CN218825032U - Substrate supporting structure and pre-baking device - Google Patents

Abstract

The utility model relates to a show technical field, disclose a base plate bearing structure and bake in advance device. The substrate supporting structure comprises a plurality of supporting assemblies, the supporting assemblies are distributed in an array mode, each supporting assembly comprises an intermediate supporting portion and a surrounding supporting portion, the surrounding supporting portions are arranged around the intermediate supporting portion in a surrounding mode, and the intermediate supporting portion and the surrounding supporting portions can be lifted and lowered alternately to support a substrate to be dried. The support of the substrate to be dried is realized by arranging a plurality of support assemblies, so that the stability of the substrate to be dried can be improved; through setting up intermediate strut portion and supporting part in turn go up and down in order to alternate the support and treat the stoving base plate around, can avoid because the uneven phenomenon of being heated that the position that has on treating the stoving base plate and contact with the supporting component and the position that does not have the contact leads to improve the finished product quality.

Description

Substrate supporting structure and pre-baking device

Technical Field

The utility model relates to a show technical field, especially relate to a base plate bearing structure and bake device in advance.

Background

A Liquid Crystal Display (LCD) has many advantages such as a thin body, power saving, and no radiation, and is widely used. Most of the liquid crystal display devices on the market are backlight liquid crystal display devices, which include a liquid crystal display panel and a backlight module. Generally, a Liquid Crystal display panel is composed of a Color Filter (CF) substrate, a Thin Film Transistor (TFT) substrate, a Liquid Crystal (LC) sandwiched between the CF substrate and the TFT substrate, and a sealant. The liquid crystal display panel has the working principle that liquid crystal molecules are placed in two parallel glass substrates, and the liquid crystal molecules are controlled to change directions by whether the glass substrates are electrified or not, so that light rays of the backlight module are refracted out to generate pictures.

The TFT substrate and the CF substrate are respectively provided with a layer of alignment film, after the alignment films are contacted with the LC, the LC can generate a pretilt angle in a certain direction, so that a bearing angle is provided for liquid crystal molecules, the pretilt angle has important influence on the driving voltage, the contrast, the response time, the visual angle and the like of the LCD, and the alignment films are usually made of Polyimide (PI) materials which are coated on the substrates through PI liquid and then dried.

The commonly used method for manufacturing the alignment film in the prior art comprises the following steps: the PI solution is coated on a substrate (an array substrate or a CF substrate) using a transfer plate, and then a desired alignment film is formed on the substrate through an alignment process (e.g., a rubbing alignment process/a photo-alignment process) and other processes. The specific process of coating the alignment layer generally includes the following steps: cleaning a substrate, coating PI liquid on the substrate subjected to the cleaning process, pre-baking the PI liquid coated on the substrate, removing a solvent in the PI liquid to form a PI film preliminarily, then performing PI film coating defect inspection through a detection device, performing main baking on the PI film if the PI film is inspected to be free of abnormality, and completely removing the solvent in the PI film to form a final alignment film.

The pre-baking is to volatilize solvents such as N-methyl pyrrolidone in the PI liquid to flatten the PI film so as to facilitate the next inspection of the PI film. The PI pre-baking mode is that the substrate is heated through infrared radiation so as to volatilize the solvent, and the substrate is supported through the lifting support pins, so that the effects of uniformly supporting the substrate and facilitating the upstream and downstream conveying mechanical arms to take and place the substrate are achieved. However, the PI prebaking technology has the problem that the substrate is heated unevenly in the heating process: the contact between the supporting pins and the substrate may cause uneven heating at the contact position and the non-contact position, which may cause uneven film (Pin Mura) caused by the supporting pins, and further may affect the product quality.

In addition, in the photolithography process, after the photoresist is coated on the substrate, the prebaking device is also required to be used for drying the photoresist coated on the substrate, and when the photoresist on the substrate is prebaked by the conventional prebaking device, the problem that the substrate is heated unevenly also exists, so that the photolithography quality is influenced.

Therefore, a need exists to provide a substrate supporting structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a base plate bearing structure can improve the homogeneity that the base plate is heated, avoids the inhomogeneous phenomenon of rete that arouses by the supporting pin to guarantee the product quality.

