CN219303014U - Electronic equipment eDP signal test tool - Google Patents
Electronic equipment eDP signal test tool Download PDFInfo
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- CN219303014U CN219303014U CN202320734715.4U CN202320734715U CN219303014U CN 219303014 U CN219303014 U CN 219303014U CN 202320734715 U CN202320734715 U CN 202320734715U CN 219303014 U CN219303014 U CN 219303014U
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Abstract
The utility model provides an electronic equipment eDP signal test fixture, which comprises: the test fixture plate is provided with a first test passage and a second test passage; the first test path includes: the system comprises eDP interface sockets of first sizes and first SMA interfaces which are in one-to-one correspondence with eDP test signals of each first size; the second test path includes: the second size eDP interface socket and with each second size eDP test signal the second SMA interface of one-to-one. The eDP interface socket of the first size and the eDP interface socket of the second size are respectively connected to a first SMA interface and a second SMA interface corresponding to the eDP interface socket of the first size and the eDP interface socket of the second size on the test jig board through wiring. The utility model can meet the requirement of comprehensively, simply and conveniently detecting the signal quality of eDP interfaces with different sizes of the mainboard and Cable line of the electronic equipment.
Description
Technical Field
The utility model relates to the field of electronic equipment signal testing, in particular to an eDP signal testing jig for electronic equipment.
Background
Along with the continuous development of technology, notebook computers and other electronic devices are rapidly updated, and user demands are different. eDP (Embedded DisplayPort) is a communication interface mode, namely an internal DP (DisplayPort) interface, which has strong capability of transmitting high resolution and resisting EMI (Electromagnetic Interference ), is simple, and gradually becomes the main stream of the interface of the display screen of the notebook computer. In order to meet the requirements of users for different resolutions, a notebook computer is usually provided with display screens (30 Pin and 40Pin are common) with different resolutions, and an eDP interface of a main board end of the notebook computer is connected with a screen end through a cable line and is adapted to corresponding sizes after signal communication. However, during testing, the signal quality of the eDP interface with different sizes of the notebook motherboard and the Cable line cannot be detected comprehensively, simply and conveniently in the prior art due to different sizes of the supported display screens and different numbers of the used high-speed signal lines.
Disclosure of Invention
Therefore, the technical problem to be solved by the utility model is to solve the problem that the prior art cannot fully, simply and conveniently detect the signal quality of eDP interfaces with different sizes of electronic equipment main boards and cable wires, so as to provide the eDP signal testing jig for the electronic equipment.
The utility model provides an electronic equipment eDP signal test fixture, which comprises: the test fixture comprises a test fixture plate, a first test passage and a second test passage, wherein the first test passage and the second test passage are arranged on the test fixture plate;
the first test path includes: the test fixture comprises an eDP interface socket of a first size and first SMA interfaces corresponding to eDP test signals of each first size one by one, wherein the eDP interface socket of the first size is arranged at one end of the test fixture plate, and the test fixture plate is connected to the first SMA interfaces corresponding to the eDP test signals of each first size through wiring;
the second test path includes: the test fixture comprises an eDP interface socket of a second size and second SMA interfaces corresponding to eDP test signals of each second size one by one, wherein the eDP interface socket of the second size is arranged at one end of the test fixture plate, and the test fixture plate is connected to the second SMA interfaces corresponding to the eDP test signals of each second size through wiring.
Optionally, the test jig board is a multi-layer circuit board.
Optionally, the first test via and the second test via are disposed at different layers of the multilayer circuit board.
Optionally, the first test path and the second test path are perpendicular to each other on the test jig board.
Optionally, the first test path and the second test path each include: the pin arrangement area is provided with a plurality of pins, and each pin is respectively connected with other eDP signals on the eDP interface socket corresponding to the first size or the eDP interface socket corresponding to the second size.
Optionally, the electronic device eDP signal testing jig further includes: converting the eDP plug with the first size into a first standard cable of the eDP plug with the first size and converting the eDP plug with the second size into a second standard cable of the eDP plug with the second size;
one end of the first standard cable wire is connected to a mainboard of the electronic equipment to be tested with a first size, and the other end of the first standard cable wire is connected to an eDP interface socket with the first size;
one end of the second standard cable wire is connected to the motherboard of the electronic device to be tested with the second size, and the other end of the second standard cable wire is connected to the eDP interface socket with the second size.
Optionally, the first test path and the second test path further include: a ground hole;
the grounding holes are in blind hole forms and are arranged on two sides of the wiring in the first test passage and the second test passage.
Optionally, the first size is 30Pin; the second size is 40Pin.
Optionally, the first SMA interface or the second SMA interface of the test jig plate is connected to the oscilloscope through an SMA cable wire.
Optionally, the other eDP signals include: audio input signal, hot plug signal, power signal and ground signal.
