CN221301785U

CN221301785U - Heat conduction device for ceramic PCB (printed circuit board) processing

Info

Publication number: CN221301785U
Application number: CN202322064995.5U
Authority: CN
Inventors: 甘继明
Original assignee: Shenzhen Jinruixin Special Circuit Technology Co ltd
Current assignee: Shenzhen Jinruixin Special Circuit Technology Co ltd
Priority date: 2023-08-02
Filing date: 2023-08-02
Publication date: 2024-07-09
Anticipated expiration: 2033-08-02

Abstract

The utility model discloses a heat conduction device for ceramic PCB processing, and relates to the technical field of PCB processing. The utility model comprises a heating box, wherein a PCB heat conduction drawer is movably inserted in the front side of the heating box, a handle is fixedly arranged in the middle of the front side of the PCB heat conduction drawer, heat conduction holes are uniformly formed in the bottom of the inner side of the PCB heat conduction drawer, and a heating box is fixedly connected to the rear side wall of the lower part of the heating box. According to the utility model, the air guide fan is driven to rotate, the electric heating net is electrified to heat, hot air can be conveyed into the heating box to conduct heat and dry the ceramic PCB, moisture generated in the drying process of the ceramic PCB enters the drying box along with hot air through the first air guide pipe, adsorption drying can be carried out through the drying and dehumidifying plate in the drying box, and the dried hot air can be guided into the air guide pipe through the second air guide pipe, so that the hot air can be recycled, and the drying processing of the ceramic PCB can be more efficient and energy-saving.

Description

Heat conduction device for ceramic PCB (printed circuit board) processing

Technical Field

The utility model belongs to the technical field of PCB processing, and particularly relates to a heat conduction device for ceramic PCB processing.

Background

The ceramic PCB is a heat-conducting organic ceramic circuit board with the heat conductivity coefficient of 9-20W/m.k, which is prepared by using heat-conducting ceramic powder and an organic adhesive at the temperature of below 250 ℃. In the ceramic PCB processing process, in order to reduce the internal stress of the ceramic PCB, the ceramic PCB needs to be heated and dried, and dehumidified. Because the ceramic PCBs of the same batch in the production and processing process are more in quantity, whether the ceramic PCBs can be rapidly processed or not, and the ceramic PCBs can be dried in a large batch while conducting heat, so that the production efficiency of the ceramic PCBs can be directly affected.

Disclosure of utility model

In order to solve the technical problems, the utility model is realized by the following technical scheme:

The utility model relates to a heat conduction device for ceramic PCB processing, which comprises a heating box, wherein a PCB heat conduction drawer is movably inserted into the front side of the heating box, a handle is fixedly arranged in the middle of the front side of the PCB heat conduction drawer, heat conduction holes are uniformly formed in the bottom of the inner side of the PCB heat conduction drawer, a heating box is fixedly connected to the rear side wall of the lower part of the heating box, an electric heating net is fixedly connected to the inside of the heating box, an air duct is fixedly connected to the rear side of the heating box, an air guide fan is fixedly arranged in the air duct, and the air guide fan is communicated with the inside of the heating box through the heating box.

Preferably, a drying box is fixedly connected to the rear side wall of the heating box above the heating box, and a drying and dehumidifying plate is movably inserted into the rear side of the drying box.

Preferably, two drying and dehumidifying plates on the drying box are inserted, and the tail end of the drying box protrudes out of the outer side wall of the drying box.

Preferably, the air inlet at the top of the drying box is communicated with the air outlet at the top of the heating box through a first air guide pipe, and the air outlet at the bottom of the drying box is communicated with the air inlet of the air guide pipe through a second air guide pipe.

Preferably, a power switch is fixedly arranged on the outer side wall of the heating box, the power switch is electrically connected with an external power supply through a wire, and the air guide fan and the electric heating net are electrically connected with the power switch through wires respectively.

Preferably, the PCB heat conduction drawer at the front side of the heating box is provided with three layers from top to bottom at equal intervals.