Another object of the utility model is to provide a bake device in advance, through using above-mentioned base plate bearing structure, can form even joining in marriage to the membrane on the base plate, improve the product yield.

As the conception, the utility model adopts the technical proposal that:

a substrate support structure comprising:

the supporting assemblies are distributed in an array mode and each supporting assembly comprises a middle supporting portion and surrounding supporting portions, the surrounding supporting portions are arranged around the middle supporting portion in a surrounding mode, and the middle supporting portion and the surrounding supporting portions can alternately lift up and down to support the substrate to be dried.

As a preferred solution of the substrate supporting structure provided by the present invention, the intermediate supporting portion is an intermediate supporting pin; the surrounding support portion includes:

the peripheral supporting needles are annularly arranged along the circumferential direction of the middle supporting needle at intervals and can be lifted alternately so as to support the substrate to be dried;

the needle sleeve is sleeved outside the middle supporting needle and the plurality of surrounding supporting needles.

As the utility model provides a substrate supporting structure's an optimal selection scheme, the needle cover adopts the preparation of heat preservation material to form.

As an optimized scheme of the substrate supporting structure provided by the present invention, the upper ends of the supporting pins are conical.

As a preferred solution of the substrate supporting structure provided by the present invention, the intermediate supporting portion is an intermediate supporting pin; the peripheral supporting part is a needle ring, and the needle ring is sleeved outside the middle supporting needle.

As an optimized scheme of the substrate supporting structure provided by the utility model, the upper end of the middle supporting needle is conical.

As a preferred aspect of the substrate support structure provided by the present invention, the substrate support structure further comprises a temperature adjustment component, the temperature adjustment component is configured to adjust the temperature of the support component.

As the utility model provides a substrate supporting structure's an optimal selection scheme, be provided with the air intake on the supporting part on every side, the subassembly that adjusts the temperature includes hot-blast main, fan and heating member, the export of hot-blast main with the air intake is linked together, the fan set up in among the hot-blast main, the heating member set up in the air intake with between the fan.

As the utility model provides a substrate supporting structure's an preferred scheme, the subassembly that adjusts the temperature still includes temperature sensor, temperature sensor is used for detecting supporting component's temperature.

In order to achieve the above object, the present invention further provides a pre-baking apparatus, which includes the substrate supporting structure according to any one of the above aspects.

The utility model has the advantages that:

the utility model provides a substrate supporting structure, including a plurality of supporting components, a plurality of supporting components are the array and distribute, and every supporting component all includes intermediate strut portion and supporting part on every side, and the supporting part ring is located around the intermediate strut portion around, and intermediate strut portion and supporting part on every side can go up and down in turn to treat the stoving substrate and support. The support of the substrate to be dried is realized by arranging a plurality of support assemblies, so that the stability of the substrate to be dried can be improved; through setting up middle supporting part and supporting part lift in turn around with the support base plate of treating drying in turn, can avoid because the position that exists on the base plate of treating drying and the position that does not contact leads to with the supporting component inhomogeneous phenomenon of being heated to improve the finished product quality.

The utility model also provides a bake the device in advance, through using above-mentioned base plate bearing structure, can form even joining in marriage to the membrane on treating the stoving base plate, improve the product yield.

Drawings

Fig. 1 is a schematic structural diagram of a substrate support structure according to an embodiment of the present invention;

fig. 2 is a schematic structural view illustrating a substrate to be dried supported by an intermediate support portion in a substrate support structure according to an embodiment of the present invention;

fig. 3 is a schematic structural view illustrating a substrate to be dried supported by a surrounding support portion in a substrate support structure according to an embodiment of the present invention;

fig. 4 is a first flowchart of a baking process of the substrate supporting structure according to the first embodiment of the present invention;

fig. 5 is a second flowchart of the substrate supporting structure provided by the first embodiment of the present invention in the baking process of the substrate to be dried;

fig. 6 is a schematic structural diagram of a substrate support structure according to a second embodiment of the present invention;

fig. 7 is a flowchart of the substrate supporting structure provided by the embodiment of the present invention in the baking process of the substrate to be dried.

