DK0388972T3 - Apparat til slibning af en halvlederskive - Google Patents
Apparat til slibning af en halvlederskiveInfo
- Publication number
- DK0388972T3 DK0388972T3 DK90105542.6T DK90105542T DK0388972T3 DK 0388972 T3 DK0388972 T3 DK 0388972T3 DK 90105542 T DK90105542 T DK 90105542T DK 0388972 T3 DK0388972 T3 DK 0388972T3
- Authority
- DK
- Denmark
- Prior art keywords
- grinding
- semiconductor disc
- disc
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1072906A JP2674665B2 (ja) | 1989-03-24 | 1989-03-24 | 半導体ウェーハの研削装置 |
JP9038789A JP2602948B2 (ja) | 1989-04-10 | 1989-04-10 | 半導体ウェーハの研削装置 |
JP9038689A JP2647193B2 (ja) | 1989-04-10 | 1989-04-10 | 半導体ウェーハの研削装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0388972T3 true DK0388972T3 (da) | 1996-02-12 |
Family
ID=27301075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK90105542.6T DK0388972T3 (da) | 1989-03-24 | 1990-03-23 | Apparat til slibning af en halvlederskive |
Country Status (7)
Country | Link |
---|---|
US (1) | US5113622A (da) |
EP (1) | EP0388972B1 (da) |
KR (1) | KR930010977B1 (da) |
AU (1) | AU637087B2 (da) |
CA (1) | CA2012878C (da) |
DE (1) | DE69024681T2 (da) |
DK (1) | DK0388972T3 (da) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5230184A (en) * | 1991-07-05 | 1993-07-27 | Motorola, Inc. | Distributed polishing head |
US5329732A (en) | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
US5476566A (en) * | 1992-09-02 | 1995-12-19 | Motorola, Inc. | Method for thinning a semiconductor wafer |
US5487697A (en) * | 1993-02-09 | 1996-01-30 | Rodel, Inc. | Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads |
JP2894153B2 (ja) * | 1993-05-27 | 1999-05-24 | 信越半導体株式会社 | シリコンウエーハの製造方法、およびその装置 |
JP3363587B2 (ja) * | 1993-07-13 | 2003-01-08 | キヤノン株式会社 | 脆性材料の加工方法及びその装置 |
US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
US5643060A (en) * | 1993-08-25 | 1997-07-01 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including heater |
US5700180A (en) | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
US5891352A (en) | 1993-09-16 | 1999-04-06 | Luxtron Corporation | Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
DE4335980C2 (de) * | 1993-10-21 | 1998-09-10 | Wacker Siltronic Halbleitermat | Verfahren zum Positionieren einer Werkstückhalterung |
US5938504A (en) | 1993-11-16 | 1999-08-17 | Applied Materials, Inc. | Substrate polishing apparatus |
JPH07237120A (ja) * | 1994-02-22 | 1995-09-12 | Nec Corp | ウェーハ研磨装置 |
DE4424829A1 (de) * | 1994-07-14 | 1996-01-18 | Zahnradfabrik Friedrichshafen | Vorrichtung für ein Verfahren zur Vermeidung von Überbeanspruchungen eines Werkstückes beim Schleifen |
KR100258802B1 (ko) * | 1995-02-15 | 2000-06-15 | 전주범 | 평탄화 장치 및 그를 이용한 평탄화 방법 |
US20070123151A1 (en) * | 1995-05-23 | 2007-05-31 | Nova Measuring Instruments Ltd | Apparatus for optical inspection of wafers during polishing |
US7169015B2 (en) * | 1995-05-23 | 2007-01-30 | Nova Measuring Instruments Ltd. | Apparatus for optical inspection of wafers during processing |
IL113829A (en) * | 1995-05-23 | 2000-12-06 | Nova Measuring Instr Ltd | Apparatus for optical inspection of wafers during polishing |
US5632667A (en) * | 1995-06-29 | 1997-05-27 | Delco Electronics Corporation | No coat backside wafer grinding process |
