CN221079961U - Special guide piece device for semiconductor wafer acid etching machine - Google Patents
Special guide piece device for semiconductor wafer acid etching machine Download PDFInfo
- Publication number
- CN221079961U CN221079961U CN202322669878.1U CN202322669878U CN221079961U CN 221079961 U CN221079961 U CN 221079961U CN 202322669878 U CN202322669878 U CN 202322669878U CN 221079961 U CN221079961 U CN 221079961U
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- Prior art keywords
- guide piece
- roller
- groove
- acid etching
- semiconductor wafer
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- 238000005530 etching Methods 0.000 title claims abstract description 26
- 239000002253 acid Substances 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 48
- 238000000034 method Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a special guide piece device for a semiconductor wafer acid etching machine, which relates to the technical field of semiconductor acid etching and comprises a guide piece groove and a guide piece assembly arranged in the guide piece groove, wherein the guide piece groove comprises a groove body and a supporting table arranged in the groove body, the bottom of the groove body is provided with a liquid inlet structure, and the side wall of the groove body is provided with a liquid discharge structure; the top of the supporting table is provided with a positioning pin shaft, and the bottom of the supporting table is provided with a rotating shaft for driving the supporting table to act; the guide piece assembly comprises a base, and a support, a transfer box and a roller structure which are arranged on the base, wherein a plurality of locating pin shaft holes which are used for being matched and connected with the locating pin shafts are formed in the base, the support is used for supporting a wafer accommodating structure, the transfer box and the roller structure are sequentially arranged, grooves are formed in the transfer box, and the grooves are correspondingly formed in the wafer accommodating structure and the grooves in the roller structure. The utility model has the beneficial effects of effectively solving the problem of wafer corrosion leakage and ensuring simple replacement.
Description
Technical Field
The utility model relates to the technical field of semiconductor acid corrosion, in particular to a guide vane device special for a semiconductor wafer acid corrosion machine.
Background
In the semiconductor industry, acid etching is a very important process in the processing of silicon wafers.
The acid etching equipment utilizes an etchant to enable the silicon wafer which is ground and cleaned to perform electrochemical reaction with the etchant, so that the purpose of etching away a damaged layer on the surface of the silicon wafer or chemically thinning the silicon wafer is achieved, and the surface and geometric parameters of the silicon wafer reach a certain standard by controlling etching conditions so as to meet the use requirements of customers.
The acid etching process requires a special roller to ensure uniform etching of the wafer, and a special guide device to ensure complete entry of the wafer into the roller.
The conventional guide device is characterized in that wafers in a wafer basket are led into a roller by means of an air cylinder and gravity, the wafers are clamped in the guide device in the guide process, the clamped wafers are prevented from being corroded, and the guide device and a guide groove are generally fixedly connected through bolts, so that the problem of low efficiency in replacement exists.
Disclosure of utility model
The utility model aims to provide a guide device special for a semiconductor wafer acid etching machine, which aims to solve the technical problems that the prior guide device in the prior art is used for guiding wafers in a wafer basket into a roller by means of an air cylinder and gravity, the clamped wafers are corroded due to leakage of the clamped wafers caused by clamping the wafers in the guide process, and the guide device is generally fixedly connected with a guide groove through bolts, so that the efficiency is low in replacement. The preferred technical solutions of the technical solutions provided by the present utility model can produce a plurality of technical effects described below.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a special guide piece device for a semiconductor wafer acid etching machine, which comprises a guide piece groove and a guide piece assembly arranged in the guide piece groove, wherein the guide piece assembly comprises a guide piece assembly body, a guide piece assembly body and a guide piece assembly body, wherein the guide piece assembly body is arranged in the guide piece groove, and the guide piece assembly body comprises a guide piece assembly body, wherein the guide piece assembly body comprises a guide piece assembly body and a guide piece assembly body, and the guide piece assembly body comprises a guide piece assembly body:
The guide piece groove comprises a groove body and a supporting table arranged in the groove body, wherein a liquid inlet structure is arranged at the bottom of the groove body, and a liquid discharge structure is arranged on the side wall of the groove body; the top of the supporting table is provided with a positioning pin shaft, and the bottom of the supporting table is provided with a rotating shaft for driving the supporting table to act;
The guide piece assembly comprises a base, a support, a transfer box and a roller structure, wherein the support, the transfer box and the roller structure are arranged on the base, a plurality of locating pin holes are formed in the base and are used for being connected with the locating pin shafts in a matched mode, the support is used for supporting a wafer accommodating structure, the transfer box and the roller structure are sequentially arranged, grooves are formed in the transfer box, and the grooves are correspondingly formed in the wafer accommodating structure and the grooves in the roller structure.