In the figure:

100-a substrate to be dried; 200-baking oven;

1-a support assembly; 11-an intermediate support; 12-a surrounding support; 121-surrounding supporting pins; 122-a needle guard; 120-air inlet;

2-temperature regulating component.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures associated with the present invention are shown in the drawings, not all of them.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

Example one

Fig. 1 is a schematic structural diagram of a substrate support structure according to a first embodiment of the present invention. Fig. 2 is a schematic structural diagram illustrating a substrate supporting structure according to a first embodiment of the present invention, in which an intermediate supporting portion 11 supports a substrate 100 to be dried. Fig. 3 is a schematic structural diagram illustrating a substrate 100 to be dried supported by the surrounding support portion 12 in the substrate support structure according to the first embodiment. As shown in fig. 1 to fig. 3, the present embodiment provides a substrate supporting structure, which includes a plurality of supporting assemblies 1, wherein the plurality of supporting assemblies 1 are distributed in an array, each supporting assembly 1 includes a middle supporting portion 11 and a peripheral supporting portion 12, the peripheral supporting portion 12 is disposed around the middle supporting portion 11, and the middle supporting portion 11 and the peripheral supporting portion 12 can be lifted and lowered alternately to support a substrate 100 to be dried.

In the substrate supporting structure provided by this embodiment, the substrate 100 to be dried is supported by the plurality of supporting assemblies 1, so that the stability of the substrate 100 to be dried can be improved; through setting up middle supporting part 11 and the alternate lift of surrounding supporting part 12 in order to support in turn treating stoving base plate 100, can avoid because there is the inhomogeneous phenomenon of being heated that leads to with the position of supporting component 1 contact and the position that does not contact on treating stoving base plate 100 to improve the finished product quality.

Since the middle support part 11 and the peripheral support part 12 contact the substrate 100 to be dried and then exchange heat with the substrate 100 to be dried when the substrate 100 to be dried is dried, in order to ensure that the temperatures of the middle support part 11 and the peripheral support part 12 are consistent with the ambient temperature in the oven 200 of the pre-baking apparatus, the substrate support structure further includes the temperature adjusting assembly 2, and the temperature adjusting assembly 2 is configured to adjust the temperature of the support assembly 1.

Specifically, the peripheral support portion 12 is provided with an air inlet 120, the temperature adjustment assembly 2 includes a hot air pipe, a fan and a heating element, an outlet of the hot air pipe is communicated with the air inlet 120, the fan is disposed in the hot air pipe, and the heating element is disposed between the air inlet 120 and the fan. The heating member can heat the air in the hot air pipeline, and the fan can blow the hot air in the hot air pipeline into the surrounding support part 12, so that the effect of adjusting the temperature of the surrounding support part 12 and the middle support part 11 is realized. Optionally, the heating member is PTC heating block, and heating efficiency is higher, and easy to assemble.

Further, the temperature regulating assembly 2 further comprises a temperature sensor for detecting the temperature of the support assembly 1. The temperature sensor can transmit the temperature of the supporting component 1 to a control system of the pre-baking device in real time, and the control system can control the starting and stopping of the fan according to the current temperature of the supporting component 1 so as to ensure that the temperatures of the middle supporting part 11 and the surrounding supporting parts 12 are kept within a preset temperature range. Optionally, the predetermined temperature range is 90 ℃ to 120 ℃, which is the same as the ambient temperature inside the oven 200.

In this embodiment, the number of the temperature adjustment assemblies 2 is a plurality of, and each support assembly 1 corresponds to one temperature adjustment assembly 2, so as to realize the independent temperature adjustment of each support assembly 1, thereby ensuring the accuracy of the temperature of each support assembly 1. Of course, in other embodiments, the number of the temperature adjustment assemblies 2 may also be one, and one temperature adjustment assembly 2 simultaneously realizes temperature adjustment of a plurality of support assemblies 1, so as to save the number of the temperature adjustment assemblies 2 and reduce the production cost.