JP3923107B2 (ja) * | 1995-07-03 | 2007-05-30 | 株式会社Sumco | シリコンウェーハの製造方法およびその装置 |
JPH0929620A (ja) * | 1995-07-20 | 1997-02-04 | Ebara Corp | ポリッシング装置 |
US5643050A (en) * | 1996-05-23 | 1997-07-01 | Industrial Technology Research Institute | Chemical/mechanical polish (CMP) thickness monitor |
US5664990A (en) * | 1996-07-29 | 1997-09-09 | Integrated Process Equipment Corp. | Slurry recycling in CMP apparatus |
DE69739740D1 (de) | 1996-11-14 | 2010-03-04 | Ebara Corp | Drainageanordnung einer Polieranlage |
KR19980064180A (ko) * | 1996-12-19 | 1998-10-07 | 윌리엄비.켐플러 | 실리콘 웨이퍼의 등온 연마 촉진 방법 |
SG70097A1 (en) * | 1997-08-15 | 2000-01-25 | Disio Corp | Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
CN1272222A (zh) * | 1997-08-21 | 2000-11-01 | Memc电子材料有限公司 | 处理半导体晶片的方法 |
US6102784A (en) * | 1997-11-05 | 2000-08-15 | Speedfam-Ipec Corporation | Method and apparatus for improved gear cleaning assembly in polishing machines |
US6146241A (en) * | 1997-11-12 | 2000-11-14 | Fujitsu Limited | Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation |
JPH11156715A (ja) * | 1997-11-21 | 1999-06-15 | Ebara Corp | ポリッシング装置 |
US5827111A (en) * | 1997-12-15 | 1998-10-27 | Micron Technology, Inc. | Method and apparatus for grinding wafers |
US5827112A (en) * | 1997-12-15 | 1998-10-27 | Micron Technology, Inc. | Method and apparatus for grinding wafers |
JP3467184B2 (ja) * | 1998-02-05 | 2003-11-17 | 信越半導体株式会社 | ワークの研磨方法 |
JPH11254298A (ja) * | 1998-03-06 | 1999-09-21 | Speedfam Co Ltd | スラリー循環供給式平面研磨装置 |
JP2000015557A (ja) * | 1998-04-27 | 2000-01-18 | Ebara Corp | 研磨装置 |
US6214704B1 (en) | 1998-12-16 | 2001-04-10 | Memc Electronic Materials, Inc. | Method of processing semiconductor wafers to build in back surface damage |
US6240942B1 (en) * | 1999-05-13 | 2001-06-05 | Micron Technology, Inc. | Method for conserving a resource by flow interruption |
US6294469B1 (en) | 1999-05-21 | 2001-09-25 | Plasmasil, Llc | Silicon wafering process flow |
KR100413493B1 (ko) * | 2001-10-17 | 2004-01-03 | 주식회사 하이닉스반도체 | 화학적 기계적 연마 장치의 연마 플래튼 및 그를 이용한평탄화방법 |
US6743722B2 (en) | 2002-01-29 | 2004-06-01 | Strasbaugh | Method of spin etching wafers with an alkali solution |
US20030209310A1 (en) * | 2002-05-13 | 2003-11-13 | Fuentes Anastacio C. | Apparatus, system and method to reduce wafer warpage |
KR100655122B1 (ko) * | 2005-08-17 | 2006-12-08 | 현대자동차주식회사 | 연삭용 냉각액 공급 시스템 |
DE102006032455A1 (de) * | 2006-07-13 | 2008-04-10 | Siltronic Ag | Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit |
DE102006037490B4 (de) | 2006-08-10 | 2011-04-07 | Peter Wolters Gmbh | Doppelseiten-Bearbeitungsmaschine |
DE102007030958B4 (de) * | 2007-07-04 | 2014-09-11 | Siltronic Ag | Verfahren zum Schleifen von Halbleiterscheiben |
ES2618180T3 (es) * | 2009-08-31 | 2017-06-21 | Elm Inc. | Método de restauración de disco óptico y aparato |
US8568198B2 (en) * | 2010-07-16 | 2013-10-29 | Pratt & Whitney Canada Corp. | Active coolant flow control for machining processes |
CN102615583A (zh) * | 2011-01-28 | 2012-08-01 | 鸿富锦精密工业(深圳)有限公司 | 研磨装置 |
CN104084885B (zh) * | 2014-07-15 | 2016-04-13 | 宇环数控机床股份有限公司 | 一种研磨抛光盘的循环冷却结构 |