Preferably, the guide vane assembly further comprises a fixed cover, wherein:
One end of the fixed cover is hinged to the transfer box, and the other end cover of the fixed cover is arranged on the wafer accommodating structure.
Preferably, the roller structure comprises a roller, a roller bracket for supporting the roller, and a mounting plate, wherein:
The roller bracket is connected to the mounting plate;
The base is provided with a sliding rail, and the mounting plate is provided with a sliding block in sliding connection with the sliding rail.
Preferably, a first bar-shaped hole is formed in the mounting plate, and the roller support is connected into the first bar-shaped hole through a connecting piece.
Preferably, the liquid inlet structure adopts an overflow liquid inlet pipe, and a plurality of overflow liquid inlet holes are arranged on the liquid inlet pipe.
Preferably, the liquid draining structure adopts an overflow liquid draining groove, and a liquid draining pipeline communicated with a sewer pipeline is arranged in the overflow liquid draining groove.
Preferably, a second bar-shaped hole is formed in the base, and the support is connected to the second bar-shaped hole through a connecting piece.
Preferably, the transfer box is made of transparent materials.
The utility model provides a special guide piece device for a semiconductor wafer acid etching machine, which comprises a guide piece groove and a guide piece assembly arranged in the guide piece groove, wherein the guide piece action is performed in the guide piece groove, the guide piece assembly comprises a groove body and a supporting table arranged in the groove body, the guide piece assembly comprises a base, a bracket arranged on the base, a transfer box and a roller structure, the bracket is used for supporting a wafer accommodating structure, the transfer box and the roller structure are sequentially arranged, a groove is arranged in the transfer box, the groove is correspondingly arranged with the grooves in the wafer accommodating structure and the roller structure and is used for guiding a wafer, and the wafer is prevented from being blocked in the guide piece process. Through setting up the locating pin axle at the top of brace table to set up a plurality of locating pin axle holes that are used for being connected with the locating pin axle cooperation on the base, be convenient for according to the difference of production product, change different guide vane subassembly, can effectively solve the wafer and leak the corruption problem and can guarantee simple and easy change.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the structure of a guide groove in a guide device special for a semiconductor wafer acid etching machine according to the present utility model;
FIG. 2 is a schematic view of the structure of a guide assembly in a guide apparatus for a semiconductor wafer acid etching machine according to the present utility model;
FIG. 3 is a schematic top view of FIG. 2;
FIG. 4 is a schematic view of the structure of FIG. 2 at another angle;
Fig. 5 is a schematic view of the structure of fig. 2 at another angle.
In the figure: 1. a guide groove; 10. a tank body; 11. a support table; 12. a liquid inlet structure; 120. overflow liquid inlet hole; 13. a liquid discharge structure; 14. positioning pin shafts; 15. a rotation shaft;
2. A guide vane assembly; 20. a base; 201. positioning pin shaft holes; 202. a slide rail; 203. a second bar-shaped hole; 21. a bracket; 22. a transfer box; 23. a roller structure; 230. a roller; 231. a roller bracket; 232. a mounting plate; 2320. a first bar-shaped hole; 233. a slide block; 24. a wafer receiving structure; 25. and fixing the cover.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, based on the examples herein, which are within the scope of the utility model as defined by the claims, will be within the scope of the utility model as defined by the claims.
The utility model provides a special guide piece device for a semiconductor wafer acid etching machine, which comprises a guide piece groove 1 and a guide piece assembly 2 arranged in the guide piece groove 1.
Fig. 1 is a schematic structural diagram of a guide groove in the present embodiment, as shown in fig. 1, the guide groove 1 includes a groove body 10 and a supporting table 11 disposed in the groove body 10, a liquid inlet structure 12 is disposed at the bottom of the groove body 10, a liquid discharge structure 13 is disposed on a side wall of the groove body 10, the groove body 10 in the present embodiment is a square groove body made of PVC plates, and the guide action is performed in the groove body 10.
The top of supporting bench 11 sets up locating pin axle 14, and the bottom of supporting bench 11 sets up the rotation axis 15 that is used for driving supporting bench 11 action, and supporting bench 11 is used for carrying out effectual support to guide piece subassembly 2 to drive guide piece subassembly 2 action, rotation axis 15 passes through relay control cylinder action, and cylinder control rotation axis 15 motion drives supporting bench 11, and then drives the guide piece subassembly 2 action on the supporting bench, reaches the guide piece effect.
