EP1176630A4 - Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device - Google Patents
Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor deviceInfo
- Publication number
- EP1176630A4 EP1176630A4 EP00908067A EP00908067A EP1176630A4 EP 1176630 A4 EP1176630 A4 EP 1176630A4 EP 00908067 A EP00908067 A EP 00908067A EP 00908067 A EP00908067 A EP 00908067A EP 1176630 A4 EP1176630 A4 EP 1176630A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- polishing
- polisher
- polishing pad
- transparent window
- window plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title abstract 11
- 238000000034 method Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9107799 | 1999-03-31 | ||
JP9107799 | 1999-03-31 | ||
JP34505899 | 1999-12-03 | ||
JP34505899A JP3374814B2 (en) | 1999-12-03 | 1999-12-03 | Polishing body, planarization apparatus, semiconductor device manufacturing method, and semiconductor device |
JP2000011126A JP3367496B2 (en) | 2000-01-20 | 2000-01-20 | Polishing body, planarization apparatus, semiconductor device manufacturing method, and semiconductor device |
JP2000011126 | 2000-01-20 | ||
JP2000025323 | 2000-02-02 | ||
JP2000025323 | 2000-02-02 | ||
PCT/JP2000/001545 WO2000060650A1 (en) | 1999-03-31 | 2000-03-14 | Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1176630A1 EP1176630A1 (en) | 2002-01-30 |
EP1176630A4 true EP1176630A4 (en) | 2005-11-30 |
EP1176630B1 EP1176630B1 (en) | 2007-06-27 |
Family
ID=27467869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00908067A Expired - Lifetime EP1176630B1 (en) | 1999-03-31 | 2000-03-14 | Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
Country Status (7)
Country | Link |
---|---|
US (1) | US6458014B1 (en) |
EP (1) | EP1176630B1 (en) |
KR (1) | KR100435246B1 (en) |
CN (1) | CN1150601C (en) |
DE (1) | DE60035341D1 (en) |
TW (1) | TW484181B (en) |
WO (1) | WO2000060650A1 (en) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6994607B2 (en) * | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
US6213845B1 (en) | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
US7374477B2 (en) * | 2002-02-06 | 2008-05-20 | Applied Materials, Inc. | Polishing pads useful for endpoint detection in chemical mechanical polishing |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6924641B1 (en) * | 2000-05-19 | 2005-08-02 | Applied Materials, Inc. | Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
US6685537B1 (en) * | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
JP2002001647A (en) * | 2000-06-19 | 2002-01-08 | Rodel Nitta Co | Polishing pad |
JP3844973B2 (en) * | 2001-03-16 | 2006-11-15 | 大日本スクリーン製造株式会社 | Substrate polishing end point detection |
US6608495B2 (en) | 2001-03-19 | 2003-08-19 | Applied Materials, Inc. | Eddy-optic sensor for object inspection |
US6641470B1 (en) * | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
JP4131632B2 (en) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | Polishing apparatus and polishing pad |
JP4570286B2 (en) * | 2001-07-03 | 2010-10-27 | ニッタ・ハース株式会社 | Polishing pad |
US6811466B1 (en) * | 2001-12-28 | 2004-11-02 | Applied Materials, Inc. | System and method for in-line metal profile measurement |
US6884146B2 (en) * | 2002-02-04 | 2005-04-26 | Kla-Tencor Technologies Corp. | Systems and methods for characterizing a polishing process |
KR20050059123A (en) * | 2002-08-30 | 2005-06-17 | 도레이 가부시끼가이샤 | Polishing pad, polishing plate hole cover, polishing apparatus, polishing method, and method for manufacturing semiconductor device |
KR101047933B1 (en) * | 2002-11-27 | 2011-07-11 | 도요 고무 고교 가부시키가이샤 | Method of manufacturing a polishing pad and a semiconductor device |
US6676483B1 (en) * | 2003-02-03 | 2004-01-13 | Rodel Holdings, Inc. | Anti-scattering layer for polishing pad windows |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
EP1466699A1 (en) * | 2003-04-09 | 2004-10-13 | JSR Corporation | Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method |
US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
KR100541545B1 (en) | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | Polishing table of a chemical mechanical polishing apparatus |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
KR100627202B1 (en) * | 2003-07-17 | 2006-09-25 | 제이에스알 가부시끼가이샤 | Chemical Mechanical Polishing Pad and Chemical Mechanical Polishing Method |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7264536B2 (en) * | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
