CN221259136U

CN221259136U - Semiconductor air conditioner

Info

Publication number: CN221259136U
Application number: CN202321528136.0U
Authority: CN
Inventors: 宗战伟
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-06-11
Filing date: 2023-06-11
Publication date: 2024-07-02
Anticipated expiration: 2033-06-11

Abstract

The utility model relates to a semiconductor air conditioner, comprising a cooling and heating device and an air conveying device, wherein the cooling and heating device and the air conveying device are respectively formed by a first heat exchanger, a second heat exchanger and a semiconductor refrigerating sheet, an air duct space with a certain volume is formed between the front end face of the cooling and heating device and a front baffle or a front cover plate, an air guide opening comprising a side air guide opening and/or an upper air guide opening is arranged on the shell at the air duct space, a plurality of multidirectional air guide openings are arranged to facilitate a user to select the installation direction and the air guide direction of the semiconductor air conditioner in a room according to different scenes and wishes, a fin-type heat exchanger can more efficiently take away heat energy or cold energy on the heat exchanger through air flow among fins in the heat exchanger, the semiconductor refrigerating sheet is clamped between the first heat exchanger and the second heat exchanger according to different air guide openings of different shells, the heat dissipation and the cooling function of the cooling and heating function of the cooling device can be controlled by an electromagnetic switch to switch the polarity of the positive electrode and the negative electrode of the semiconductor refrigerating sheet.

Description

Semiconductor air conditioner

Technical Field

The utility model relates to the technical field of air conditioning equipment, in particular to a semiconductor air conditioner.

Background

The semiconductor refrigerating sheet is also called as electronic refrigerating sheet, which uses P-N junction formed by special semiconductor material to form thermocouple pair, and produces Peltier effect, and is made into sheet body, and after passing through DC current, the energy transfer is produced, and when the current flows from N-type element to the joint of P-type element, the heat is absorbed to form cold end, and when the current flows from P-type element to the joint of N-type element, the heat is released to form hot end.

People apply the device to equipment in the industries of electric appliances, medical treatment and the like, including vehicle-mounted small refrigerators, electric appliance cabinets, constant temperature cabins and the like by utilizing the characteristics of generating heat and generating cold.

The semiconductor air conditioner mainly comprising the semiconductor refrigerating sheets without using the compressor and the refrigerant starts to appear in the market, and compared with the air conditioner mainly comprising the compressor and the refrigerant, the semiconductor air conditioner has the advantages of complex structure, large volume and heavy weight, no compressor and refrigerant, greatly simplified structure and small volume.

In the semiconductor air conditioner according to patent (201020165946.0), a runner type cooling fin 18 and a cooling fin 11 are vertically connected with one end of a plurality of fins arranged at intervals, heat energy is conducted to the fins after the heat is received by the metal base, the heat energy is further conducted to the outer ends of the fins, the heat conducting capacity gradually decreases from inside to outside, the heat conducting capacity is poor, the volume of the cooling fin 18 is smaller than that of the cooling fin 11, after the cold end and the hot end of the semiconductor cooling fin are mutually converted, the semiconductor air conditioner is in a hot air mode, when the cooling fin 18 is in the hot end, the heat radiating area of the cooling fin 18 is smaller, the refrigerating effect of the semiconductor cooling fin is affected due to the insufficient heat radiating capacity, an air inlet 2 of a shell is arranged on a cover 1, an air outlet 6 is arranged below the air inlet 2, the two air inlets are positioned on the same-direction vertical surface, the air inlet and outlet paths of the two air inlets are in a side U shape, the air paths are bent and not smooth, the air entering from the air inlet 2 cannot pass through the radiating fins 11 easily, heat energy or cold energy on the radiating fins 11 cannot be taken away timely or completely, the radiating fins 18 are arranged in the long cylinder 12 at the upper part in the shell, the heat on the radiating fins 18 in the cylinder are blown out from the air outlet 3 at the other end by the fan 9 at one end of the long cylinder 12, the heat radiating area of the radiating fins 18 is limited by the narrow space in the cylinder, the air channels in the cylinder are made to be narrower by the arrangement of the radiating fins 18, the air speed and the air pressure blown out from the air outlet 3 are low, the flow is not smooth, the radiating capability of the radiating fins 18 is insufficient, the heat radiating efficiency is reduced, and the heating and refrigerating efficiency of the semiconductor refrigerating fin is affected.

Disclosure of Invention

Based on the above, in order to improve or solve the problems of the prior art that the air duct and the air guide are not reasonable enough and the air exhaust efficiency is limited, or the heat dissipation capability of the heat dissipation fin of the semiconductor refrigeration fin is poor, and the heat dissipation area is limited and the heat dissipation capability is insufficient, the working efficiency of the semiconductor refrigeration fin is reduced, the utility model provides a semiconductor air conditioner, and aims to solve one of the problems.

The semiconductor air conditioner comprises a cooling and heating device and an air conveying device, wherein the cooling and heating device and the air conveying device are formed by a first heat exchanger, a second heat exchanger and semiconductor refrigerating sheets, the cooling and heating device and the air conveying device are respectively arranged in a shell, the shell is provided with at least two air guide openings, and the air guide openings comprise side air guide openings and/or upper air guide openings.

The first heat exchanger and the second heat exchanger respectively comprise heating bodies, heat conducting pipes and fins, and a plurality of semiconductor refrigerating sheets are arranged between the heating bodies of the first heat exchanger and the second heat exchanger.

The heating body is in a cavity shape, and the heat conducting pipe comprises a heat conducting straight pipe or a heat conducting U pipe.

The heating body, the heat conducting pipe and the fins are made of metals such as copper, aluminum or alloy, and the heat conducting liquid is filled in the heating body and the heat conducting pipe.

The shell is internally provided with a cover plate, a baffle, an air deflector, an air guide port, an air inlet, an air outlet and a partition plate, wherein the air inlet comprises an air grid.

The cover plate comprises a front cover plate and/or a side cover plate, the baffle plate comprises a front baffle plate and/or a lower baffle plate, and the lower baffle plate comprises a microporous water absorbing plate.

