Außenseite (O) aufweist, und dass an der Lötverbindung die Außenseite (O) des Bürstenelementes (2, 21) zur ersten Oberfläche (A) der Leiterplatte (1) weist.
- Schleifringbürste, gemäß dem Anspruch 8 oder 9, dadurch gekennzeichnet, dass das Bürstenelement (2, 21) U-förmig ausgestaltet ist und mehrere Schenkel (2.1, 21.1, 2.2, 21.2, 2.3, 21.3) umfasst.
- Schleifringbürste gemäß einem der Ansprüche 8 bis 10, dadurch gekennzeichnet, dass das Bürstenelement (2, 21) aus einer Edelmetalllegierung besteht.
- Schleifringbürste gemäß einem der Ansprüche 8 bis 11, dadurch gekennzeichnet, dass die Bohrung (1.2, 1.21, 1.22) metallisiert ist.
- Schleifringbürste gemäß einem der Ansprüche 8 bis 12, dadurch gekennzeichnet, dass auf der zweiten Oberfläche (B) der Leiterplatte (1) ein Pad (1.3, 1.31, 1.31a, 1.32, 1.32a) vorgesehen ist, an dem das Ende eines Kabels (5), insbesondere eines Flachbandkabels, kontaktierbar ist.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10309213 | 2003-02-28 | ||
DE10309213 | 2003-02-28 | ||
DE10324699A DE10324699A1 (de) | 2003-02-28 | 2003-05-30 | Verfahren zur Herstellung von Schleifringbürsten und auf diese WEise hergestellte Schleifringbürste |
DE10324699 | 2003-05-30 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1453155A2 true EP1453155A2 (de) | 2004-09-01 |
EP1453155A3 EP1453155A3 (de) | 2005-10-26 |
EP1453155B1 EP1453155B1 (de) | 2007-03-07 |
Family
ID=32773175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03026305A Expired - Lifetime EP1453155B1 (de) | 2003-02-28 | 2003-11-15 | Verfahren zur Herstellung von Schleifringbürsten und auf diese Weise hergestellte Schleifringbürste |
Country Status (4)
Country | Link |
---|---|
US (1) | US6909217B2 (de) |
EP (1) | EP1453155B1 (de) |
AT (1) | ATE356451T1 (de) |
DE (1) | DE50306739D1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012203842B3 (de) * | 2012-03-12 | 2013-09-05 | Schleifring Und Apparatebau Gmbh | Schleifringbürste und Halter für Schleifringbürste |
DE102013204004A1 (de) | 2012-03-12 | 2013-09-12 | Schleifring Und Apparatebau Gmbh | Schleifringbürsten in Blindniettechnik und Halterung |
DE102012204830A1 (de) | 2012-03-26 | 2013-09-26 | Schleifring Und Apparatebau Gmbh | Bürstenblock für eine Schleifringanordnung |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8587648B2 (en) * | 2004-06-01 | 2013-11-19 | SeeScan, Inc. | Self-leveling camera head |
KR100699723B1 (ko) * | 2005-09-12 | 2007-03-26 | 삼성전기주식회사 | 진동 모터의 브러쉬 |
DE102006002104A1 (de) | 2006-01-17 | 2007-07-19 | Ltn Servotechnik Gmbh | Schleifringbürste und damit ausgestattete Schleifringeinheit |
US10288997B2 (en) * | 2012-12-20 | 2019-05-14 | SeeScan, Inc. | Rotating contact assemblies for self-leveling camera heads |
EP2903103B1 (de) * | 2014-01-31 | 2019-01-02 | LTN Servotechnik GmbH | Bürsteneinheit mit einer elastischen Bürste |
CN111834851A (zh) * | 2019-04-17 | 2020-10-27 | 泓记精密股份有限公司 | 电刷丝结构、电刷模块结构及其制造方法 |
CN112003110B (zh) * | 2020-08-26 | 2021-10-08 | 徐洪杰 | 一种整体式平板电刷生产方法 |
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US20030015934A1 (en) * | 2001-07-18 | 2003-01-23 | Hajime Kobayashi | Axial direction sliding-contact type brush apparatus, manufacturing method thereof, and flat motor having the brush apparatus |
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DE1275672B (de) | 1960-02-08 | 1968-08-22 | North American Aviation Inc | Buerstenhalterung fuer eine Miniaturschleifringanordnung |
US4850880A (en) * | 1987-12-01 | 1989-07-25 | Zayat Jr Charles D | Anti-tangle swivel electrical connector |
JPH11329653A (ja) * | 1998-05-18 | 1999-11-30 | Star Micronics Co Ltd | スリップリングとその製造方法 |
US6356002B1 (en) * | 1999-02-08 | 2002-03-12 | Northrop Grumman Corporation | Electrical slip ring having a higher circuit density |
US6517357B1 (en) * | 2000-11-22 | 2003-02-11 | Athan Corporation | Slip ring and brush assembly for use in a video recorder |
US20040169434A1 (en) * | 2003-01-02 | 2004-09-02 | Washington Richard G. | Slip ring apparatus |
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2003
- 2003-11-15 EP EP03026305A patent/EP1453155B1/de not_active Expired - Lifetime
- 2003-11-15 AT AT03026305T patent/ATE356451T1/de not_active IP Right Cessation
- 2003-11-15 DE DE50306739T patent/DE50306739D1/de not_active Expired - Lifetime
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2004
- 2004-03-01 US US10/791,463 patent/US6909217B2/en not_active Expired - Lifetime
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US4143929A (en) * | 1976-04-29 | 1979-03-13 | Messer Griesheim Gmbh | Current collector |
US4583797A (en) * | 1985-06-11 | 1986-04-22 | Engelmore Anthony R | Rotatable electrical connector for coiled telephone cord |
US20030015934A1 (en) * | 2001-07-18 | 2003-01-23 | Hajime Kobayashi | Axial direction sliding-contact type brush apparatus, manufacturing method thereof, and flat motor having the brush apparatus |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012203842B3 (de) * | 2012-03-12 | 2013-09-05 | Schleifring Und Apparatebau Gmbh | Schleifringbürste und Halter für Schleifringbürste |
DE102013204004A1 (de) | 2012-03-12 | 2013-09-12 | Schleifring Und Apparatebau Gmbh | Schleifringbürsten in Blindniettechnik und Halterung |
DE102012204829A1 (de) * | 2012-03-12 | 2013-09-12 | Schleifring Und Apparatebau Gmbh | Schleifringbürsten in Einpresstechnik und Halterung |
US8986053B2 (en) | 2012-03-12 | 2015-03-24 | Schleifring Und Apparatebau Gmbh | Slip ring brush and holder for slip ring brush |
DE102013204004B4 (de) * | 2012-03-12 | 2020-03-05 | Schleifring Gmbh | Schleifringbürsten in Blindniettechnik und Halterung |
DE102012204830A1 (de) | 2012-03-26 | 2013-09-26 | Schleifring Und Apparatebau Gmbh | Bürstenblock für eine Schleifringanordnung |
WO2013143842A1 (de) | 2012-03-26 | 2013-10-03 | Schleifring Und Apparatebau Gmbh | Bürstenblock für eine schleifringanordnung |
Also Published As
Publication number | Publication date |
---|---|
DE50306739D1 (de) | 2007-04-19 |
US6909217B2 (en) | 2005-06-21 |
ATE356451T1 (de) | 2007-03-15 |
EP1453155B1 (de) | 2007-03-07 |
EP1453155A3 (de) | 2005-10-26 |
US20050012426A1 (en) | 2005-01-20 |
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