CN219868251U - Heat abstractor and air conditioning system - Google Patents
Heat abstractor and air conditioning system Download PDFInfo
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- CN219868251U CN219868251U CN202320861193.4U CN202320861193U CN219868251U CN 219868251 U CN219868251 U CN 219868251U CN 202320861193 U CN202320861193 U CN 202320861193U CN 219868251 U CN219868251 U CN 219868251U
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- heat
- semiconductor refrigeration
- refrigeration module
- liquid
- compressor
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- 238000004378 air conditioning Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 74
- 239000004065 semiconductor Substances 0.000 claims abstract description 56
- 238000005057 refrigeration Methods 0.000 claims abstract description 52
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 21
- 238000000034 method Methods 0.000 description 9
- 230000005494 condensation Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000026058 directional locomotion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device and an air conditioning system, and aims to solve the problem that heat dissipation of a compressor is affected due to the arrangement of a noise reduction structure when the existing compressor operates. For this purpose, the heat dissipating device of the present utility model comprises: a supercharging device; one end of the liquid passing pipeline is connected with the input end of the pressurizing device, the other end of the liquid passing pipeline is connected with the output end of the pressurizing device, and the liquid passing pipeline and the pressurizing device form a circulating liquid path system; and the semiconductor refrigeration module is provided with a cold end and a hot end which are opposite, the liquid passing pipeline is partially attached to the cold end of the semiconductor refrigeration module, and the liquid passing pipeline can be partially attached to a heat source to be cooled, so that the heat source exchanges heat with the semiconductor refrigeration module through the liquid passing pipeline. The utility model adopts a mode of combining liquid path circulation and a semiconductor refrigeration module to cool the compressor, and meets the heat dissipation requirement on the basis of realizing noise reduction.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, and particularly provides a heat dissipation device and an air conditioning system.
Background
At present, in an air conditioning system, a large amount of noise is generated when a compressor runs, and for a household air conditioner, the compressor is generally placed outdoors so as to reduce the influence caused by the noise, but for application occasions such as a computer room data center, the compressor needs to be placed indoors.
For the indoor scene of the compressor, in order to reduce the noise of the compressor, a physical noise reduction structure is generally added to the outer side of the compressor, but in this way, the heat dissipation of the compressor is affected due to the noise reduction structure wrapping the outer side of the compressor.
Accordingly, there is a need in the art for a new solution to the above-mentioned problems.
Disclosure of Invention
The utility model aims to solve the technical problems, namely, the problem that the heat dissipation of the compressor is affected due to the arrangement of the noise reduction structure when the existing compressor operates.
In a first aspect, the present utility model provides a heat dissipating device comprising:
a supercharging device;
one end of the liquid passing pipeline is connected with the input end of the pressurizing device, the other end of the liquid passing pipeline is connected with the output end of the pressurizing device, and the liquid passing pipeline and the pressurizing device form a circulating liquid path system; and
the semiconductor refrigeration module is provided with a cold end and a hot end which are opposite, the liquid-passing pipeline is partially attached to the cold end of the semiconductor refrigeration module, and the liquid-passing pipeline can be partially attached to a heat source to be cooled, so that the heat source exchanges heat with the semiconductor refrigeration module through the liquid-passing pipeline.
Optionally, the heat dissipation device further includes:
the liquid storage tank is communicated with the circulating liquid path system, and the outer surface of the liquid storage tank is attached to the cold end of the semiconductor refrigeration module.
Optionally, the liquid storage tank is tightly pressed and fixed with the cold end of the semiconductor refrigeration module.
Optionally, a heat conducting layer is coated between the outer surface of the liquid storage tank and the cold end of the semiconductor refrigeration module.
Optionally, the heat conducting layer is heat conducting silicone grease or heat conducting silica gel or heat conducting gasket.
Optionally, a portion of the liquid-passing pipe away from the semiconductor refrigeration module is formed with a spiral structure for coiling on the outside of the heat source.
Optionally, a heat sink is disposed at the hot end of the semiconductor refrigeration module.
Optionally, the heat sink includes:
the heat pipe assembly is attached to the hot end of the semiconductor refrigeration module; and
and the radiating fin is connected to one end of the heat pipe assembly, which is far away from the semiconductor refrigeration module.
Optionally, a fan is disposed on one side of the heat dissipation fin.