The air guide opening comprises an exhaust fan and an air pipe.

The air deflector is arranged at the air outlet.

The air conveying device comprises an air blowing device, an air outlet device and an air guiding device, wherein the air blowing device comprises a wind wheel and a wind wheel motor and is arranged at the rear side of the cooling and heating device.

The air outlet device comprises the air deflector connected with the reciprocating motor.

The air guide device comprises an exhaust fan and an air pipe and is arranged at or on the side air guide opening or the upper air guide opening.

The first heat exchanger is a hot end heat exchanger, and the second heat exchanger is a cold end heat exchanger.

Or the first heat exchange heat exchanger is a cold end heat exchanger, and the second heat exchanger is a hot end heat exchanger.

The semiconductor refrigerating sheet is clamped in an up-down mode on the corresponding surfaces of the heating bodies of the first heat exchanger and the second heat exchanger, and a transverse partition plate is arranged on the front end face of the semiconductor refrigerating sheet.

In some embodiments, the semiconductor cooling fin is sandwiched between the corresponding surfaces of the heating bodies of the first heat exchanger and the second heat exchanger in a left-right shape, and a top-bottom partition plate is provided on the front end surface of the semiconductor cooling fin.

In some embodiments, the two first heat exchangers are respectively disposed at two side ends of the second heat exchanger, the semiconductor refrigeration sheet is sandwiched between the heating body surface of the first heat exchanger and the corresponding surface of the heating body surface of the second heat exchanger, and the front end surface of the semiconductor refrigeration sheet is provided with a partition board in an up-down shape.

In some embodiments, the two second heat exchangers are respectively disposed at two side ends of the first heat exchanger, the semiconductor refrigeration sheet is sandwiched between the heating body surface of the second heat exchanger and the corresponding surface of the heating body surface of the first heat exchanger, and the front end surface of the semiconductor refrigeration sheet is provided with a partition board in an up-down shape.

The side cover plate comprises a locating pin and is covered on the side wall plate of the shell.

An air duct space is formed between the front end face of the cooling and heating device and the front baffle of the shell.

In some embodiments, an air duct space is formed between the front end surface of the cooling and heating device and the inner side surface of the front cover plate of the shell.

The air guide opening is arranged on a top plate of the shell and/or side wall plates corresponding to two ends of the shell in the air channel space, and the air guide opening is internally provided with a shearing plate.

The shell is provided with a control device which is respectively and electrically connected with a wind wheel motor, an exhaust fan, a semiconductor refrigerating sheet, an electromagnetic switch and a temperature sensor, wherein the wind wheel motor, the exhaust fan, the semiconductor refrigerating sheet and the temperature sensor are arranged in the shell, and the control device is used for respectively controlling the wind wheel motor, the electromagnetic switch and the semiconductor refrigerating sheet to be opened or closed.

The control device controls the mutual conversion of the positive polarity and the negative polarity of the semiconductor refrigerating sheet by comprising the electromagnetic switch.

The partition plate divides the air duct space.

When the output of the air outlet is hot air, the air guiding device guides cold air.

When the output of the air outlet is cold air, the air guiding device guides out the cold air as hot air.

The utility model has the beneficial effects that the semiconductor air conditioner forms the air duct space with a certain volume between the front end face of the cooling and heating device and the front baffle plate or the front cover plate, the L-shaped air duct is formed between the air inlet and the air duct space, the baffle plate is arranged in the same direction with the arrangement direction of the semiconductor refrigerating sheets, the baffle plate divides the air outlet intersection face of the first heat exchanger and the second heat exchanger to prevent the mutual crosstalk of hot air and cold air, the baffle plate also divides the air duct space, the hot air or cold air in the air duct space on one side is discharged from the air guide port on the other side, the hot air or cold air in the air duct space on the other side is blown out from the air outlet on the other side, the air blown out from the heat exchanger has a certain air pressure, and no obstruction exists in the air duct space, the air can smoothly circulate, the air is rapidly discharged from the air pipe after being pressurized again by the exhaust fan arranged on the shell or in the side air guide port or the upper air guide port, the heat radiation capability of the heat exchanger can be obviously improved, the working efficiency of the semiconductor refrigerating sheet is further improved, the original shape of the side air guide port or the upper air guide port is the air guide port with a shearing and disassembling plate shape, the arrangement of the plurality of multidirectional air guide ports can facilitate a user to select the installation direction and the air guide direction of the semiconductor air conditioner in a room according to different scenes and will, and the upper air guide port can be selectively communicated with an exhaust pipeline which is arranged in the ceiling in advance, so that the concealed air pipe in the room can improve the cleanness and the aesthetic degree of the room.

The structure and the working principle of the first heat exchanger and the second heat exchanger forming the cooling and heating device are the same and are in a modularized structural design, so that the production cost can be reduced, the semiconductor refrigerating sheets are arranged or clamped up and down or left and right according to different air guide openings of different shells, the fin type heat exchanger can more efficiently take away heat energy or cold energy on the heat exchanger through air flow among fins in the heat exchanger, the heat dissipation and cooling functions of the cooling and heating device can be converted by controlling the conversion of the positive polarity and the negative polarity of the semiconductor refrigerating sheets through the included electromagnetic switch, the structural complexity of the semiconductor air conditioner is avoided, the maintenance and use cost of a user is reduced, and the heating and cooling functions of the semiconductor air conditioner using the semiconductor refrigerating sheets are not influenced by the change of the outside air temperature, so that people can obtain better experience.

Drawings

Fig. 1 is a schematic view of a semiconductor air conditioner according to an embodiment of the present utility model, including an upper air guide.

Fig. 2 is a schematic view of a semiconductor air conditioner according to some embodiments of the present utility model, including two upper air guides.

Fig. 3 is a schematic view of a semiconductor air conditioner according to some embodiments of the present utility model, including three upper air guides.