The technical scheme of the utility model has the following advantages:
the utility model provides an electronic equipment eDP signal test fixture, which is characterized by comprising: the test fixture comprises a test fixture plate, a first test passage and a second test passage, wherein the first test passage and the second test passage are arranged on the test fixture plate; the first test path includes: the test fixture comprises an eDP interface socket of a first size and first SMA interfaces corresponding to eDP test signals of each first size one by one, wherein the eDP interface socket of the first size is arranged at one end of the test fixture plate, and the test fixture plate is connected to the first SMA interfaces corresponding to the eDP test signals of each first size through wiring; the second test path includes: the test fixture comprises an eDP interface socket of a second size and second SMA interfaces corresponding to eDP test signals of each second size one by one, wherein the eDP interface socket of the second size is arranged at one end of the test fixture plate, and the test fixture plate is connected to the second SMA interfaces corresponding to the eDP test signals of each second size through wiring. According to the utility model, only one test jig board and the first test passage and the second test passage arranged on the test jig board are used, so that the signal quality of eDP interfaces with different sizes of the main board and cable lines of the electronic equipment is comprehensively, simply and conveniently detected. The testing difficulty and the testing time are reduced, and the testing cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an eDP signal testing tool for an electronic device according to an embodiment of the utility model;
fig. 2 is a schematic structural diagram of a first test path of the eDP signal testing tool of the electronic device according to an embodiment of the present utility model;
fig. 3 is a schematic structural diagram of a second test path of the eDP signal testing tool of the electronic device according to an embodiment of the present utility model;
FIG. 4 is a schematic view of the placement of the grounding hole in an embodiment of the present utility model;
fig. 5 is another schematic structural diagram of an eDP signal testing jig for an electronic device according to an embodiment of the utility model.
Detailed Description
The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
In the prior art, electronic devices such as a notebook computer are generally equipped with display screens (usually 30Pin and 40 Pin) with different resolutions, and an eDP interface at a motherboard end of the electronic device such as the notebook computer is connected with a screen end through a cable line, and after signals are exchanged, the electronic device adapts to corresponding sizes. However, when signal testing is performed, the signal quality of the eDP interface of the motherboard and the cable of the electronic device such as the notebook computer cannot be comprehensively, simply and conveniently detected due to different sizes of the supported display screens and different numbers of the used high-speed signal lines in the prior art.
Based on the above problems, the present utility model provides an eDP signal testing jig for electronic devices, as shown in fig. 1, which includes: a test jig board 1, and a first test path 11 and a second test path 12 provided on the test jig board 1; as shown in fig. 2, the first test path 11 includes: the test fixture comprises a first-size eDP interface socket 111 and first SMA interfaces 113 which are in one-to-one correspondence with the eDP test signals of each first size, wherein the first-size eDP interface socket 111 is arranged at one end of the test fixture board 1 and is connected to the first SMA interfaces 113 corresponding to the eDP test signals of each first size on the test fixture board 1 through wiring; as shown in fig. 3, the second test path 12 includes: the second-size eDP interface socket 121 and the second SMA interface 123 corresponding to the eDP test signals of each second size are arranged at one end of the test fixture board 1, and the second-size eDP interface socket 121 is connected to the second SMA interface 123 corresponding to the eDP test signals of each second size on the test fixture board 1 through wiring.
2-3, the eDP test signal of the first size may be Lan0 positive and negative, lan1 positive and negative; the eDP test signal of the second size may be Lan0 positive and negative, lan1 positive and negative, lan2 positive and negative, lan3 positive and negative.
Through the cooperation of the components, the utility model realizes comprehensive, simple and convenient detection of the signal quality of eDP interfaces with different sizes of the main board and cable of the electronic equipment by using only one test jig board 1 and the first test channel 11 and the second test channel 12 arranged on the test jig board 1. The testing difficulty and the testing time are reduced, and the testing cost is reduced.
Specifically, in one embodiment, as shown in fig. 1, the test fixture board 1 is a multi-layer circuit board. The multilayer circuit board has high density and small volume, meets the light and small-sized requirements of the electronic equipment, and can increase the wiring layer number, thereby increasing the design flexibility.
Specifically, in one embodiment, the first test via 11 and the second test via 12 are disposed on different layers of the multi-layer circuit board, and are not interfered with each other, and the structure is simple and clear. The first test path 11 and the second test path 12 may be disposed on the top layer and the bottom layer of the multi-layer circuit board, respectively, to avoid signal interference to the greatest extent and ensure the accuracy of the test result.
Specifically, in one embodiment, the first test path 11 and the second test path 12 are perpendicular to each other on the test jig board 1. The wires of the first test path 11 for transmitting signals and the wires of the second test path 12 for transmitting signals are distributed vertically on different layers of the multi-layer circuit board, so that the wires of the transmitted signals on different layers do not form inter-plate capacitance, thereby reducing signal interference.