US8066552B2 (en) | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US7258602B2 (en) * | 2003-10-22 | 2007-08-21 | Iv Technologies Co., Ltd. | Polishing pad having grooved window therein and method of forming the same |
US20090020433A1 (en) * | 2003-12-31 | 2009-01-22 | Microfabrica Inc. | Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization of Deposits of Material |
WO2005065436A2 (en) | 2003-12-31 | 2005-07-21 | Microfabrica Inc. | Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
US7204742B2 (en) | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
US20060019417A1 (en) * | 2004-07-26 | 2006-01-26 | Atsushi Shigeta | Substrate processing method and substrate processing apparatus |
KR100953928B1 (en) * | 2004-12-10 | 2010-04-23 | 도요 고무 고교 가부시키가이샤 | Polishing pad |
TWI385050B (en) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
CN104526536B (en) * | 2005-08-22 | 2017-09-22 | 应用材料公司 | The device and method of monitoring of chemical mechanical polishing based on spectrum |
US7306507B2 (en) | 2005-08-22 | 2007-12-11 | Applied Materials, Inc. | Polishing pad assembly with glass or crystalline window |
US20070212548A1 (en) * | 2006-03-10 | 2007-09-13 | Exatec Llc | Glazing system with high glass transition temperature decorative ink |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
JP4931133B2 (en) * | 2007-03-15 | 2012-05-16 | 東洋ゴム工業株式会社 | Polishing pad |
US8562389B2 (en) * | 2007-06-08 | 2013-10-22 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
US8337278B2 (en) | 2007-09-24 | 2012-12-25 | Applied Materials, Inc. | Wafer edge characterization by successive radius measurements |
TWI409868B (en) * | 2008-01-30 | 2013-09-21 | Iv Technologies Co Ltd | Polishing method, polishing pad and polishing system |
US20090305610A1 (en) * | 2008-06-06 | 2009-12-10 | Applied Materials, Inc. | Multiple window pad assembly |
DE112009001875B4 (en) | 2008-07-31 | 2023-06-22 | Shin-Etsu Handotai Co., Ltd. | Wafer polishing method and double side polishing device |
TWI381904B (en) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
TW201223702A (en) * | 2010-08-06 | 2012-06-16 | Applied Materials Inc | Techniques for matching measured spectra to reference spectra for in-situ optical monitoring |
US8628384B2 (en) * | 2010-09-30 | 2014-01-14 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
US8657653B2 (en) | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
WO2012054263A2 (en) * | 2010-10-20 | 2012-04-26 | Applied Materials, Inc. | Multiple matching reference spectra for in-situ optical monitoring |
US8367429B2 (en) | 2011-03-10 | 2013-02-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Adaptive endpoint method for pad life effect on chemical mechanical polishing |
CN102922415B (en) * | 2011-08-10 | 2015-05-13 | 无锡华润上华科技有限公司 | Chemical mechanical polishing method capable of prolonging service life of polishing pad |
US9393669B2 (en) * | 2011-10-21 | 2016-07-19 | Strasbaugh | Systems and methods of processing substrates |
JP5907081B2 (en) * | 2012-02-02 | 2016-04-20 | 信越化学工業株式会社 | Method for producing synthetic quartz glass substrate |
US9168630B2 (en) * | 2012-04-23 | 2015-10-27 | Applied Materials, Inc. | User-input functions for data sequences in polishing endpoint detection |
US9597769B2 (en) * | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
US9457446B2 (en) | 2012-10-01 | 2016-10-04 | Strasbaugh | Methods and systems for use in grind shape control adaptation |
US9610669B2 (en) | 2012-10-01 | 2017-04-04 | Strasbaugh | Methods and systems for use in grind spindle alignment |
JP2014113644A (en) | 2012-12-06 | 2014-06-26 | Toyo Tire & Rubber Co Ltd | Polishing pad |
US9446497B2 (en) * | 2013-03-07 | 2016-09-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad |
US20140256231A1 (en) * | 2013-03-07 | 2014-09-11 | Dow Global Technologies Llc | Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window |
US9108290B2 (en) | 2013-03-07 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad |
JP6170356B2 (en) * | 2013-07-01 | 2017-07-26 | 株式会社荏原製作所 | Polishing apparatus, polishing pad arrangement method, and polishing pad |
US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
EP2955478B1 (en) * | 2014-06-13 | 2019-08-21 | Mitutoyo Corporation | Calculating a height map of a body of transparent material with an inclined or curved surface |
US9475168B2 (en) | 2015-03-26 | 2016-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad window |
US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