Reference numerals: 1 casing 2 side cover plate 3 front cover plate 4 front baffle plate 5 lower baffle plate 6 air deflector 7 side air deflector 8 upper air deflector 9 air deflector 10 frame mouth 11 air outlet 12 baffle 13 pin hole 14 locating pin 15 exhaust fan 16 air pipe 101 first heat exchanger 102 second heat exchanger 103 semiconductor refrigeration sheet 104 wind wheel 105 wind wheel motor

Detailed Description

A semiconductor air conditioner according to the present utility model will be described in further detail with reference to the accompanying drawings and examples.

Referring to fig. 1 and 2 and 3, a semiconductor air conditioner comprises a cooling and heating device and an air delivery device which are respectively formed by a first heat exchanger 101, a second heat exchanger 102 and a semiconductor refrigerating sheet 103 and are arranged in a shell 1, an air channel space with a certain volume is formed between the front end face of the cooling and heating device and the inner side face of a front cover plate 3 or a front baffle plate 4 and the left and right wall plates and the upper top plate and the lower bottom of the shell 1, air guide openings are arranged on the top plate and/or the corresponding side wall plates at the two ends of the shell at the air channel space, the air channel space between the side air guide openings of the left and right wall plates is smooth, the air guide openings comprise side air guide openings 7 and/or upper air guide openings 8, the original shapes of the air guide openings are all air guide openings with a shearing plate shape so as to facilitate users according to different scenes and wishes, the semiconductor air conditioner is conveniently selected to be installed in the room and guided in the wind direction, the exhaust fan 15 is installed on the wind guide opening for determining the wind direction, as the semiconductor refrigerating sheet 103 has the characteristics of heating and cooling at the same time after being electrified, the two side surfaces of the semiconductor refrigerating sheet 103 which are in interval shape and in the same direction are respectively stuck on the heating bodies of the first heat exchanger 101 and the second heat exchanger 102 which are opposite, the heat energy or the cold energy is respectively transmitted to the corresponding first heat exchanger 101 or the second heat exchanger 102, different wind outlet paths are respectively arranged according to the clamping direction of the heat exchanger which clamps the semiconductor refrigerating sheet 103, the upper and lower shape or the left and right shape, the needed hot wind or the cold wind is blown to the indoor space from the lower wind outlet 11, the proper temperature environment is provided for the room of a user, the unnecessary hot air or cold air passes through the side air guide opening 7 or the exhaust fan 15 in the upper air guide opening 8 to be pressurized again and then is discharged to the outside through the air pipe 16.

Specifically, the first heat exchanger 102 and/or the second heat exchanger 102 are both combined by a metallic heating body and a heat radiator, wherein the heating body comprises a rectangular and cavity-shaped heating body, a side wall body of the cavity-shaped heating body is provided with a plurality of through holes which are distributed at equal intervals and are not less than two rows, pipe openings at the same side end of the plurality of heat conduction U-tubes are distributed at intervals and are connected in series and are attached to through holes in a plurality of fins with a plurality of through holes which are distributed at equal intervals and are not less than two rows, and pipe openings of the plurality of heat conduction U-tubes are respectively and fixedly communicated with through hole openings in the heating body with a plurality of through holes which are distributed at equal intervals and are not less than two rows on the side wall in opposite directions.

In some embodiments, the heating body of the first heat exchanger 102 and/or the second heat exchanger 102 includes a rectangular and cavity-shaped heating body, the tubular bodies of the plurality of spaced heat-conducting straight pipes of no less than two rows are respectively connected in series and attached to the through holes on the fins with the plurality of through holes distributed at equal intervals and no less than two rows, the two end ports of the plurality of heat-conducting straight pipes are respectively and fixedly communicated with the plurality of through hole orifices in the heating body with the plurality of through holes distributed at equal intervals and no less than two rows on the side wall in opposite directions, wherein the heating body, the heat-conducting pipes and the fins are both composed of metal of copper, aluminum or alloy.

Preferably, a heat transfer liquid including a superconducting liquid is filled in the heat transfer pipe body and the heating body to increase the heat transfer efficiency of the first heat exchanger 102 and the second heat exchanger 102.

Preferably, the cross-sectional shapes of the side ends of the first heat exchanger 101 and the second heat exchanger 102 are arc shapes, and the arc shapes are curved towards the wind wheel 104, so as to increase the influence surface of wind blown out by the wind wheel 104 and increase the heat dissipation effect.

In some embodiments, the side end profile shapes of the first heat exchanger 101 and the second heat exchanger 102 are rectangular.

Further, the two first heat exchangers 101 and the outer surfaces of the heating bodies of the second heat exchangers 102 are oppositely arranged, the heating bodies of the first heat exchangers 101 and the second heat exchangers 102 are arranged at intervals between the upper and lower parts, and the upper and lower parts are attached with at least two semiconductor refrigerating sheets 103 to form a cooling and heating device, wherein the hot end surfaces and the cold end surfaces of the at least two refrigerating sheets 103 are respectively arranged in the same direction, and the attached surfaces of the semiconductor refrigerating sheets 103 and the bottom surfaces of the heating bodies are coated with heat-conducting silicone grease to improve the heat conducting efficiency of the heating bodies, and the first heat exchangers 101 and the second heat exchangers 102 are connected together through connecting pieces.

In some embodiments, the first heat exchanger 101 and the second heat exchanger 102 are arranged in a left-right shape, and the two rectangular semiconductor refrigeration sheets 103 are included to form the cooling and heating device.

At this time, the cross-sectional shape of the side ends of the cooling and heating device of the first heat exchanger 101 and the second heat exchanger 102 after sandwiching the semiconductor cooling and heating sheet 103 is an arc shape, and the arc-shaped cooling and heating device is bent toward the wind wheel 104, so as to increase the influence area of the wind blown out by the wind wheel 104 and increase the heat dissipation effect.

In some embodiments, the side end profile shapes of the first heat exchanger 101 and the second heat exchanger 102 are rectangular shapes that include.