Further, the intermediate support portion 11 is an intermediate support needle; the peripheral support portion 12 includes a needle sheath 122 and a plurality of peripheral support needles 121, the plurality of peripheral support needles 121 are circumferentially spaced and annularly arranged along the central support needle, and the plurality of peripheral support needles 121 can alternately lift up and down to support the substrate 100 to be dried; the needle sheath 122 is sleeved outside the middle support needle and the plurality of surrounding support needles 121. Wherein, the air inlet 120 is arranged on the needle sleeve 122. The intermediate supporting needles and the plurality of peripheral supporting needles 121 are accommodated in the needle sleeve 122, so that the intermediate supporting needles and the plurality of peripheral supporting needles 121 can be insulated, heat exchange between the intermediate supporting needles and the plurality of peripheral supporting needles 121 and the surrounding environment is reduced, the volume of the needle sleeve 122 is small, and the temperature regulating efficiency of the temperature regulating assembly 2 on the intermediate supporting needles and the plurality of peripheral supporting needles 121 can be improved.

Optionally, the needle sheath 122 is made of a thermal insulation material, so as to further reduce the heat exchange between the intermediate supporting needle and the plurality of surrounding supporting needles 121 and the surrounding environment. The heat insulating material is not limited in this embodiment, and any heat insulating material of the needle sheath 122 in the prior art may be adopted.

Further, the upper end of the surrounding support pin 121 is conical; the upper end of the middle supporting needle is conical. This design can reduce the area of contact between supporting component 1 and the base plate 100 of waiting to dry, reduces heat exchange efficiency between the two, further improves the degree of consistency of the rete on the base plate 100 of waiting to dry.

Fig. 4 shows a first flowchart of the substrate supporting structure provided in the first embodiment in the process of baking the substrate 100 to be dried. In fig. 4, the number of the intermediate support pins is one, and the number of the peripheral support pins 121 is four, which are the first peripheral support pin, the second peripheral support pin, the third peripheral support pin, and the fourth peripheral support pin, respectively, and the first peripheral support pin, the second peripheral support pin, the third peripheral support pin, and the fourth peripheral support pin are annularly provided around the intermediate support pin. When the substrate 100 to be dried is dried, as shown in fig. 4, five support pins are alternately lifted to support the substrate 100 to be dried, wherein the support pins of the solid circular structure are the support pins which are in contact with the substrate 100 to be dried at the current time, and the support pins of the hollow circular structure are the support pins which are not in contact with the substrate 100 to be dried at the current time.

Exemplarily, the whole drying process needs 150s, which is divided into three cycles, each cycle is 50s, and in the first cycle, 0-10 s, the middle support pins move upwards to support the substrate 100 to be dried; when the time is 10 s-20 s, the middle supporting pins move downwards to be far away from the substrate 100 to be dried, and meanwhile, the first peripheral supporting pins move upwards to support the substrate 100 to be dried; when the time is 20 s-30 s, the first peripheral supporting pins move downwards to be far away from the substrate 100 to be dried, and meanwhile, the second peripheral supporting pins move upwards to support the substrate 100 to be dried; 30 s-40 s, the second surrounding supporting pins move downwards to be far away from the substrate 100 to be dried, and the third surrounding supporting pins move upwards to support the substrate 100 to be dried; and 40 s-50 s, the third surrounding supporting pins move downwards to be far away from the substrate 100 to be dried, and the fourth surrounding supporting pins move upwards to support the substrate 100 to be dried. The above process is repeated for the second cycle and the third cycle. The design can reduce the contact time between each supporting needle and the substrate 100 to be dried, and reduce heat exchange.

Of course, the time division of the drying cycle may be adjusted according to actual situations, which is not limited in this embodiment.

Fig. 5 shows a second flowchart of the substrate supporting structure provided in the first embodiment in the baking process of the substrate 100 to be dried. In fig. 5, the number of the middle support pins is one, the number of the peripheral support pins 121 is eight, and eight peripheral support pins 121 are annularly arranged around the middle support pins. When the substrate 100 to be dried is dried, as shown in fig. 5, the nine support pins are alternately lifted to support the substrate 100 to be dried, wherein the support pins of the solid circular structure are the support pins that are in contact with the substrate 100 to be dried at the current time, and the support pins of the hollow circular structure are the support pins that are not in contact with the substrate 100 to be dried at the current time. The loop process is the same as the loop process in fig. 4, and is not described again here.

Of course, in other embodiments, the number of the surrounding supporting pins 121 may also be three, five, seven, etc., which is not limited in this embodiment.