JP6602725B2 (en) * | 2016-05-24 | 2019-11-06 | スピードファム株式会社 | Window structure for workpiece thickness measurement |
TWI593511B (en) * | 2016-06-08 | 2017-08-01 | 智勝科技股份有限公司 | Polishing pad and polishing method |
MX2020003717A (en) | 2017-10-04 | 2020-12-09 | Saint Gobain Abrasives Inc | Abrasive article and method for forming same. |
CN109202693B (en) | 2017-10-16 | 2021-10-12 | Skc索密思株式会社 | Leak-proof polishing pad and method of manufacturing the same |
KR102080840B1 (en) * | 2018-03-29 | 2020-02-24 | 에스케이씨 주식회사 | Polishing pad with water leakage prevention and manufacturing method thereof |
JP7041638B2 (en) * | 2019-01-10 | 2022-03-24 | 株式会社荏原製作所 | Polishing equipment |
US20200361052A1 (en) * | 2019-05-16 | 2020-11-19 | Micron Technology, Inc. | Planarization endpoint determination |
JP2024505191A (en) * | 2021-01-25 | 2024-02-05 | シーエムシー マテリアルズ リミティド ライアビリティ カンパニー | Endpoint window with controlled textured surface |
CN113319736B (en) * | 2021-07-12 | 2022-06-07 | 北京烁科精微电子装备有限公司 | Grinding disc window cover, grinding disc and grinding machine |
CN116276619B (en) * | 2023-04-17 | 2023-09-29 | 华海清科股份有限公司 | Data compensation method and chemical mechanical polishing equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0752032A (en) * | 1993-08-10 | 1995-02-28 | Sumitomo Metal Mining Co Ltd | Wafer polishing method and device therefor |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
EP0941806A2 (en) * | 1998-03-10 | 1999-09-15 | LAM Research Corporation | Wafer polishing device with moveable window |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
JP3313505B2 (en) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | Polishing method |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
JP3431115B2 (en) * | 1995-03-28 | 2003-07-28 | アプライド マテリアルズ インコーポレイテッド | Apparatus and method for monitoring the operation of chemical mechanical polishing in situ |
US5964643A (en) * | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
JPH10125634A (en) * | 1996-10-19 | 1998-05-15 | Nikon Corp | Polishing apparatus |
US6074287A (en) * | 1996-04-12 | 2000-06-13 | Nikon Corporation | Semiconductor wafer polishing apparatus |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6108091A (en) * | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
JPH1114305A (en) * | 1997-06-26 | 1999-01-22 | Mitsutoyo Corp | In-process light interference type measuring apparatus for working and working device equipped with the same, and working tool suitable for in-process light measurement |
US6106662A (en) * | 1998-06-08 | 2000-08-22 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
US6213845B1 (en) * | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
US6146242A (en) * | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
US6273792B1 (en) * | 1999-08-11 | 2001-08-14 | Speedfam-Ipec Corporation | Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing |
US6309276B1 (en) * | 2000-02-01 | 2001-10-30 | Applied Materials, Inc. | Endpoint monitoring with polishing rate change |
-
2000
- 2000-03-14 EP EP00908067A patent/EP1176630B1/en not_active Expired - Lifetime
- 2000-03-14 CN CNB00802085XA patent/CN1150601C/en not_active Expired - Fee Related
- 2000-03-14 WO PCT/JP2000/001545 patent/WO2000060650A1/en active IP Right Grant
- 2000-03-14 KR KR10-2001-7008191A patent/KR100435246B1/en not_active IP Right Cessation
- 2000-03-14 DE DE60035341T patent/DE60035341D1/en not_active Expired - Lifetime
- 2000-03-23 TW TW089105309A patent/TW484181B/en not_active IP Right Cessation
-
2001
- 2001-05-02 US US09/846,339 patent/US6458014B1/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0752032A (en) * | 1993-08-10 | 1995-02-28 | Sumitomo Metal Mining Co Ltd | Wafer polishing method and device therefor |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
EP0941806A2 (en) * | 1998-03-10 | 1999-09-15 | LAM Research Corporation | Wafer polishing device with moveable window |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 05 30 June 1995 (1995-06-30) * |
See also references of WO0060650A1 * |
Also Published As
Publication number | Publication date |
---|---|
US6458014B1 (en) | 2002-10-01 |
KR100435246B1 (en) | 2004-06-11 |
US20020042243A1 (en) | 2002-04-11 |
WO2000060650A1 (en) | 2000-10-12 |
CN1322374A (en) | 2001-11-14 |
CN1150601C (en) | 2004-05-19 |
EP1176630A1 (en) | 2002-01-30 |
TW484181B (en) | 2002-04-21 |
EP1176630B1 (en) | 2007-06-27 |
DE60035341D1 (en) | 2007-08-09 |
KR20010089717A (en) | 2001-10-08 |
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