When the terminals of the plurality of semiconductor refrigeration sheets 103 in the cooling and heating device pass through or are connected in series or in parallel and direct current is passed through, cold energy is generated at the cold end surface and heat energy is generated at the hot end surface of the semiconductor refrigeration sheets 103, and the heat energy or cold energy is conducted to the fins through the heating body, the heat conduction pipe and the liquid in the heat conduction pipe, so that the first heat exchanger 101 and the second heat exchanger 102 have heat energy or cold energy.

In this embodiment and some embodiments, the semiconductor refrigeration sheet 103 is used to provide heat energy or cold energy for the first heat exchanger 101 and the second heat exchanger 102, because one side of the semiconductor refrigeration sheet generates heat energy and the other side generates cold energy simultaneously, in practical application, people only need to discharge unnecessary heat energy or cold energy by using single energy of the generated heat energy or cold energy, and therefore, an air guide port needs to be arranged on the shell 1 to discharge unnecessary wind from the air guide port according to the requirement.

Referring to fig. 1, a housing 1 comprises a long box-shaped housing 1, wherein the front end surfaces of the left wall plate and the right wall plate are in an included arc shape, an air grid 9 for air intake is arranged on the rear end plate body of a top plate, a frame opening 10 and an air outlet 11 for blowing hot air or cold air to a room are respectively arranged on the front wall plate in an up-down shape, an air outlet device in an air delivery device with one end of an air deflector 6 connected with the shaft end of a reciprocating motor is arranged on the air outlet 11, the air deflector 6 swings back and forth at a certain angle along with the rotation of the reciprocating motor during operation to control the air outlet direction of the air blown to the air guide plate surface, continuous hot air or cold air is provided for the room, and a front cover plate 3 is arranged on the front end wall plate surface of the housing.

It should be noted that, the arc and radian of the front cover plate 3, the air deflector 6 and the front baffle plate 4 are respectively adapted to the arc and radian of the front end port surface of the side wall plate.

Further, a blowing device in the air conveying device is arranged in the shell 1 below the air grid 9, the blowing device comprises a wind wheel motor 105 connected with a wind wheel 104, the wind wheel motor 105 drives the wind wheel 104 to blow the wind entering from the air grid 9 to the semiconductor cooling and heating device according to the instruction, and the wind wheel 104 comprises cross-flow blades, so that the heat radiating surfaces of the transverse heat exchangers can be influenced by the wind blown by the wind wheel 104 to take away the generated heat energy and cold energy.

Specifically, a semiconductor cooling and heating device is arranged in the middle of the shell 1 and at the front end of the wind wheel 104, and a certain volume of air channel space is formed between the front end face of the cooling and heating device and the front wall plate, the left wall plate, the right wall plate, the upper top plate and the lower bottom plate of the shell 1 so as to accommodate hot air and cold air blown out from the cooling and heating device, further, a partition plate 12 which is made of a material with certain thickness, width and length and difficult heat conduction is arranged at the front end face of a semiconductor cooling and heating sheet 103 of the cooling and heating device and is used for isolating the hot air and the cold air, the air channel space is partitioned so as to prevent the mutual crosstalk of the hot air and the cold air blown out from the cooling and heating device, and the two end propping joint surfaces of the partition plate 12 are respectively matched with the arc and the radian of the heat exchanger or the arc and the radian of the front baffle plate 4 or the front cover plate 3 and are in a propping joint shape.

In some embodiments, the partition 12 is rectangular, and the two end abutting surfaces are respectively matched with and abut against the abutting surfaces of the heat exchanger and the front baffle 4 or the front cover plate 3.

Preferably, the front baffle 4 is disposed in the frame opening 10 to increase the sealing performance and heat insulation capability of the frame opening 10 at the front end of the air duct space, and the front end surface of the partition 12 is abutted against the inner side surface of the front baffle 4.

In some embodiments, the front end face of the partition 12 abuts against the inner side face of the front cover plate 3.

Because the uncertainty of the installation position when the semiconductor air conditioner is installed on the wall of a room by a user, and the air conditioner needs to discharge unnecessary or hot air or cold air outside the room, an air guide device consisting of a partition plate 12, an exhaust fan 15 and an air pipe 16 is arranged in an air duct space of a shell 1, side air guide holes 7 with a shearing plate shape are respectively arranged on two side wall plates of the air duct space above the partition plate 12, the shearing plate is connected with the air guide hole plate body through a plurality of interval-shaped connecting ribs, the user can conveniently install the exhaust fan 15 and the air pipe 16 on the side air guide holes 7 after the shearing plate is selected and removed, and the other end of the air pipe 16 is communicated with the outside to discharge the hot air or the cold air in the air duct space to the outside.

In order to increase the aesthetic degree of the air conditioner, a side cover plate 2 is arranged on the outer side face of a side wall plate of a shell 1, the arc and radian of the front end face of the side cover plate 2 are respectively matched with those of the front end face of the side wall plate, a plurality of interval-shaped positioning pins 14 are arranged on the periphery of the inner side plate face of the side cover plate 2 in a circumferential mode, pin holes 13 are respectively arranged on the side wall plate corresponding to the positioning pins 14, the side cover plate 2 is covered on the side wall plate of the shell 1 through the positioning pins 14 to shield a side air guide opening 7, at the moment, the pin holes 13 on the side wall plates on two sides are in a corresponding shape, the positioning pins 14 on the side cover plates 2 on two sides are in an opposite shape, and the side cover plate 2 can facilitate a user to select the air guide direction of the air guide opening according to different scenes or will.

In some embodiments, in order to improve the air guiding capability, the exhaust fans 15 are respectively installed in the side air guiding ports 7 at two sides of the housing 1, and at this time, the exhaust directions of the exhaust fans 15 at two sides are in the same direction, so that the air guiding capability of the semiconductor air conditioner can be greatly improved.

When the room and the outdoor space where the semiconductor air conditioner is installed are blocked or are not suitable for adopting a side air guide mode, the exhaust fan 15 is installed in the upper air guide opening 8 arranged on the top plate at the air duct space, the other end of the air pipe 16 installed on the upper air guide opening 8 is communicated with a reserved exhaust pipeline installed in a suspended ceiling, and hot air or cold air is exhausted to the outside through the exhaust pipeline.

