CN2610494Y - Water cooling conductive copper line - Google Patents

Water cooling conductive copper line Download PDF

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Publication number
CN2610494Y
CN2610494Y CN 03227325 CN03227325U CN2610494Y CN 2610494 Y CN2610494 Y CN 2610494Y CN 03227325 CN03227325 CN 03227325 CN 03227325 U CN03227325 U CN 03227325U CN 2610494 Y CN2610494 Y CN 2610494Y
Authority
CN
China
Prior art keywords
copper bar
groove
water cooling
copper
milled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 03227325
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Chinese (zh)
Inventor
李健泉
唐海燕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuzhou CRRC Times Electric Co Ltd
Original Assignee
Zhuzhou CSR Times Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuzhou CSR Times Electric Co Ltd filed Critical Zhuzhou CSR Times Electric Co Ltd
Priority to CN 03227325 priority Critical patent/CN2610494Y/en
Application granted granted Critical
Publication of CN2610494Y publication Critical patent/CN2610494Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A water cooling conductive copper bar comprises a copper bar 2and a metal pipe 1 connected with a cooling water supply system, wherein one side of the copper bar 2 is milled with a groove, and the other side is opened with an installing hole for equipping the semiconductor parts; and the metal pipe 1 is bent as the shape coincident with the groove on the copper bar 2 and embedded and welded in the groove. Without preparing the vent, the utility model can make the power supply case structure completely sealed, enhance the capabilities of corrosion resistance and moisture resistance, advances the shielding efficiency to the electromagnetic interference radiation, and reduces the volume and the weight of the power supply. And at the same time the conductivity of the copper is better than the aluminum, thus enhancing the conductivity of the electric connecting position.

Description

The water cooling conducting copper
Technical field
The utility model relates to a kind of water cooling conducting copper that semiconductor is used of installing.
Technical background
In the middle low power supply unit, power semiconductor is installed and is cooled off the aluminium radiators that adopt more and install and forced air cooling at present, in the work under bad environment place, moist and corrosive gas will have a strong impact on the life-span and the reliability of supply unit, cross the electromagnet shield effect that the wind passage also will reduce casing simultaneously, huge radiator can increase the volume and weight of power supply.
Technology contents
The utility model aims to provide a kind of suitable plating, the contour humidity of electrolysis and highly corrosive gaseous environment, can improve the power supply electromagnet shield effect, the good water cooling conducting copper of electric conductivity.
It comprises copper bar 2 and the metal tube 1 that links to each other with the cooling water system, be milled with groove on the one side of described copper bar 2, another side has the installing hole that semiconductor device by using is installed, and described metal tube 1 is bent into the shape consistent with groove on the copper bar 2 and scarfweld among this groove.
Perhaps, it comprises copper bar 2 and copper bar cover plate 3, and described copper bar 2 one sides are milled with groove, and another side has the installing hole that semiconductor device by using is installed, described copper bar cover plate 3 is consistent with copper bar 2 shapes size, and copper bar cover plate 3 is covered in described copper bar 2 and is milled with on the one side of groove.
Such water cooling conducting copper can use by the cooling water pipe serial or parallel connection, and the substitution of Al radiator adopts recirculated water cooling heat radiation, and this is very suitable to the supply unit that uses in occasions such as plating, electrolysis.
Figure of description
Fig. 1 is the utility model structural representation;
Fig. 2 is the copper bar schematic diagram;
Fig. 3 is the side schematic view of the utility model band copper bar cover plate;
Connection diagram when Fig. 4 uses for the utility model series and parallel.
Embodiment
As Fig. 1 and Fig. 2, it comprises copper bar 2 and the metal tube 1 that links to each other with the cooling water system, be milled with groove on the one side of described copper bar 2, another side has the installing hole of installation power semiconductor device by using, and described metal tube 1 is bent into the shape consistent with groove on the copper bar 2 and scarfweld among this groove.In the reverse side groove milling of copper bar 2, the size of groove and shape are by metal tube 1 external diameter and shape and the decision of semiconductor installation site, and the length of groove is determined according to the requirement of heat radiation; Power semiconductor is installed in the front of copper bar 2, and preferably red copper row conducts electricity very well; The internal diameter size of metal tube 1 is determined according to the required current size of specific heat load.Metal tube 1 is embedded in the groove of copper bar 2, and make copper bar 2 and metal tube 1, strengthen its conductivity of heat with welding manner;
As Fig. 2,3, it comprises copper bar 2 and copper bar cover plate 3, and described copper bar 2 one sides are milled with groove, and another side has the installing hole of installation power semiconductor device by using, described copper bar cover plate 3 is consistent with copper bar 2 shapes size, and these copper bar cover plate 3 welding are covered in described copper bar 2 and are milled with on the one side of groove.Be the front that power semiconductor is installed in copper bar 2, copper bar cover plate 3 is attached to the reverse side of copper bar 2, and is weldingly connected, and reaches effect same as the previously described embodiments.
As Fig. 4, the water cooling conducting copper can use by the cooling water pipe serial or parallel connection, and the substitution of Al radiator adopts the recirculated water cooling.
Metal tube can adopt copper pipe, also can be iron pipe, steel pipe, aluminum pipe.
Copper bar conduction, and pyrotoxin is installed is power semiconductor; Copper pipe embeds between copper bar or copper bar and the copper bar and is weldingly connected;
The heat that power semiconductor work the time is produced passes to copper bar, passes to metal tube by copper bar again, flows through metal tube as the water of coolant, takes away the heat on the metal tube; Or the heat on the copper bar is taken away by the water that directly flows through groove.In the practical application of occasions such as plating, electrolysis, this type of cooling is very practical, and effect is fine, has reached the purpose of this utility model.
The utility model need not ventilation hole because of adopting water cooling, can make the supply unit body structure hermetically sealed, improves that it is anticorrosive, and the moisture resistance energy improves the screening effectiveness to electromagnetic interference (EMI) emissions, reduces the volume and weight of power supply.The electric conductivity of copper is better than aluminium simultaneously, makes it be electrically connected place's electric conductivity and improves.