Fig. 2 is a schematic structural view of the guide vane assembly in the present embodiment, fig. 3 is a schematic structural view from above in fig. 2, and as shown in fig. 2 and 3, the guide vane assembly 2 includes a base 20, a bracket 21 disposed on the base 20, a transfer box 22, and a roller structure 23. The support 21 is used for supporting the wafer accommodating structure 24, the transfer box 22 and the roller structure 23 are sequentially arranged, a groove is formed in the transfer box 22, the groove corresponds to the groove in the wafer accommodating structure 24 and the groove in the roller structure 23, and the support is used for guiding wafers and can ensure that the wafers are not blocked in the wafer guiding process.
The guide sheet process is as follows: the operator installs the wafer holding structure 24 with the wafer on the support 21, presses the start button, and the cylinder control rotation axis 15 motion of this moment drives guide piece subassembly 2 action, makes the wafer roll into roller structure 23 through gravity effect to reach the guide piece effect.
In this embodiment, the base 20 is provided with a plurality of positioning pin holes 201 for being cooperatively connected with the positioning pins 14 for positioning and fixing the guide assembly. When the acid etching machine is used, the guide piece groove 1 is fixed near the acid etching machine, the guide piece assembly 2 is arranged in the guide piece groove 1, and different guide piece assemblies 2 can be replaced according to different products. Because the guide piece assembly 2 and the guide piece groove 1 are matched and connected with the positioning pin shaft hole 201 through the positioning pin shaft 14, the guide piece assembly 2 can be vertically taken by a single person during replacement, and a new guide piece assembly 2 is put in again, namely, the positioning pin shaft hole 201 on the base 20 of the new guide piece assembly 2 is placed at the positioning pin shaft 14, so that the positioning pin shaft 14 is inserted into the positioning pin shaft hole 201, and the replacement can be completed.
As an alternative embodiment, as shown in fig. 2-5, the guide assembly 2 further includes a fixing cover 25, where the fixing cover 25 is mainly used to fix the wafer accommodating structure 24, so as to ensure that the wafer accommodating structure 24 does not move during the guide process.
Specifically, in the present embodiment, one end of the fixed cover 25 is hinged to the transfer box 22, and the other end of the fixed cover 25 is disposed on the wafer accommodating structure 24.
As an alternative embodiment, the drum structure 23 includes a drum 230, a drum bracket 231 for supporting the drum 230, and a mounting plate 232.
The roller bracket 231 is connected to the mounting plate 232, the mounting plate 232 is located at the bottom of the roller bracket 231, and the roller bracket 231 is mainly used for supporting the roller 230 and ensuring alignment of the roller 230 and the transfer box 22, so as to ensure smooth guiding.
The base 20 is provided with a sliding rail 202, and the mounting plate 232 is provided with a sliding block 233 in sliding connection with the sliding rail 202. After the guide, the slider 233 drives the mounting plate 232 and further drives the roller support 231 on the mounting plate 232 to move, so that the wafer is completely guided into the roller 230.
In this embodiment, the sliding rails 202 disposed on the base 20 include two groups, which are respectively located at two sides of the base 20, the sliding blocks 233 are disposed at the bottom of the mounting plate 232 and located at two sides of the mounting plate 232, and the two groups of sliding blocks 233 respectively cooperate with the corresponding sliding rails 202 to slide, so as to ensure stability during use.
Specifically, the mounting plate 232 is provided with a first bar-shaped hole 2320, and the drum bracket 231 is connected to the inside of the first bar-shaped hole 2320 through a connection member. In this embodiment, the connecting member is a screw, and by providing a long bar hole on the mounting plate 232, the position of the roller bracket 231 in the first bar hole 2320 can be adjusted to ensure that the groove of the roller 230 is aligned with the groove of the transfer box 22 and the wafer accommodating structure 24.
As an alternative embodiment, the liquid inlet structure 12 adopts an overflow liquid inlet pipe, and a plurality of overflow liquid inlet holes 120 are arranged on the liquid inlet pipe, so that water flows into the tank body 10 through the overflow liquid inlet holes 120 positioned above, and the overflow liquid inlet pipe is used for overflowing water into the tank body 10 of the guide vane groove 1.
As an alternative embodiment, the drain structure 13 adopts an overflow drain tank, and a drain pipeline communicated with a sewer pipeline is arranged in the overflow drain tank.