Since the refrigerating effect of the semiconductor refrigerating sheet 103 is related to the heat dissipation capacity of the hot end, the lower the temperature of the hot end is, the lower the temperature of the cold end is, whereas the temperature of the hot end is poor, the cold end has poor temperature, the refrigerating capacity of the cold end is poor and the temperature is high, according to the principle of rising hot air, the air guiding mode of the upper air guide opening 8 is more beneficial to guiding hot air, so that the refrigerating effect of the semiconductor refrigerating sheet 103 is better, and the air guiding mode of the air exhaust pipeline hidden in the suspended ceiling can improve the cleanness and the attractiveness of a room.

Specifically, a control device is arranged in the shell 1 and is respectively and electrically connected with the wind wheel motor 105 and the exhaust fan 15, the semiconductor refrigerating sheet 103, the electromagnetic switch, the air deflector motor and the temperature sensor, and the control device respectively controls the wind wheel motor 105 and the exhaust fan 15, the electromagnetic switch, the semiconductor refrigerating sheet 103 and the air deflector motor to be turned on or turned off, wherein the control device controls the mutual conversion of the positive polarity and the negative polarity of the semiconductor refrigerating sheet 103 through the electromagnetic switch according to a preset program, the temperature sensor arranged in the shell 1 feeds back the temperature change information of a room to the control device, and the control device controls the semiconductor refrigerating sheet 103 to be turned on or turned off after the temperature parameter preset or set by a user is compared with the temperature change information parameter between rooms.

When the semiconductor air conditioner is in a hot air mode, the first heat exchanger 102 at the lower end, which is respectively attached to the semiconductor refrigerating sheet 103, is provided with heat energy, the second heat exchanger 101 at the upper end is provided with cold energy, wind entering from the wind grid 9 is blown to a cold and warm device in operation by the wind wheel 104, the heat energy on the first heat exchanger 102 is taken away and changed into hot wind, the hot wind is discharged from the air outlet 11 through the air duct space, the air deflector 6 swings back and forth to discharge the hot wind into a room, and meanwhile, the cold energy on the second heat exchanger 101 taken away and is changed into cold wind, and the cold wind is discharged to the outside through the air duct space, or the air exhaust pipe 16 of the side air guide 7 or the air exhaust fan 15 in the upper air guide 8, and is discharged to the outside through the air exhaust pipeline in the suspended ceiling.

On the contrary, when the semiconductor air conditioner is in the cold air mode, the control device controls the mutual conversion of the positive and negative polarities of the semiconductor refrigeration sheets 103 through the electromagnetic switch according to the instruction or the pre-stored program, so that the lower first heat exchanger 102 attached to the semiconductor refrigeration sheets 103 respectively has cold energy, the upper second heat exchanger 101 has heat energy, wind entering from the wind grid 9 is blown to the working cooling and heating device through the wind wheel 104, the cold energy on the lower first heat exchanger 102 is taken away and changed into cold air to be discharged from the air outlet 11 through the air duct space, the air deflector 6 swings reciprocally to discharge the cold air into the room, and meanwhile, the heat energy on the upper second heat exchanger 101 is changed into hot air to be discharged to the outside through the air duct space from the air outlet 7 or the air outlet 15 in the upper air guide 8 through the wind pipe 16 or is discharged to the outside through the air discharge pipeline in the suspended ceiling.

It should be noted that, in order to improve the heat conducting capability of the first heat exchanger 101 located at the upper end, preferably, the height of the first heat exchanger 101 is greater than that of the second heat exchanger 102, so that the heat dissipation area of the first heat exchanger 101 is greater than that of the second heat exchanger 102, and since the heat generation amount of the semiconductor refrigerating sheet is greater than the refrigerating amount, the heat dissipation area of the first heat exchanger 101 is large, and the heat dissipation effect is better, the second heat exchanger 102 at the other end can obtain a lower refrigerating temperature at this time, whereas when the second heat exchanger 102 with a small area is located at the hot end surface and dissipates heat, the heat dissipation effect is better because the large heat generation amount of the semiconductor refrigerating sheet can still obtain enough heat energy.

In some embodiments, referring to fig. 2, a semiconductor air conditioner is shown in fig. 1 and 2, and the working mode and working principle of the semiconductor air conditioner are the same, and the difference is that two upper air guide openings 8 corresponding to the heat exchangers are arranged on a top plate, the first heat exchanger 101 and the second heat exchanger 102 are both in a U-shaped heat conduction pipe single-heating type structure, a plurality of spaced semiconductor cooling plates 103 are left and right-shaped in the left and right of the first heat exchanger 101 and the second heat exchanger 102 of the cooling and heating device, a partition plate 12 in the upper and lower shape is arranged on the front end surface of the cooling and heating device at the position where the partition plate 12 is arranged, in order to increase the tightness and heat insulation capability of the frame opening 10, the left and right-shaped arrangement in the frame opening 10 comprises a front baffle plate 4, the front end surface of the partition plate 12 is abutted against the inner side plate surface of the front baffle plate 4, in some embodiments, the front end surface of the partition plate 12 is abutted against the inner side plate of the front cover plate 3 and separates the air duct space, a lateral lower baffle plate 5 comprising the left and right-shaped lower baffle 5 is arranged on the lower end surface of the cooling and heating device, the front end surface of the lower baffle 5 is higher than the air outlet 11, the air guide opening 11 is not affected, the air outlet 11 is arranged on the left side of the air guide opening and the air guide opening 7, the upper air guide opening is arranged in the upper air guide opening space 7 and the upper air guide opening space is arranged in the upper side of the air guide opening space 7, and the upper side of the air guide opening is arranged in the air guide space 7, respectively, and the upper side space is arranged in the upper side of the air guide opening space is arranged.