The utility model has the following beneficial effects:

According to the heat conduction device for ceramic PCB processing, the ceramic PCB to be dried is placed in the PCB heat conduction drawer, the air guide fan is driven to rotate, the electric heating net is electrified and heated, hot air can be conveyed into the heating box, the hot air can enter the inside of the PCB heat conduction drawer through the heat conduction holes to conduct heat conduction and drying on the ceramic PCB, moisture generated in the ceramic PCB drying process enters the inside of the drying box along with hot air through the first air guide pipe, the ceramic PCB can be adsorbed and dried through the drying and dehumidifying plate in the drying box, and the dried hot air can be guided into the air guide pipe through the second air guide pipe, so that the cyclic utilization of the hot air is realized, and the drying processing of the ceramic PCB can be more efficient and energy-saving.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a front view structure of a heat conduction device for ceramic PCB processing according to the present utility model;

Fig. 2 is a schematic diagram of a rear view structure of a heat conduction device for ceramic PCB processing according to the present utility model;

Fig. 3 is a schematic diagram of an internal structure of a heat conduction device for ceramic PCB processing according to the present utility model.

In the drawings, the list of components represented by the various numbers is as follows:

1. A heating box; 2. a power switch; 3. PCB board heat conduction drawer; 31. a handle; 32. a heat conduction hole; 4. a first air guide pipe; 5. a drying box; 6. a second air guide pipe; 7. drying the dehumidifying board; 8. an air duct; 9. a heating box; 10. an air guiding fan; 11. an electric heating net.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution:

Embodiment one: a heat conduction device for ceramic PCB processing comprises a heating box 1, wherein a PCB heat conduction drawer 3 is movably inserted at the front side of the heating box 1, three layers are equidistantly arranged from top to bottom on the PCB heat conduction drawer 3 at the front side of the heating box 1, the three layers of the arranged PCB heat conduction drawers 3 are used for placing ceramic PCB boards to be subjected to heating and drying treatment, heat conduction and drying can be simultaneously carried out on a large number of ceramic PCB boards, the efficiency is higher, a handle 31 is fixedly arranged in the middle of the front side of the PCB heat conduction drawer 3, heat conduction holes 32 are uniformly formed in the bottom of the inner side of the PCB heat conduction drawer 3, the heat conduction holes 32 are formed for realizing smooth ventilation, further realizing heat conduction and drying of the ceramic PCB boards placed inside the PCB heat conduction drawer 3, a heating box 9 is fixedly connected to the rear side wall of the lower part of the heating box 1, an electric heating network 11 is fixedly connected to the inside of the heating box 9, the rear side of the heating box 9 is fixedly connected with an air duct 8, an air guide fan 10 is fixedly arranged in the air duct 8, the air guide fan 10 is communicated with the inside of the heating box 1 through the heating box 9, a power switch 2 is fixedly arranged on the outer side wall of the heating box 1, the power switch 2 is electrically connected with an external power supply through a wire, the air guide fan 10 and an electric heating net 11 are respectively electrically connected with the power switch 2 through wires, in the ceramic PCB processing process, when the ceramic PCB is required to be dried, the PCB heat conduction drawer 3 at the front side of the heating box 1 can be drawn out, the ceramic PCB to be dried is placed in the PCB heat conduction drawer 3, the PCB heat conduction drawer 3 is pushed into the heating box 1, at the moment, the air guide fan 10 can be driven to rotate through the power switch 2, the electric heating net 11 is electrified and heated, at the moment, the air guide fan 10 can be rotated to blow air into the inside the heating box 9, the inside air that gets into heating box 9 can get into the inside of heating cabinet 1 after the heating of electric heat net 11, and the inside that can get into PCB board heat conduction steamer tray 3 through heat conduction hole 32 after the hot air gets into the inside of heating cabinet 1 carries out heat conduction stoving to the inside ceramic PCB board of placing of PCB board heat conduction steamer tray 3, and the inside steam that produces of stoving in-process of ceramic PCB board can be along with the hot air is discharged from the inside of heating cabinet 1, realizes the heat conduction stoving to the inside ceramic PCB board of placing of PCB board heat conduction steamer tray 3.

Embodiment two: the difference between this embodiment and the first embodiment lies in that, fixedly connected with drying cabinet 5 on the back lateral wall of heating cabinet 1 above the heating box 9, drying and dehumidifying board 7 has been inserted in the activity of rear side of drying cabinet 5, setting up of drying and dehumidifying board 7, can adsorb the drying to the moisture in the air, drying and dehumidifying board 7 on the drying cabinet 5 has been inserted two, and the tail end protrusion of drying cabinet 5 is in the lateral wall of drying cabinet 5, the air intake at drying cabinet 5 top communicates with the air outlet at heating cabinet 1 top through first guide duct 4, the air outlet at drying cabinet 5 bottom communicates with the air intake of air duct 8 through second guide duct 6, at the in-process of heat conduction stoving to the ceramic PCB board of PCB board heat conduction steamer 3 inside, the gas that discharges from heating cabinet 1 can get into drying cabinet 5 through first guide duct 4, and can adsorb the dehumidification through drying and dehumidifying board 7 in the air after drying can follow the bottom of drying cabinet 5 and guide into air duct 8 through second guide duct 6, realize the circulation to hot-blast, can improve energy-conserving efficiency.

