DE60127056D1 - Elektrisches verbindungsmaterial und elektrisches verbindungsverfahren - Google Patents
Elektrisches verbindungsmaterial und elektrisches verbindungsverfahrenInfo
- Publication number
- DE60127056D1 DE60127056D1 DE60127056T DE60127056T DE60127056D1 DE 60127056 D1 DE60127056 D1 DE 60127056D1 DE 60127056 T DE60127056 T DE 60127056T DE 60127056 T DE60127056 T DE 60127056T DE 60127056 D1 DE60127056 D1 DE 60127056D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical
- connection method
- connecting material
- electrical connection
- electrical connecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000087104 | 2000-03-23 | ||
JP2000087104 | 2000-03-23 | ||
PCT/JP2001/002356 WO2001071854A1 (en) | 2000-03-23 | 2001-03-23 | Electrical connection material and electrical connection method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60127056D1 true DE60127056D1 (de) | 2007-04-19 |
DE60127056T2 DE60127056T2 (de) | 2007-11-08 |
Family
ID=18603168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60127056T Expired - Lifetime DE60127056T2 (de) | 2000-03-23 | 2001-03-23 | Elektrisches verbindungsmaterial und elektrisches verbindungsverfahren |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1189308B1 (de) |
JP (1) | JP4411819B2 (de) |
KR (1) | KR100738246B1 (de) |
DE (1) | DE60127056T2 (de) |
TW (1) | TW492215B (de) |
WO (1) | WO2001071854A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100684169B1 (ko) * | 2005-08-11 | 2007-02-20 | 삼성전자주식회사 | 이원 필러 분포를 가지는 접착 필름 및 그 제조 방법, 이를이용한 칩 적층 패키지 및 그 제조 방법 |
JP5311772B2 (ja) * | 2007-06-27 | 2013-10-09 | デクセリアルズ株式会社 | 接着フィルム |
JP5226562B2 (ja) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接合体及びその製造方法 |
JP4623224B2 (ja) * | 2008-06-26 | 2011-02-02 | 日立化成工業株式会社 | 樹脂フィルムシート及び電子部品 |
US9368374B2 (en) | 2009-02-27 | 2016-06-14 | Dexerials Corporation | Method of manufacturing semiconductor device |
JP5540916B2 (ja) * | 2010-06-15 | 2014-07-02 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
JP5631654B2 (ja) * | 2010-07-28 | 2014-11-26 | デクセリアルズ株式会社 | 実装体の製造方法及び接続方法 |
WO2015056754A1 (ja) * | 2013-10-17 | 2015-04-23 | デクセリアルズ株式会社 | 異方性導電接着剤及び接続構造体 |
JP6307308B2 (ja) * | 2014-03-06 | 2018-04-04 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4554033A (en) * | 1984-10-04 | 1985-11-19 | Amp Incorporated | Method of forming an electrical interconnection means |
US4643843A (en) * | 1985-06-03 | 1987-02-17 | Lowdon Harold L | Preparation for improving the reliability of electrical connections |
JPS6215777A (ja) * | 1985-07-12 | 1987-01-24 | 日本写真印刷株式会社 | フイルム状コネクタ及びその製造方法 |
JPH0770252B2 (ja) * | 1988-01-28 | 1995-07-31 | 信越ポリマー株式会社 | 熱接着性可撓性配線部材 |
US5371327A (en) * | 1992-02-19 | 1994-12-06 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector sheet |
JP2888466B2 (ja) * | 1992-04-07 | 1999-05-10 | 信越ポリマー株式会社 | ヒートシールコネクターの製造方法 |
JPH0685337B2 (ja) * | 1992-10-30 | 1994-10-26 | 信越ポリマー株式会社 | ヒートシールコネクター |
ATE216122T1 (de) * | 1994-01-27 | 2002-04-15 | Loctite Ireland Ltd | Zusammenstellungen und methoden zur anordnung anisotropisch leitender bahnen und verbindungen zwischen zwei sätzen von leitern |
JPH08279388A (ja) * | 1995-04-04 | 1996-10-22 | Idemitsu Kosan Co Ltd | 電気回路の接続方法 |
JP2710234B2 (ja) * | 1995-07-31 | 1998-02-10 | 日本電気株式会社 | 端子接続方法およびこの方法により製造される回路基板 |
JP3258550B2 (ja) * | 1996-01-12 | 2002-02-18 | 日本黒鉛工業株式会社 | ファインピッチヒートシールコネクタ用三層構造導電異方性帯状部材およびその製造方法 |
-
2001
- 2001-03-23 WO PCT/JP2001/002356 patent/WO2001071854A1/ja active IP Right Grant
- 2001-03-23 JP JP2001569929A patent/JP4411819B2/ja not_active Expired - Fee Related
- 2001-03-23 EP EP01915737A patent/EP1189308B1/de not_active Expired - Lifetime
- 2001-03-23 DE DE60127056T patent/DE60127056T2/de not_active Expired - Lifetime
- 2001-03-23 KR KR1020017015002A patent/KR100738246B1/ko not_active IP Right Cessation
- 2001-03-23 TW TW090106949A patent/TW492215B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60127056T2 (de) | 2007-11-08 |
WO2001071854A1 (en) | 2001-09-27 |
EP1189308A4 (de) | 2005-06-08 |
JP4411819B2 (ja) | 2010-02-10 |
EP1189308A1 (de) | 2002-03-20 |
EP1189308B1 (de) | 2007-03-07 |
KR100738246B1 (ko) | 2007-07-12 |
KR20020022676A (ko) | 2002-03-27 |
TW492215B (en) | 2002-06-21 |
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8364 | No opposition during term of opposition |