DE3789909D1 - Vorrichtung mit einem ferroelektrischen Film. - Google Patents

Vorrichtung mit einem ferroelektrischen Film.

Info

Publication number
DE3789909D1
DE3789909D1 DE3789909T DE3789909T DE3789909D1 DE 3789909 D1 DE3789909 D1 DE 3789909D1 DE 3789909 T DE3789909 T DE 3789909T DE 3789909 T DE3789909 T DE 3789909T DE 3789909 D1 DE3789909 D1 DE 3789909D1
Authority
DE
Germany
Prior art keywords
ferroelectric film
ferroelectric
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3789909T
Other languages
English (en)
Other versions
DE3789909T2 (de
Inventor
Kenji Iijima
Ryoichi Takayama
Yoshihiro Tomita
Ichiro Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE3789909D1 publication Critical patent/DE3789909D1/de
Publication of DE3789909T2 publication Critical patent/DE3789909T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/088—Oxides of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
    • H10N15/15—Thermoelectric active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Insulating Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Radiation Pyrometers (AREA)
  • Laminated Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
DE3789909T 1986-03-04 1987-03-03 Vorrichtung mit einem ferroelektrischen Film. Expired - Lifetime DE3789909T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4656086A JP2532381B2 (ja) 1986-03-04 1986-03-04 強誘電体薄膜素子及びその製造方法

Publications (2)

Publication Number Publication Date
DE3789909D1 true DE3789909D1 (de) 1994-07-07
DE3789909T2 DE3789909T2 (de) 1995-01-05

Family

ID=12750705

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3789909T Expired - Lifetime DE3789909T2 (de) 1986-03-04 1987-03-03 Vorrichtung mit einem ferroelektrischen Film.
DE3752094T Expired - Lifetime DE3752094T2 (de) 1986-03-04 1987-03-03 Verfahren zur Herstellung eines ferroelektrischen Film

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3752094T Expired - Lifetime DE3752094T2 (de) 1986-03-04 1987-03-03 Verfahren zur Herstellung eines ferroelektrischen Film

Country Status (4)

Country Link
US (1) US5308462A (de)
EP (2) EP0441408B1 (de)
JP (1) JP2532381B2 (de)
DE (2) DE3789909T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6369104A (ja) * 1986-09-10 1988-03-29 松下電器産業株式会社 強誘電体薄膜素子の製造方法
FR2673001A1 (fr) * 1991-02-19 1992-08-21 Thomson Csf Capteur de champ electrique sensible aux champs faibles.
EP0600303B1 (de) * 1992-12-01 2002-02-06 Matsushita Electric Industrial Co., Ltd. Verfahren zur Herstellung einer elektrischen Dünnschicht
US5338999A (en) * 1993-05-05 1994-08-16 Motorola, Inc. Piezoelectric lead zirconium titanate device and method for forming same
JP2924574B2 (ja) * 1993-05-31 1999-07-26 富士ゼロックス株式会社 配向性強誘電体薄膜素子
KR0147245B1 (ko) * 1993-12-01 1998-09-15 모리시타 요이찌 강유전체박막 및 그 제조방법
US5825121A (en) * 1994-07-08 1998-10-20 Seiko Epson Corporation Thin film piezoelectric device and ink jet recording head comprising the same
JP3193302B2 (ja) 1996-06-26 2001-07-30 ティーディーケイ株式会社 膜構造体、電子デバイス、記録媒体および強誘電体薄膜の製造方法
DE19842816C1 (de) * 1998-09-18 2000-02-03 Siemens Ag Verfahren zur Herstellung selbstpolarisierter ferroelektrischer Schichten, insbesondere PZT-Schichten, mit rhomboedrischer Kristallstruktur
US6113761A (en) 1999-06-02 2000-09-05 Johnson Matthey Electronics, Inc. Copper sputtering target assembly and method of making same
US6858102B1 (en) 2000-11-15 2005-02-22 Honeywell International Inc. Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets
FR2795552B1 (fr) * 1999-06-28 2001-09-14 France Telecom Procede de realisation de films et structures dielectriques orientes a la demande
EP1232525A2 (de) 1999-11-24 2002-08-21 Honeywell International, Inc. Leitende verbindung
US6451222B1 (en) 1999-12-16 2002-09-17 Honeywell International Inc. Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target
US6623865B1 (en) * 2000-03-04 2003-09-23 Energenius, Inc. Lead zirconate titanate dielectric thin film composites on metallic foils
JP2002006649A (ja) * 2000-06-19 2002-01-11 Sharp Corp 画像形成装置
DE102004001696A1 (de) * 2004-01-12 2005-10-27 Siemens Ag Verfahren zum Herstellen einer Korrelation zwischen einem ersten Zustand eines piezoelektrischen Bauteils und einem zweiten Zustand des Bauteils sowie Verwendung der Korrelation
JP2009062564A (ja) * 2007-09-05 2009-03-26 Fujifilm Corp ペロブスカイト型酸化物、強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置
JP4993294B2 (ja) * 2007-09-05 2012-08-08 富士フイルム株式会社 ペロブスカイト型酸化物、強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置
JP5095315B2 (ja) * 2007-09-05 2012-12-12 富士フイルム株式会社 ペロブスカイト型酸化物、強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757129A (fr) * 1969-10-07 1971-04-06 Philips Nv Resonateur electromecanique
US3666666A (en) * 1969-12-17 1972-05-30 Atomic Energy Commission Ferroelectric ceramic materials
US3816750A (en) * 1971-06-04 1974-06-11 Honeywell Inc Pyroelectric detector
US3997690A (en) * 1975-05-27 1976-12-14 Honeywell Inc. Method of adjusting refractive index of PLZT optical coating on optical element
GB1516408A (en) * 1975-06-09 1978-07-05 Mullard Ltd Ferroelectric ceramic materials
US4201450A (en) * 1978-04-03 1980-05-06 Polaroid Corporation Rigid electro-optic device using a transparent ferroelectric ceramic element
JPS56131979A (en) * 1980-03-19 1981-10-15 Hitachi Ltd Piezoelectric material for transparent vibrator and transparent vibrator
DE3169146D1 (en) * 1980-11-07 1985-04-04 Hitachi Ltd Piezoelectric ceramic transducer
DE3240884A1 (de) * 1982-11-05 1984-05-10 Philips Patentverwaltung Gmbh, 2000 Hamburg Keramisches bistabiles biegeelement
JPS60172103A (ja) * 1984-02-17 1985-09-05 松下電器産業株式会社 強誘電体薄膜
JPH0763101B2 (ja) * 1985-02-04 1995-07-05 株式会社日立製作所 圧電変換器およびその製造方法

Also Published As

Publication number Publication date
DE3752094T2 (de) 1998-02-12
DE3752094D1 (de) 1997-08-21
JP2532381B2 (ja) 1996-09-11
EP0441408B1 (de) 1997-07-16
EP0237250B1 (de) 1994-06-01
DE3789909T2 (de) 1995-01-05
EP0237250A1 (de) 1987-09-16
US5308462A (en) 1994-05-03
EP0441408A3 (de) 1991-08-28
EP0441408A2 (de) 1991-08-14
JPS62205266A (ja) 1987-09-09

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