Specifically, the overflow drain adopts a rectangular water tank, and a drain pipe is arranged in the overflow drain and is communicated with a sewer pipe, and the overflow drain is mainly used for pure water overflow drain.
As an alternative embodiment, the base 20 is provided with a second bar-shaped hole 203, and the bracket 21 is connected to the second bar-shaped hole 203 through a connecting member. In this embodiment, the connecting piece adopts the screw, through setting up the bar slot hole on the base 20, the bar slot hole that sets up on the cooperation mounting panel 232 can be through adjusting the position that support 21 connects in second bar hole 203, and the cooperation adjusts the position that roller support 231 connects in first bar hole 2320 and ensures that the recess of cylinder 230 aligns with the recess of transfer box 22, wafer accommodation structure 24.
As an alternative embodiment, the transfer box 22 is made of transparent material. In this embodiment, the transfer box 22 is made of transparent PVC, and if the problem of wafer jamming occurs during the guide sheet process, the transfer box 22 is made of transparent PVC, so that the operator can find out and process the transfer box in time to ensure smooth guide sheet processing.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (8)
1. The utility model provides a special guide piece device of semiconductor wafer acid etching machine which characterized in that includes the guide piece groove and installs in the guide piece subassembly in the guide piece inslot, wherein:
The guide piece groove comprises a groove body and a supporting table arranged in the groove body, wherein a liquid inlet structure is arranged at the bottom of the groove body, and a liquid discharge structure is arranged on the side wall of the groove body; the top of the supporting table is provided with a positioning pin shaft, and the bottom of the supporting table is provided with a rotating shaft for driving the supporting table to act;
The guide piece assembly comprises a base, a support, a transfer box and a roller structure, wherein the support, the transfer box and the roller structure are arranged on the base, a plurality of locating pin holes are formed in the base and are used for being connected with the locating pin shafts in a matched mode, the support is used for supporting a wafer accommodating structure, the transfer box and the roller structure are sequentially arranged, grooves are formed in the transfer box, and the grooves are correspondingly formed in the wafer accommodating structure and the grooves in the roller structure.
2. The guide vane device special for a semiconductor wafer acid etching machine as claimed in claim 1, wherein: the guide vane assembly further comprises a fixed cover, wherein:
One end of the fixed cover is hinged to the transfer box, and the other end cover of the fixed cover is arranged on the wafer accommodating structure.
3. A semiconductor wafer acid etching machine specific guide sheet apparatus according to claim 1 or 2, wherein the roller structure comprises a roller, a roller bracket for supporting the roller, and a mounting plate, wherein:
The roller bracket is connected to the mounting plate;
The base is provided with a sliding rail, and the mounting plate is provided with a sliding block in sliding connection with the sliding rail.
4. A guide vane device special for a semiconductor wafer acid etching machine as claimed in claim 3, wherein the mounting plate is provided with a first strip-shaped hole, and the roller support is connected in the first strip-shaped hole through a connecting piece.
5. A semiconductor wafer acid etching machine-specific guide sheet apparatus according to claim 1 or 2, characterized in that: the liquid inlet structure adopts an overflow liquid inlet pipe, and a plurality of overflow liquid inlet holes are arranged on the liquid inlet pipe.
6. A semiconductor wafer acid etching machine-specific guide sheet apparatus according to claim 1 or 2, characterized in that: the liquid draining structure adopts an overflow liquid draining groove, and a liquid draining pipeline communicated with a sewer pipeline is arranged in the overflow liquid draining groove.
7. A semiconductor wafer acid etching machine-specific guide sheet apparatus according to claim 1 or 2, characterized in that: the base is provided with a second strip-shaped hole, and the bracket is connected into the second strip-shaped hole through a connecting piece.
8. A semiconductor wafer acid etching machine-specific guide sheet apparatus according to claim 1 or 2, characterized in that: the transfer box is made of transparent materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322669878.1U CN221079961U (en) | 2023-10-07 | 2023-10-07 | Special guide piece device for semiconductor wafer acid etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322669878.1U CN221079961U (en) | 2023-10-07 | 2023-10-07 | Special guide piece device for semiconductor wafer acid etching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221079961U true CN221079961U (en) | 2024-06-04 |
Family
ID=91256493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322669878.1U Active CN221079961U (en) | 2023-10-07 | 2023-10-07 | Special guide piece device for semiconductor wafer acid etching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221079961U (en) |
-
2023
- 2023-10-07 CN CN202322669878.1U patent/CN221079961U/en active Active
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