DE69701209D1 - Dielektrische keramische Zusammensetzung - Google Patents

Dielektrische keramische Zusammensetzung

Info

Publication number: DE69701209D1
Authority: DE; Germany
Prior art keywords: dielectric ceramic; ceramic composition; dielectric; composition; ceramic
Prior art date: 1996-07-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69701209T

Other languages

English (en)

Other versions

DE69701209T2 (de

Inventor

Tadahiro Minamikawa

Akira Ando

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Murata Manufacturing Co Ltd

Original Assignee

Murata Manufacturing Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-07-26

Filing date

1997-07-25

Publication date

2000-03-02

1997-07-25 Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd

2000-03-02 Application granted granted Critical

2000-03-02 Publication of DE69701209D1 publication Critical patent/DE69701209D1/de

2000-09-28 Publication of DE69701209T2 publication Critical patent/DE69701209T2/de

2017-07-26 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

239000000919 ceramic Substances 0.000 title 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1254—Ceramic dielectrics characterised by the ceramic dielectric material based on niobium or tungsteen, tantalum oxides or niobates, tantalates
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Ceramic Engineering (AREA)
Manufacturing & Machinery (AREA)
Power Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Inorganic Chemistry (AREA)
Materials Engineering (AREA)
Structural Engineering (AREA)
Organic Chemistry (AREA)
Inorganic Insulating Materials (AREA)
Compositions Of Oxide Ceramics (AREA)
Ceramic Capacitors (AREA)

DE69701209T 1996-07-26 1997-07-25 Dielektrische keramische Zusammensetzung Expired - Lifetime DE69701209T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP08197701A JP3087657B2 (ja)	1996-07-26	1996-07-26	誘電体磁器組成物

Publications (2)

Publication Number	Publication Date
DE69701209D1 true DE69701209D1 (de)	2000-03-02
DE69701209T2 DE69701209T2 (de)	2000-09-28

Family

ID=16378929

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69701209T Expired - Lifetime DE69701209T2 (de)	1996-07-26	1997-07-25	Dielektrische keramische Zusammensetzung

Country Status (7)

Country	Link
US (1)	US5763346A (de)
EP (1)	EP0820968B1 (de)
JP (1)	JP3087657B2 (de)
KR (1)	KR100207900B1 (de)
CN (1)	CN1090372C (de)
DE (1)	DE69701209T2 (de)
TW (1)	TW373190B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3228175B2 (ja) *	1997-04-28	2001-11-12	株式会社村田製作所	圧電磁器組成物
JP2000516190A (ja) *	1997-05-30	2000-12-05	コーニンクレッカフィリップスエレクトロニクスエヌヴィ	セラミック（多層）キャパシタ及び当該キャパシタに用いるセラミック組成物
JP2001506425A (ja) *	1997-10-08	2001-05-15	コーニンクレッカフィリップスエレクトロニクスエヌヴィ	セラミック多層キャパシタ
JP4396136B2 (ja) *	2003-05-21	2010-01-13	株式会社村田製作所	圧電磁器組成物およびそれを用いた圧電セラミック素子
JP3846464B2 (ja) *	2003-08-07	2006-11-15	松下電器産業株式会社	誘電体セラミック組成物およびこれを用いたセラミック電子部品
KR20070115903A (ko) *	2005-02-07	2007-12-06	호치키 가부시키가이샤	열 감지기 및 열 감지 소자의 제조 방법
JP5087938B2 (ja) *	2007-02-01	2012-12-05	株式会社村田製作所	誘電体セラミック組成物及び積層セラミックコンデンサ
KR101575244B1 (ko)	2013-12-09	2015-12-08	현대자동차 주식회사	온도보상용 유전체 재료 및 이의 제조 방법
US9255034B1 (en)	2014-09-15	2016-02-09	Hyundai Motor Company	Dielectric material for temperature compensation and method of preparing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5548407B2 (de) *	1973-08-15	1980-12-05
US4978646A (en) *	1989-03-03	1990-12-18	Corning Incorporated	Capacitors and high dielectric constant ceramics therefor
JP2798105B2 (ja) *	1992-02-14	1998-09-17	松下電器産業株式会社	誘電体磁器組成物及び積層型マイクロ波デバイス
JP3479324B2 (ja) *	1993-08-19	2003-12-15	日本特殊陶業株式会社	マイクロ波誘電体磁器組成物及びその製造方法
DE69409477T2 (de) *	1993-12-27	1998-08-06	Ngk Spark Plug Co	Mikrowellendielektrische keramische Zusammensetzung

