DE59700621D1 - Process for material-removing processing of the edge of a semiconductor wafer - Google Patents
Process for material-removing processing of the edge of a semiconductor waferInfo
- Publication number
- DE59700621D1 DE59700621D1 DE59700621T DE59700621T DE59700621D1 DE 59700621 D1 DE59700621 D1 DE 59700621D1 DE 59700621 T DE59700621 T DE 59700621T DE 59700621 T DE59700621 T DE 59700621T DE 59700621 D1 DE59700621 D1 DE 59700621D1
- Authority
- DE
- Germany
- Prior art keywords
- edge
- semiconductor wafer
- removing processing
- processing
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19636055A DE19636055A1 (en) | 1996-09-05 | 1996-09-05 | Edge material removing machining method for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59700621D1 true DE59700621D1 (en) | 1999-12-02 |
Family
ID=7804717
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19636055A Withdrawn DE19636055A1 (en) | 1996-09-05 | 1996-09-05 | Edge material removing machining method for semiconductor wafer |
DE59700621T Expired - Lifetime DE59700621D1 (en) | 1996-09-05 | 1997-09-04 | Process for material-removing processing of the edge of a semiconductor wafer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19636055A Withdrawn DE19636055A1 (en) | 1996-09-05 | 1996-09-05 | Edge material removing machining method for semiconductor wafer |
Country Status (6)
Country | Link |
---|---|
US (1) | US6045436A (en) |
EP (1) | EP0881035B1 (en) |
JP (1) | JP2900253B2 (en) |
KR (1) | KR100273960B1 (en) |
DE (2) | DE19636055A1 (en) |
TW (1) | TW352354B (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11320363A (en) * | 1998-05-18 | 1999-11-24 | Tokyo Seimitsu Co Ltd | Wafer chamferring device |
DE19841492A1 (en) * | 1998-09-10 | 2000-03-23 | Wacker Siltronic Halbleitermat | Method and device for separating a large number of disks from a brittle hard workpiece |
DE19928949A1 (en) * | 1999-06-24 | 2001-01-04 | Wacker Siltronic Halbleitermat | Production of a semiconductor wafer used as the base material for a semiconductor component comprises removing the semiconductor from a single crystal, processing by ductile chip removal, and polishing and cleaning the surface |
JP3510584B2 (en) * | 2000-11-07 | 2004-03-29 | スピードファム株式会社 | Peripheral polishing device for disk-shaped workpiece |
US20020058466A1 (en) * | 2000-11-13 | 2002-05-16 | Curran David M. | Method and system for reducing thickness of spin-on glass on semiconductor wafers |
US6860795B2 (en) * | 2001-09-17 | 2005-03-01 | Hitachi Global Storage Technologies Netherlands B.V. | Edge finishing process for glass or ceramic disks used in disk drive data storage devices |
DE10147646C1 (en) * | 2001-09-27 | 2002-12-19 | Wacker Siltronic Halbleitermat | Machining method for semiconductor disc edge calculates displacement rate for semiconductor disc by comparing overall material volume to be removed with volume removed per unit of time |
US20070298240A1 (en) * | 2006-06-22 | 2007-12-27 | Gobena Feben T | Compressible abrasive article |
US9676114B2 (en) * | 2012-02-29 | 2017-06-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer edge trim blade with slots |
KR101414204B1 (en) * | 2013-01-30 | 2014-07-01 | 주식회사 엘지실트론 | Apparatus and method for grinding wafer edge |
JP2014226767A (en) * | 2013-05-27 | 2014-12-08 | 株式会社東京精密 | Wafer chamfer device and wafer chamfer method |
JP7222636B2 (en) * | 2018-09-12 | 2023-02-15 | 株式会社ディスコ | Edge trimming device |
CN110605629B (en) * | 2019-09-19 | 2022-11-18 | 西安奕斯伟材料科技有限公司 | Grinding device |
CN114643519B (en) * | 2022-03-26 | 2022-12-09 | 浙江金连接科技股份有限公司 | Palladium alloy sleeve barrel for semiconductor chip test probe and processing equipment thereof |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60104644A (en) * | 1983-11-08 | 1985-06-10 | Mitsubishi Metal Corp | Device for grinding and chamfering outer periphery of wafer |
JPH0637025B2 (en) * | 1987-09-14 | 1994-05-18 | スピードファム株式会社 | Wafer mirror surface processing equipment |
