CN218850764U - High-flux communication equipment - Google Patents
High-flux communication equipment Download PDFInfo
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- CN218850764U CN218850764U CN202222409635.XU CN202222409635U CN218850764U CN 218850764 U CN218850764 U CN 218850764U CN 202222409635 U CN202222409635 U CN 202222409635U CN 218850764 U CN218850764 U CN 218850764U
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Abstract
The utility model discloses a high flux communication device, which relates to the technical field of communication devices and comprises a case, a mainboard, an interface board and a high-speed connector, wherein the mainboard, the interface board and the high-speed connector are arranged in the case; the main board comprises a main control chip, an exchange chip and a power management chip, wherein the main control chip and the exchange chip are both connected with the power management chip, and the main control chip is in communication connection with the exchange chip; and two ends of the high-speed connector are respectively connected with the interface board and the exchange chip. The utility model discloses a through high-speed connector communication connection between exchange chip among the communication equipment and the interface board to improve the transmission performance between mainboard and the interface board, improve communication equipment's communication speed and communication stability.
Description
Technical Field
The utility model relates to a communication equipment technical field, concretely relates to high flux communication equipment.
Background
In the existing communication equipment, a main board and an interface board are connected through an RJ45 connector and a cable. When communication equipment is used for communication transmission in a vehicle-mounted environment, the problems of slow transmission, impact resistance, vibration resistance and poor anti-interference capability between a main board and an interface board often exist, so that the communication speed and the communication stability of the communication equipment are low. The reason for this is that the conventional RJ45 connector is generally used for commercial or industrial communication equipment and can be directly connected to a common network cable, and the RJ45 connector plus cable connection method is only applicable to a machine room environment and not applicable to a vehicle-mounted environment, which requires a connection method with high reliability, and strong impact and vibration resistance.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem who solves does: when the existing communication equipment carries out communication transmission, the communication speed and the communication stability are low. In order to solve the technical problem, the utility model provides a high flux communication equipment.
The utility model provides a technical scheme as follows:
a high-flux communication device comprises a case, a mainboard, an interface board and a high-speed connector, wherein the mainboard, the interface board and the high-speed connector are arranged in the case; the main board comprises a main control chip, an exchange chip and a power management chip, wherein the main control chip and the exchange chip are both connected with the power management chip, and the main control chip is in communication connection with the exchange chip; and two ends of the high-speed connector are respectively connected with the interface board and the exchange chip.
The beneficial effects of the utility model are that: the exchange chip is in communication connection with the interface board through the high-speed connector, so that the transmission performance between the main board and the interface board is improved, and the communication speed and the communication stability of the communication equipment are improved.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
The communication equipment further comprises a power panel, wherein the power panel is connected with the power management chip and comprises a power module, a direct current module and an alternating current module, and the direct current module and the alternating current module are electrically connected with the power module;
the direct current module comprises a direct current filter, a direct current switch and a direct current safety device, the direct current filter and the direct current safety device are both connected with the direct current switch, and the direct current filter and the direct current safety device are both connected with the power supply module;
the alternating current module comprises an alternating current filter, an alternating current switch and an alternating current safety device, the alternating current filter and the alternating current safety device are connected with the alternating current switch, and the alternating current filter and the alternating current safety device are connected with the power module.
The beneficial effect of adopting the further scheme is that: the power panel and the power management chip are matched for use, so that the input power voltage can be converted into various levels of working voltage required by an electronic circuit, and power is supplied to each module of the communication equipment; through setting up direct current module and interchange module, make communications facilities both can connect DC power supply, can connect alternating current power supply again.
Furthermore, the communication device further comprises a management interface, the management interface is arranged on one side of the case, and the management interface is in communication connection with the exchange chip.
The beneficial effect of adopting the further scheme is that: the management interface is arranged, so that the communication equipment can be connected with external management equipment, and the management of the communication equipment is realized.
Further, the communication equipment further comprises an indicator lamp plate, and the indicator lamp plate is connected with the mainboard.
The beneficial effect of adopting the further scheme is that: through the indicator light board, can find out communications facilities's electric quantity situation directly perceivedly.