Specifically, in one embodiment, as shown in fig. 2 and 3, the first test path 11 and the second test path 12 each include: the pin arrangement area 112, the pin arrangement area 112 is provided with a plurality of pins, and each pin is connected with other eDP signals on the eDP interface socket 111 corresponding to the first size or the eDP interface socket 121 corresponding to the second size. For example, other eDP signals (such as an audio input signal, a hot plug signal, a power signal, a ground signal, etc.) are led from the end of the eDP interface socket 111 with the first size to the pin header with the size of 2.54mm, so that the requirements of users for testing different signals are met. Illustratively, the AUX signal has both an SMA female interface and a 2.54mm pin header interface, which can accommodate most EDID devices 4, resulting in wider test selectivity and compatibility.
Specifically, in an embodiment, the electronic device eDP signal testing jig provided by the embodiment of the present utility model further includes: converting the eDP plug with the first size into a first standard cable of the eDP plug with the first size and converting the eDP plug with the second size into a second standard cable of the eDP plug with the second size; one end of the first standard cable wire is connected to the mainboard of the electronic device to be tested with the first size, and the other end of the first standard cable wire is connected to the eDP interface socket 111 with the first size; one end of the second standard cable wire is connected to the motherboard of the electronic device to be tested with the second size, and the other end of the second standard cable wire is connected to the eDP interface socket 121 with the second size. The electronic equipment eDP signal testing jig not only can be used for testing the eDP signal quality of the main board end of the electronic equipment to be tested, but also can be used for testing the eDP signal quality of the whole cable added line of the main board end of the electronic equipment to be tested. For example, when the notebook is manufactured, a matched eDP cable line (each notebook has its own cable line) is designed to connect the motherboard and the screen. In the process of testing the eDP, the signal quality of the whole body of the notebook main board plus the eDP cable matched with the notebook is usually tested. However, in actual testing, there may be a case that the whole signal test fails, and at this time, it is required to analyze whether the quality of the notebook motherboard is poor or the quality of the set eDP cable line is poor. At this time, the electronic equipment eDP signal testing jig is changed from the first standard cable of the eDP plug with the first size to the second standard cable of the eDP plug with the second size to replace the eDP cable matched with the notebook, so that the eDP signal quality of the pure main board can be verified, and the problem can be checked. The quality of converting the eDP plug of the first size into a first standard cable of the eDP plug of the first size or converting the eDP plug of the second size into a second standard cable of the eDP plug of the second size is absolutely good, and the eDP cable matched with the actual notebook may have the problems of too long cable, poor material quality and the like.
Specifically, in an embodiment, as shown in fig. 4, the first test path 11 and the second test path 12 further include: a ground hole 5; the grounding holes are in the form of blind holes and are arranged on two sides of the wiring 6 in the first test path 11 and the second test path 12. The first test passage 11 and the second test passage 12 are not interfered with each other, so that the shielding effect of the signal wire can be ensured, the testing precision is improved, the interference and loss of the length of the wiring 6 on the electronic equipment eDP signal testing jig to the signal testing of the main board of the electronic equipment are reduced, the lamination of the multi-layer circuit board can be reduced to the greatest extent, the cost is reduced, and the electronic equipment eDP signal testing jig is lighter and convenient to carry and store.
Specifically, in one embodiment, the first size is 30Pin; the second size is 40Pin. A notebook computer is usually equipped with display screens with different resolutions (usually 30Pin and 40 Pin), so that the requirements of the general notebook computer on signal testing with different sizes can be met.
Specifically, in one embodiment, as shown in fig. 5, the first SMA interface 113 or the second SMA interface 123 of the test jig plate 1 is connected to the oscilloscope 3 through an SMA cable wire; according to the resolution of the display screen of the main board 2 of the electronic device to be tested, the electronic device is correspondingly connected to the eDP interface socket 111 of the first size or the eDP interface socket 121 of the second size on the test fixture board 1, and the oscilloscope 3 is connected with the first SMA interface 113 or the second SMA interface 123 of the test fixture board 1 through an SMA cable wire. And displaying the relevant information such as the size of the tested signal. The EDID device 4 corresponds to an AUX signal connected to the pin arrangement area 112 on the test fixture board 1 or an AUX signal of the SMA interface, and when it is desired to verify the eDP signal rate (resolution) of the electronic device motherboard 2 to be tested, but there is no corresponding display screen, the EDID device 4 can induce the electronic device motherboard 2 to be tested to generate a signal test with a response rate.
Specifically, in one embodiment, the other eDP signals include: the audio input signal, the hot plug signal, the power signal and the ground signal meet the requirements of users for testing different signals.
