DE60206470D1 - Saw-bauelement und verfahren zu seiner herstellung - Google Patents
Saw-bauelement und verfahren zu seiner herstellungInfo
- Publication number
- DE60206470D1 DE60206470D1 DE60206470T DE60206470T DE60206470D1 DE 60206470 D1 DE60206470 D1 DE 60206470D1 DE 60206470 T DE60206470 T DE 60206470T DE 60206470 T DE60206470 T DE 60206470T DE 60206470 D1 DE60206470 D1 DE 60206470D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- saw component
- saw
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02937—Means for compensation or elimination of undesirable effects of chemical damage, e.g. corrosion
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02984—Protection measures against damaging
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001006031 | 2001-01-15 | ||
JP2001006031 | 2001-01-15 | ||
PCT/JP2002/000032 WO2002056465A1 (fr) | 2001-01-15 | 2002-01-09 | Dispositif saw et procede de production de ce dispositif |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60206470D1 true DE60206470D1 (de) | 2006-02-16 |
DE60206470T2 DE60206470T2 (de) | 2006-05-11 |
Family
ID=18873986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2002606470 Expired - Fee Related DE60206470T2 (de) | 2001-01-15 | 2002-01-09 | Saw-bauelement und verfahren zu seiner herstellung |
Country Status (8)
Country | Link |
---|---|
US (1) | US20030111936A1 (de) |
EP (1) | EP1353441B1 (de) |
JP (1) | JP3818258B2 (de) |
KR (1) | KR100479287B1 (de) |
CN (1) | CN1209870C (de) |
DE (1) | DE60206470T2 (de) |
TW (1) | TW513855B (de) |
WO (1) | WO2002056465A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3926633B2 (ja) * | 2001-06-22 | 2007-06-06 | 沖電気工業株式会社 | Sawデバイス及びその製造方法 |
WO2006042116A2 (en) * | 2004-10-05 | 2006-04-20 | Applied Thin Films, Inc. | Aluminum phosphate compositions, coatings and related composites |
WO2007088788A1 (ja) * | 2006-01-31 | 2007-08-09 | National University Corporation Chiba University | 弾性表面波装置 |
FI20060389L (fi) * | 2006-04-21 | 2007-10-22 | Environics Oy | Sensori |
JP2012160979A (ja) * | 2011-02-01 | 2012-08-23 | Taiyo Yuden Co Ltd | 弾性波デバイス及びその製造方法 |
CN112179981A (zh) * | 2020-09-30 | 2021-01-05 | 湖南大学 | 一种声表面波传感器 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3799804A (en) * | 1972-01-03 | 1974-03-26 | Honeywell Bull Soc Ind | Process and apparatus for obtaining wire for magnetic memories |
DE2749294A1 (de) * | 1977-11-03 | 1979-05-10 | Siemens Ag | Verfahren um herstellen einer halbleitervorrichtung |
JPS6220351A (ja) * | 1985-07-18 | 1987-01-28 | Nec Corp | 半導体装置 |
US5857250A (en) * | 1994-10-25 | 1999-01-12 | Texas Instruments Incorporated | Method of forming a capacitance type gaseous sensing device and apparatus thereof |
JP2929987B2 (ja) * | 1996-01-12 | 1999-08-03 | 日本電気株式会社 | 弾性表面波装置の製造方法 |
JPH10163800A (ja) * | 1996-11-25 | 1998-06-19 | Sanyo Electric Co Ltd | 弾性表面波装置及びその製造方法 |
DE19758198A1 (de) * | 1997-12-30 | 1999-08-19 | Siemens Ag | Oberflächenwellen-(SAW-)Bauelement auf auch pyroelektrischem Einkristall-Substrat |
JP2000261283A (ja) * | 1999-03-04 | 2000-09-22 | Kyocera Corp | 弾性表面波装置 |
JP3411908B2 (ja) * | 1999-11-30 | 2003-06-03 | ティーディーケイ株式会社 | 弾性表面波装置およびその製造方法 |
JP3345779B2 (ja) * | 2000-07-18 | 2002-11-18 | セイコーエプソン株式会社 | Sawチップ及びこれを利用したsawデバイスの製造方法 |
JP3379518B2 (ja) * | 2000-08-14 | 2003-02-24 | 株式会社村田製作所 | 圧電素子の製造方法 |
-
2001
- 2001-12-31 TW TW90133377A patent/TW513855B/zh not_active IP Right Cessation
-
2002
- 2002-01-09 US US10/221,353 patent/US20030111936A1/en not_active Abandoned
- 2002-01-09 KR KR10-2002-7011989A patent/KR100479287B1/ko not_active IP Right Cessation
- 2002-01-09 WO PCT/JP2002/000032 patent/WO2002056465A1/ja active IP Right Grant
- 2002-01-09 CN CNB028000846A patent/CN1209870C/zh not_active Expired - Fee Related
- 2002-01-09 DE DE2002606470 patent/DE60206470T2/de not_active Expired - Fee Related
- 2002-01-09 EP EP02729520A patent/EP1353441B1/de not_active Expired - Lifetime
- 2002-01-09 JP JP2002557012A patent/JP3818258B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1455986A (zh) | 2003-11-12 |
WO2002056465A1 (fr) | 2002-07-18 |
EP1353441A1 (de) | 2003-10-15 |
CN1209870C (zh) | 2005-07-06 |
JP3818258B2 (ja) | 2006-09-06 |
KR20020082871A (ko) | 2002-10-31 |
EP1353441B1 (de) | 2005-10-05 |
DE60206470T2 (de) | 2006-05-11 |
KR100479287B1 (ko) | 2005-03-28 |
EP1353441A4 (de) | 2005-03-09 |
JPWO2002056465A1 (ja) | 2004-05-20 |
TW513855B (en) | 2002-12-11 |
US20030111936A1 (en) | 2003-06-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8339 | Ceased/non-payment of the annual fee |