In a second aspect, the present utility model provides an air conditioning system including a compressor, a condenser, a throttle member, and an evaporator, the air conditioning system further including:
the heat dissipating device according to any one of the first aspects, wherein the liquid passage pipe portion is attached to an outer surface of the compressor; and
and the noise reduction device is arranged on the outer side of the compressor and is used for reducing noise generated by the compressor.
Under the condition of adopting the technical scheme, the semiconductor refrigerating module and the supercharging device are placed on one side of the compressor, the semiconductor refrigerating module is in an electrified state in the operation process of the compressor, the supercharging device is started to enable liquid in the liquid passing pipeline to circularly flow, when the liquid flows through the surface of the compressor, the temperature is increased to take away heat on the surface of the compressor, when the liquid flows through the cold end of the semiconductor refrigerating module, the temperature is reduced, the heat is dissipated to the surrounding environment through the semiconductor refrigerating module, and the heat is circularly circulated to realize heat exchange, so that the compressor is cooled.
According to the utility model, the liquid path circulation and the semiconductor refrigeration module are combined to cool the compressor, and noise generated by the liquid path circulation and the semiconductor refrigeration module is small, so that for a scene that the compressor is placed indoors, after the noise reduction device is arranged on the outer side of the compressor, the liquid passage pipeline can extend into the noise reduction device and be attached to the surface of the compressor, and the heat dissipation requirement is met on the basis of realizing noise reduction.
Drawings
Preferred embodiments of the present utility model are described below with reference to the accompanying drawings, in which:
fig. 1 is a schematic view of a heat dissipating device according to an embodiment of the present utility model.
In the drawings, reference numerals refer to the following:
1. a supercharging device; 2. a liquid-passing pipeline; 3. a semiconductor refrigeration module; 4. a liquid storage tank; 5. a heat sink; 51. a heat pipe assembly; 52. a heat radiation fin; 53. a fan.
Detailed Description
Preferred embodiments of the present utility model are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present utility model, and are not intended to limit the scope of the present utility model. Those skilled in the art can adapt it as desired to suit a particular application.
It should be noted that, in the description of the present utility model, terms such as "upper," "lower," "inner," "outer," and the like, which indicate a direction or a positional relationship, are based on the direction or the positional relationship shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the relevant devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the ordinal terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model can be understood by those skilled in the art according to the specific circumstances.
Referring to fig. 1, a heat dissipating device according to the present utility model includes a supercharging device 1, a liquid passage 2, and a semiconductor refrigeration module 3.
One end of the liquid passing pipeline 2 is connected with the input end of the supercharging device 1, and the other end of the liquid passing pipeline is connected with the output end of the supercharging device 1, so that the liquid passing pipeline 2 and the supercharging device 1 form a complete closed loop. The pressurizing device 1 is mainly used for forming a pressure difference at two ends of the pressurizing device, for example, the pressurizing device 1 can adopt a pump device, and when the pump device works, the liquid in the liquid through pipeline 2 circularly flows to form a circulating liquid path system.
The semiconductor refrigeration module 3 has opposite cold and hot ends, which employ the peltier effect, and in particular, in an energized state, electrons inside the semiconductor refrigeration module 3 undergo directional movement, bringing a portion of the internal energy to the other end of the electric field, thereby creating a temperature difference. Alternatively, the semiconductor refrigeration module 3 in the present utility model has a plate-like structure, so that both the cold end and the hot end thereof have planar structures.
As a possible implementation manner of the present utility model, the circulation liquid path system is further provided with a liquid storage tank 4 in a communicating manner, and the liquid storage tank 4 is used for storing liquid, and when the supercharging device 1 is operated, the liquid in the circulation liquid path system circulates through the liquid storage tank 4. The liquid storage tank 4 has a rectangular parallelepiped shape, and the side surface thereof is attached to the cold end of the semiconductor refrigeration module 3, so that the contact area between the circulating liquid path system and the semiconductor refrigeration module 3 can be increased.
When the heat dissipating device is applied, a part of the liquid passing pipeline 2 is attached to the outer surface of the compressor, the semiconductor refrigeration module 3 and the supercharging device 1 are placed on one side of the compressor, the semiconductor refrigeration module 3 is ensured to be in an electrified state in the operation process of the compressor, the supercharging device 1 is started, liquid in the liquid passing pipeline 2 circularly flows, when the liquid flows through the surface of the compressor, the temperature rises, heat on the surface of the compressor is taken away, when the liquid flows through the cold end of the semiconductor refrigeration module 3, the temperature is reduced, the heat is dissipated to the surrounding environment through the semiconductor refrigeration module 3, and the heat is circularly circulated in the process of the compressor, so that heat exchange is realized, and the compressor is cooled.