Through the cooperation of the parts, the electronic equipment eDP signal testing jig provided by the utility model performs signal testing on the tested signals with different sizes through the testing channels, and realizes comprehensive, simple and convenient detection on the signal quality of eDP interfaces with different sizes of the electronic equipment main board and cable lines. The electronic equipment eDP signal testing jig provided by the utility model can be used for testing the eDP signal quality of the main board end of the electronic equipment and also can be used for testing the eDP signal quality of the whole cable added at the main board end of the electronic equipment by converting the eDP plug with the first size into the first standard cable of the eDP plug with the first size and converting the eDP plug with the second size into the second standard cable of the eDP plug with the second size. And the dual-interface design of the SMA interface and the 2.54mm pin header interface of the AUX signal can adapt to most EDID equipment, so that the test selectivity and compatibility are wider. The grounding hole beside the signal wire on the multilayer circuit board of the electronic equipment eDP signal testing jig is designed as a blind hole, so that the isolation of the 30Pin signal path and the 40Pin signal path is ensured, the shielding effect of the signal wire is ensured, the testing precision is improved, the interference and loss of the wiring length on the jig to the signal testing of the notebook motherboard are reduced, and the lamination of the printed board is reduced to the greatest extent, thereby reducing the cost. The clamp is lighter and convenient to carry and store.
It is apparent that the above embodiments are merely examples given for clarity of illustration. And not to limit the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.
Claims (10)
1. Electronic equipment eDP signal test tool, its characterized in that includes: the test fixture comprises a test fixture plate, a first test passage and a second test passage, wherein the first test passage and the second test passage are arranged on the test fixture plate;
the first test path includes: the test fixture comprises an eDP interface socket of a first size and first SMA interfaces corresponding to eDP test signals of each first size one by one, wherein the eDP interface socket of the first size is arranged at one end of the test fixture plate, and the test fixture plate is connected to the first SMA interfaces corresponding to the eDP test signals of each first size through wiring;
the second test path includes: the test fixture comprises an eDP interface socket of a second size and second SMA interfaces corresponding to eDP test signals of each second size one by one, wherein the eDP interface socket of the second size is arranged at one end of the test fixture plate, and the test fixture plate is connected to the second SMA interfaces corresponding to the eDP test signals of each second size through wiring.
2. The eDP signal testing jig for electronic device according to claim 1, wherein,
the test jig board is a multi-layer circuit board.
3. The eDP signal testing jig for electronic device according to claim 2, wherein,
the first test via and the second test via are disposed at different layers of the multi-layer circuit board.
4. The electronic device eDP signal testing fixture according to claim 3, wherein,
the first test passage and the second test passage are perpendicular to each other on the test jig board.
5. The eDP signal testing jig for electronic device according to claim 1, wherein,
the first test path and the second test path each include: the pin arrangement area is provided with a plurality of pins, and each pin is respectively connected with other eDP signals on the eDP interface socket corresponding to the first size or the eDP interface socket corresponding to the second size.
6. The eDP signal testing jig for electronic device according to claim 1, wherein,
further comprises: converting the eDP plug with the first size into a first standard cable of the eDP plug with the first size and converting the eDP plug with the second size into a second standard cable of the eDP plug with the second size;
one end of the first standard cable wire is connected to a mainboard of the electronic equipment to be tested with a first size, and the other end of the first standard cable wire is connected to an eDP interface socket with the first size;
one end of the second standard cable wire is connected to the motherboard of the electronic device to be tested with the second size, and the other end of the second standard cable wire is connected to the eDP interface socket with the second size.
7. The eDP signal testing jig for electronic device according to claim 1, wherein,
the first test path and the second test path each further comprise: a ground hole;
the grounding holes are in blind hole forms and are arranged on two sides of the wiring in the first test passage and the second test passage.
8. The eDP signal testing jig for electronic device according to claim 1, wherein,
the first size is 30Pin;
the second size is 40Pin.
9. The eDP signal testing jig for electronic device according to claim 1, wherein,
and the first SMA interface or the second SMA interface of the test jig plate is connected with the oscilloscope through an SMA cable wire.
10. The electronic device eDP signal testing fixture according to claim 5, wherein,
the other eDP signals include: audio input signal, hot plug signal, power signal and ground signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320734715.4U CN219303014U (en) | 2023-04-03 | 2023-04-03 | Electronic equipment eDP signal test tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320734715.4U CN219303014U (en) | 2023-04-03 | 2023-04-03 | Electronic equipment eDP signal test tool |
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| Publication Number | Publication Date |
|---|---|
| CN219303014U true CN219303014U (en) | 2023-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320734715.4U Active CN219303014U (en) | 2023-04-03 | 2023-04-03 | Electronic equipment eDP signal test tool |
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| CN (1) | CN219303014U (en) |
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- 2023-04-03 CN CN202320734715.4U patent/CN219303014U/en active Active
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