Further, the switching chip is provided with at least one optical fiber interface, and each optical fiber interface adopts a serializer/deserializer interface.
The beneficial effect of adopting the further scheme is that: by using the serializer/deserializer interface as the optical fiber interface, the data transmission speed can be improved.
Further, the interface board adopts a 24-path ethernet interface board.
The beneficial effect of adopting the further scheme is that: by adopting the 24-path Ethernet interface board as the interface board, the internal wiring of the case can be reduced, the signal interference in the case can be reduced, and the signal transmission quality can be improved.
Furthermore, a wire binding seat and a cable are arranged inside the case, the wire binding seat comprises a wire binding and a wire binding fixing seat, and the cable is fixed in the wire binding fixing seat through the wire binding.
The beneficial effect of adopting the above further scheme is: regular cable inside the communication equipment is arranged through the wire binding seat, and subsequent repair is facilitated.
Further, the outer wall of the cable is sleeved with a spiral pipe sleeve.
The beneficial effect of adopting the above further scheme is: through setting up the spiral pipe box, the condition that the cable damaged when having avoided the cable crooked appears.
Furthermore, at least one heat dissipation hole is formed in the case.
The beneficial effect of adopting the further scheme is that: through setting up the louvre, avoided the inside high temperature of communication equipment to lead to equipment to damage.
Further, at least one pin hole is formed in the case.
The beneficial effect of adopting the above further scheme is: through setting up the cotter hole, be convenient for fix and spacing communication equipment.
Drawings
Fig. 1 is a schematic structural diagram a of the communication device of the present invention;
fig. 2 is a schematic structural diagram B of the communication device of the present invention;
fig. 3 is a schematic structural diagram of the middle power panel of the present invention.
Detailed Description
The principles and features of the present invention are described below, with the examples being given only for the purpose of illustration and not for the purpose of limiting the scope of the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention since the positional or orientational relationships indicated herein are merely for the convenience of description and simplicity of description.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and embodiments.
Example one
In order to solve the technical problems in the prior art, the present embodiment provides a high-throughput communication device, as shown in fig. 1, including a chassis, and a main board, an interface board and a high-speed connector which are disposed inside the chassis; the main board comprises a main control chip, an exchange chip and a power management chip, wherein the main control chip and the exchange chip are both connected with the power management chip, and the main control chip is in communication connection with the exchange chip; and two ends of the high-speed connector are respectively connected with the interface board and the exchange chip.
In this embodiment, the high-speed connector is a connector with a packet forwarding rate greater than or equal to 3.125Gpps, such as an FC-type connector; the mainboard is a mainboard or a system board; the main control chip is a chip for controlling the exchange chip, such as a central controller; the exchange chip is a chip capable of performing high-performance exchange, such as a chip with the model number of CTC 8096; the power management chip is used for supplying power to the main control chip and the exchange chip; the high-speed connector is connected with the exchange chip and the interface board in an inserting manner; and the main control chip is in communication connection with the exchange chip through a PCI-E bus.
The exchange chip is in communication connection with the interface board through a high-speed connector, so that the transmission performance between the mainboard and the interface board is improved, and the communication speed and the communication stability of communication equipment are improved.
Further, the communication device further includes a management interface and an indicator light board, as shown in fig. 2, the management interface is disposed on a rear panel of the chassis, and the management interface is in communication connection with the switch chip; the indicator lamp plate is arranged on the front panel of the case, and the indicator lamp plate is connected with the main control chip.
In this embodiment, the management interface is an interface for connecting a management device to manage the communication device, and the management device may be an intelligent device, such as a smart phone or a computer. The circuit board that includes at least one pilot lamp on the indicator lamp plate, the bright state sign that goes out of each pilot lamp communication equipment's electric quantity situation.
Further, the switching chip is provided with at least one optical fiber interface, and each optical fiber interface adopts a serializer/deserializer interface.
The optical fiber interface is a physical interface used for connecting an optical fiber cable.
Further, the interface board adopts a 24-path ethernet interface board.