CN104175225A (zh) * | 2014-08-23 | 2014-12-03 | 济南大学 | 一种抛光机降温装置 |
US11491611B2 (en) * | 2018-08-14 | 2022-11-08 | Illinois Tool Works Inc. | Splash guards for grinder/polisher machines and grinder/polisher machines having splash guards |
CN109940506B (zh) * | 2019-03-27 | 2020-02-28 | 浙江大学台州研究院 | 基于晶片区分的石英晶片谐振频率及散差统计方法 |
CN112720247B (zh) * | 2020-12-30 | 2022-04-19 | 合肥晶合集成电路股份有限公司 | 一种化学机械平坦化设备及其应用 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3611654A (en) * | 1969-09-30 | 1971-10-12 | Alliance Tool & Die Corp | Polishing machine or similar abrading apparatus |
US3905162A (en) * | 1974-07-23 | 1975-09-16 | Silicon Material Inc | Method of preparing high yield semiconductor wafer |
US4122008A (en) * | 1977-02-10 | 1978-10-24 | Eddy Allen | Filtration process for separating particles from liquid coolants in lens grinding devices |
DE3128880C2 (de) * | 1981-07-22 | 1987-03-19 | Fa. Peter Wolters, 2370 Rendsburg | Maschine zum Läppen oder Polieren |
US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
FR2523892A1 (fr) * | 1982-03-26 | 1983-09-30 | Procedes Equip Sciences Ind | Perfectionnements aux machines de polissage a plateau tournant |
DE3306246C2 (de) * | 1983-02-23 | 1984-12-06 | Maschinenfabrik Ernst Thielenhaus GmbH, 5600 Wuppertal | Werkstückaufnahme zum Feinschleifen von zumindest bereichsweise kreiszylindrischen oder topfförmig ausgebildeten Werkstücken |
JPS6034266A (ja) * | 1983-08-08 | 1985-02-21 | Toshiba Corp | 研磨方法 |
DE3429965A1 (de) * | 1983-08-29 | 1985-03-21 | Hauni-Werke Körber & Co KG, 2050 Hamburg | Schleifmaschine mit kuehlmittelumlauf |
JPS60155363A (ja) * | 1984-01-26 | 1985-08-15 | Mitsui Mining & Smelting Co Ltd | 平面研削機 |
JPH0659623B2 (ja) * | 1984-03-23 | 1994-08-10 | 株式会社日立製作所 | ウェハのメカノケミカルポリシング加工方法および装置 |
FR2564360B1 (fr) * | 1984-05-21 | 1986-10-17 | Crismatec | Machine d'usinage double face et dispositif de transmission de courant et de fluide entre une structure tournante et une structure non tournante |
JPS61226260A (ja) * | 1985-03-30 | 1986-10-08 | Mitsubishi Metal Corp | 研削盤におけるドレツシング装置 |
JPS62264858A (ja) * | 1986-05-13 | 1987-11-17 | Hitachi Seiko Ltd | 平面研削方法 |
JPS63114872A (ja) * | 1986-10-29 | 1988-05-19 | Speedfam Co Ltd | 平面研磨装置 |
-
1990
- 1990-03-22 CA CA002012878A patent/CA2012878C/en not_active Expired - Fee Related
- 1990-03-22 AU AU52120/90A patent/AU637087B2/en not_active Ceased
- 1990-03-23 DE DE69024681T patent/DE69024681T2/de not_active Expired - Fee Related
- 1990-03-23 DK DK90105542.6T patent/DK0388972T3/da active
- 1990-03-23 EP EP90105542A patent/EP0388972B1/en not_active Expired - Lifetime
- 1990-04-10 KR KR1019900004924A patent/KR930010977B1/ko not_active IP Right Cessation
-
1991
- 1991-08-19 US US07/747,494 patent/US5113622A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU637087B2 (en) | 1993-05-20 |
KR900017119A (ko) | 1990-11-15 |
US5113622A (en) | 1992-05-19 |
DE69024681D1 (de) | 1996-02-22 |
CA2012878A1 (en) | 1990-09-24 |
EP0388972A2 (en) | 1990-09-26 |
EP0388972B1 (en) | 1996-01-10 |
AU5212090A (en) | 1990-09-27 |
DE69024681T2 (de) | 1996-06-05 |
EP0388972A3 (en) | 1991-02-06 |
CA2012878C (en) | 1995-09-12 |
KR930010977B1 (ko) | 1993-11-18 |
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