When a user selects a lateral wind direction when installing a semiconductor air conditioner shown in fig. 2, an exhaust fan 15 and a wind pipe 16 are installed on a lateral wind guide 7 in a selected or left wind guide space or right wind guide space, and a lower wind guide 5 in the opposite position of the lateral wind guide 7 or in the left wind guide space or right wind guide space is taken away, or hot wind or cold wind is blown out through an air outlet 11 in the wind guide space where the lower wind guide 5 is taken away, or the hot wind or the cold wind is discharged outdoors from the selected lateral wind guide 7.

When the user selects the upward wind direction, the exhaust fan 15 and the wind pipe 16 are arranged on the upper wind guide opening 8 in the selected or left wind guide opening space or right wind guide opening space, the lower wind guide opening 5 in the opposite position of the upper wind guide opening 8 or in the left wind guide opening space or right wind guide opening space is taken out, or hot wind or cold wind is blown out through the wind outlet 11 in the wind guide opening space where the lower wind guide opening 5 is taken out, or the hot wind or the cold wind is discharged outdoors from the selected upper wind guide opening 8.

In the semiconductor air conditioner shown in fig. 2, when the lower air deflector 5 in the left air duct space is required to be taken away and is in a hot air mode, the first heat exchanger 101 at the left end, which is respectively attached to the semiconductor refrigerating sheet 103, has heat energy, the second heat exchanger 102 at the right end has cold energy, the wind entering from the air grid 9 is blown to the working cooling and heating device by the wind wheel 104, the heat energy carried away from the first heat exchanger 101 is changed into hot air, the hot air is discharged from the air outlet 11 through the left air duct space, the air deflector 6 swings back and forth to discharge the hot air into the room, and meanwhile, the cold energy carried away from the second heat exchanger 102 at the right end is changed into cold air, and the cold air is discharged outdoors through the wind pipe 16 or the exhaust fan 15 in the side air duct 7 or the upper air duct 8 to be discharged outdoors through the exhaust pipeline including a suspended ceiling.

On the contrary, when the semiconductor air conditioner is in the cold air mode, the control device controls the mutual conversion of the positive and negative polarities of the semiconductor refrigeration sheets 103 through the electromagnetic switch according to the instruction or the pre-stored program, so that the left-end first heat exchanger 101 attached to the semiconductor refrigeration sheets 103 respectively has cold energy, the right-end second heat exchanger 102 has heat energy, wind entering from the wind grid 9 is blown to the working cooling and heating device through the wind wheel 104, the cold energy on the left-end first heat exchanger 101 is taken away and changed into cold air to be discharged from the air outlet 11 through the left air channel space, the air deflector 6 swings reciprocally to discharge the cold air into the room, and meanwhile, the heat energy on the right-end second heat exchanger 102 is taken away and changed into hot air to be discharged outdoors through the right air channel space from the air outlet 7 or the exhaust fan 15 in the upper air guide 8 through the wind pipe 16 or is discharged outdoors through the exhaust pipeline comprising a suspended ceiling.

In some embodiments, referring to fig. 3, a semiconductor air conditioner is shown in fig. 1, 2 and 3, and the working mode and working principle of the semiconductor air conditioner are the same, except that three upper air guide ports 8 corresponding to heat exchangers are respectively arranged on a top plate, a first heat exchanger 101 is of a direct heat pipe double-heating type structure, a second heat exchanger 102 is of an included U heat pipe single-heating type structure, the second heat exchangers 102 of the cooling and heating device are respectively arranged at two side ends of the first heat exchanger 101, a plurality of semiconductor refrigerating sheets 103 are respectively arranged at left and right sides of a heating body end of the second heat exchanger 102 and opposite to a heating body on the first heat exchanger 101 in a left and right side, a partition plate 12 is respectively arranged at the front end face of the cooling and heating device at the clamping position in an upper and lower side, in order to increase the sealing property and the heat insulation capability of a frame opening 10, the left-middle-right-shaped arrangement in the frame opening 10 comprises a front baffle 4, the front end surface of a baffle 12 is abutted with the inner side plate surface of the front baffle 4, in some embodiments, the front end surface of the baffle 12 is abutted with the inner side plate surface of the front cover plate 3 and separates the air duct space, the lower end surface of the cooling and heating device is provided with a transverse lower baffle 5 comprising the left-middle-right-shaped arrangement, the front end surface of the lower baffle 5 is higher than an air outlet 11 air outlet, the air outlet of the air outlet 11 is not influenced, the lower baffle 5 and the baffle 12 jointly separate the air duct space into a left air duct space, an air duct space and a right air duct space, side air guide openings 7 are respectively arranged on side wall plates in the left air duct space and the right air duct space, and left upper air guide openings 8 and right upper air guide openings 8 are respectively arranged on top plates of the left air duct space and the right air duct space.

When a user selects a side air guiding direction when installing and using the semiconductor air conditioner shown in fig. 3, the exhaust fan 15 and the air duct 16 are respectively installed on the side air guiding ports 7 in the left air duct space and the right air guiding space, and the lower air guiding plate 5 in the middle air duct space is taken away, or hot air or cold air is blown out from the air outlet 11 through the middle air duct space, or the hot air or the cold air is respectively discharged to the outside from the side air guiding ports 7 in the left air duct space and the right air duct space at two sides.

When a user selects the upper wind direction, an exhaust fan 15 and an air pipe 16 are arranged at the left upper wind guide 8 and the right upper wind guide 8, when the lower wind guide 5 in the middle wind channel space is taken out, or hot air or cold air is blown out from the air outlets 11 at the middle wind channel space, or hot air or cold air is respectively discharged outdoors from the left upper wind guide 8 and the right upper wind guide 8 in the left wind channel space and the right wind channel space at two sides, or when the exhaust fan 15 and the air pipe 16 are arranged at the middle upper wind guide 8, the lower wind guide 5 in the left wind channel space and the right wind channel space is taken out, or hot air or cold air is blown out from the upper wind guide 8 in the left wind channel space and the right wind channel space, or hot air or cold air is discharged outdoors from the upper wind guide 8 in the middle wind channel space.