Working principle: during the use, in ceramic PCB board course of working, when needs are dried ceramic PCB board, can take out the PCB board heat conduction steamer tray 3 of heating cabinet 1 front side, place the ceramic PCB board that will treat drying in PCB board heat conduction steamer tray 3, and with the inside propelling movement of PCB board heat conduction steamer tray 3 to heating cabinet 1 in, accessible switch 2 drive air-guide fan 10 rotates this moment, and make electric heating net 11 switch on electric heating, air-guide fan 10 rotates this moment can get into the inside air supply of heating box 9, get into the inside of heating cabinet 1 after the inside through electric heating net 11 heats, the inside that hot air got into heating cabinet 1 can get into through heat conduction steamer tray 3 after the inside through heat conduction hole 32, carry out the heat conduction stoving to the inside ceramic PCB board of placing of PCB board heat conduction steamer tray 3, the inside hot gas that produces of ceramic PCB board stoving in-process can be along with the inside discharge of hot air from heating cabinet 1, realize the inside ceramic board of placing to PCB board heat conduction steamer tray 3, in the inside ceramic board stoving steamer tray 3, can be to the inside through the inside of hot-air duct tray 1, can be through the heat conduction steamer tray 5, can be gone into through the drying duct 5 from the inside of hot-air duct 5 through the heat-guide duct 5 after the inside of hot-air inlet drying cabinet, can be more through the drying duct 5, can be realized through the drying duct 5, the drying duct is more can be more through the drying duct 5.

In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, and any modification of the technical solutions described in the foregoing embodiments, and equivalent substitution of some technical features thereof, falls within the scope of the present utility model.

Claims

1. A be used for ceramic PCB board processing to use heat conduction device, includes heating cabinet (1), its characterized in that: the utility model discloses a heating cabinet, including heating cabinet (1), PCB board heat conduction steamer tray (3) have been inserted in the front side activity of heating cabinet (1), the fixed handle (31) that is provided with in middle part of PCB board heat conduction steamer tray (3) front side, heat conduction hole (32) have evenly been seted up to the inboard bottom of PCB board heat conduction steamer tray (3), fixedly connected with heating box (9) on the back lateral wall of heating cabinet (1) lower part, the inside fixedly connected with electric heating net (11) of heating box (9), the rear side fixedly connected with air duct (8) of heating box (9), the inside fixed mounting of air duct (8) is equipped with air guide fan (10), air guide fan (10) are through the inside intercommunication of heating box (9) and heating cabinet (1).

2. The heat conduction device for ceramic PCB processing according to claim 1, wherein a drying box (5) is fixedly connected to the rear side wall of the heating box (1) above the heating box (9), and a drying and dehumidifying plate (7) is movably inserted into the rear side of the drying box (5).

3. The heat conducting device for ceramic PCB processing according to claim 2, wherein two drying and dehumidifying boards (7) on the drying oven (5) are inserted, and the tail end of the drying oven (5) protrudes out of the outer side wall of the drying oven (5).

4. A heat conducting device for ceramic PCB processing according to claim 3, wherein the air inlet at the top of the drying box (5) is communicated with the air outlet at the top of the heating box (1) through a first air guide pipe (4), and the air outlet at the bottom of the drying box (5) is communicated with the air inlet of the air guide pipe (8) through a second air guide pipe (6).

5. The heat conduction device for ceramic PCB processing according to claim 1, wherein a power switch (2) is fixedly arranged on the outer side wall of the heating box (1), the power switch (2) is electrically connected with an external power supply through a wire, and the air guide fan (10) and the electric heating net (11) are electrically connected with the power switch (2) through wires respectively.

6. The heat conduction device for ceramic PCB processing according to claim 1, wherein the PCB heat conduction drawers (3) on the front side of the heating box (1) are arranged with three layers from top to bottom at equal intervals.