Further, the substrate supporting structure further includes a lifting driving assembly (not shown in the figure) for driving the corresponding supporting pins to lift and lower. The specific structure and number of the lifting driving components are not limited in this embodiment, and it is within the protection scope of this embodiment as long as the corresponding supporting pins can be driven to move up and down within the corresponding time.

Example two

Fig. 6 is a schematic structural diagram of a substrate support structure according to a second embodiment. As shown in fig. 6, the present embodiment provides a substrate supporting structure, which includes a plurality of supporting assemblies 1, wherein the plurality of supporting assemblies 1 are distributed in an array, each supporting assembly 1 includes a middle supporting portion 11 and a peripheral supporting portion 12, the peripheral supporting portion 12 is disposed around the middle supporting portion 11, and the middle supporting portion 11 and the peripheral supporting portion 12 can be lifted and lowered alternately to support a substrate 100 to be dried.

In the substrate support structure provided by this embodiment, the substrate 100 to be dried is supported by the plurality of support assemblies 1, so that the stability of the substrate 100 to be dried can be improved; through setting up middle support portion 11 and the 12 lifting in turn of supporting part around with the alternative support treat drying substrate 100, can avoid because the uneven phenomenon of being heated that the position that has on treating drying substrate 100 and contact with supporting component 1 and the position that does not have the contact leads to improve the degree of consistency of rete, improve the finished product quality.

Since the middle support part 11 and the peripheral support part 12 contact the substrate 100 to be dried and then exchange heat with the substrate 100 to be dried when the substrate 100 to be dried is dried, in order to ensure that the temperatures of the middle support part 11 and the peripheral support part 12 are consistent with the ambient temperature in the oven 200 of the pre-baking apparatus, the substrate support structure further includes the temperature adjusting assembly 2, and the temperature adjusting assembly 2 is configured to adjust the temperature of the support assembly 1.

Specifically, the peripheral support portion 12 is provided with an air inlet 120, the temperature adjustment assembly 2 includes a hot air pipe, a fan and a heating element, an outlet of the hot air pipe is communicated with the air inlet 120, the fan is disposed in the hot air pipe, and the heating element is disposed between the air inlet 120 and the fan. The heating element can heat the air in the hot air pipeline, and the fan can blow the hot air in the hot air pipeline into the surrounding supporting part 12, so that the temperature regulation effect of the surrounding supporting part 12 and the middle supporting part 11 is realized. Optionally, the heating member is PTC heating block, and heating efficiency is higher, and easy to assemble.

Further, the temperature regulating assembly 2 further comprises a temperature sensor for detecting the temperature of the support assembly 1. The temperature sensor can transmit the temperature of the supporting component 1 to a control system of the pre-baking device in real time, and the control system can control the starting and stopping of the fan according to the current temperature of the supporting component 1 so as to ensure that the temperatures of the middle supporting part 11 and the surrounding supporting parts 12 are kept within a preset temperature range. Optionally, the predetermined temperature range is 90 ℃ to 120 ℃, which is the same as the ambient temperature inside the oven 200.

In this embodiment, the number of the temperature adjustment assemblies 2 is a plurality of, and each support assembly 1 corresponds to one temperature adjustment assembly 2, so as to realize the independent temperature adjustment of each support assembly 1, thereby ensuring the accuracy of the temperature of each support assembly 1. Of course, in other embodiments, the number of the temperature adjustment assemblies 2 may also be one, and one temperature adjustment assembly 2 simultaneously realizes temperature adjustment of a plurality of support assemblies 1, so as to save the number of the temperature adjustment assemblies 2 and reduce the production cost.

It should be noted that the specific structure of the substrate support structure provided in this embodiment is substantially the same as that of the substrate support structure provided in the first embodiment, and the differences mainly lie in: the structure of the surrounding support portion 12 is different.

Specifically, in the present embodiment, as shown in fig. 6, the intermediate support portion 11 is an intermediate support needle; the peripheral support portion 12 is a needle ring, the needle ring is sleeved outside the middle support needle, and the needle ring is provided with the air inlet 120. By adopting the arrangement mode, the structure of the supporting component 1 can be simplified, the needle ring can play a role in supporting the substrate 100 to be dried and can also play a role in preserving heat of the middle supporting needle, the needle ring has two purposes, the production cost is saved, and the production efficiency is improved.