When a semiconductor air conditioner shown in fig. 3 is left air guide and right air guide, and the air passage space is an air outlet, the middle lower wind shield 5 is removed, and the semiconductor air conditioner is in a hot air mode, and the first heat exchanger 101 is a hot end and the second heat exchanger 102 is a cold end, at this time, the mounting surfaces of the left and right semiconductor refrigerating sheets 103 and the first heat exchanger 101 are hot end surfaces, the mounting surfaces of the semiconductor refrigerating sheets are both cold end surfaces, the first heat exchanger 101 respectively mounted with the semiconductor refrigerating sheets 103 is provided with heat energy, the second heat exchanger 102 is provided with cold energy, the air entering from the air grid 9 is blown to the cold and warm device in operation by the wind wheel 104, the heat energy on the first heat exchanger 101 is changed into hot air to be discharged from the air outlet 11 through the air passage space, the air guide plate 6 swings reciprocally to discharge the hot air into the room, and simultaneously, the cold energy on the second heat exchangers 102 at both ends is changed into cold energy on the cooling air passage spaces to be discharged from the side air guide 7 through the left air passage space and the exhaust fan 15 in the right air guide 7 to the outside through the air duct 16.

On the contrary, when the semiconductor air conditioner is in the cold air mode, the control device controls the mutual conversion of the positive and negative polarities of the semiconductor refrigeration piece 103 through the electromagnetic switch according to the instruction or the pre-stored program, so that the left first heat exchanger 102 and the right first heat exchanger 102 respectively attached to the semiconductor refrigeration piece 103 have heat energy, the first heat exchanger 101 has cold energy, wind entering from the wind grid 9 is blown to the working cooling and heating device through the wind wheel 104, the cold energy on the first heat exchanger 101 is taken away to be changed into cold air to be discharged from the air outlet 11 through the wind channel space, the wind deflector 6 swings reciprocally to discharge the cold air into the room, and meanwhile, the heat energy on the second heat exchanger 102 taken away at the left end and the right end is changed into hot air to be discharged to the outside through the wind pipe 16 through the side wind guide 7 of the left wind channel space and the exhaust fan 15 in the wind guide 7 of the right wind channel space.

In the case that the semiconductor air conditioner shown in fig. 3 is an upper left air guide 8 and an upper right air guide 8 in an upper air guide mode, the middle and lower wind baffles 5 are taken away, and when the first heat exchanger 101 is in a hot air mode and the second heat exchanger 102 is in a cold end, at this time, the surface of the semiconductor refrigeration sheet 103 which is clamped left and right is a hot end surface and the surface of the second heat exchanger 102 is a cold end surface, the first heat exchanger 101 which is respectively attached to the semiconductor refrigeration sheet 103 has heat energy, the second heat exchanger 102 has cold energy, the wind entering from the wind grid 9 is blown to the cold and hot device in operation by the wind wheel 104, the heat energy on the first heat exchanger 101 is taken away to be changed into the hot wind to be discharged from the air outlet 11 through the middle wind channel space, the wind guide 6 swings reciprocally to be discharged indoors, and at the same time, the cold energy on the second heat exchanger 102 taken away both ends is changed into the cold energy on the left wind channel space to be discharged from the upper wind guide 8 through the left wind channel space and the cold wind channel space to the outside through the air outlet 15 or the air outlet pipe to the outside through the air outlet 16.

On the contrary, when the semiconductor air conditioner is in the cold air mode, the control device controls the mutual conversion of the positive and negative polarities of the semiconductor refrigeration piece 103 through the electromagnetic switch according to the instruction or the pre-stored program, so that the left first heat exchanger 102 and the right first heat exchanger 102 respectively attached to the semiconductor refrigeration piece 103 have heat energy, the first heat exchanger 101 has cold energy, wind entering from the wind grid 9 is blown to the working cooling and heating device through the wind wheel 104, the cold energy on the first heat exchanger 101 is taken away to be changed into cold air to be blown out from the air outlet 11 through the wind channel space, the wind deflector 6 swings reciprocally to discharge the cold air indoors, and meanwhile, the heat energy on the second heat exchanger 102 taken away at the left end and the right end is changed into hot air to be discharged outdoors through the wind pipe 16 through the upper wind guide 8 of the left wind channel space and the exhaust fan 15 in the upper wind guide 8 of the right wind channel space.

In the case that the semiconductor air conditioner is shown in fig. 3 and is in an upper air guiding mode, the middle air guiding port 8 is used for guiding air, the left air channel space and the right air channel space are air outlets, the left lower air guiding plate 5 and the right lower air guiding plate 5 are taken away, and are in a hot air mode, and the second heat exchanger 102 is in a hot air mode and is in a cold end, at the moment, the mounting surface of the left-right-shaped semiconductor refrigerating sheet 103 and the first heat exchanger 101 is a cold end surface, the mounting surface of the second heat exchanger 102 is a hot end surface, the first heat exchanger 101 respectively mounted with the semiconductor refrigerating sheet 103 is provided with cold energy, the second heat exchanger 102 is provided with heat energy, the air entering from the air grid 9 is blown to a cold and hot device in operation by the wind wheel 104, the heat energy on the second heat exchangers 102 at two ends is taken away is changed into the air outlet 11 through the left air channel space and the right air channel space, the air guiding plate 6 swings reciprocally to discharge the hot air into the indoor, and at the same time, the cold energy on the first heat exchanger 101 is taken away into the cold air channel space to be discharged from the air inlet 8 through the cold air channel space through the fan 16 or the air channel 16 to the outdoor through the air channel and the outdoor air channel and the air channel is discharged from the outdoor to the outdoor through the ceiling.

On the contrary, when the semiconductor air conditioner is in the cold air mode, the control device controls the mutual conversion of the positive and negative polarities of the semiconductor refrigeration piece 103 through the electromagnetic switch according to the instruction or the pre-stored program, so that the left first heat exchanger 102 and the right first heat exchanger 102 respectively attached to the semiconductor refrigeration piece 103 have cold energy, the first heat exchanger 101 has heat energy, wind entering from the wind grid 9 is blown to the working cooling and heating device through the wind wheel 104, the cold energy on the second heat exchanger 102 is taken away to be changed into cold wind to be blown out from the air outlet 11 through the left wind channel space and the right wind channel space, the wind deflector 6 swings reciprocally to discharge the hot wind into the room, and meanwhile, the heat energy on the first heat exchanger 102 is taken away to be changed into hot wind to be discharged outdoors through the exhaust fan 15 in the upper wind guide 8 of the wind channel space through the wind pipe 16 or discharged outdoors through the exhaust pipeline comprising the suspended ceiling.