Claims (3)

1, a kind of water cooling conducting copper, it is characterized in that it comprises copper bar (2) and the metal tube (1) that links to each other with the cooling water system, be milled with groove on the one side of described copper bar (2), another side has the installing hole that semiconductor device by using is installed, and described metal tube (1) is bent into the shape consistent with groove on the copper bar (2) and scarfweld among this groove.
2, a kind of water cooling conducting copper is characterized in that it comprises copper bar (2) and copper bar cover plate (3), and described copper bar cover plate (3) is consistent with copper bar (2) shape size, and this copper bar cover plate (3) is covered in described copper bar (2) and is milled with on the one side of groove.
3, a kind of water cooling conducting copper as claimed in claim 2 is characterized in that described copper bar cover plate (3) welding is covered in described copper bar (2) and is milled with on the one side of groove.
CN 03227325 2003-04-04 2003-04-04 Water cooling conductive copper line Expired - Lifetime CN2610494Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03227325 CN2610494Y (en) 2003-04-04 2003-04-04 Water cooling conductive copper line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03227325 CN2610494Y (en) 2003-04-04 2003-04-04 Water cooling conductive copper line

Publications (1)

Publication Number Publication Date
CN2610494Y true CN2610494Y (en) 2004-04-07

Family

ID=34164041

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03227325 Expired - Lifetime CN2610494Y (en) 2003-04-04 2003-04-04 Water cooling conductive copper line

Country Status (1)

Country Link
CN (1) CN2610494Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101005187B (en) * 2006-12-07 2010-10-13 广州电器科学研究院 Method for producing integrated in-phase inverse and parallel guide row and its structure
CN104681515A (en) * 2015-03-12 2015-06-03 中国计量学院 Novel pressure tube type IGBT water cooling plate
CN104716048A (en) * 2015-03-12 2015-06-17 中国计量学院 Pipe pressing type water cooling plate manufacturing technology
CN105762739A (en) * 2016-04-08 2016-07-13 江苏金奕达铜业股份有限公司 Copper busbar cooling device
WO2017124428A1 (en) * 2016-01-22 2017-07-27 Abb 瑞士股份有限公司 Metal coating copper bar and electrical equipment
CN109959413A (en) * 2019-02-18 2019-07-02 北华大学 Cooling tube plugging fault prediction meanss and method in a kind of water-cooled copper bar

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101005187B (en) * 2006-12-07 2010-10-13 广州电器科学研究院 Method for producing integrated in-phase inverse and parallel guide row and its structure
CN104681515A (en) * 2015-03-12 2015-06-03 中国计量学院 Novel pressure tube type IGBT water cooling plate
CN104716048A (en) * 2015-03-12 2015-06-17 中国计量学院 Pipe pressing type water cooling plate manufacturing technology
WO2017124428A1 (en) * 2016-01-22 2017-07-27 Abb 瑞士股份有限公司 Metal coating copper bar and electrical equipment
CN105762739A (en) * 2016-04-08 2016-07-13 江苏金奕达铜业股份有限公司 Copper busbar cooling device
CN109959413A (en) * 2019-02-18 2019-07-02 北华大学 Cooling tube plugging fault prediction meanss and method in a kind of water-cooled copper bar

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GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20130408

Granted publication date: 20040407