In addition, the utility model adopts a mode of combining liquid path circulation and the semiconductor refrigeration module 3 to cool the compressor, and the noise generated by the compressor is small, so that for the scene that the compressor is placed indoors, after the noise reduction device is arranged at the outer side of the compressor, the liquid through pipeline 2 can extend into the noise reduction device and be attached to the surface of the compressor, thereby realizing noise reduction and simultaneously meeting the heat dissipation requirement.
The heat dissipating device of the present utility model is not limited to be applied to an air conditioning system, and may be applied to any occasion sensitive to noise, and the liquid passing pipe 2 may be attached to a corresponding heat source. For example, when some indoor power-making and heating apparatuses need noise reduction treatment, the heat dissipation device can be applied to the indoor power-making and heating apparatuses, so that the noise reduction effect is achieved, and the heat dissipation requirement can be met.
Optionally, the cold end of the liquid storage tank 4 and the cold end of the semiconductor refrigeration module 3 are pressed and fixed, so that the side surface of the liquid storage tank 4 can be always attached to the semiconductor refrigeration module 3, and the liquid storage tank 4 is prevented from being influenced by external environmental factors to be separated from the semiconductor refrigeration module 3.
Further, a heat conducting layer is coated between the outer surface of the liquid storage tank 4 and the cold end of the semiconductor refrigeration module 3. In some possible implementations, the thermally conductive layer may take the form of, for example, thermally conductive silicone grease, thermally conductive silicone gel, or thermally conductive shims, or the like.
In practical application, even if the cold ends of the liquid storage tank 4 and the semiconductor refrigeration module 3 are smooth enough, gaps still exist between the two parts when the two parts are contacted, air in the gaps is a poor heat conductor, heat transfer between the liquid storage tank 4 and the semiconductor refrigeration module 3 can be hindered, and the heat conducting layer is filled in the gaps, so that heat transfer is smoother and quicker, and heat exchange efficiency between liquid in the liquid storage tank 4 and the cold end of the semiconductor refrigeration module 3 is enhanced, thereby enhancing heat dissipation efficiency.
Referring to fig. 1, as a possible implementation manner of the present utility model, one section of the liquid-passing pipe 2 is processed to form a spiral structure, and the spiral structure is located at a position far away from the semiconductor refrigeration module 3 and is used for coiling on the outer side of a heat source such as a compressor, and the bonding area between the liquid-passing pipe 2 and the heat source such as the compressor can be increased by adopting a spiral coiling mode, so that the heat exchange efficiency is enhanced.
Referring to fig. 1, the heat end of the semiconductor refrigeration module 3 is further provided with a radiator 5, and the radiator 5 may be attached to the heat end of the semiconductor refrigeration module 3 in a pressing and fixing manner, and similarly, a heat-conducting material such as a heat-conducting silica gel or a heat-conducting silicone grease may be disposed between the radiator 5 and the cold end of the semiconductor refrigeration module 3, so as to enhance heat transfer efficiency.
By arranging the radiator 5, the heat at the hot end of the semiconductor refrigeration module 3 can be rapidly dissipated to the surrounding environment, so that the heat dissipation efficiency of the whole heat dissipation device is enhanced.
Alternatively, the heat sink 5 is a heat pipe heat sink, which includes a heat pipe assembly 51 and heat radiating fins 52. The heat pipe assembly 51 is filled with liquid, the lower end of the heat pipe assembly 51 is attached to the hot end of the semiconductor refrigeration module 3, the radiating fins 52 are connected to the upper end of the heat pipe assembly 51, and a capillary network is fixedly arranged in the heat pipe assembly 51. The lower end of the heat pipe assembly 51 is an evaporation end, the upper end is a condensation end, when the heat of the hot end of the semiconductor refrigeration module 3 is transferred to the lower end of the heat pipe assembly 51, the liquid in the capillary tube evaporates, the vapor flows to the upper end of the heat pipe assembly 51 under a tiny pressure difference, the heat is released, the vapor is condensed into liquid again, and the liquid flows back to the evaporation end along the porous material under the action of capillary force, so that the heat dissipation is realized. The heat dissipation fins 52 increase the contact area between the upper end of the heat pipe assembly 51 and the surrounding air, thereby accelerating the release of heat and the condensation process of steam.