In some embodiments, the lower baffle 5 of the semiconductor air conditioner shown in fig. 1, 2 and 3 comprises a microporous water absorbing plate and a lower baffle 5 made of a high-temperature-resistant, low-temperature-resistant, deformation-resistant and water absorbing functional material with certain strength, and is spaced from a bottom plate, the plate body comprises a plurality of micropores for receiving condensed water dropped on the cold-end heat exchanger, the condensed water permeates into the plate body through the micropores, moisture in the plate body is taken away by air flow blowing over the plate body, the moisture is blown outdoors through an upper space of the lower baffle 5 and is blown indoors through a lower space of the lower baffle 5, wherein in fig. 1, the lower baffle 5 is transversely arranged on the lower end surface of the heat exchanger and does not influence the blowing of wind from the air outlet 11.

In fig. 1, when the cold-end heat exchanger is above the hot-end heat exchanger, the condensed water produced on the cold-end heat exchanger drops on the hot-end heat exchanger, the heat energy on the hot-end heat exchanger absorbs and evaporates the condensed water and then is taken away by the blown air flow, whereas when the hot-end heat exchanger is above the cold-end heat exchanger, the condensed water drops spread on the lower baffle 5 and slowly blow into the room without generating accumulated water, and in the same way, when the hot-end heat exchanger and the cold-end heat exchanger are transversely arranged, the lower wind baffle 5 in the corresponding air duct space is taken away according to the difference of the wind direction, or after the hot air mode and the cold air mode are mutually converted, the condensed water is blown into the room and/or discharged out of the room, which is not described in detail.

It should be noted that the above-mentioned embodiments and some embodiments of the present utility model are not intended to limit the present utility model, and it will be apparent to those skilled in the art that various modifications, equivalent substitutions, improvements, etc. can be made without departing from the principles of the present utility model, and all the embodiments belong to the scope of the present utility model.

Claims

1. A semiconductor air conditioner, comprising:

The semiconductor air conditioner comprises a cooling and heating device and an air conveying device, wherein the cooling and heating device and the air conveying device are composed of a first heat exchanger, a second heat exchanger and semiconductor refrigerating sheets and are respectively arranged in a shell, the shell is provided with at least two air guide openings, and each air guide opening comprises a side air guide opening and/or an upper air guide opening.

2. The semiconductor air conditioner according to claim 1, wherein the first heat exchanger and the second heat exchanger each comprise a heating body, a heat conduction pipe and a fin, and a plurality of semiconductor refrigerating sheets are arranged between the heating bodies of the first heat exchanger and the second heat exchanger, the heating bodies are in a cavity shape,

The heat conducting pipe comprises a heat conducting straight pipe or a heat conducting U pipe, the heating body, the heat conducting pipe and the fins are all composed of metal of copper, aluminum or alloy, and heat conducting liquid is filled in the heating body and the heat conducting pipe.

3. The semiconductor air conditioner according to claim 1, wherein the shell comprises a cover plate, a baffle plate, an air guide plate, an air inlet, an air outlet and a partition plate, the air inlet comprises an air grid, the cover plate comprises a front cover plate and/or a side cover plate, the baffle plate comprises a front baffle plate and/or a lower baffle plate, the air guide plate comprises an exhaust fan and an air pipe, the air guide plate is arranged at the air outlet, and the lower baffle plate comprises a microporous water absorbing plate.

4. The semiconductor air conditioner according to claim 1, wherein the air delivery device comprises an air blowing device, an air outlet device and an air guiding device, the air blowing device comprises a wind wheel and a wind wheel motor and is arranged at the rear end of the cooling and heating device, the air outlet device comprises an air guiding plate connected with a reciprocating motor and is arranged at an air outlet, and the air guiding device comprises a partition plate, the air guiding plate, an exhaust fan, an air pipe and is arranged at the front end of the cooling and heating device.

5. The semiconductor air conditioner of claim 1, wherein the first heat exchanger is a hot side heat exchanger, the second heat exchanger is a cold side heat exchanger, or the first heat exchanger is a cold side heat exchanger, and the second heat exchanger is a hot side heat exchanger.

6. The semiconductor air conditioner according to claim 2, wherein the semiconductor cooling sheet is sandwiched between the corresponding surfaces of the heating bodies of the first heat exchanger and the second heat exchanger in a left-right or up-down shape, and a partition plate in a front end surface of the semiconductor cooling sheet in a top-down or left-right or up-down shape is provided.

7. A semiconductor air conditioner according to claim 3 wherein said side cover plate arrangement includes locating pins and is covered on said housing side wall plate.

8. The semiconductor air conditioner according to claim 1, wherein an air duct space is formed between the front end face of the cooling and heating device and the front cover plate or the front baffle plate of the shell, the air guide opening is arranged on a top plate and/or side wall plates corresponding to two ends of the shell of the air duct space, and the air guide opening comprises a shear plate.

9. The semiconductor air conditioner according to claim 1, wherein the housing comprises a control device, the control device is respectively and electrically connected with a wind wheel motor and an exhaust fan which are arranged on the housing, a semiconductor refrigerating sheet, an electromagnetic switch and a temperature sensor, and the control device respectively controls the wind wheel motor, the exhaust fan, the electromagnetic switch and the semiconductor refrigerating sheet to be turned on or off, and the control device controls the mutual conversion of the positive polarity and the negative polarity of the semiconductor refrigerating sheet by comprising the electromagnetic switch.

10. A semiconductor air conditioner according to claim 3, wherein when the air outlet output is hot air, the air guide outlet guides cold air, or when the air outlet output is cold air, the air guide outlet guides hot air.