DE60127056D1 - Elektrisches verbindungsmaterial und elektrisches verbindungsverfahren - Google Patents

Elektrisches verbindungsmaterial und elektrisches verbindungsverfahren

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Publication number
DE60127056D1
DE60127056D1 DE60127056T DE60127056T DE60127056D1 DE 60127056 D1 DE60127056 D1 DE 60127056D1 DE 60127056 T DE60127056 T DE 60127056T DE 60127056 T DE60127056 T DE 60127056T DE 60127056 D1 DE60127056 D1 DE 60127056D1
Authority
DE
Germany
Prior art keywords
electrical
connection method
connecting material
electrical connection
electrical connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60127056T
Other languages
English (en)
Other versions
DE60127056T2 (de
Inventor
Noriyuki Honda
Nobuhiro Hanai
Masakazu Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE60127056D1 publication Critical patent/DE60127056D1/de
Publication of DE60127056T2 publication Critical patent/DE60127056T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
DE60127056T 2000-03-23 2001-03-23 Elektrisches verbindungsmaterial und elektrisches verbindungsverfahren Expired - Lifetime DE60127056T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000087104 2000-03-23
JP2000087104 2000-03-23
PCT/JP2001/002356 WO2001071854A1 (en) 2000-03-23 2001-03-23 Electrical connection material and electrical connection method

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DE60127056T2 DE60127056T2 (de) 2007-11-08

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KR100684169B1 (ko) * 2005-08-11 2007-02-20 삼성전자주식회사 이원 필러 분포를 가지는 접착 필름 및 그 제조 방법, 이를이용한 칩 적층 패키지 및 그 제조 방법
JP5311772B2 (ja) * 2007-06-27 2013-10-09 デクセリアルズ株式会社 接着フィルム
JP5226562B2 (ja) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
US9368374B2 (en) 2009-02-27 2016-06-14 Dexerials Corporation Method of manufacturing semiconductor device
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
JP5631654B2 (ja) * 2010-07-28 2014-11-26 デクセリアルズ株式会社 実装体の製造方法及び接続方法
WO2015056754A1 (ja) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料

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US4554033A (en) * 1984-10-04 1985-11-19 Amp Incorporated Method of forming an electrical interconnection means
US4643843A (en) * 1985-06-03 1987-02-17 Lowdon Harold L Preparation for improving the reliability of electrical connections
JPS6215777A (ja) * 1985-07-12 1987-01-24 日本写真印刷株式会社 フイルム状コネクタ及びその製造方法
JPH0770252B2 (ja) * 1988-01-28 1995-07-31 信越ポリマー株式会社 熱接着性可撓性配線部材
US5371327A (en) * 1992-02-19 1994-12-06 Shin-Etsu Polymer Co., Ltd. Heat-sealable connector sheet
JP2888466B2 (ja) * 1992-04-07 1999-05-10 信越ポリマー株式会社 ヒートシールコネクターの製造方法
JPH0685337B2 (ja) * 1992-10-30 1994-10-26 信越ポリマー株式会社 ヒートシールコネクター
ATE216122T1 (de) * 1994-01-27 2002-04-15 Loctite Ireland Ltd Zusammenstellungen und methoden zur anordnung anisotropisch leitender bahnen und verbindungen zwischen zwei sätzen von leitern
JPH08279388A (ja) * 1995-04-04 1996-10-22 Idemitsu Kosan Co Ltd 電気回路の接続方法
JP2710234B2 (ja) * 1995-07-31 1998-02-10 日本電気株式会社 端子接続方法およびこの方法により製造される回路基板
JP3258550B2 (ja) * 1996-01-12 2002-02-18 日本黒鉛工業株式会社 ファインピッチヒートシールコネクタ用三層構造導電異方性帯状部材およびその製造方法

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DE60127056T2 (de) 2007-11-08
WO2001071854A1 (en) 2001-09-27
EP1189308A4 (de) 2005-06-08
JP4411819B2 (ja) 2010-02-10
EP1189308A1 (de) 2002-03-20
EP1189308B1 (de) 2007-03-07
KR100738246B1 (ko) 2007-07-12
KR20020022676A (ko) 2002-03-27
TW492215B (en) 2002-06-21

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