1996
- 1996-07-26 JP JP08197701A patent/JP3087657B2/ja not_active Expired - Lifetime
1997
- 1997-07-23 TW TW086110468A patent/TW373190B/zh not_active IP Right Cessation
- 1997-07-24 KR KR1019970034606A patent/KR100207900B1/ko not_active IP Right Cessation
- 1997-07-24 US US08/899,584 patent/US5763346A/en not_active Expired - Lifetime
- 1997-07-24 CN CN97115584A patent/CN1090372C/zh not_active Expired - Lifetime
- 1997-07-25 DE DE69701209T patent/DE69701209T2/de not_active Expired - Lifetime
- 1997-07-25 EP EP97112859A patent/EP0820968B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JPH1036172A (ja)	1998-02-10
TW373190B (en)	1999-11-01
CN1090372C (zh)	2002-09-04
KR100207900B1 (en)	1999-07-15
DE69701209T2 (de)	2000-09-28
EP0820968A1 (de)	1998-01-28
KR980009198A (ko)	1998-04-30
CN1173024A (zh)	1998-02-11
US5763346A (en)	1998-06-09
JP3087657B2 (ja)	2000-09-11
EP0820968B1 (de)	2000-01-26

Legal Events

Date	Code	Title	Description
2001-02-15	8364	No opposition during term of opposition

Publication	Publication Date	Title
DE69609119D1 (de)	2000-08-10	Dielektrische keramische Zusammensetzungen
DE69400932D1 (de)	1997-01-02	Nichtreduzierende dielektrische keramische Zusammensetzung
DE69630681D1 (de)	2003-12-18	Keramische struktur
DE69929589D1 (de)	2006-04-13	Bioaktive keramische beschichtung
DE69728457D1 (de)	2004-05-06	Dielektrische keramische Zusammensetzung und diese verwendender keramischer Kondensator
DE69913284D1 (de)	2004-01-15	Dielektrische keramische Zusammensetzung und monolithischer keramischer Kondensator
DE69621222D1 (de)	2002-06-20	Keramische leiterplatte
DE69304034D1 (de)	1996-09-19	Nichtreduzierbare, dielektrische keramische Zusammensetzung
DE69710160D1 (de)	2002-03-14	Keramische Glühkerze
DE69209417D1 (de)	1996-05-02	Nichtreduzierbare dielektrische keramische Zusammensetzung
DE59701223D1 (de)	2000-04-13	Keramische klinge
DE69815631D1 (de)	2003-07-24	Dielektrische keramische zusammensetzung und resonator daraus
DE69802457D1 (de)	2001-12-20	Piezoelektrische keramische Zusammensetzung
DE69601822D1 (de)	1999-04-29	Nichtreduzierte, dielektrische, keramische Zusammensetzungen
DE69907084D1 (de)	2003-05-28	Dielektrische Porzellanzusammensetzung
DE69512612D1 (de)	1999-11-11	Piezoelektrische keramische Zusammensetzung
DE69400553D1 (de)	1996-10-24	Nicht-reduzierbare dielektrische keramische Zusammensetzung
DE69527185D1 (de)	2002-08-01	Dielektrische, keramische Zusammensetzungen und dielektrische Resonatoren
DE69513472D1 (de)	1999-12-30	Dielectrische keramische Zusammensetzung
DE69409881D1 (de)	1998-06-04	Dielektrische keramische Zusammensetzung
DE69516430D1 (de)	2000-05-31	Dielektrische keramische Zusammensetzung
DE59708863D1 (de)	2003-01-16	Keramische Verdampfermaterialien
FI956170A0 (fi)	1995-12-21	Piezosähköinen keraaminen koostumus
DE69512502D1 (de)	1999-11-04	Piezoelektrische keramische Zusammensetzung
DE69701209D1 (de)	2000-03-02	Dielektrische keramische Zusammensetzung