Furthermore, a wire binding seat and a cable are arranged inside the case, the wire binding seat comprises a wire binding and a wire binding fixing seat, and the cable is fixed in the wire binding fixing seat through the wire binding.
Further, the outer wall of the cable is sleeved with a spiral pipe sleeve.
Furthermore, at least one heat dissipation hole is formed in the case.
Furthermore, at least one pin hole is formed in the case.
Example two
On the basis of the first embodiment, as shown in fig. 3, the communication device further includes a power panel, the power panel is connected to the power management chip, the power panel includes a power module, a dc module and an ac module, and both the dc module and the ac module are electrically connected to the power module.
The direct current module comprises a direct current filter, a direct current switch and a direct current safety device, the direct current filter and the direct current safety device are both connected with the direct current switch, and the direct current filter and the direct current safety device are both connected with the power module.
The alternating current module comprises an alternating current filter, an alternating current switch and an alternating current safety device, the alternating current filter and the alternating current safety device are connected with the alternating current switch, and the alternating current filter and the alternating current safety device are connected with the power module.
The power panel selects components including a machine panel mainly used for power supply processing, and can convert input power supply voltage into various levels of working voltage required by an electronic circuit through the matching use of the power panel and a power management chip so as to supply power to each module of the communication equipment; through setting up DC module and interchange module, make communications facilities both can connect DC power supply, can connect AC power supply again.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (10)
1. The high-flux communication equipment is characterized by comprising a case, and a mainboard, an interface board and a high-speed connector which are arranged in the case; the main board comprises a main control chip, an exchange chip and a power management chip, wherein the main control chip and the exchange chip are both connected with the power management chip, and the main control chip is in communication connection with the exchange chip; and two ends of the high-speed connector are respectively connected with the interface board and the exchange chip.
2. The high-throughput communication device according to claim 1, further comprising a power board, wherein the power board is connected to the power management chip, the power board comprises a power module, a dc module and an ac module, and the dc module and the ac module are both electrically connected to the power module;
the direct current module comprises a direct current filter, a direct current switch and a direct current safety device, the direct current filter and the direct current safety device are both connected with the direct current switch, and the direct current filter and the direct current safety device are both connected with the power supply module;
the alternating current module comprises an alternating current filter, an alternating current switch and an alternating current safety device, the alternating current filter and the alternating current safety device are both connected with the alternating current switch, and the alternating current filter and the alternating current safety device are both connected with the power module.
3. A high throughput communication device according to claim 1, wherein said communication device further comprises a management interface, said management interface is disposed on one side of said chassis, said management interface is communicatively connected to said switch chip.
4. A high throughput communication apparatus according to claim 1, wherein said communication apparatus further comprises an indicator light panel, said indicator light panel is connected to said main board.
5. A high-throughput communication device according to claim 1, wherein at least one optical fiber interface is disposed on said switch chip, and each said optical fiber interface adopts a serializer/deserializer interface.
6. A high-throughput communication device according to claim 1, wherein said interface board is a 24-way ethernet interface board.
7. The high-throughput communication device according to claim 1, wherein a wire binding seat and a cable are arranged inside the case, the wire binding seat comprises a wire binding and a wire binding fixing seat, and the cable is fixed in the wire binding fixing seat through the wire binding.
8. High throughput communication device according to claim 7, wherein said cable jacket is provided with a helical casing.
9. A high throughput communication device according to claim 1, wherein said cabinet is provided with at least one heat dissipation hole.
10. A high throughput communication device according to claim 1, wherein said housing is provided with at least one pin hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202222409635.XU CN218850764U (en) | 2022-09-09 | 2022-09-09 | High-flux communication equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202222409635.XU CN218850764U (en) | 2022-09-09 | 2022-09-09 | High-flux communication equipment |
Publications (1)
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CN218850764U true CN218850764U (en) | 2023-04-11 |
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CN202222409635.XU Active CN218850764U (en) | 2022-09-09 | 2022-09-09 | High-flux communication equipment |
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- 2022-09-09 CN CN202222409635.XU patent/CN218850764U/en active Active
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