Fig. 7 shows a flowchart of the substrate supporting structure provided in the second embodiment in the baking process of the substrate 100 to be dried. In fig. 7, the intermediate support pins and the pin rings are alternately lifted to alternately support the substrate 100 to be dried. In the present embodiment, the time for which the intermediate support pins and the pin rings support the substrate 100 to be dried each time is 10s. Of course, the time for supporting the substrate 100 to be dried by the intermediate supporting pins and the pin rings is not limited in this embodiment, and may be adjusted according to actual needs. The middle supporting needle of the solid circular structure indicates that the middle supporting needle of the solid circular structure is in contact with the substrate 100 to be dried within the current time, the middle supporting needle of the hollow circular structure indicates that the middle supporting needle of the hollow circular structure is not in contact with the substrate 100 to be dried within the current time, the needle ring with the darker line color indicates that the middle supporting needle of the hollow circular structure is in contact with the substrate 100 to be dried within the current time, and the needle ring with the lighter line color indicates that the middle supporting needle of the hollow circular structure is not in contact with the substrate 100 to be dried within the current time.

Further, the substrate supporting structure further includes a lifting driving assembly (not shown in the figures) for driving the corresponding intermediate supporting pins or pin rings to lift and lower. The specific structure and number of the lifting driving components are not limited in this embodiment, and it is within the protection scope of this embodiment as long as the corresponding middle supporting needle or needle ring can be driven to move up and down within the corresponding time.

EXAMPLE III

The present embodiment further provides a pre-baking apparatus, which includes the substrate supporting structure provided in the first embodiment or the second embodiment. By applying the substrate supporting structure, a uniform alignment film can be formed on the substrate 100 to be dried, and the product yield is improved.

It should be noted that the pre-baking apparatus provided in this embodiment may be used in a pre-baking process of an alignment film, so as to uniformly heat the substrate 100 to be baked and improve uniformity of the film layer; the method can also be used in a photoresist pre-baking process to improve the lithography quality, which is not limited in this embodiment.

The above embodiments have been described only the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and is not departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (10)

1. A substrate support structure, comprising:

the drying device comprises a plurality of supporting assemblies (1) which are distributed in an array, wherein each supporting assembly (1) comprises a middle supporting part (11) and a surrounding supporting part (12), the surrounding supporting parts (12) are arranged around the middle supporting part (11), and the middle supporting part (11) and the surrounding supporting parts (12) can be lifted and lowered alternately to support a substrate (100) to be dried.

2. The substrate support structure according to claim 1, wherein the intermediate support portion (11) is an intermediate support pin; the surrounding support portion (12) includes:

a plurality of peripheral supporting pins (121) which are arranged at intervals along the circumferential direction of the middle supporting pin, wherein the plurality of peripheral supporting pins (121) can be lifted and lowered alternately so as to support the substrate (100) to be dried;

and the needle sleeve (122) is sleeved outside the middle supporting needle and the plurality of surrounding supporting needles (121).

3. The substrate support structure of claim 2, wherein the needle guard (122) is fabricated from a thermally insulating material.

4. The substrate support structure of claim 2, wherein the upper ends of the surrounding support pins (121) are conical.

5. The substrate support structure according to claim 1, wherein the intermediate support portion (11) is an intermediate support pin; the peripheral supporting part (12) is a needle ring, and the needle ring is sleeved outside the middle supporting needle.

6. The substrate support structure of claim 2 or 5, wherein the upper end of the intermediate support pin is conical.

7. The substrate support structure according to any of claims 1-5, further comprising a temperature regulating assembly (2), the temperature regulating assembly (2) being configured to regulate the temperature of the support assembly (1).

8. The substrate support structure of claim 7, wherein the peripheral support portion (12) is provided with an air inlet (120), the temperature adjustment assembly (2) comprises a hot air duct, a fan and a heating element, an outlet of the hot air duct is communicated with the air inlet (120), the fan is disposed in the hot air duct, and the heating element is disposed between the air inlet (120) and the fan.

9. The substrate support structure of claim 7, wherein the temperature conditioning assembly (2) further comprises a temperature sensor for detecting the temperature of the support assembly (1).

10. A pre-bake apparatus, comprising a substrate support structure according to any of claims 1-9.

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