KR0185234B1 (en) * | 1991-11-28 | 1999-04-15 | 가부시키 가이샤 토쿄 세이미쯔 | Method of chamfering semiconductor wafer |
JP2628424B2 (en) * | 1992-01-24 | 1997-07-09 | 信越半導体株式会社 | Polishing method and apparatus for wafer chamfer |
JPH07205001A (en) * | 1993-11-16 | 1995-08-08 | Tokyo Seimitsu Co Ltd | Wafer chamfering machine |
US5595522A (en) * | 1994-01-04 | 1997-01-21 | Texas Instruments Incorporated | Semiconductor wafer edge polishing system and method |
JP3010572B2 (en) * | 1994-09-29 | 2000-02-21 | 株式会社東京精密 | Wafer edge processing equipment |
US5816897A (en) * | 1996-09-16 | 1998-10-06 | Corning Incorporated | Method and apparatus for edge finishing glass |
US5725414A (en) * | 1996-12-30 | 1998-03-10 | Intel Corporation | Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer |
-
1996
- 1996-09-05 DE DE19636055A patent/DE19636055A1/en not_active Withdrawn
-
1997
- 1997-07-25 JP JP9200342A patent/JP2900253B2/en not_active Expired - Fee Related
- 1997-08-05 US US08/906,573 patent/US6045436A/en not_active Expired - Lifetime
- 1997-08-26 KR KR1019970041267A patent/KR100273960B1/en not_active IP Right Cessation
- 1997-09-01 TW TW086112483A patent/TW352354B/en not_active IP Right Cessation
- 1997-09-04 DE DE59700621T patent/DE59700621D1/en not_active Expired - Lifetime
- 1997-09-04 EP EP97115333A patent/EP0881035B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0881035B1 (en) | 1999-10-27 |
JP2900253B2 (en) | 1999-06-02 |
KR100273960B1 (en) | 2001-01-15 |
US6045436A (en) | 2000-04-04 |
DE19636055A1 (en) | 1998-03-12 |
JPH1080849A (en) | 1998-03-31 |
EP0881035A1 (en) | 1998-12-02 |
KR19980024185A (en) | 1998-07-06 |
TW352354B (en) | 1999-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69737702D1 (en) | Process for the production of semiconductor wafers | |
DE69812869D1 (en) | Process for substrate processing | |
DE69124672D1 (en) | Process for substrate processing | |
DE69636426D1 (en) | Process for cleaning semiconducting wafers | |
DE68920365D1 (en) | Process for polishing a semiconductor wafer. | |
DE69431385D1 (en) | Process for the production of silicon semiconductor wafers | |
DE60018553D1 (en) | METHOD AND DEVICE FOR SEPARATING AND POLISHING THE SURFACE OF A SEMICONDUCTOR DISC | |
DE69916728D1 (en) | Process for cleaning a semiconductor substrate | |
DE3887477D1 (en) | Process for the surface treatment of a semiconductor wafer. | |
DE3679565D1 (en) | METHOD FOR REMOVING PHOTORESIST AND STRIPER REMAINS FROM SEMICONDUCTOR SUBSTRATES. | |
DE69325325D1 (en) | Process for the production of semiconductor wafers | |
DE69739444D1 (en) | Method for improving the solderability of a surface | |
DE69636618D1 (en) | METHOD FOR THE TREATMENT OF A SUBSTRATE SURFACE AND TREATMENT THEREFOR | |
DE69528611D1 (en) | Method of manufacturing a semiconductor substrate | |
DE69529858D1 (en) | Surface treatment for semiconductor substrate | |
DE69216752D1 (en) | Method of manufacturing a semiconductor wafer | |
DE59700621D1 (en) | Process for material-removing processing of the edge of a semiconductor wafer | |
DE69507567D1 (en) | Process for cleaning semiconducting wafers | |
DE69519460D1 (en) | Process for cleaning a semiconductor wafer | |
DE69903215D1 (en) | Method and device for grinding the surface of a semiconductor wafer | |
DE69734078D1 (en) | A method of cleaning a porous surface of a semiconductor substrate | |
DE69824372D1 (en) | Device for exposing the peripheral surface of a semiconductor wafer | |
DE59506147D1 (en) | Process for cleaning semiconductor wafers | |
DE59800920D1 (en) | Process for the production of a semiconductor wafer | |
DE69231021D1 (en) | Method for checking the etching contour of a layer of an integrated circuit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: WACKER SILTRONIC AG, 84489 BURGHAUSEN, DE |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: SILTRONIC AG, 81737 MUENCHEN, DE |