Further, in order to promote condensation of steam, a fan 53 is fixedly installed on one side surface of the heat dissipation fin 52, and the heat dissipation fin 52 is cooled by starting the fan 53 to accelerate the condensation process.
The utility model also discloses an air conditioning system which comprises a compressor, a condenser, a throttling component, an evaporator, the heat radiating device and the noise reducing device in any embodiment.
The noise reduction device is fixedly arranged on the outer side of the compressor, and the noise reduction device comprises, but is not limited to, a sound insulation cover with sound absorbing cotton, a cover body with a damping spring or a vacuum cover. The liquid-passing pipeline 2 of the heat radiator extends into the noise reducer and is attached to the surface of the compressor.
It should be understood that no matter what type of noise reduction device is used, only the process structure of the noise reduction device for the liquid passing pipe 2 to pass through needs to be ensured. For example, a process hole is reserved on the noise reduction device, and after the liquid passing pipeline 2 extends into the noise reduction device through the process hole, the joint of the liquid passing pipeline 2 and the process hole is sealed.
Thus far, the technical solution of the present utility model has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present utility model is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present utility model, and such modifications and substitutions will fall within the scope of the present utility model.
Claims (10)
1. A heat sink, comprising:
a supercharging device;
one end of the liquid passing pipeline is connected with the input end of the pressurizing device, the other end of the liquid passing pipeline is connected with the output end of the pressurizing device, and the liquid passing pipeline and the pressurizing device form a circulating liquid path system; and
the semiconductor refrigeration module is provided with a cold end and a hot end which are opposite, the liquid-passing pipeline is partially attached to the cold end of the semiconductor refrigeration module, and the liquid-passing pipeline can be partially attached to a heat source to be cooled, so that the heat source exchanges heat with the semiconductor refrigeration module through the liquid-passing pipeline.
2. The heat sink of claim 1, further comprising:
the liquid storage tank is communicated with the circulating liquid path system, and the outer surface of the liquid storage tank is attached to the cold end of the semiconductor refrigeration module.
3. The heat sink of claim 2 wherein the reservoir is secured in compression with the cold end of the semiconductor refrigeration module.
4. The heat sink of claim 2 wherein a thermally conductive layer is applied between an outer surface of the reservoir and a cold end of the semiconductor refrigeration module.
5. The heat dissipating device of claim 4, wherein the thermally conductive layer is a thermally conductive silicone grease or a thermally conductive silicone gel or a thermally conductive gasket.
6. The heat dissipating device of any one of claims 1 to 5, wherein a portion of the liquid passing conduit remote from the semiconductor refrigeration module is formed with a spiral structure for coiling on an outside of the heat source.
7. The heat sink as claimed in any one of claims 1 to 5, wherein the hot end of the semiconductor refrigeration module is provided with a heat sink.
8. The heat sink of claim 7, wherein the heat sink comprises:
the heat pipe assembly is attached to the hot end of the semiconductor refrigeration module; and
and the radiating fin is connected to one end of the heat pipe assembly, which is far away from the semiconductor refrigeration module.
9. The heat sink of claim 8, wherein a fan is provided on one side of the heat radiating fin.
10. An air conditioning system comprising a compressor, a condenser, a throttling element and an evaporator, the air conditioning system further comprising:
the heat dissipating device of any one of claims 1 to 9, the liquid passing conduit portion being attached to an outer surface of the compressor; and
and the noise reduction device is arranged on the outer side of the compressor and is used for reducing noise generated by the compressor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320861193.4U CN219868251U (en) | 2023-04-17 | 2023-04-17 | Heat abstractor and air conditioning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320861193.4U CN219868251U (en) | 2023-04-17 | 2023-04-17 | Heat abstractor and air conditioning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219868251U true CN219868251U (en) | 2023-10-20 |
Family
ID=88318087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320861193.4U Active CN219868251U (en) | 2023-04-17 | 2023-04-17 | Heat abstractor and air conditioning system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219868251U (en) |
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2023
- 2023-04-17 CN CN202320861193.4U patent/CN219868251U/en active Active
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